CN220189617U - Metal ceramic tube shell with prefabricated solder - Google Patents
Metal ceramic tube shell with prefabricated solder Download PDFInfo
- Publication number
- CN220189617U CN220189617U CN202221643162.3U CN202221643162U CN220189617U CN 220189617 U CN220189617 U CN 220189617U CN 202221643162 U CN202221643162 U CN 202221643162U CN 220189617 U CN220189617 U CN 220189617U
- Authority
- CN
- China
- Prior art keywords
- solder
- welding area
- preform according
- tube housing
- solder preform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 70
- 239000000919 ceramic Substances 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 title abstract description 7
- 239000002184 metal Substances 0.000 title abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 26
- 230000000903 blocking effect Effects 0.000 claims abstract description 23
- 239000012943 hotmelt Substances 0.000 claims abstract description 18
- 239000011195 cermet Substances 0.000 claims description 11
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 10
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 9
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims 2
- 238000003892 spreading Methods 0.000 abstract description 8
- 230000007480 spreading Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Abstract
The utility model provides a metal ceramic tube shell with prefabricated solder, which comprises a tube shell body, wherein a die welding area is arranged in the tube shell body, a blocking groove is formed along the edge of the upper surface of the die welding area, the prefabricated solder is fixedly arranged in the center of an area surrounded by the blocking groove, a hot melt film is attached above the area surrounded by the blocking groove, and a solder sheet is arranged between the hot melt film and the die welding area. According to the utility model, the hot-melt film is used for coating the welding area of the chip and the solder piece, so that the solder piece is protected, the solder piece is prevented from falling off in the transportation and transfer process, the hot-melt film is melted while the solder piece is heated, melted and spread, the chip is fixed, and the range of the melted and spread of the solder piece is limited by adopting the blocking groove, so that the solder spreading range is prevented from being overlarge.
Description
Technical Field
The utility model belongs to the technical field of chip packaging, and particularly relates to a metal ceramic tube shell with prefabricated solder.
Background
In chip packaging, a chip is required to be fixed at a preset position in a tube shell by using a solder sheet or solder paste, and then the chip is packaged by the tube shell, but in the chip fixing process, a technician is required to confirm the preset position by using the chip, then place the solder sheet at the preset position for heating until the solder sheet is melted and expanded, and then place the chip at the position after the expansion of the solder sheet, wait for the solder to cool and solidify, and finish the fixing work.
Disclosure of Invention
In view of the above, the present utility model is directed to a metal-ceramic package with a solder preform to improve the packaging efficiency of the chip and the long-term reliability.
In order to achieve the above purpose, the technical scheme of the utility model is realized as follows:
the utility model provides a cermet tube shell with prefabricated solder, includes the tube shell body, is equipped with the die bonding district in it, opens along die bonding district upper surface edge has the baffle groove, prefabricated solder sets firmly in the center that the baffle groove surrounded the region, and is in the top that the baffle groove surrounded the region, has attached the hot melt film, the solder piece is arranged in between hot melt film and the die bonding district.
Further, a plurality of annular guide ring grooves are sequentially arranged along the outward direction of the center of the chip welding area.
Further, a plurality of 'mouth' -shaped flow guiding ring grooves are sequentially arranged along the outward direction of the center of the chip welding area.
Further, the distance between every two guide ring grooves increases from the center of the area surrounded by the blocking ring.
Further, a plurality of diversion trenches are formed in the chip welding area, the diversion trenches are radially arranged with the middle of the chip welding area as the center, and the diversion trenches are communicated with the diversion ring grooves.
Further, a plurality of pins penetrate through the side wall of the tube shell, and the middle parts of the pins are fixedly connected with the side wall of the tube shell through insulating sleeves.
Further, a plurality of insulation columns are fixedly arranged in the tube shell, and the inner ends of the tube pins are fixedly connected with the insulation columns.
Furthermore, the shell further comprises a bottom plate, wherein a tungsten copper bottom plate and a beryllium oxide insulating sheet are sequentially and fixedly arranged on the bottom plate from bottom to top, and the chip welding area is made of the beryllium oxide insulating sheet.
Further, the depth of the guide ring groove is smaller than that of the blocking groove.
Further, the depth of the diversion trench is smaller than that of the diversion trench.
Compared with the prior art, the metal ceramic tube shell with the prefabricated solder has the following advantages:
according to the utility model, the hot-melt film is used for coating the welding area of the chip and the solder piece, so that the solder piece is protected, the solder piece is prevented from falling off in the transportation and transfer process, meanwhile, the hot-melt film is melted when the solder piece is heated, melted and spread, the chip is fixed, and the range of the melted and spread of the solder piece is limited by adopting the blocking groove, so that the solder spreading range is prevented from being overlarge;
the adoption of a plurality of circles of annular guide ring grooves enables solder to be uniformly spread in the melting process;
radial diversion trenches are adopted so as to facilitate outward spreading of the melted solder pieces, reduce the void ratio after welding and improve the long-term reliability of chip welding.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:
FIG. 1 is a schematic cross-sectional view of the internal structure of a cartridge according to the present utility model;
FIG. 2 is a schematic diagram of a distribution structure of annular diversion trenches in a chip bonding area;
fig. 3 is a schematic diagram of a distribution structure of "mouth" shaped diversion trenches in a die bonding area.
