CN112014721B - Universal LCR test board and manufacturing method thereof - Google Patents
Universal LCR test board and manufacturing method thereof Download PDFInfo
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- CN112014721B CN112014721B CN202010904522.XA CN202010904522A CN112014721B CN 112014721 B CN112014721 B CN 112014721B CN 202010904522 A CN202010904522 A CN 202010904522A CN 112014721 B CN112014721 B CN 112014721B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2803—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a universal LCR test board, which comprises a test board body and a plurality of high-frequency probes; the front surface of the test board body is provided with a high-frequency probe circuit, and the back surface of the test board body is provided with a test probe circuit; the high-frequency probe circuit is electrically connected with the test probe circuit; the high-frequency probe is arranged above the front surface of the test board body, and a plurality of test pin holes are formed in the middle of the lower part of the test board body. The universal LCR test board provided by the invention solves the problem of single adaptability of the conventional LCR test board, can be suitable for different wireless charging products, and is suitable for wireless charging products with different PAD intervals; each test needle of the test board can be organically connected with the high-frequency probe, so that the test using requirements can be met for different types of products to be tested, and the waste of time and resources caused by additionally processing the corresponding test board for each product is avoided; the preparation time of the test board is greatly shortened from 3-4 days before improvement to 1-2 days, and the processing efficiency and the economic benefit of enterprises are improved.
Description
Technical Field
The invention relates to FPC wireless charging product test, in particular to a universal LCR test board and a manufacturing method thereof.
Background
The testing jig is characterized in that a testing seed needle and a high-frequency probe are arranged on a testing board which is a double-sided PCB product, the corresponding testing boards cannot be shared due to the difference of the positions of the testing needles of different wireless charging product materials, each product is independently used as one testing board when being used as the testing jig, the testing board is processed according to a PCB flow, the quantity of the testing boards is small, each wireless charging product needs to be used, the wireless charging product is independently processed and manufactured each time, the cost is high, the manufacturing time is relatively long, and the wireless charging product cannot be taken at any time.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a universal LCR test board and a manufacturing method thereof.
In order to realize the purpose, the invention adopts the following technical scheme: a universal LCR test board comprises a test board body and a plurality of high-frequency probes; the front surface of the test board body is provided with a high-frequency probe line, and the back surface of the test board body is provided with a test probe line; the high-frequency probe circuit is electrically connected with the test probe circuit; the high-frequency probe is arranged above the front surface of the test board body, and a plurality of test pin holes are formed in the middle of the lower part of the test board body; the test board comprises a test board body, wherein the middle part of the test board body is provided with 12 drill holes, and the drill holes are arranged into matrix hole sites in three rows and four columns;
the number of the high-frequency probes is 4, each high-frequency probe is correspondingly connected with 3 drill holes in a row through a lead, and the high-frequency probe lines on the front surface of the test board body are formed by 4 groups of high-frequency probes and the passages of the drill holes; the middle part of the back of the test board body is provided with a plurality of welding PADs corresponding to the test pinholes, each test pinhole is correspondingly connected with 4 welding PADs in one line through a wire, and 20 groups of test pinholes and the passages of the welding PADs jointly form a test needle circuit at the back of the test board body.
The further technical scheme is that the number of the test pinholes is 20, and the test pinholes are arranged into matrix hole sites with four rows and five columns.
The further technical scheme is that the drill hole is a through hole, and the surface of the inner wall of the drill hole is plated with copper.
The further technical scheme is that the test needle hole is a through hole, and the surface of the inner wall of the test needle hole is plated with copper.
The test board body is a double-sided FR4 copper-clad plate.
A processing method, suitable for the aforesaid universal LCR test board, comprising:
the method comprises the following steps: designing data, namely selecting a raw material of a test board body to be processed and the model of the test board body;
step two: cutting and drilling the raw material of the test board body according to the data design parameters to obtain the test board body;
step three: carrying out black hole/copper plating operation on hole sites obtained by drilling holes on the surface of the test plate body;
step four: respectively carrying out circuit manufacturing on the front surface and the back surface of the test board body after the black hole/copper plating, wherein the circuit manufacturing comprises a high-frequency probe circuit on the front surface and a test needle circuit on the back surface;
step five: carrying out ink printing, exposure, development and curing procedures and gold and gong shape procedures on the test board body after the circuit is manufactured to obtain a semi-finished test board;
step six: and welding and mounting the semi-finished product test board to obtain the finished product of the universal LCR test board.
The further technical scheme is that the method comprises the following steps: and welding and mounting the semi-finished product test board to obtain a finished product of the universal LCR test board, wherein the welding and mounting is to connect the high-frequency probe with an LCR tester through a data line, and the data line is a parallel data line with a shielding function.
