CN220187503U - 均热板以及电子设备 - Google Patents

均热板以及电子设备 Download PDF

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Publication number
CN220187503U
CN220187503U CN202190000558.3U CN202190000558U CN220187503U CN 220187503 U CN220187503 U CN 220187503U CN 202190000558 U CN202190000558 U CN 202190000558U CN 220187503 U CN220187503 U CN 220187503U
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CN
China
Prior art keywords
porous body
wall surface
flow path
vapor chamber
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202190000558.3U
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English (en)
Chinese (zh)
Inventor
若冈拓生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
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Publication of CN220187503U publication Critical patent/CN220187503U/zh
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202190000558.3U 2020-06-19 2021-05-12 均热板以及电子设备 Active CN220187503U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-106262 2020-06-19
JP2020106262 2020-06-19
PCT/JP2021/018069 WO2021256126A1 (ja) 2020-06-19 2021-05-12 ベーパーチャンバー

Publications (1)

Publication Number Publication Date
CN220187503U true CN220187503U (zh) 2023-12-15

Family

ID=79267792

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202190000558.3U Active CN220187503U (zh) 2020-06-19 2021-05-12 均热板以及电子设备

Country Status (4)

Country Link
JP (1) JPWO2021256126A1 (https=)
CN (1) CN220187503U (https=)
TW (1) TWI827944B (https=)
WO (1) WO2021256126A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114727546B (zh) * 2022-02-23 2023-04-28 华为技术有限公司 一种散热装置和电子设备
TWI846369B (zh) * 2022-03-25 2024-06-21 日商村田製作所股份有限公司 熱擴散裝置及電子機器
WO2023182033A1 (ja) * 2022-03-25 2023-09-28 株式会社村田製作所 熱拡散デバイス及び電子機器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002206882A (ja) * 2000-10-31 2002-07-26 Tokai Rubber Ind Ltd シート状ヒートパイプおよびその製法
TWI425178B (zh) * 2008-02-05 2014-02-01 Nat Applied Res Laboratories A Closed Groove Heat Pipe Capillary Structure
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
US10264707B2 (en) * 2014-10-14 2019-04-16 Korea Advanced Institute Of Science And Technology Flat plate pulsating heat pipe applicable at various angles and method of manufacturing same
TWI571197B (zh) * 2014-12-04 2017-02-11 超眾科技股份有限公司 薄型均溫板及其毛細結構
JP6564879B2 (ja) * 2015-12-18 2019-08-21 株式会社フジクラ ベーパーチャンバー
JPWO2018147283A1 (ja) * 2017-02-07 2019-07-18 古河電気工業株式会社 ベーパーチャンバ
JP6988170B2 (ja) * 2017-04-28 2022-01-05 株式会社村田製作所 ベーパーチャンバー
DE112018003831T5 (de) * 2017-07-28 2020-04-09 Dana Canada Corporation Ultradünne wärmetauscher für das wärmemanagement
JP6442594B1 (ja) * 2017-12-25 2018-12-19 株式会社フジクラ 放熱モジュール
JP6951267B2 (ja) * 2018-01-22 2021-10-20 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP6988681B2 (ja) * 2018-05-11 2022-01-05 富士通株式会社 ヒートパイプ及び電子機器
JP2020076522A (ja) * 2018-11-06 2020-05-21 東芝ホームテクノ株式会社 シート状ヒートパイプ
CN109579584A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄环路均热板
CN209546220U (zh) * 2019-01-14 2019-10-25 唐山达创传导科技有限公司 超薄导热装置

Also Published As

Publication number Publication date
WO2021256126A1 (ja) 2021-12-23
TW202219450A (zh) 2022-05-16
TWI827944B (zh) 2024-01-01
JPWO2021256126A1 (https=) 2021-12-23

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