JPWO2021256126A1 - - Google Patents

Info

Publication number
JPWO2021256126A1
JPWO2021256126A1 JP2022520544A JP2022520544A JPWO2021256126A1 JP WO2021256126 A1 JPWO2021256126 A1 JP WO2021256126A1 JP 2022520544 A JP2022520544 A JP 2022520544A JP 2022520544 A JP2022520544 A JP 2022520544A JP WO2021256126 A1 JPWO2021256126 A1 JP WO2021256126A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022520544A
Other languages
Japanese (ja)
Other versions
JPWO2021256126A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021256126A1 publication Critical patent/JPWO2021256126A1/ja
Publication of JPWO2021256126A5 publication Critical patent/JPWO2021256126A5/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022520544A 2020-06-19 2021-05-12 Pending JPWO2021256126A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020106262 2020-06-19
PCT/JP2021/018069 WO2021256126A1 (ja) 2020-06-19 2021-05-12 ベーパーチャンバー

Publications (2)

Publication Number Publication Date
JPWO2021256126A1 true JPWO2021256126A1 (https=) 2021-12-23
JPWO2021256126A5 JPWO2021256126A5 (https=) 2022-06-10

Family

ID=79267792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022520544A Pending JPWO2021256126A1 (https=) 2020-06-19 2021-05-12

Country Status (4)

Country Link
JP (1) JPWO2021256126A1 (https=)
CN (1) CN220187503U (https=)
TW (1) TWI827944B (https=)
WO (1) WO2021256126A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114727546B (zh) * 2022-02-23 2023-04-28 华为技术有限公司 一种散热装置和电子设备
TWI846369B (zh) * 2022-03-25 2024-06-21 日商村田製作所股份有限公司 熱擴散裝置及電子機器
WO2023182033A1 (ja) * 2022-03-25 2023-09-28 株式会社村田製作所 熱拡散デバイス及び電子機器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002206882A (ja) * 2000-10-31 2002-07-26 Tokai Rubber Ind Ltd シート状ヒートパイプおよびその製法
WO2017104819A1 (ja) * 2015-12-18 2017-06-22 株式会社フジクラ ベーパーチャンバー
WO2018147283A1 (ja) * 2017-02-07 2018-08-16 古河電気工業株式会社 ベーパーチャンバ
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
US20190033006A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation Ultra Thin Heat Exchangers For Thermal Management
CN109579584A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄环路均热板
JP2019113270A (ja) * 2017-12-25 2019-07-11 株式会社フジクラ 放熱モジュール
JP2019128058A (ja) * 2018-01-22 2019-08-01 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP2019196886A (ja) * 2018-05-11 2019-11-14 富士通株式会社 ヒートパイプ及び電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425178B (zh) * 2008-02-05 2014-02-01 Nat Applied Res Laboratories A Closed Groove Heat Pipe Capillary Structure
TWI459889B (zh) * 2008-09-18 2014-11-01 Pegatron Corp 均溫板
US10264707B2 (en) * 2014-10-14 2019-04-16 Korea Advanced Institute Of Science And Technology Flat plate pulsating heat pipe applicable at various angles and method of manufacturing same
TWI571197B (zh) * 2014-12-04 2017-02-11 超眾科技股份有限公司 薄型均溫板及其毛細結構
JP2020076522A (ja) * 2018-11-06 2020-05-21 東芝ホームテクノ株式会社 シート状ヒートパイプ
CN209546220U (zh) * 2019-01-14 2019-10-25 唐山达创传导科技有限公司 超薄导热装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002206882A (ja) * 2000-10-31 2002-07-26 Tokai Rubber Ind Ltd シート状ヒートパイプおよびその製法
WO2017104819A1 (ja) * 2015-12-18 2017-06-22 株式会社フジクラ ベーパーチャンバー
WO2018147283A1 (ja) * 2017-02-07 2018-08-16 古河電気工業株式会社 ベーパーチャンバ
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
US20190033006A1 (en) * 2017-07-28 2019-01-31 Dana Canada Corporation Ultra Thin Heat Exchangers For Thermal Management
JP2019113270A (ja) * 2017-12-25 2019-07-11 株式会社フジクラ 放熱モジュール
JP2019128058A (ja) * 2018-01-22 2019-08-01 新光電気工業株式会社 ヒートパイプ及びその製造方法
JP2019196886A (ja) * 2018-05-11 2019-11-14 富士通株式会社 ヒートパイプ及び電子機器
CN109579584A (zh) * 2018-11-30 2019-04-05 华南理工大学 一种超薄环路均热板

Also Published As

Publication number Publication date
WO2021256126A1 (ja) 2021-12-23
TW202219450A (zh) 2022-05-16
CN220187503U (zh) 2023-12-15
TWI827944B (zh) 2024-01-01

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