CN220172110U

CN220172110U - Heat dissipation paste, flip chip film packaging structure and display device

Info

Publication number: CN220172110U
Application number: CN202321644663.8U
Authority: CN
Inventors: 唐锋; 邓创华; 辛武根; 曹丹
Original assignee: Suzhou China Star Optoelectronics Technology Co Ltd
Current assignee: Suzhou China Star Optoelectronics Technology Co Ltd
Priority date: 2023-06-27
Filing date: 2023-06-27
Publication date: 2023-12-12
Anticipated expiration: 2033-06-27

Abstract

The utility model discloses a heat dissipation paste, a flip chip film packaging structure and a display device, wherein the heat dissipation paste comprises a first side, a second side, a third side and a fourth side which are sequentially connected in a closed loop manner; the first side edge and the third side edge are oppositely arranged, and the second side edge and the fourth side edge are oppositely arranged; the second side edge and the fourth side edge are both arranged in an arc shape, and the second side edge and the fourth side edge are symmetrically arranged about a symmetry axis extending along a preset direction; the first side is symmetrically disposed about the axis of symmetry, and the third side is symmetrically disposed about the axis of symmetry. The utility model can effectively reduce the bending area stress of the flip-chip film in the bending process, thereby effectively reducing the damage probability of the internal wiring of the flip-chip film and the peeling probability of the flip-chip film, and improving the quality and yield of the display product.

Description

Heat dissipation paste, flip chip film packaging structure and display device

Technical Field

The utility model relates to the technical field of display, in particular to a heat dissipation paste, a flip chip film packaging structure and a display device.

Background

Since chips (ICs) On Chip On Films (COFs) generate severe heat, aluminum heat sinks are typically disposed On the COFs. COF usually uses Polyimide (PI) as a substrate, and since the elastic modulus of aluminum is much higher than that of PI substrate, the heat dissipation paste on COF will affect the deformation of COF when COF is assembled on display module. And the heat dissipation paste with an improper shape can cause severe deformation of the COF, so that the internal wiring (such as copper wires) of the COF is folded or the binding area of the COF is separated, thereby influencing the yield of the display product.

Disclosure of Invention

The utility model provides a heat dissipation paste, a flip chip film packaging structure and a display device, which can effectively reduce the bending area stress of a flip chip film in the bending process, thereby effectively reducing the damage probability of wires in the flip chip film and the peeling probability of the flip chip film, and improving the quality and yield of display products.

The utility model provides a heat dissipation patch which is applied to a flip chip film and comprises a first side, a second side, a third side and a fourth side which are sequentially connected in a closed loop manner; the first side edge and the third side edge are oppositely arranged, and the second side edge and the fourth side edge are oppositely arranged;

the second side edge and the fourth side edge are both arranged in an arc shape, and the second side edge and the fourth side edge are symmetrically arranged about a symmetry axis extending along a preset direction; the first side is symmetrically disposed about the axis of symmetry, and the third side is symmetrically disposed about the axis of symmetry.

Optionally, the second side edge protrudes away from the fourth side edge, and the fourth side edge protrudes away from the second side edge.

Optionally, the distance between the two ends of the third side edge is smaller than the distance between the two ends of the first side edge.

Optionally, the second side includes a first end point and a second end point connected to the first side and the third side, respectively, and a first bump between the first end point and the second end point; the first salient point is the position of the second side edge farthest from the symmetry axis; the distance between the first end point and the first bump is smaller than the distance between the second end point and the first bump;

correspondingly, the fourth side edge comprises a third end point, a fourth end point and a second salient point, wherein the third end point and the fourth end point are respectively connected with the first side edge and the third side edge, and the second salient point is positioned between the third end point and the fourth end point; the second salient point is the position of the fourth side edge farthest from the symmetry axis; the distance between the third end point and the second bump is smaller than the distance between the fourth end point and the second bump.

Optionally, the first bump and the second bump are symmetrically disposed about the symmetry axis, and a distance between the first bump and the second bump is greater than a distance between two ends of the first side.

Optionally, the first side is arranged in a straight line and is perpendicular to the symmetry axis.

Optionally, the third side is arc-shaped and protrudes towards the direction close to the first side.

