CN220155527U - Power management chip with plastic package structure - Google Patents
Power management chip with plastic package structure Download PDFInfo
- Publication number
- CN220155527U CN220155527U CN202321697045.XU CN202321697045U CN220155527U CN 220155527 U CN220155527 U CN 220155527U CN 202321697045 U CN202321697045 U CN 202321697045U CN 220155527 U CN220155527 U CN 220155527U
- Authority
- CN
- China
- Prior art keywords
- plastic package
- power management
- management chip
- package body
- lower plastic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004033 plastic Substances 0.000 title claims abstract description 122
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 239000004519 grease Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 5
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a power management chip with a plastic package structure, which comprises a lower plastic package body, an upper plastic package body, a power management chip body, plastic packages and pins, wherein the upper plastic package body is arranged above the lower plastic package body, the plastic packages are filled at the joint of the lower plastic package body and the upper plastic package body, positioning clamping grooves are formed in the edge positions of the top end of the lower plastic package body, positioning protrusions are fixed at the edge positions of the bottom end of the upper plastic package body, the power management chip body is arranged inside the lower plastic package body and the upper plastic package body, heat conduction silicone grease is coated on the upper surface and the lower surface of the power management chip body, and the two sides of the power management chip body are provided with the pins with equal intervals. The utility model not only can fully seal and wrap the power management chip, prevent the power management chip from being influenced by the temperature, humidity, dust and corrosive gas of air, improve the heat dissipation effect, prevent the temperature from being too high, but also can prevent the end parts of the pins from being pressed and broken.
Description
Technical Field
The utility model relates to the technical field of power management chips, in particular to a power management chip with a plastic package structure.
Background
The power management chip is a chip which plays roles in converting, distributing and detecting electric energy and managing other electric energy in the electronic equipment system, and is mainly responsible for identifying the power supply amplitude of the CPU, generating corresponding short moment waves and pushing the rear-stage circuit to output power.
The power management chip is easily affected by the temperature, humidity, dust and corrosive gas of air when in use, electrical performance is easily reduced, service life is greatly affected, and heat dissipation effect is general, so that the temperature is easily overhigh, and the power management chip needs to be improved.
Disclosure of Invention
The present utility model is directed to a power management chip with a plastic package structure, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a power management chip with plastic envelope structure, includes plastic envelope body, last plastic envelope body, power management chip body, plastic envelope glue and pin down, the top of plastic envelope body is provided with the plastic envelope body down, plastic envelope glue fills the junction of plastic envelope body and last plastic envelope body down, the edge position department on plastic envelope body top all is provided with the location draw-in groove down, the edge position department of last plastic envelope body bottom all is fixed with the location arch, location arch and the inseparable joint of location draw-in groove, the power management chip body sets up the inside of plastic envelope body and last plastic envelope body down, just the upper and lower surface of power management chip body all is coated with heat conduction silicone grease, equidistant pin is all installed to the both sides of power management chip body, and the one end of pin extends to the outside of last plastic envelope body, all glue on the outer wall of lower plastic envelope body and last plastic envelope body and have the heat dissipation copper.
Preferably, both sides of the lower plastic package body and the upper plastic package body are adhered with protection plates, and equidistant through grooves are formed in the protection plates, so that the ends of the pins are protected conveniently, and the pins are prevented from being extruded and broken.
Preferably, the surfaces of the lower plastic package body and the upper plastic package body are provided with equidistant through holes, and heat conducting fins are arranged in the through holes, one ends of the heat conducting fins are adhered to the heat conducting silicone grease, and the other ends of the heat conducting fins are adhered to the heat radiating copper plate, so that heat generated by the power management chip body is conveniently led out.
Preferably, the lower locating pieces are fixed on the inner wall of the lower plastic package body below the power management chip body, and the upper locating pieces are fixed on the inner wall of the upper plastic package body above the power management chip body, and the lower locating pieces and the upper locating pieces are tightly attached to the power management chip body, so that the power management chip body is conveniently located.
Preferably, a first heat dissipation cavity is arranged in the lower plastic package body below the power management chip body, and a second heat dissipation cavity is arranged in the upper plastic package body above the power management chip body, so that heat can be conveniently dissipated.
Preferably, rubber gaskets are adhered to the two inner walls of the through groove, so that the soft support effect on the pins is achieved.