Compared with the prior art, the invention has the beneficial effects that: the universal LCR test board provided by the invention solves the problem of single adaptability of the conventional LCR test board, can be suitable for different wireless charging products, and is suitable for wireless charging products with different PAD intervals; each test needle of the test board can be organically connected with the high-frequency probe, so that the test using requirements can be met for different types of products to be tested, and the waste of time and resources caused by additionally processing the corresponding test board for each product is avoided; the preparation time of the test board is greatly shortened from 3-4 days before improvement to 1-2 days, and the processing efficiency and the economic benefit of enterprises are improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more apparent, the following detailed description will be given of preferred embodiments.
Drawings
FIG. 1 is a schematic circuit diagram of an LCR test board before modification;
FIG. 2 is a front circuit diagram of a universal LCR test board according to the present invention;
FIG. 3 is a circuit diagram of the backside of a universal LCR test board according to the present invention.
Reference numerals
1. A test board body; 2. a high-frequency probe; 3. testing a pinhole; 4. a wire; 5. drilling; 6. and (6) welding the PAD.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
Referring to fig. 1, a test board before improvement is designed independently according to wireless charging products, each two test pin holes 3 are aligned with one test pin on the product, and the test position is determined according to each product, in the conventional method, the test pin holes 3 and the high-frequency probes 2 are arranged on one test board body 1 and connected through wires, the number of the test pin holes 3 of the test board body 1 is only 4, the test board can only be installed and tested on a specified wireless charging product, only one-to-one design is performed on a single-material-number wireless charging product, and after the positions of the test pins are changed, the original test board cannot be used continuously.
Referring to fig. 2-3, the present invention provides a universal LCR test board, which includes a test board body 1 and a plurality of high frequency probes 2; the front surface of the test board body 1 is provided with a high-frequency probe line, and the back surface of the test board body 1 is provided with a test probe line; the high-frequency probe circuit is electrically connected with the test probe circuit; the high-frequency probe 2 is arranged above the front surface of the test board body 1, and a plurality of test pin holes 3 are arranged in the middle of the lower part of the test board body 1.
The test board body 1 is provided with drill holes 5 in the middle, the number of the drill holes 5 is 12, and the drill holes 5 are arranged in matrix type hole positions of three rows and four columns.
The number of the high-frequency probes 2 is 4, and each high-frequency probe 2 is correspondingly connected with a row of 3 drilling holes 5,4 through a lead 4, and the high-frequency probe line on the front surface of the test board body is formed by the high-frequency probes 2 and the passages of the drilling holes 5.
The number of the test pin holes 3 is 20, and the test pin holes 3 are arranged in matrix holes with four rows and five columns.
The middle part of the back of the test board body is provided with a plurality of welding PADs 6 corresponding to the test pin holes 3, each test pin hole 3 is correspondingly connected with 4 welding PADs 6 arranged in a row through a lead 4, and the paths of 20 groups of test pin holes 3 and the welding PADs 6 jointly form a test pin circuit on the back of the test board body.
The drill hole 5 is a through hole, and the surface of the inner wall of the drill hole 5 is plated with copper. The test pin hole 3 is a through hole, and the surface of the inner wall of the test pin hole 3 is plated with copper and is also required for welding. The test board body 1 is a double-sided FR4 copper-clad plate.
The welding PAD6 is arranged on the circuit and can be used for welding a lead, and is connected with the drill hole 5 through the lead to achieve the purpose of conducting the circuit.
A method of manufacturing the aforesaid generic LCR test panel, comprising:
the method comprises the following steps: designing data, namely selecting a raw material of a test board body to be processed and the model of the test board body; according to the manufacturing principle of the wireless charging LCR test board and the size of the wireless charging LCR test board installed in the test fixture, the test board is determined to be processed by selecting a double-sided FR4 copper-clad plate;
step two: cutting and drilling the raw material of the test board body according to the data design parameters to obtain the test board body; the circuit corresponding to the high-frequency probe 2 of the test board and the circuit corresponding to the test needle are divided into two test surfaces;
step three: carrying out black hole/copper plating operation on hole sites obtained by drilling holes on the surface of the test plate body;
step four: respectively carrying out circuit manufacturing on the front surface and the back surface of the test board body after the black hole/copper plating, wherein the circuit manufacturing comprises a high-frequency probe circuit on the front surface and a test needle circuit on the back surface; the back of the test board is designed into 20 test pin holes 3 of 4*5 in total according to the relative position of the existing test pin for wireless charging, and each test pin hole 3 is led out and provided with 4 corresponding welding PADs 6 according to the sequence requirement; designing a high-frequency probe circuit, drilling a through hole and welding a PAD6 on the front surface of the test board;
step five: carrying out ink printing, exposure, development and curing procedures and gold and gong shape procedures on the test board body 1 after the circuit is manufactured to obtain a semi-finished test board;
step six: and welding and mounting the semi-finished product test board to obtain the finished product of the universal LCR test board. The welding installation is to connect the high-frequency probe 2 with the LCR tester through a data line, and the data line is a parallel data line with a shielding function. Selecting 4 corresponding test pin holes 3 on the test board to be connected with the corresponding high-frequency probes 2 by leads 4 in a welding way, and connecting the high-frequency probes 2 with an LCR tester by parallel data wires with a shielding function (20 test pin holes 3 are selected and only 4 of the test pin holes are selected for use);
in the testing process, the required drill holes 5 (4 holes correspondingly connected with the high-frequency needle 2) and the welding PAD6 (the welding PAD6 on the circuit led out from the testing pinhole 3) are correspondingly welded and connected by a lead, so that the testing pinhole 3 and the high-frequency needle 2 form a conductive path.