Reference numerals illustrate:
1-a tube shell body; an 11-iron-nickel alloy frame; 12-tungsten copper bottom plate; 13-beryllium oxide insulating sheet; 14-an insulating sleeve; 15-insulating columns; 16-pins; 2-die bond pads; 21-a blocking groove; 22-a diversion ring groove; 23-diversion trenches; 3-solder sheets; 4-hot melt film.
Detailed Description
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
The utility model will be described in detail below with reference to the drawings in connection with embodiments.
The metal ceramic tube shell with the prefabricated solder comprises a tube shell body 1 formed by surrounding an iron-nickel alloy frame 11 and a tungsten copper base plate 12, wherein a beryllium oxide insulating sheet 13 is fixedly arranged on the upper surface of the tungsten copper base plate 12, the upper surface of the beryllium oxide insulating sheet 13 is used as a die welding area 2 in the embodiment, and a die and the beryllium oxide insulating sheet 13 are required to be fixed in production. In order to simplify the preparation work for fixing the chip in the subsequent work, a prefabricated solder sheet 3 needs to be fixed in the middle of the chip bonding area 2, specifically, the solder sheet 3 is placed at a preset position of the chip bonding area 2, then a hot-melt film 4 is attached to the upper surface of a beryllium oxide insulating sheet 13, meanwhile, the solder sheet 3 is covered between the hot-melt film 4 and the beryllium oxide insulating sheet 13, the solder sheet 3 is fixed and protected through the hot-melt film 4, in the chip mounting process, the solder sheet 3 is heated, so that the solder sheet 3 is melted, the chip fixing is completed, meanwhile, in the heating process, the hot-melt film 4 is heated and melted, the influence of the hot-melt film 4 on the chip mounting is prevented, and the hot-melt film 4 can be a plastic film such as PE.
In order to prevent the solder sheet 3 from falling out of the die bonding area 2 in the process of melting and spreading, a blocking groove 21 is formed on a die-defining platform, the blocking groove 21 is arranged along the edge of the die bonding area 2, so that the solder sheet 3 can flow into the blocking groove 21 after being melted and spread to the edge of the die bonding area 2 to prevent molten solder from continuously flowing out, a plurality of flow guiding ring grooves 22 are formed on the die bonding area 2, the flow guiding ring grooves 22 are in an elliptic shape or a 'mouth' shape, the plurality of flow guiding ring grooves 22 are concentrically arranged at the center of the die bonding area 2, the interval between every two flow guiding ring grooves sequentially increases from the center of an area surrounded by the blocking ring to the outside, in particular, the interval between two flow guiding ring grooves 22 close to the center is smaller than the interval between two flow guiding ring grooves 22 close to the blocking groove 21. Through the diversion ring groove 22, during the molten solder spreading process, the solder flows into the diversion ring groove 22 of the innermost ring first, when the solder is biased or flows to one side only, the solder flows into the diversion ring groove 22, the area surrounded by the diversion ring groove 22 of the innermost ring is paved by the solder first due to the influence of the liquid tension, then flows into the area surrounded by the diversion ring groove 22 of the next ring, and so on, the solder gradually flows outwards with the center of the chip welding area 2, and the solder spreading is completed, so that the chip is fixed conveniently.
In order to facilitate the solder to flow on the die-bonding area 2, a plurality of diversion trenches 23 are opened on the die-bonding area 2, the diversion trenches 23 are radially arranged with the middle of the die-bonding area 2 as the center, the diversion trenches 23 are communicated with the diversion trench 22, and the depth of the diversion trenches 23 is smaller than that of the diversion trench 22, so that the molten solder is limited by the trench walls of the diversion trench 22, the solder spreading direction deviation caused by the solder bias or the unidirectional flow passage is avoided, the depth of the blocking trench 21 is larger than that of the diversion trench 22 for the solder to flow out of the range surrounded by the blocking trench 21, and the width of the blocking trench 21 is also larger than that of the diversion trench 22, so that the blocking trench 21 can more accommodate the molten solder to prevent the solder outflow.
The tube shell is internally and fixedly provided with a plurality of insulation columns 15, and the inner ends of the tube pins 16 are fixedly connected with the insulation columns 15, so that the inner ends of the tube pins 16 are stable. It should be understood by those skilled in the art that after the die is soldered, the pins 16 may be bonded to corresponding pins of the die by wires or wires of aluminum, and the structures such as the guide grooves, the blocking grooves, the ring grooves in the die bonding area may be formed by etching, etc. which will not be described herein.