Compared with the prior art, the utility model has the beneficial effects that: the power management chip with the plastic package structure not only can fully package the power management chip and prevent the power management chip from being influenced by the temperature, humidity, dust and corrosive gas of air, improves the heat dissipation effect, prevents the temperature from being too high, but also can prevent the end parts of the pins from being pressed and broken;
(1) The lower plastic package body, the upper plastic package body, the plastic package glue, the positioning bulge and the positioning clamping groove are arranged, and the lower plastic package body and the upper plastic package body are respectively arranged below and above the lower plastic package body, so that the positioning bulge at the bottom end of the upper plastic package body is clamped into the positioning clamping groove at the top end of the lower plastic package body, the joint of the lower plastic package body and the upper plastic package body is sealed by the plastic package glue, the lower plastic package body and the upper plastic package body form a closed whole, and the power management chip body is fully sealed by adopting a double-sided plastic package structure, thereby preventing the power management chip body from being influenced by temperature, humidity, dust and corrosive gas of air, ensuring electrical performance and prolonging service life;
(2) The heat conducting silicone grease, the through hole, the heat conducting fin, the heat radiating copper plate, the lower locating fin, the first heat radiating cavity, the upper locating fin and the second heat radiating cavity are arranged, and the power management chip body is located between the lower locating fin and the upper locating fin;
(3) Through being provided with guard plate, logical groove, rubber gasket, because the pin passes from the inside logical groove of guard plate, guard plate and logical groove cooperation protect the tip of pin, rubber gasket has played soft bearing's effect to the pin to can prevent the tip pressurized fracture of pin.
Drawings
FIG. 1 is a schematic cross-sectional elevation view of the present utility model;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;
FIG. 3 is a schematic top view of the present utility model;
fig. 4 is a schematic diagram of a side view appearance structure of the present utility model.
In the figure: 1. a lower plastic package body; 2. applying a plastic package body; 3. a power management chip body; 4. heat conductive silicone grease; 5. a through hole; 6. a heat conductive sheet; 7. a heat-dissipating copper plate; 8. a lower locating piece; 9. a first heat dissipation chamber; 10. a positioning sheet is arranged on the upper part; 11. a second heat dissipation chamber; 12. plastic packaging glue; 13. positioning the bulge; 14. positioning clamping grooves; 15. pins; 16. a protection plate; 17. a through groove; 18. rubber gaskets.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.
Referring to fig. 1-4, an embodiment of the present utility model is provided: the power management chip with the plastic package structure comprises a lower plastic package body 1, an upper plastic package body 2, a power management chip body 3, plastic package adhesives 12 and pins 15, wherein the upper plastic package body 2 is arranged above the lower plastic package body 1, the plastic package adhesives 12 are filled at the joint of the lower plastic package body 1 and the upper plastic package body 2, positioning clamping grooves 14 are formed in the edge positions of the top end of the lower plastic package body 1, positioning protrusions 13 are fixed at the edge positions of the bottom end of the upper plastic package body 2, and the positioning protrusions 13 are tightly clamped with the positioning clamping grooves 14;
the power management chip body 3 is arranged in the lower plastic package body 1 and the upper plastic package body 2, the upper surface and the lower surface of the power management chip body 3 are coated with heat conduction silicone grease 4, equally spaced pins 15 are arranged on two sides of the power management chip body 3, one ends of the pins 15 extend to the outside of the upper plastic package body 2, and heat dissipation copper plates 7 are adhered to the outer walls of the lower plastic package body 1 and the upper plastic package body 2;
the two sides of the lower plastic package body 1 and the upper plastic package body 2 are adhered with the protection plates 16, and the inside of the protection plates 16 is provided with equidistant through grooves 17, so that the ends of the pins 15 are conveniently protected and prevented from being extruded and broken;
the surfaces of the lower plastic package body 1 and the upper plastic package body 2 are provided with equidistant through holes 5, and heat conducting fins 6 are arranged in the through holes 5, one ends of the heat conducting fins 6 are adhered to the heat conducting silicone grease 4, and the other ends of the heat conducting fins 6 are adhered to the heat radiating copper plate 7, so that heat generated by the power management chip body 3 is conveniently led out;
a lower locating piece 8 is fixed on the inner wall of the lower plastic package body 1 below the power management chip body 3, an upper locating piece 10 is fixed on the inner wall of the upper plastic package body 2 above the power management chip body 3, and the lower locating piece 8 and the upper locating piece 10 are tightly attached to the power management chip body 3, so that the power management chip body 3 is conveniently located;
a first heat dissipation cavity 9 is formed in the lower plastic package body 1 below the power management chip body 3, and a second heat dissipation cavity 11 is formed in the upper plastic package body 2 above the power management chip body 3, so that heat can be conveniently dissipated;
rubber gaskets 18 are adhered to the two inner walls of the through groove 17, so that the soft support function is achieved on the pins 15.
