CN218939643U

CN218939643U - Diode packaging tube shell structure

Info

Publication number: CN218939643U
Application number: CN202221643450.9U
Authority: CN
Inventors: 王秀静
Original assignee: Tianjin Weitong Aerospace Technology Co ltd
Current assignee: Tianjin Weitong Aerospace Technology Co ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2023-04-28
Anticipated expiration: 2032-06-29

Abstract

The utility model provides a diode packaging tube shell structure, which comprises a tube shell body and a guide vane, wherein the tube shell body is fixedly provided with three electrodes, and the guide vane spans two electrodes arranged in the tube shell body and is fixedly connected with the two electrodes; the upper surfaces of the two electrodes fixedly connected with the guide vane are respectively provided with a blocking groove, the blocking grooves are arranged along the edges of the electrodes, and the guide vane can be covered and pressed above the blocking grooves. According to the utility model, the original two electrodes of the tube shell are connected by the guide plate, and one electrode on the diode is connected with the guide plate in operation, so that the connection reliability of the electrode on the diode is increased, the contact area is increased, and the current is more uniform and reliable in operation.

Description

Diode packaging tube shell structure

Technical Field

The utility model belongs to the field of electronic product packaging, and particularly relates to a diode packaging tube shell.

Background

When high-power diode encapsulation, because the PCB circuit design needs, often can utilize current encapsulation tube shell, with one of them electrode of diode through aluminium silk and two electrode bonding in the tube shell, the function of two pins of tube shell is the same to in order to realize the function of diode, after external circuit connection tube shell, can realize the function of diode through the mode of connecting two electrodes simultaneously, but this kind of mode appears the pin easily and leads electric capacity not enough, perhaps the poor problem of on-current homogeneity, can influence the long-term reliability of device.

Disclosure of Invention

In view of this, the present utility model aims to propose a diode packaging tube structure, so that the current of the diode is more stable during the operation.

In order to achieve the above purpose, the technical scheme of the utility model is realized as follows:

the diode packaging tube shell structure comprises a tube shell body and a guide vane, wherein the tube shell body is fixedly provided with three electrodes, and the guide vane spans two electrodes arranged in the tube shell body and is fixedly connected with the two electrodes;

the upper surfaces of the two electrodes fixedly connected with the guide vane are respectively provided with a blocking groove, the blocking grooves are arranged along the edges of the electrodes, and the guide vane can be covered and pressed above the blocking grooves.

Further, a plurality of annular grooves are formed in the area surrounded by the blocking grooves, the annular grooves are concentrically arranged, and the distance between every two adjacent annular grooves is gradually increased along the center outwards direction.

Furthermore, a plurality of diversion trenches are formed in each electrode, and the diversion trenches are radially arranged by taking the center of the electrode plate as a reference.

Further, the depth of the blocking groove is larger than that of the annular groove.

Further, the depth of the blocking groove is larger than that of the diversion trench.

Furthermore, a plurality of limiting strips are fixedly arranged on the lower surface of the guide vane, and when the guide vane is contacted with the electrode, the limiting strips can be clamped at the edge of the electrode.

Further, a plurality of limit strips surround to form a positioning space, and a part of the limit strips facing the inner side of the positioning space is provided with a guide surface.

Compared with the prior art, the diode packaging tube shell structure has the following advantages:

according to the utility model, the original two electrodes of the tube shell are connected by the guide plate, one electrode on the diode is connected with the guide plate in operation, so that the connection reliability of the electrode on the diode is increased, the contact area is increased, and the current is more uniform and reliable in operation;

the electrode is provided with the diversion trench and the diversion trench, so that when welding is carried out between the diversion trench and the diversion trench by using the soldering paste or the soldering lug, the soldering paste or the soldering lug can be uniformly spread on the electrode, the welding quality is ensured, and the reliability of electric connection between the diversion trench and the electrode of the tube shell is improved;

the guide plate is conveniently positioned by arranging the limiting strips on the guide plate, so that the guide plate is prevented from sliding in a shifting manner when the soldering paste is in a molten state.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 is a schematic diagram of the overall structure of a cartridge;

FIG. 2 is a schematic view of an explosive structure of a tube shell and a deflector;

fig. 3 is a schematic view of the lower surface structure of the deflector.

Reference numerals illustrate:

1-a tube shell body; 11-a first electrode; 12-a second electrode; 121-a blocking groove; 122-ring groove; 123-diversion trenches; 13-a third electrode; 2-a deflector; 21-a limit bar; 22-guide surface.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

The utility model will be described in detail below with reference to the drawings in connection with embodiments.

