CN220172094U - Mechanical arm and silicon wafer degumming equipment - Google Patents

Abstract

The utility model discloses a manipulator and silicon wafer degumming equipment, wherein the manipulator comprises a frame, a movable frame, a plurality of material frame grabbing arms and a plurality of filter device grabbing arms, and the movable frame is movably connected with the frame; the material frame grabbing arm is connected with the movable frame and is provided with a material frame hooking part for hooking and hanging the material frame; the filter device grabbing arm is movably connected with the movable frame so as to switch between a working position and a avoiding position, and is provided with a filter device hooking part for hooking a filter device; in the working position, the filter device hooking part is lower than the material frame hooking part so as to hook the filter device; in the avoidance position, the hooking part of the filtering device is higher than the hooking part of the material frame so as to avoid the material frame. The manipulator provided by the embodiment of the utility model can reduce the labor cost in the silicon wafer production process.

Description

Mechanical arm and silicon wafer degumming equipment

Technical Field

The utility model relates to the technical field of solar cell manufacturing equipment, in particular to a mechanical arm and silicon wafer degumming equipment.

Background

After photovoltaic and semiconductor silicon wafers are cut in a line, degumming is needed, and the degumming method is to put a material frame filled with silicon wafers into a degumming tank filled with liquid for heating so as to separate the silicon wafers from a pasting plate. For reasons of cutting or transfer, it is inevitable that broken silicon pieces fall from the frame into the degumping tank. When more broken silicon chips are in the degumming groove, the broken silicon chips possibly collide with the silicon chips in the material frame, so that the silicon chips are damaged.

In the related art, a filter device is placed in a degumming tank, broken silicon wafers are filtered by the filter device, when the broken silicon wafers on the filter device are more, liquid in the degumming tank is discharged, and the filter device is manually taken out from the degumming tank and cleaned. On one hand, the waste of liquid in the degumming tank is caused, and the production cost of the silicon wafer is increased; on the other hand, the time spent for cleaning the filter device is long, and the production efficiency of the silicon wafer is affected. In addition, the cleaning method of the filtering device also increases the labor cost in the production process of the silicon wafer; in the process of manually cleaning the filtering device, the human body can contact the liquid in the degumming tank, and the human body is damaged.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent.

Therefore, the embodiment of the utility model provides a manipulator for reducing labor cost in the production process of silicon wafers.

The manipulator comprises a frame, a movable frame, a plurality of material frame grabbing arms and a plurality of filtering device grabbing arms, wherein the movable frame is movably connected with the frame; the material frame grabbing arm is connected with the movable frame and is provided with a material frame hooking part for hooking and hanging the material frame; the filter device grabbing arm is movably connected with the movable frame so as to switch between a working position and a avoiding position, and is provided with a filter device hooking part for hooking a filter device; in the working position, the filter device hooking part is lower than the material frame hooking part so as to hook the filter device; in the avoidance position, the hooking part of the filtering device is higher than the hooking part of the material frame so as to avoid the material frame.

In some embodiments, the filter device gripper arm is swingably connected to the mobile frame.

In some embodiments, the manipulator further comprises a drive assembly disposed on the mobile frame, the drive assembly being connected to the filter gripper arm to drive the filter gripper arm to swing.

In some embodiments, the drive assembly comprises a connecting rod and a telescopic rod, one end of the connecting rod is rotatably connected with the filter device gripping arm; and two ends of the telescopic rod are respectively connected with the movable frame and the other end of the connecting rod in a rotating way.

In some embodiments, the telescoping rod is a cylinder; and/or the manipulator further comprises a limiting device, and in the working position, the limiting device is stopped against the connecting rod to limit the driving assembly.

In some embodiments, the plurality of filter gripper arms are divided into two gripper arm sets, each gripper arm set comprising a plurality of filter gripper arms; the number of the driving assemblies is two, the two driving assemblies are in one-to-one correspondence with the two grabbing arm groups, and each driving assembly is connected with a plurality of grabbing arms of the filtering device in the corresponding grabbing arm group.