In addition, a limit fitting for a test product is required to be manufactured, the fitting is milled out from FR4 material, and a bit alignment pinhole is drilled, and the fitting is manufactured according to a material number and cannot be shared (on the other hand, the fitting is also used for preventing fool during test use). The test board and the limiting accessories are sequentially arranged in the LCR test frame, relevant parameters are set and verified to be abnormal, and the LCR test frame can be put into production.
Compared with the prior art, the universal LCR test board of the embodiment solves the problem of single adaptability of the conventional LCR test board, can be suitable for different wireless charging products, and is suitable for wireless charging products with different PAD intervals; each test needle of the test board can be organically connected with the high-frequency probe, so that the test using requirements can be met for different types of products to be tested, and the waste of time and resources caused by additionally processing the corresponding test board for each product is avoided; the preparation time of the test board is greatly shortened from 3-4 days before improvement to 1-2 days, and the processing efficiency and the economic benefit of enterprises are improved.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
Claims (7)
1. A universal LCR test board is characterized by comprising a test board body and a plurality of high-frequency probes; the front surface of the test board body is provided with a high-frequency probe line, and the back surface of the test board body is provided with a test probe line; the high-frequency probe circuit is electrically connected with the test probe circuit; the high-frequency probe is arranged above the front surface of the test board body, and a plurality of test pin holes are formed in the middle of the lower part of the test board body; the test board comprises a test board body, wherein the middle part of the test board body is provided with 12 drill holes, and the drill holes are arranged into matrix hole sites in three rows and four columns; the number of the high-frequency probes is 4, each high-frequency probe is correspondingly connected with 3 drill holes in a row through a lead, and the high-frequency probe lines on the front surface of the test board body are formed by 4 groups of high-frequency probes and the passages of the drill holes; the middle part of the back of the test board body is provided with a plurality of welding PADs corresponding to the test pinholes, each test pinhole is correspondingly connected with 4 welding PADs in one row through a lead, and the 20 groups of test pinholes and the passages of the welding PADs jointly form a test needle circuit at the back of the test board body.
2. The universal LCR test plate as defined in claim 1 wherein, the number of the test pin holes is 20, and the test pin holes are arranged in matrix type holes with four rows and five columns.
3. The universal LCR test plate according to claim 1 wherein the bores are through holes and the inner wall surface of the bores is plated with copper.
4. The universal LCR test plate as defined in claim 1 wherein, the test pin holes are through holes, the inner wall surfaces of the test pin holes are plated with copper.
5. The universal LCR test board according to claim 1, wherein the test board body is a double-sided FR4 copper clad laminate.
6. A method of manufacturing a universal LCR test panel according to any one of claims 1 to 5 comprising:
the method comprises the following steps: designing data, namely selecting a raw material of a test board body to be processed and the model of the test board body;
step two: cutting and drilling the raw material of the test board body according to the data design parameters to obtain the test board body;
step three: carrying out black hole/copper plating operation on hole sites obtained by drilling holes on the surface of the test plate body;
step four: respectively carrying out circuit manufacturing on the front surface and the back surface of the test board body after the black hole/copper plating, wherein the circuit manufacturing comprises a high-frequency probe circuit on the front surface and a test probe circuit on the back surface;
step five: carrying out ink printing, exposure, development and curing procedures and gold and gong shape procedures on the test board body after the circuit is manufactured to obtain a semi-finished test board;
step six: and welding and mounting the semi-finished product test board to obtain the finished product of the universal LCR test board.
7. The machining method according to claim 6, characterized in that the sixth step: and welding and mounting the semi-finished product test board to obtain a finished product of the universal LCR test board, wherein the welding and mounting is to connect the high-frequency probe with an LCR tester through a data line, and the data line is a parallel data line with a shielding function.
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| CN202010904522.XA CN112014721B (en) | 2020-09-01 | 2020-09-01 | Universal LCR test board and manufacturing method thereof |
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| CN202010904522.XA CN112014721B (en) | 2020-09-01 | 2020-09-01 | Universal LCR test board and manufacturing method thereof |
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| CN112014721A CN112014721A (en) | 2020-12-01 |
| CN112014721B true CN112014721B (en) | 2023-04-11 |
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