JPWO2021256126A1 - - Google Patents

Info

Publication number
JPWO2021256126A1
JPWO2021256126A1 JP2022520544A JP2022520544A JPWO2021256126A1 JP WO2021256126 A1 JPWO2021256126 A1 JP WO2021256126A1 JP 2022520544 A JP2022520544 A JP 2022520544A JP 2022520544 A JP2022520544 A JP 2022520544A JP WO2021256126 A1 JPWO2021256126 A1 JP WO2021256126A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022520544A
Other versions
JPWO2021256126A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021256126A1 publication Critical patent/JPWO2021256126A1/ja
Publication of JPWO2021256126A5 publication Critical patent/JPWO2021256126A5/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022520544A 2020-06-19 2021-05-12 Pending JPWO2021256126A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020106262 2020-06-19
PCT/JP2021/018069 WO2021256126A1 (ja) 2020-06-19 2021-05-12 ベーパーチャンバー

Publications (2)

Publication Number Publication Date
JPWO2021256126A1 true JPWO2021256126A1 (ja) 2021-12-23
JPWO2021256126A5 JPWO2021256126A5 (ja) 2022-06-10

Family

ID=79267792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022520544A Pending JPWO2021256126A1 (ja) 2020-06-19 2021-05-12

Country Status (4)

Country Link
JP (1) JPWO2021256126A1 (ja)
CN (1) CN220187503U (ja)
TW (1) TWI827944B (ja)
WO (1) WO2021256126A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114727546B (zh) * 2022-02-23 2023-04-28 华为技术有限公司 一种散热装置和电子设备
TW202344793A (zh) * 2022-03-25 2023-11-16 日商村田製作所股份有限公司 熱擴散裝置及電子機器
WO2023182033A1 (ja) * 2022-03-25 2023-09-28 株式会社村田製作所 熱拡散デバイス及び電子機器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002206882A (ja) * 2000-10-31 2002-07-26 Tokai Rubber Ind Ltd シート状ヒートパイプおよびその製法
WO2017104819A1 (ja) * 2015-12-18 2017-06-22 株式会社フジクラ ベーパーチャンバー
WO2018147283A1 (ja) * 2017-02-07 2018-08-16 古河電気工業株式会社 ベーパーチャンバ
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
US20190033006A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation Ultra Thin Heat Exchangers For Thermal Management
CN109579584A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄环路均热板
JP2019113270A (ja) * 2017-12-25 2019-07-11 株式会社フジクラ 放熱モジュール
JP2019128058A (ja) * 2018-01-22 2019-08-01 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP2019196886A (ja) * 2018-05-11 2019-11-14 富士通株式会社 ヒートパイプ及び電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425178B (zh) * 2008-02-05 2014-02-01 Nat Applied Res Laboratories A Closed Groove Heat Pipe Capillary Structure
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
US10264707B2 (en) * 2014-10-14 2019-04-16 Korea Advanced Institute Of Science And Technology Flat plate pulsating heat pipe applicable at various angles and method of manufacturing same
TWI571197B (zh) * 2014-12-04 2017-02-11 超眾科技股份有限公司 薄型均溫板及其毛細結構
JP2020076522A (ja) * 2018-11-06 2020-05-21 東芝ホームテクノ株式会社 シート状ヒートパイプ
CN209546220U (zh) * 2019-01-14 2019-10-25 唐山达创传导科技有限公司 超薄导热装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002206882A (ja) * 2000-10-31 2002-07-26 Tokai Rubber Ind Ltd シート状ヒートパイプおよびその製法
WO2017104819A1 (ja) * 2015-12-18 2017-06-22 株式会社フジクラ ベーパーチャンバー
WO2018147283A1 (ja) * 2017-02-07 2018-08-16 古河電気工業株式会社 ベーパーチャンバ
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
US20190033006A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation Ultra Thin Heat Exchangers For Thermal Management
JP2019113270A (ja) * 2017-12-25 2019-07-11 株式会社フジクラ 放熱モジュール
JP2019128058A (ja) * 2018-01-22 2019-08-01 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP2019196886A (ja) * 2018-05-11 2019-11-14 富士通株式会社 ヒートパイプ及び電子機器
CN109579584A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄环路均热板

Also Published As

Publication number Publication date
TW202219450A (zh) 2022-05-16
TWI827944B (zh) 2024-01-01
WO2021256126A1 (ja) 2021-12-23
CN220187503U (zh) 2023-12-15

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