In some embodiments, in the avoidance bit, two of the gripping arm groups are arranged in a stacked manner in the up-down direction.

In some embodiments, in the avoidance position, the filter device gripping arm is located entirely above the mobile frame.

The embodiment of the utility model also provides silicon wafer degumming equipment.

The silicon wafer degumming device comprises a degumming tank, a filtering device and a manipulator, wherein the filtering device is detachably arranged in the degumming tank, and a manipulator hooking part is arranged on the filtering device; the mechanical arm is arranged on the upper side of the degumming groove, the mechanical arm is the mechanical arm according to any one of the claims, and the filter device hooking part is used for hooking the mechanical arm hooking part.

In some embodiments, the manipulator hook is a sling and the filter hook is a hook; and/or the filtering device comprises a frame, a first filter screen and a second filter screen, wherein the first filter screen and the second filter screen are connected with the frame, the first filter screen is arranged on the upper side of the second filter screen, and the mesh number of the first filter screen is smaller than that of the second filter screen.

According to the manipulator disclosed by the embodiment of the utility model, when the material frame needs to be transferred, the grabbing arm of the filtering device is kept away from the position, the material frame is hooked by the hooking part of the material frame, and the movable frame moves relative to the frame, so that the material frame is transferred. At this time, the filter hooking part is higher than the material frame hooking part, so that the mutual interference between the filter hooking part and the material frame can be avoided. When the filter device is required to be transferred, the grabbing arm of the filter device is in a working position, the filter device is hooked by the hooking part of the filter device, and the movable frame moves relative to the frame, so that the transfer of the filter device is realized. At this time, the filter device hook is lower than the material frame hook, so that when the travel of the movable frame in the up-down direction is smaller, the filter device in the degumming tank can be hooked by the filter device hook and the filter device is placed into the degumming tank to a preset depth.

Therefore, on one hand, when the filter device is cleaned, the manipulator can realize the transfer of the filter device in the degumming tank without discharging the liquid in the degumming tank, thereby being beneficial to reducing the production cost of the silicon wafer; on the other hand, the transfer of the filter device is realized by using the manipulator, so that the efficiency of taking out and putting in the filter device can be greatly improved, the cleaning time of the filter device is shortened, and the production efficiency of the silicon wafer is improved. In addition, the labor cost in the production process of the silicon wafer can be reduced; because the human body is rarely or even not required to contact the liquid in the degumming tank, the damage to the human health in the silicon wafer production process can be reduced.

Drawings

Fig. 1 is a schematic view of a manipulator according to an embodiment of the present utility model (the filter gripping arm is in the working position).

Fig. 2 is an enlarged view at a in fig. 1.

Fig. 3 is a schematic structural diagram of a manipulator according to an embodiment of the present utility model (the gripping arm of the filtering device is in a yielding position).

Fig. 4 is an enlarged view at B in fig. 3.

Fig. 5 is a schematic structural view of a silicon wafer degumming apparatus according to an embodiment of the present utility model.

Fig. 6 is a schematic view of the structure of the filtering apparatus of fig. 5.

Reference numerals:

100. silicon wafer degumming equipment;

10. a manipulator;

1. a frame; 11. a guide rail; 12. a carriage; 13. a lifting device;

2. a moving rack;

3. a material frame grabbing arm; 31. a material frame hooking part;

4. a filter device gripping arm; 41. a filter device hooking part;

5. a drive assembly; 51. a connecting rod; 52. a telescopic rod;

6. a rotating shaft;

7. a limiting device;

20. a degumming tank;

30. a filtering device; 301. a manipulator hooking part; 302. a frame; 303. a first filter screen; 304. and a second filter screen.