Optionally, the heat dissipation paste comprises a substrate, and a first adhesive layer, a metal layer and a second adhesive layer which are sequentially arranged on the substrate.

The utility model also provides a flip chip film packaging structure, which comprises:

a thin film substrate having a first surface and a second surface disposed opposite to each other;

a chip located on the first surface of the thin film substrate;

the heat dissipating paste as described above is located on the first surface of the film substrate and completely covers the chip.

The utility model also provides a display device which comprises a display panel and the flip chip film packaging structure, wherein the flip chip film packaging structure is electrically connected with the display panel.

According to the radiating patch, the flip chip film packaging structure and the display device, the shape of the radiating patch is optimized, so that the bending area stress of the flip chip film in a curved surface display product in the bending process can be effectively reduced, the damage probability of wires inside the flip chip film and the peeling probability of the flip chip film are effectively reduced, and the quality and the yield of the display product are improved.

Drawings

The technical solution and other advantageous effects of the present utility model will be made apparent by the following detailed description of the specific embodiments of the present utility model with reference to the accompanying drawings.

Fig. 1 is a schematic top view of an exemplary heat dissipating patch.

Fig. 2 is a schematic top view of a heat dissipating patch according to an embodiment of the present utility model.

Fig. 3 is a schematic cross-sectional structure of a heat dissipating patch according to an embodiment of the present utility model.

Fig. 4 is a schematic diagram illustrating simulation of bending stress of a flip chip film attached with the heat dissipation paste shown in fig. 1 according to an embodiment of the present utility model.

Fig. 5 is a schematic diagram illustrating simulation of bending stress of a flip chip film attached with the heat dissipation paste shown in fig. 2 according to an embodiment of the present utility model.

Fig. 6 is a schematic cross-sectional structure of a flip-chip thin film package structure according to an embodiment of the present utility model.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Fig. 1 is a schematic top view of an exemplary heat dissipating patch. As shown in fig. 1, the heat spreader 1 is formed of two rectangular structures connected to each other, and when the heat spreader 1 is covered on a Chip On Film (COF), a chip corresponding region a on the flip film is provided. In the bending process of the flip chip film attached with the heat dissipation paste 1 with the shape shown in fig. 1, the heat dissipation paste 1 has larger influence on the pulling and jacking of the flip chip film, which leads to larger bending stress to which the flip chip film is subjected, and easily leads to the damage of the internal wiring of the flip chip film or the peeling of the flip chip film from the display panel, thereby influencing the quality of the display product.

In order to solve the above technical problems, the present utility model optimizes the shape of the heat dissipating patch to mitigate the negative effect of the heat dissipating patch on the flip chip film, and specifically refers to the following description of embodiments.

The flip chip film in the present utility model refers to a structure including a film substrate and a chip.

As shown in fig. 2 and 3, an embodiment of the present utility model provides a heat dissipating patch 2 applied to a flip chip film. The heat dissipation patch 2 comprises a first side edge 3, a second side edge 4, a third side edge 5 and a fourth side edge 6 which are sequentially connected in a closed loop manner; the first side 3 and the third side 5 are arranged opposite each other, and the second side 4 and the fourth side 6 are arranged opposite each other. Wherein the second side edge 4 and the fourth side edge 6 are both arc-shaped, and the second side edge 4 and the fourth side edge 6 are symmetrically arranged about a symmetry axis L extending in a predetermined direction (e.g., a vertical direction); the first side 3 is symmetrically arranged about the symmetry axis L and the third side 5 is symmetrically arranged about the symmetry axis L.

Specifically, the second side edge 4 protrudes in a direction away from the fourth side edge 6, and the fourth side edge 6 protrudes in a direction away from the second side edge 4.

Specifically, the first side edge 3 is disposed in a straight line and is disposed perpendicular to the symmetry axis L.

Specifically, the third side 5 is arc-shaped and protrudes toward the direction approaching the first side 3.

Specifically, the distance between the two ends of the third side edge 5 is smaller than the distance between the two ends of the first side edge 3.