The utility model relates to a diode packaging tube shell structure, which comprises a tube shell body 1 and a guide vane 2, wherein the tube shell body 1 is fixedly provided with three electrodes, the guide vane 2 is spanned between two electrodes arranged in the tube shell body and fixedly connected with the two electrodes, in particular to the embodiment, the three electrodes are divided into a first electrode 11, a second electrode 12 and a third electrode 13, and the three electrodes are distributed in a delta shape, wherein the first electrode 11 is arranged at one end of the tube shell, the second electrode 13 and the third electrode 13 are arranged at the other end of the tube shell, and the guide vane 2 is fixedly connected with the second electrode 12 and the third electrode 13, so that the two electrodes are electrically connected;

the upper surfaces of the second electrode 12 and the third electrode 13 are provided with a blocking groove 121, the blocking groove 121 is annular and is arranged along the edge of the electrode, a plurality of annular grooves 122 and a plurality of diversion grooves 123 are arranged in the range surrounded by the blocking groove 121, the diversion grooves 123 are radially arranged by taking the center of the electrode as a reference, the annular grooves 122 are concentrically arranged, and the annular grooves 122 are concentric with the blocking groove 121; the interval before every two adjacent ring grooves 122 gradually increases along the outward direction of the center, in operation, an operator smears or places soldering paste or soldering paste on an electrode, optimally, places soldering paste on the middle part of the electrode, then heats, as the soldering paste melts, the soldering paste in a molten state spreads outwards from the middle part of the electrode, during spreading, under the blocking and drainage of the wall of the ring groove 122, the soldering paste will firstly spread over the range surrounded by the ring groove 122 of the innermost ring, then continues to spread outwards along with the increase of molten material, the ring grooves 122 are sequentially spread from inside to outside until the soldering paste is completely in a molten state, meanwhile, after the guide sheet 2 is pressed on the electrode, the soldering paste continues to spread outwards under the pressure and the tension of molten liquid, and flows into the blocking groove 121, the overflow of the soldering paste is prevented, the depth of the blocking groove 121 is larger than the depth of the ring groove 122, so that the wall of the ring groove 122 can continuously flow along the guide groove 123 until the molten soldering paste is excessively large, the wall of the ring groove 122 continues to flow towards the next ring groove 122, and the depth of the blocking groove 121 is larger than the depth of the guide groove 123, and the overflow of the soldering paste is prevented.

In order to be more convenient for the welded fastening of guide vane 2, prevent guide vane 2 skew, guide vane 2 lower surface has set firmly many spacing bars 21, and many spacing bars 21 form two location spaces through the form of encirclement or semi-encirclement, when the installation, place second electrode 12 and third electrode 13 in the location space, it is spacing to guide vane 2 and electrode, prevent guide vane 2 skew and lead to the poor contact, when guide vane 2 and electrode contact, spacing bar 21 can block in the electrode edge, and the part of spacing bar 21 orientation location space inboard is opened there is guide surface 22, thereby the operator of being more convenient for confirm guide vane 2 position, it should be known to the person skilled in the art that spacing bar 21 should be used for on the product that tube shell upper surface and electrode upper surface have certain difference in height, when electrode and tube shell upper surface are in the coplanar, it is not suitable for spacing bar 21 structure.

In the diode packaging tube shell structure, in the use process, a preset amount of soldering paste is firstly smeared on the electrodes and heated, so that the soldering paste is melted, the guide plates 2 are fixed on the two electrodes, so that the two electrodes are communicated, then the first electrode 11 and the guide plates 2 are smeared with the soldering paste again and heated, the diode is fixed on the first electrode 11 and the guide plates 2, and during the secondary heating, the position relation between the second electrode 12 and the third electrode 13 and the guide plates 2 is unchanged due to the effect of the limiting plates, so that the influence of secondary heating on the welding fixation between the guide plates 2 and the electrodes is prevented; or the soldering paste soldering lug can be smeared or fixed on the flow deflector 2 firstly, and after the flow deflector 2 is placed on the second electrode 12 and the third electrode 13, the flow deflector 2 and the diode are welded and fixed simultaneously after heating.

The structures such as the guide groove, the blocking groove and the ring groove on each electrode can be processed and molded in an etching mode.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. A diode package tube housing structure, characterized in that: the electrode structure comprises a tube shell body and a guide vane, wherein the tube shell body is fixedly provided with three electrodes, and the guide vane spans two electrodes arranged in the tube shell body and is fixedly connected with the two electrodes;

2. A diode package structure as claimed in claim 1, wherein: the blocking groove surrounds the area, a plurality of annular grooves are formed in the area, the annular grooves are concentrically arranged, and the distance between every two adjacent annular grooves is gradually increased along the center outwards direction.

3. A diode package structure as claimed in claim 2, wherein: each electrode is provided with a plurality of diversion trenches, and the diversion trenches are radially arranged by taking the center of the electrode plate as a reference.

4. A diode package structure according to claim 3, wherein: the depth of the blocking groove is greater than the depth of the annular groove.

5. A diode package structure according to claim 3, wherein: the depth of the blocking groove is greater than that of the diversion trench.

6. A diode package structure as claimed in claim 1, wherein: the lower surface of the guide vane is fixedly provided with a plurality of limit strips, and when the guide vane is contacted with the electrode, the limit strips can be clamped at the edge of the electrode.

7. A diode package structure as claimed in claim 6, wherein: the plurality of limit strips surround to form a positioning space, and a part of the limit strips facing the inner side of the positioning space is provided with a guide surface.