Detailed Description

Reference will now be made in detail to embodiments of the present utility model, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

The present utility model has been made based on the findings and knowledge of the inventors regarding the following facts and problems:

in the related art, the silicon wafer degumming device includes a manipulator for transferring the frame, and in order to achieve automatic transfer of the filtering device, it is conceivable to transfer the filtering device in the degumming tank using the manipulator for transferring the frame. However, the material frame includes an upper layer portion and a lower layer portion, and the manipulator is required to grasp the upper layer portion and the lower layer portion of the material frame, so that the stroke in the up-down direction is generally set larger, which results in higher overall height of the silicon wafer degumming device.

According to the manipulator disclosed by the embodiment of the utility model, the filter device grabbing arm for grabbing the filter device is additionally arranged on the existing manipulator for transferring the material frame, and the filter device grabbing arm is movable relative to the material frame grabbing arm, so that the manipulator can be used for transferring the material frame and the filter device. The automatic transfer of the filter device is realized with less increase in the cost of the manipulator. The material frame grabbing arm is used for grabbing a material frame and is used for grabbing a manipulator.

As shown in fig. 1 to 4, a robot 10 according to an embodiment of the present utility model includes a frame 1, a moving frame 2, a plurality of frame gripping arms 3, and a plurality of filter gripping arms 4, the moving frame 2 being movably connected to the frame 1. The frame gripping arm 3 is connected to the movable frame 2, and the frame gripping arm 3 has a frame hooking portion 31 for hooking the frame. The filter gripper arm 4 is movably connected to the mobile frame 2 for switching between a working position and a retracted position, the filter gripper arm 4 having a filter hooking portion 41 for hooking the filter 30. In the operating position, the filter hooking portion 41 is lower than the frame hooking portion 31 so as to hook the filter 30. In the escape position, the filter hooking portion 41 is higher than the frame hooking portion 31 to escape the frame.

According to the manipulator 10 provided by the embodiment of the utility model, when the material frame needs to be transferred, the grabbing arm 4 of the filtering device is in a yielding position, the material frame is hooked by the material frame hooking part 31, and the movable frame 2 moves relative to the frame 1, so that the material frame is transferred. At this time, the filter hooking portion 41 is higher than the frame hooking portion 31, so that interference between the filter hooking portion 41 and the frame can be avoided. When the filter device 30 needs to be transferred, the filter device gripping arm 4 is in the working position, the filter device 30 is hooked by the filter device hooking part 41, and the movable frame 2 moves relative to the frame 1, so that the filter device 30 is transferred. At this time, when the filter hooking portion 41 is lower than the frame hooking portion 31 so that the travel of the moving frame 2 in the up-down direction is small, the filter hooking portion 41 may be used to hook the filter 30 in the degumming tank 20 and to put the filter 30 into the degumming tank 20 to a predetermined depth.

Therefore, in the manipulator 10 according to the embodiment of the utility model, on one hand, when cleaning the filtering device 30, the liquid in the degumming tank 20 is not required to be discharged, so that the filtering device 30 in the degumming tank 20 can be transferred, and the production cost of the silicon wafer is reduced; on the other hand, the manipulator 10 is utilized to realize the transfer of the filter device 30, so that the efficiency of taking out and putting in the filter device 30 can be greatly improved, the cleaning time of the filter device 30 is shortened, and the production efficiency of silicon wafers is improved. In addition, the labor cost in the production process of the silicon wafer can be reduced; because the human body is rarely or even not required to contact the liquid in the degumming tank, the damage to the human health in the silicon wafer production process can be reduced.

Optionally, the frame gripping arm 3 and the filter gripping arm 4 are both rod-shaped.

In some embodiments, the filter device gripper arm 4 is pivotably connected to the mobile carriage 2. In other words, the filter device gripping arm 4 is hinged to the mobile frame 2.

From this, filter equipment grabs arm 4 through the swing realization and dodges the switching between the position at work position and dodge, conveniently realizes filter equipment grabs arm 4 and dodges the switching between the position at work position.

Of course, in other embodiments, the filter gripping arms 4 may be configured in other ways. For example, the filter gripping arm 4 is configured as a gripping arm that is vertically retractable, the filter gripping arm 4 is switched to the operating position by extending the filter gripping arm 4, and the filter gripping arm 4 is switched to the avoidance position by shortening the filter gripping arm 4.