Specifically, the second side 4 includes a first end point 7 and a second end point 8 connected to the first side 3 and the third side 5, respectively, and a first bump 9 located between the first end point 7 and the second end point 8; the first salient point 9 is the position of the second side edge 4 farthest from the symmetry axis L; the distance between the first end point 7 and the first bump 9 is smaller than the distance between the second end point 8 and the first bump 9. Correspondingly, the fourth side 6 includes a third end point 10 and a fourth end point 11 connected to the first side 3 and the third side 5, respectively, and a second bump 12 located between the third end point 10 and the fourth end point 11; the second bump 12 is the position of the fourth side 6 farthest from the symmetry axis L; the distance between the third end point 10 and the second bump 12 is smaller than the distance between the fourth end point 11 and the second bump 12.

Specifically, the first bump 9 and the second bump 12 are symmetrically disposed about the symmetry axis L, and a distance between the first bump 9 and the second bump 12 is greater than a distance between two ends of the first side 3.

Specifically, the heat dissipating patch 2 includes a substrate 13, and a first adhesive layer 14, a metal layer 15, and a second adhesive layer 16 sequentially disposed on the substrate 13.

It can be appreciated that, when the heat dissipating patch 2 is covered on the flip chip film, the second adhesive layer 16 contacts the surface of the flip chip film, so as to fixedly connect the metal layer 15 and the flip chip film, thereby realizing the effect of transferring heat.

Specifically, the material of the metal layer 15 includes a metal material with high thermal conductivity, such as aluminum material, but is not limited thereto.

Of course, in other specific embodiments, the heat dissipating patch 2 may further include a heat conducting layer located between the first adhesive layer 14 and the metal layer 15, and the heat conducting layer may be a heat conducting/dissipating film, and the material may include, for example, but not limited to, graphene, artificial graphite, natural graphite, carbon nanotubes, aluminum oxide, boron nitride, or zinc oxide, or a combination thereof. Specifically, the heat conductive layer and the metal layer 15 are connected by a third adhesive layer.

Specifically, the first adhesive layer 14, the second adhesive layer 16, and the third adhesive layer may be double-sided adhesive, or heat-conductive adhesive having a heat-conductive function.

It will be appreciated that the heat spreader 2 may further include a release film on the surface of the substrate 13 and the surface of the second adhesive layer 16, and that when the heat spreader 2 is attached to a flip chip film, the release film needs to be peeled off.

Fig. 4 is a schematic diagram illustrating simulation of bending stress of a flip chip film attached with the heat dissipation paste shown in fig. 1 according to an embodiment of the present utility model. Fig. 5 is a schematic diagram illustrating simulation of bending stress of a flip chip film attached with the heat dissipation paste shown in fig. 2 according to an embodiment of the present utility model.

The heat dissipation patch 1 shown in fig. 1 and the heat dissipation patch 2 according to the embodiment of the present utility model are respectively attached to the same two flip chip films, and the two flip chip films are bent to the same extent under the same condition, and the following results are obtained through stress simulation experiments: as shown in fig. 4 and 5, the maximum bending stress to which the flip chip film attached with the heat spreader according to the embodiment of the present utility model is subjected is reduced by about 10% compared to the maximum bending stress to which the flip chip film attached with the heat spreader shown in fig. 1 is subjected.

As can be seen from the above, the shape of the heat dissipation patch 2 is optimized in the embodiment of the present utility model, so that the stress of the bending region of the flip chip film in the bending process can be effectively reduced, and the probability of damage to the wiring inside the flip chip film and the probability of peeling off the flip chip film can be effectively reduced, i.e. the structure of the flip chip film is more stable and not easy to be damaged, which is beneficial to improving the quality and yield of the display product.

As shown in fig. 6, the present utility model further provides a flip-chip film package structure 17, where the flip-chip film package structure 17 includes a film substrate 18, and a chip 19 and a heat dissipating patch 2 sequentially disposed on the film substrate 18. The heat dissipation patch 2 is the heat dissipation patch 2 provided in the foregoing embodiment, and the specific structure and shape features are not described herein.

Specifically, the film substrate 18 has a first surface 20 and a second surface 21 disposed opposite to each other; the chip 19 is located on the first surface 20 of the film substrate 18; the heat dissipating patch 2 is located on the first surface 20 of the film substrate 18 and completely covers the chip 19.

Of course, in other embodiments, the heat dissipating paste 2 may also be disposed on the second surface 21 of the film substrate 18, and the chip 19 may be disposed corresponding to the heat dissipating paste 2; the front projection of the heat dissipating patch 2 on the film substrate 18 completely covers the front projection of the chip 19 on the film substrate 18.

Specifically, the material of the thin film substrate 18 includes PI, but is not limited thereto. It will be appreciated that the first surface 20 and/or the second surface 21 of the film substrate 18 may also be provided with wires or circuits electrically connected to the chip 19 to enable the transmission of electrical signals.

Specifically, the heat dissipating patch 2 includes an area B for covering the chip 19, and the area B is symmetrically disposed about the symmetry axis L.

It will be appreciated that in the embodiment of the present utility model, the thin film substrate 18 and the chip 19 constitute the aforementioned flip chip film.

Specifically, the chip 19 may be a source driving chip or a data driving chip, but is not limited thereto.

In the embodiment of the utility model, the shape of the heat dissipation patch 2 is optimized, so that the bending region stress of the flip chip film in the bending process can be effectively reduced, the damage probability of the wiring inside the flip chip film and the peeling probability of the flip chip film are effectively reduced, the structure of the flip chip film is more stable and is not easy to damage, and the quality and the yield of display products are improved.

The utility model also provides a display device, which comprises a display panel and the flip chip film packaging structure in the previous embodiment, wherein the flip chip film packaging structure is electrically connected with the display panel.

Specifically, the display panel may be a liquid crystal display panel or an OLED display panel, but is not limited thereto.

Specifically, one side of the flip chip film packaging structure is connected with the display panel in a binding way.

Specifically, the first side or the third side of the heat dissipation paste is disposed near the binding area of the flip chip film package structure.

In the embodiment of the utility model, the shape of the heat dissipation paste is optimized, so that the bending region stress of the flip chip film in the bending process can be effectively reduced, the damage probability of the wiring inside the flip chip film and the peeling probability of the flip chip film are effectively reduced, the structure of the flip chip film is more stable and is not easy to damage, and the quality and the yield of the display device are improved.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

The heat dissipation paste, the flip chip film packaging structure and the display device provided by the embodiment of the utility model are described in detail, and specific examples are applied to explain the principle and the implementation mode of the utility model, and the description of the above embodiment is only used for helping to understand the technical scheme and the core idea of the utility model; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims

1. The heat dissipation patch is applied to a flip chip film and is characterized by comprising a first side, a second side, a third side and a fourth side which are sequentially connected in a closed loop manner; the first side edge and the third side edge are oppositely arranged, and the second side edge and the fourth side edge are oppositely arranged;

2. The heat dissipating patch of claim 1, wherein the second side edge projects away from the fourth side edge and the fourth side edge projects away from the second side edge.

3. The heat dissipating patch of claim 2, wherein a distance between ends of the third side edge is less than a distance between ends of the first side edge.

4. The heat dissipating patch of claim 3 wherein the second side includes a first end and a second end connected to the first side and the third side, respectively, and a first bump between the first end and the second end; the first salient point is the position of the second side edge farthest from the symmetry axis; the distance between the first end point and the first bump is smaller than the distance between the second end point and the first bump;

5. The heat dissipating patch of claim 4, wherein the first bump and the second bump are symmetrically disposed about the axis of symmetry, and a distance between the first bump and the second bump is greater than a distance between two ends of the first side.

6. The heat dissipating patch of claim 1, wherein the first side is disposed in a straight line and perpendicular to the axis of symmetry.

7. The heat dissipating patch of claim 6, wherein the third side is curved and projects in a direction toward the first side.

8. The heat dissipating patch of claim 1, wherein the heat dissipating patch comprises a substrate and a first adhesive layer, a metal layer, and a second adhesive layer disposed in sequence on the substrate.

9. The flip chip film packaging structure is characterized by comprising:

a chip located on the first surface of the thin film substrate;

the heat dissipating patch of any of claims 1 to 8, located on the first surface of the film substrate and completely covering the chip.

10. A display device comprising a display panel and the flip-chip thin film package structure of claim 9, wherein the flip-chip thin film package structure is electrically connected to the display panel.