When the embodiment of the utility model is used, the following steps are adopted: firstly, owing to establish respectively lower plastic envelope body 1 and last plastic envelope body 2 in lower plastic envelope body 1's below and top, go up the location arch 13 card of plastic envelope body 2 bottom and advance in lower plastic envelope body 1's top's location draw-in groove 14, and use plastic envelope 12 to seal the junction of lower plastic envelope body 1 and last plastic envelope body 2, make lower plastic envelope body 1 and last plastic envelope body 2 form confined whole, adopt the double-sided plastic envelope structure, carry out totally enclosed parcel to power management chip body 3, thereby can prevent that power management chip body 3 from receiving the temperature of air, humidity, dust and corrosive gas's influence, guaranteed electrical property, prolonged life, secondly, owing to power management chip body 3 is located between lower spacer 8 and the last spacer 10, lower spacer 8 and last spacer 10 are to be located power management chip body 3, make the top and bottom of power management chip body 3 all have second heat dissipation chamber 11 and first heat dissipation chamber 9, further, the upper and lower surface of power management chip body 3 all coats silicone grease body 4, the heat dissipation effect of heat conduction chip body 5 is passed through the heat dissipation pin 15 to the inside of pin 15, the inside 17 has been prevented to the bearing pin 15, the inside pin 15 has been passed through the heat dissipation pad, the inside 17 has been prevented, the tip 17, the tip of the heat dissipation pin is prevented from being broken, and the inside 17 has been passed through the heat dissipation pin 17, the tip is prevented from being broken, the inside is protected by the pad 17, the tip 17.
Claims (6)
1. The power management chip with the plastic package structure is characterized by comprising a lower plastic package body (1), an upper plastic package body (2), a power management chip body (3), plastic package glue (12) and pins (15), wherein the upper plastic package body (2) is arranged above the lower plastic package body (1), the plastic package glue (12) is filled at the joint of the lower plastic package body (1) and the upper plastic package body (2), positioning clamping grooves (14) are formed in the edge position of the top end of the lower plastic package body (1), positioning protrusions (13) are fixedly arranged at the edge position of the bottom end of the upper plastic package body (2) and are tightly clamped with the positioning clamping grooves (14), the power management chip body (3) is arranged inside the lower plastic package body (1) and the upper plastic package body (2), the upper surface and the lower surface of the power management chip body (3) are coated with silicone grease (4), equidistant pins (15) are arranged on the two sides of the lower plastic package body (3), and the outer walls (7) of the lower plastic package body (2) are sealed with the copper plate (7) in an extending mode.
2. The power management chip with plastic package structure of claim 1, wherein: the two sides of the lower plastic package body (1) and the upper plastic package body (2) are adhered with protection plates (16), and equidistant through grooves (17) are formed in the protection plates (16).
3. The power management chip with plastic package structure of claim 1, wherein: the surface of lower plastic envelope body (1) and last plastic envelope body (2) all is provided with equidistant through-hole (5), just the inside of through-hole (5) is provided with conducting strip (6), and the one end of conducting strip (6) glues with heat conduction silicone grease (4) and glues, and the other end of conducting strip (6) glues with heat dissipation copper (7).
4. The power management chip with plastic package structure of claim 1, wherein: the power management chip comprises a power management chip body (3), and is characterized in that lower locating pieces (8) are fixed on the inner wall of a lower plastic package body (1) below the power management chip body (3), and upper locating pieces (10) are fixed on the inner wall of an upper plastic package body (2) above the power management chip body (3), and the lower locating pieces (8) and the upper locating pieces (10) are tightly attached to the power management chip body (3).
5. The power management chip with plastic package structure of claim 1, wherein: the power management chip comprises a power management chip body (3), and is characterized in that a first heat dissipation cavity (9) is formed in a lower plastic package body (1) below the power management chip body (3), and a second heat dissipation cavity (11) is formed in an upper plastic package body (2) above the power management chip body (3).
6. The power management chip with plastic package structure of claim 2, wherein: rubber gaskets (18) are adhered to the two inner walls of the through groove (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321697045.XU CN220155527U (en) | 2023-06-30 | 2023-06-30 | Power management chip with plastic package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321697045.XU CN220155527U (en) | 2023-06-30 | 2023-06-30 | Power management chip with plastic package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220155527U true CN220155527U (en) | 2023-12-08 |
Family
ID=89011037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321697045.XU Active CN220155527U (en) | 2023-06-30 | 2023-06-30 | Power management chip with plastic package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220155527U (en) |
-
2023
- 2023-06-30 CN CN202321697045.XU patent/CN220155527U/en active Active
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| GR01 | Patent grant | ||
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