Alternatively, as shown in fig. 3 and 4, in the evacuation position, the filter device gripping arm 4 is entirely located on the upper side of the mobile frame 2.

Therefore, the whole filter device grabbing arm 4 in the avoidance position is positioned on the upper side of the movable frame 2, interference between the filter device grabbing arm 4 and the material frame can be effectively avoided, and the reliability of the manipulator 10 is improved.

Of course, in other embodiments, the filter gripping arm 4 in the yielding position may be located entirely on the lower side of the mobile frame 2, or one portion may be located on the upper side of the mobile frame 2, and another portion may be located on the lower side of the mobile frame 2.

Optionally, as shown in fig. 1 and 2, the manipulator 10 further includes a driving assembly 5, where the driving assembly 5 is disposed on the moving frame 2, and the driving assembly 5 is connected to the filter gripping arm 4 to drive the filter gripping arm 4 to swing.

The filter device grabbing arm 4 is driven to swing through the driving component 5, and compared with the manual driving of the filter device grabbing arm 4 to swing, the automation degree of the manipulator 10 can be further improved, the labor cost in the silicon wafer production process is further reduced, and the production efficiency of the silicon wafer is improved.

Alternatively, as shown in fig. 2, the driving assembly 5 includes a connection rod 51 and a telescopic rod 52, one end of the connection rod 51 is rotatably connected with the filter gripping arm 4, and both ends of the telescopic rod 52 are rotatably connected with the other ends of the connection rod 51 and the mounting bracket, respectively.

For example, the filter gripping arm 4 is fixedly connected with the rotating shaft 6, the rotating shaft 6 is rotatably connected with the moving frame 2, one end of the connecting rod 51 is fixedly connected with the rotating shaft 6, and the rotating shaft 6 drives the filter gripping arm 4 to swing relative to the moving frame 2 when rotating relative to the moving frame 2. When the telescopic rod 52 stretches, the connecting rod 51 and the rotating shaft 6 drive the filter device grabbing arm 4 to rotate to a working position; when the telescopic rod 52 is shortened, the connecting rod 51 and the rotating shaft 6 drive the grabbing arm 4 of the filter device to rotate to avoid yielding.

Therefore, the driving assembly 5 is simple in structure, convenient to process and manufacture the manipulator 10 and beneficial to reducing the cost of the manipulator 10.

Optionally, the telescoping rod 52 is a cylinder. In other words, the telescopic rod 52 is a rod-shaped cylinder.

By providing the telescoping rod 52 as a cylinder, the cost of the telescoping rod 52 is advantageously reduced, thereby further reducing the cost of the manipulator 10.

Of course, in other embodiments, the telescopic rod 52 may be provided in other forms, for example, the telescopic rod 52 is an electric push rod.

As shown in fig. 1 and 2, the manipulator 10 further includes a limiting device 7, and in the working position, the limiting device 7 abuts against the connecting rod 51 to limit the driving assembly 5.

For example, as shown in fig. 2, when the filter gripping arm 4 swings to the working position, the limiting device 7 is stopped against the outer peripheral surface of the connecting rod 51, so as to prevent the connecting rod 51 from continuing to rotate. On one hand, whether the grabbing arm 4 of the filtering device is in a working position or not is conveniently judged; on the other hand, the filter device gripping arm 4 can be effectively prevented from exceeding the working position in the swinging process, so that the reliability of the manipulator 10 is improved.

Alternatively, as shown in fig. 1, the plurality of filter gripper arms 4 are divided into two gripper arm groups, each gripper arm group comprising a plurality of filter gripper arms 4. The number of the driving components 5 is two, the two driving components 5 are in one-to-one correspondence with the two grabbing arm groups, and each driving component 5 is connected with the plurality of the filter device grabbing arms 4 in the corresponding grabbing arm group, so that the same driving component 5 drives the plurality of the filter device grabbing arms 4 in the same grabbing arm group at the same time.