In use, the metal ceramic tube shell with the prefabricated solder is heated by special heating equipment such as a heating table, so that the solder and the hot-melt film 4 are gradually melted to be in a molten state when being heated, and then the chip is placed at a preset position along with the complete spreading of the molten state solder, and the solder is solidified to finish welding and fixing.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (10)
1. A cermet tube housing with a pre-fabricated solder, characterized by: the welding device comprises a tube shell body, wherein a die welding area is arranged in the tube shell body, a blocking groove is formed along the edge of the upper surface of the die welding area, the prefabricated welding flux is fixedly arranged in the area surrounded by the blocking groove, a hot melt film is attached above the area surrounded by the blocking groove, and a welding flux sheet is arranged between the hot melt film and the die welding area.
2. A cermet tube housing with a solder preform according to claim 1, wherein: along the outward direction of the center of the chip welding area, a plurality of annular guide ring grooves are sequentially arranged.
3. A cermet tube housing with a solder preform according to claim 1, wherein: a plurality of 'mouth' -shaped flow guiding ring grooves are sequentially arranged along the outward direction of the center of the chip welding area.
4. A cermet tube housing with a solder preform according to claim 2 or 3, characterized in that: the distance between the two guide ring grooves increases from the center of the area surrounded by the blocking ring.
5. A cermet tube housing with a solder preform according to claim 4 wherein: the chip welding area is provided with a plurality of diversion trenches, and the diversion trenches are radially arranged by taking the middle part of the chip welding area as the center, and the diversion trenches are communicated with the diversion ring grooves.
6. A cermet tube housing with a solder preform according to claim 1, wherein: the middle part of the pin penetrates through the side wall of the tube shell, and is fixedly connected with the side wall of the pin through an insulating sleeve.
7. A cermet tube housing with a solder preform according to claim 6 wherein: a plurality of insulating columns are fixedly arranged in the tube shell, and the inner ends of the tube pins are fixedly connected with the insulating columns.
8. A cermet tube housing with a solder preform according to claim 1, wherein: the shell also comprises a bottom plate, wherein a tungsten copper bottom plate and a beryllium oxide insulating sheet are sequentially and fixedly arranged on the bottom plate from bottom to top, and the chip welding area is made of the beryllium oxide insulating sheet.
9. A cermet tube housing with a solder preform according to claim 5 wherein: the depth of the guide ring groove is smaller than that of the blocking groove.
10. A cermet tube housing with a solder preform according to claim 5 wherein: the depth of the diversion trench is smaller than that of the diversion trench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221643162.3U CN220189617U (en) | 2022-06-29 | 2022-06-29 | Metal ceramic tube shell with prefabricated solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221643162.3U CN220189617U (en) | 2022-06-29 | 2022-06-29 | Metal ceramic tube shell with prefabricated solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220189617U true CN220189617U (en) | 2023-12-15 |
Family
ID=89111526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221643162.3U Active CN220189617U (en) | 2022-06-29 | 2022-06-29 | Metal ceramic tube shell with prefabricated solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220189617U (en) |
-
2022
- 2022-06-29 CN CN202221643162.3U patent/CN220189617U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0167800B1 (en) | Semiconductor device and method of producing the same | |
| US20190033006A1 (en) | Ultra Thin Heat Exchangers For Thermal Management | |
| JP2003272949A (en) | Chip capacitor, its manufacturing method, and anode terminal plate | |
| TW579555B (en) | Semiconductor chip package and packaging of integrated circuit chip in electronic apparatus | |
| CN111123430B (en) | Packaging method of phase-control optical waveguide chip | |
| WO2008131587A1 (en) | Heat pipe and manufacturing method thereof | |
| CN220189617U (en) | Metal ceramic tube shell with prefabricated solder | |
| JP4494587B2 (en) | Optical semiconductor device package and optical semiconductor device module using the package | |
| CN110867416B (en) | Power semiconductor module packaging structure | |
| CN106169453A (en) | The manufacture method of semiconductor device, metal parts and semiconductor device | |
| CN105633064A (en) | Semiconductor assembly and preparation method thereof | |
| JP2005191178A (en) | Semiconductor device | |
| CN103814270B (en) | Side path annex for heat exchanger | |
| CN109494205A (en) | A kind of copper folder stack chip structure and its packaging method | |
| CN108422059B (en) | Brazing die and brazing method for packaging shell | |
| US6111309A (en) | Semiconductor device | |
| JP5838910B2 (en) | Cooler and method for manufacturing cooler | |
| CN103762201A (en) | MEMS sensor, semiconductor package device and method | |
| CN218939643U (en) | Diode packaging tube shell structure | |
| CN112839498A (en) | Aluminum brazing type soaking plate | |
| TW202125720A (en) | Semiconductor devices and methods of manufacturing semiconductor devices | |
| CN219017647U (en) | Integrated circuit lead frame | |
| CN211879771U (en) | Semiconductor laser device easy to package | |
| CN217182181U (en) | DrMos | |
| CN110493954A (en) | PCB construction and preparation method thereof is buried in a kind of QFN device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |