CN208140821U - A kind of optical integrated circuit suction survey binding test device - Google Patents
A kind of optical integrated circuit suction survey binding test device Download PDFInfo
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- CN208140821U CN208140821U CN201820636457.5U CN201820636457U CN208140821U CN 208140821 U CN208140821 U CN 208140821U CN 201820636457 U CN201820636457 U CN 201820636457U CN 208140821 U CN208140821 U CN 208140821U
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Abstract
A kind of optical integrated circuit suction survey binding test device,It is related to chip testing technology field,Its structure includes measuring head,Test carries seat and light source,Measuring head includes inhaling to survey component,Inhaling survey component includes pressure head test board and suction piece,Pressure head test board is equipped with telescopic probe,The back side that test carries seat is equipped with test mounted circuit board,Having double end testing needle to pass through, test carries seat and both ends expose to test and carry seat,When test,The pin at the back side of the upper end and optical integrated circuit of double end testing needle contacts,The lower end of double end testing needle and test machine circuit board contacts,Pressure head test board and test machine circuit board electrical connection,Test carries seat and is equipped with through-hole,The position of through-hole and the position of optical integrated circuit putting position are corresponding,Light source is located at the lower section of test mounted circuit board,Its light is from the back side of through-hole directive optical integrated circuit,The position of light source and the position of optical integrated circuit putting position correspond,The utility model can carry out two sides test to integrated circuit simultaneously,Work efficiency is high.
Description
Technical field
The utility model relates to probe station technical fields, inhale more particularly to a kind of optical integrated circuit and survey binding test dress
It sets.
Background technique
In the past, the test surfaces test mode directed downwardly of chip is all used to the test of integrated circuit (i.e. chip), therefore is surveyed
Trial work has the lower section for being normally at chip, and with the high speed development of integrated circuit industry, integrated circuit function is stronger and stronger, right
Test request is higher and higher.The test of present optical integrated circuit needs overleaf to carry out polishing test, therefore, existing test
Mode is not able to satisfy test request, can only carry out in two times to the test of the adhesive integrated circuit, low efficiency.
Summary of the invention
The purpose of this utility model is that avoiding shortcoming in the prior art and providing a kind of optical integrated circuit suction
Binding test device is surveyed, which, which inhales survey binding test device, to carry out two sides test, work to integrated circuit simultaneously
Make high-efficient.
The purpose of this utility model is achieved through the following technical solutions:
A kind of optical integrated circuit suction survey binding test device is provided, for testing optical integrated circuit, it is characterised in that:
Seat and light source are carried including measuring head, test,
Measuring head includes that at least one is inhaled and surveys component, and each suctions survey component includes pressure head test board and for drawing light
The suction piece of integrated circuit is learned, pressure head test board is equipped with telescopic probe, and when test, probe stretches out and optical integrated circuit
Surface pin contact,
The surface that test carries seat is equipped at least one optical integrated circuit putting position, the position of optical integrated circuit putting position
With inhale survey component correspond, test carry seat the back side be equipped with test mounted circuit board, have double end testing needle pass through test carry seat and
Both ends expose to test and carry seat, when test, the pin contact at the back side of the upper end and optical integrated circuit of double end testing needle, and double end
The lower end of testing needle and test machine circuit board contacts,
Pressure head test board and test machine circuit board electrical connection,
Test carries seat and is equipped with through-hole, and the position of through-hole and the position of optical integrated circuit putting position are corresponding, and light source is located at
The lower section of mounted circuit board is tested, for light from the back side of through-hole directive optical integrated circuit, the position of light source and optics are integrated electric
The position of road putting position corresponds.
Wherein, the measuring head includes that product to be tested puts cavity, which is equipped with vacuum hole and probe aperture, and probe is from probe
Hole extends and retracts.
Wherein, light source is set as light cylinder.
Wherein, each measuring head set there are two inhale survey component.
Wherein, each test carries seat and sets that there are four optical integrated circuit putting positions.
The beneficial effects of the utility model:A kind of optical integrated circuit of the utility model, which is inhaled, surveys binding test device, leads to
It crosses and increases pressure head test board, pressure head test board and test machine circuit board electrical connection in measuring head, i.e., guide to test mounted circuit board
Measuring head, i.e., the surface of available measuring head test optical integrated circuit, is equipped with double end testing needle for light by carrying in test on seat
The back side for learning integrated circuit is connected with test mounted circuit board, can be tested the back side of optical integrated circuit, meanwhile, it is testing
It carries seat and is equipped with through-hole, the back side for the light of light source to be led to optical integrated circuit carries out polishing test, and then can reach
On the basis of the test device of existing optical integrated circuit, it is improved to be able to achieve the optical integrated circuit for needing polishing to test
The device of two-sided test can be by optical integrated circuit to be tested in the suction survey component that measuring head is arranged because having suction piece
It draws and is placed into test and carries the corresponding optical integrated circuit putting position of seat and tested, two-sided test is disposably completed, and existing
There is technology to need to test in two times and compare, it is more efficient.
Detailed description of the invention
Utility model is described further using attached drawing, but the embodiment in attached drawing does not constitute and appoints to the utility model
What is limited, for those of ordinary skill in the art, without creative efforts, can also be according to the following drawings
Obtain other attached drawings.
Fig. 1 is that a kind of optical integrated circuit of the utility model inhales the overall structure diagram for surveying binding test device.
Fig. 2 is to inhale the structural schematic diagram for surveying component.
Fig. 3 is the enlarged diagram at the A of Fig. 1.
Include in figure:
Measuring head 1 is inhaled and surveys component 11, product to be tested storing cavity 111, pressure head test board 12, probe 121,
Test carries seat 2, optical integrated circuit putting position 21, test mounted circuit board 22, double end testing needle 23,
Light cylinder 3.
Specific embodiment
The utility model is further described with the following Examples.
A kind of optical integrated circuit of the present embodiment, which is inhaled, surveys binding test device, as shown in Figure 1, integrated for testing optics
Circuit (i.e. chip) comprising measuring head 1, test carry seat 2 and light source.
Measuring head 1 includes that component 11 is surveyed in two suctions, and each suction surveys component 11 including pressure head test board 12 and for inhaling
Take the suction piece of optical integrated circuit, pressure head test board 12 is equipped with telescopic probe 121, when test, probe 121 stretch out and
The pin on the surface of optical integrated circuit contacts.
The surface that test carries seat 2 is set there are four optical integrated circuit putting position 21, the position of optical integrated circuit putting position 21
It sets and inhales and survey the one-to-one correspondence of component 11, test the back side for carrying seat 2 equipped with test mounted circuit board 22, have double end testing needle 23 across survey
Examination, which carries seat 2 and both ends and exposes to test, carries seat 2, when test, the back side of the upper end and optical integrated circuit of double end testing needle 23
Pin contact, the lower end of double end testing needle 23 and test mounted circuit board 22 contact.
Pressure head test board 12 and test mounted circuit board 22 are electrically connected, and test mounted circuit board 22 passes through winding displacement connecting test machine.
Test carries seat 2 and is equipped with through-hole, and the position of through-hole and the position of optical integrated circuit putting position 21 are corresponding, light cylinder 3
Positioned at the lower section of test mounted circuit board 22, light is from the back side of through-hole directive optical integrated circuit, the position of light cylinder 3 and optics
The position of integrated circuit putting position 21 corresponds, and light cylinder 3 can will prevent light from losing because of scattering, illumination brightness can be improved.
Wherein, the measuring head 1 includes that product to be tested puts cavity 111, which is equipped with 121 hole of vacuum hole and probe, visits
Needle 121 is extended and retracted from 121 hole of probe.
The working principle of the present embodiment is as follows:
When vacuum hole absorption chip, chip is placed in cavity, and chip is placed into optical integrated circuit putting position by measuring head 1
After 21, measuring head 1 stretches out probe 121, and probe 121 is contacted with the pin on the surface of chip, tested with the surface to chip,
The pin at the back side on the top and chip of double end testing needle 23 contacts, bottom end and the test mounted circuit board 22 of double end testing needle 23
Position contact is tested, meanwhile, 3 polishing of light cylinder, light is from the back side of through-hole directive chip, to realize that the polishing to the back side of chip is surveyed
Examination, and then realize the two-sided test to the chip, two-sided test is disposably completed, needs to test phase in two times with the prior art
Than working efficiency is higher.
A kind of optical integrated circuit of the present embodiment, which is inhaled, surveys binding test device, by increasing pressure head test in measuring head 1
Plate 12, pressure head test board 12 and test mounted circuit board 22 are electrically connected, i.e., test mounted circuit board 22 are guided to measuring head 1, i.e., available
Measuring head 1 tests the surface of optical integrated circuit, and double end testing needle 23 is equipped on seat 2 by optical integrated circuit by carrying in test
The back side and test mounted circuit board 22 connect, the back side of optical integrated circuit can be tested, meanwhile, test carry seat 2 set
There is through-hole, the back side for the light of light cylinder 3 to be led to optical integrated circuit carries out polishing test, and then can reach existing
On the basis of the test device of optical integrated circuit, it is improved to be able to achieve the two-sided survey for the optical integrated circuit for needing polishing to test
The device of examination surveys component 11 because having suction piece in the suction that measuring head 1 is arranged, can draw optical integrated circuit to be tested
And be placed into the test load corresponding optical integrated circuit putting position 21 of seat 2 and tested, it draws and test is combined together, into one
Step improves working efficiency.
Finally it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than to this reality
With the limitation of novel protected range, although being explained in detail referring to preferred embodiment to the utility model, this field it is general
Lead to it will be appreciated by the skilled person that can be with the technical solution of the present invention is modified or equivalently replaced, without departing from this
The spirit and scope of utility model technical solution.
Claims (5)
1. a kind of optical integrated circuit, which is inhaled, surveys binding test device, for testing optical integrated circuit, it is characterised in that:Including surveying
Head, test load seat and light source are tried,
Measuring head includes that at least one is inhaled and surveys component, and each suctions survey component includes pressure head test board and for drawing optics collection
At the suction piece of circuit, pressure head test board is equipped with telescopic probe, and when test, probe stretches out and the table of optical integrated circuit
The pin in face contacts,
The surface that test carries seat is equipped at least one optical integrated circuit putting position, the position of optical integrated circuit putting position and suction
It surveys component to correspond, the back side that test carries seat is equipped with test mounted circuit board, has double end testing needle to pass through test and carries seat and both ends
It exposes to test and carries seat, when test, the pin contact at the back side of the upper end and optical integrated circuit of double end testing needle, double end test
The lower end of needle and test machine circuit board contacts,
Pressure head test board and test machine circuit board electrical connection,
Test carries seat and is equipped with through-hole, and the position of through-hole and the position of optical integrated circuit putting position are corresponding, and light source is located at test
The lower section of mounted circuit board, light are set from the back side of through-hole directive optical integrated circuit, the position of light source and optical integrated circuit
The position for putting position corresponds.
2. a kind of optical integrated circuit as described in claim 1, which is inhaled, surveys binding test device, it is characterised in that:The measuring head
Cavity is put including product to be tested, which is equipped with vacuum hole and probe aperture, and probe is extended and retracted from probe aperture.
3. a kind of optical integrated circuit as described in claim 1, which is inhaled, surveys binding test device, it is characterised in that:Light source is set as light
Cylinder.
4. a kind of optical integrated circuit as described in claim 1, which is inhaled, surveys binding test device, it is characterised in that:Each measuring head
If there are two inhale to survey component.
5. a kind of optical integrated circuit as described in claim 1, which is inhaled, surveys binding test device, it is characterised in that:Each test carries
Seat is set there are four optical integrated circuit putting position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820636457.5U CN208140821U (en) | 2018-04-28 | 2018-04-28 | A kind of optical integrated circuit suction survey binding test device |
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CN201820636457.5U CN208140821U (en) | 2018-04-28 | 2018-04-28 | A kind of optical integrated circuit suction survey binding test device |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111624463A (en) * | 2020-05-12 | 2020-09-04 | 通富微电子股份有限公司 | Integrated circuit testing device |
CN112014721A (en) * | 2020-09-01 | 2020-12-01 | 珠海景旺柔性电路有限公司 | Universal LCR test board and manufacturing method thereof |
CN113567713A (en) * | 2021-07-22 | 2021-10-29 | 昆山沃得福自动化设备有限公司 | Chip test carrier |
CN113917316A (en) * | 2021-10-14 | 2022-01-11 | 池州华宇电子科技股份有限公司 | High-precision chip testing jig |
-
2018
- 2018-04-28 CN CN201820636457.5U patent/CN208140821U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111624463A (en) * | 2020-05-12 | 2020-09-04 | 通富微电子股份有限公司 | Integrated circuit testing device |
CN112014721A (en) * | 2020-09-01 | 2020-12-01 | 珠海景旺柔性电路有限公司 | Universal LCR test board and manufacturing method thereof |
CN112014721B (en) * | 2020-09-01 | 2023-04-11 | 珠海景旺柔性电路有限公司 | Universal LCR test board and manufacturing method thereof |
CN113567713A (en) * | 2021-07-22 | 2021-10-29 | 昆山沃得福自动化设备有限公司 | Chip test carrier |
CN113917316A (en) * | 2021-10-14 | 2022-01-11 | 池州华宇电子科技股份有限公司 | High-precision chip testing jig |
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