For example, the number of the filter gripping arms 4 is four, and the four filter gripping arms 4 are divided into two gripping arm groups each including two filter gripping arms 4. Two filter equipment arm grabs 4 in same arm group respectively with the both ends fixed connection of same pivot 6, connecting rod 51 and pivot 6 rotation are connected. The same connecting rod 51 drives the two filter device gripping arms 4 in the same gripping arm group to swing through the same rotating shaft 6.

Thereby, the number of driving assemblies 5 is advantageously reduced, thereby further reducing the cost of the robot 10.

Of course, in other embodiments, the driving assemblies 5 and the filter device gripping arms 4 may be in one-to-one correspondence, and each driving assembly 5 drives the corresponding filter device gripping arm 4 to swing.

In order to make the technical solution of the present utility model easier to understand, the technical solution of the present utility model will be further described by taking the example that the moving frame 2 is movable relative to the frame 1 in the up-down direction and the front-back direction, and the arrangement direction of the two gripping arm groups is consistent with the left-right direction. The up-down direction, the front-back direction, and the left-right direction are shown in fig. 1 to 4.

For example, as shown in fig. 1 and 3, a guide rail 11 extending in the front-rear direction is provided on the frame 1, the robot 10 further includes a carriage 12 and a lifting device 13, the carriage 12 is slidably engaged with the guide rail 11 in the front-rear direction, the lifting device 13 is connected to the carriage 12, and the moving frame 2 is connected to the lifting device 13. The two gripping arms are respectively arranged at the left side and the right side of the lifting device 13, and the two driving components 5 are arranged at intervals along the left-right direction. When the movable frame is specifically used, the movable frame 2 moves in the front-back direction by utilizing the sliding frame 12 to move in the front-back direction relative to the guide rail 11; the lifting device 13 is used for lifting and lowering to realize the movement of the movable frame 2 in the up-down direction.

Alternatively, as shown in fig. 3 and 4, in the evacuation position, two gripper arm groups are arranged in a stacked manner in the up-down direction.

Therefore, when the robot is in the avoidance position, the two grabbing arm groups can occupy the same space, so that the occupied space of the robot arm 10 is reduced, and the robot arm 10 is arranged conveniently.

Of course, in other embodiments, two gripper arm sets may be spaced apart in the horizontal direction in the evasion position.

As shown in fig. 5 and 6, the silicon wafer degumming apparatus 100 according to the embodiment of the present utility model includes a degumming tank 20, a filtering device 30 and a manipulator 10, wherein the filtering device 30 is detachably disposed in the degumming tank 20, a manipulator hooking portion 301 is disposed on the filtering device 30, the manipulator 10 is disposed on the upper side of the degumming tank 20, the manipulator 10 is the manipulator 10 according to any of the embodiments, and the filtering device hooking portion 41 is used for hooking the manipulator hooking portion 301.

According to the silicon wafer degumming equipment 100 disclosed by the embodiment of the utility model, when the filtering device 30 is cleaned, the liquid in the degumming tank 20 is not required to be discharged, so that the filtering device 30 in the degumming tank 20 can be transferred, and the production cost of the silicon wafer is reduced; the transfer of the filter device 30 is realized by using the manipulator 10, so that the efficiency of taking out and putting in the filter device 30 can be greatly improved, the cleaning time of the filter device 30 is shortened, and the production efficiency of silicon wafers is improved.

Alternatively, the manipulator hook 301 is a hanging ring, and the filter hook 41 is a hook.

The above-described structure of the robot hook 301 and the filter device hook 41 not only simplifies the structure of the robot hook 301 and the filter device hook 41, but also facilitates the filter device hook 41 to hook the robot hook 301.

As shown in fig. 6, the filtering device 30 includes a frame 302, a first filter 303, and a second filter 304, the first filter 303 and the second filter 304 are connected to the frame 302, the first filter 303 is disposed on the upper side of the second filter 304, and the mesh number of the first filter 303 is smaller than that of the second filter 304.

Therefore, the filtering device 30 can utilize the first filter screen 303 to filter out the crushed silicon wafers with larger size, and utilize the second filter screen 304 to filter out the crushed silicon wafers with smaller size, so as to effectively avoid the crushed silicon wafers from entering the degumming tank 20 to block the drainage pipeline of the degumming tank 20, and be beneficial to improving the reliability of the silicon wafer degumming device 100.

According to the silicon wafer degumming equipment 100 disclosed by the embodiment of the utility model, the manipulator 10 for grabbing the material taking frame is needed by the equipment, and the filter device grabbing arm 4 is arranged, so that the manipulator 10 can be used for grabbing the material taking frame and the filter device grabbing arm 4, and the cost of the manipulator 10 is rarely increased while the function of the manipulator 10 is increased. The whole structure of the silicon wafer degumming device 100 is simple, automatic chip taking and chip taking without liquid discharging can be realized, energy saving and consumption reduction are realized, the labor intensity is reduced, the labor environment is improved, the error loss is reduced, the filtration is thorough, and the pipeline blockage is reduced.

While embodiments of the present utility model have been shown and described above, it should be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those skilled in the art without departing from the scope of the utility model.

Claims (10)

1. A manipulator, comprising:

a frame;

the movable frame is movably connected with the rack;

the material frame grabbing arms are connected with the movable frame and are provided with material frame hooking parts for hooking and hanging the material frames; and

a plurality of filter gripping arms movably connected with the moving frame to switch between a working position and a avoidance position, the filter gripping arms having a filter hooking portion for hooking the filter;

in the working position, the filter device hooking part is lower than the material frame hooking part so as to hook the filter device;

in the avoidance position, the hooking part of the filtering device is higher than the hooking part of the material frame so as to avoid the material frame.

2. The robot of claim 1, wherein the filter gripper arm is swingably connected to the moving frame.

3. The manipulator of claim 2, further comprising a drive assembly disposed on the mobile frame, the drive assembly coupled to the filter gripper arm to drive the filter gripper arm to swing.

4. A manipulator according to claim 3, wherein the drive assembly comprises:

one end of the connecting rod is rotationally connected with the grabbing arm of the filtering device; and

the two ends of the telescopic rod are respectively connected with the movable frame and the other end of the connecting rod in a rotating way.

5. The manipulator of claim 4, wherein the telescoping rod is a cylinder; and/or

The manipulator further comprises a limiting device, and the limiting device is stopped against the connecting rod to limit the driving assembly in the working position.

6. A manipulator according to claim 3, wherein a plurality of said filter gripping arms are divided into two gripping arm groups, each of said gripping arm groups comprising a plurality of said filter gripping arms;

the number of the driving assemblies is two, the two driving assemblies are in one-to-one correspondence with the two grabbing arm groups, and each driving assembly is connected with a plurality of grabbing arms of the filtering device in the corresponding grabbing arm group.

7. The manipulator according to claim 6, wherein in the avoidance position, two of the gripper arm groups are arranged in a stacked manner in the up-down direction.

8. The robot of any of claims 2-7, wherein in the avoidance position, the filter gripping arm is located entirely above the mobile carriage.

9. The silicon wafer degumming device is characterized by comprising:

a degumming tank;

the filtering device is detachably arranged in the degumming tank and is provided with a manipulator hooking part; and

the manipulator is arranged on the upper side of the degumming groove, the manipulator is the manipulator according to any one of claims 1-8, and the filter hooking part is used for hooking the manipulator hooking part.

10. The silicon wafer degumming apparatus according to claim 9, wherein the manipulator hooking portion is a hanging ring, and the filter hooking portion is a hook; and/or

The filtering device comprises a frame, a first filter screen and a second filter screen, wherein the first filter screen and the second filter screen are connected with the frame, the first filter screen is arranged on the upper side of the second filter screen, and the mesh number of the first filter screen is smaller than that of the second filter screen.