CN220138127U - High-temperature-resistant metallized film for capacitor - Google Patents
High-temperature-resistant metallized film for capacitor Download PDFInfo
- Publication number
- CN220138127U CN220138127U CN202321398925.7U CN202321398925U CN220138127U CN 220138127 U CN220138127 U CN 220138127U CN 202321398925 U CN202321398925 U CN 202321398925U CN 220138127 U CN220138127 U CN 220138127U
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- layer
- heat
- capacitor
- heat dissipation
- film
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- 239000003990 capacitor Substances 0.000 title claims abstract description 28
- 239000011104 metalized film Substances 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 239000010408 film Substances 0.000 claims abstract description 37
- 238000010521 absorption reaction Methods 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 27
- 239000011248 coating agent Substances 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000005253 cladding Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 229920000297 Rayon Polymers 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 115
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a high-temperature-resistant metallized film for a capacitor, which comprises a metal electrode coating, a dielectric film, a first heat dissipation layer, a first heat absorption layer and a first heat-resistant layer, wherein the dielectric film is arranged below the metal electrode coating, the first heat-resistant layer is arranged below the metal electrode coating, a clamping block is arranged below a negative electrode layer, and a clamping groove is formed in the contact position of the clamping block and a positive electrode layer. According to the utility model, through the arrangement of the first heat dissipation layer, the first heat absorption layer and the first heat resistance layer, due to the first heat absorption layer arranged above the metal electrode plating layer and the second heat absorption layer arranged below the dielectric film, part of heat can be absorbed through the first heat absorption layer and the second heat absorption layer, heat transfer is realized, heat is dissipated through the first heat dissipation layer and the second heat dissipation layer, and the heat resistance of the film can be improved through the first heat resistance layer and the second heat resistance layer, so that the high temperature resistance of the film is enhanced.
Description
Technical Field
The utility model relates to the technical field of metallized films, in particular to a high-temperature-resistant metallized film for a capacitor.
Background
The capacitor is generally called a capacitor for short, and is a device for containing charges, as the name implies, the capacitor is one of electronic elements widely used in electronic equipment, and is widely used in the fields of electronics, home appliances, communication, power and the like, the film capacitor is generally formed by winding a metallized capacitor film, and the metallized capacitor film is a metal electrode coating layer formed by vacuum evaporation on a dielectric film and mainly used as a preparation material of the capacitor.
The conventional metallized film for the capacitor has poor high temperature resistance in use, for example, a 3.5 mu m capacitor film disclosed in application number CN201020676461.8, the conventional film is often required to be used in a high-temperature environment, large current can appear in the capacitor to generate high temperature, and if the metallized film has poor high temperature resistance, the heat is not timely dissipated, so that the metallized film is easy to damage in a high-temperature state, and the service life of the capacitor is greatly reduced.
Therefore, it is necessary to solve the above problems by inventing a high temperature resistant metallized film for a capacitor.
Disclosure of Invention
The utility model aims to provide a high-temperature-resistant metallized film for a capacitor, which solves the problem of poor high-temperature resistance in use in the technology, the existing film is often required to be used in a high-temperature environment, large current can be generated in the capacitor to generate high temperature, and if the metallized film is poor in high-temperature resistance, the heat is not timely dissipated, so that the metallized film is easy to damage in a high-temperature state, and the service life of the capacitor is greatly reduced.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a high temperature resistant metallized film for condenser, includes metal electrode cladding layer, dielectric film, first heat dissipation layer, first heat sink layer and first heat-resisting layer, the below of metal electrode cladding layer is provided with dielectric film, the top of metal electrode cladding layer is provided with first heat sink layer, the below of dielectric film is provided with the second heat sink layer, the top of first heat sink layer is provided with first heat dissipation layer, the bottom of second heat sink layer is provided with the second heat dissipation layer, the below of metal electrode cladding layer is provided with first heat-resisting layer, the top of dielectric film is provided with the second heat-resisting layer, the below of first heat-resisting layer is provided with the negative electrode electric layer, the top of second heat-resisting layer is provided with the positive electrode electric layer, the below of negative electrode electric layer is provided with the fixture block, the draw-in groove has been seted up to fixture block and positive electrode electric layer's contact position department.
Preferably, the first heat dissipation layer and the second heat dissipation layer are formed by the same structural design, and the first heat dissipation layer and the second heat dissipation layer are connected to the first heat absorption layer and the second heat absorption layer in a viscose pasting mode.
Preferably, the first heat dissipation layer is provided with a first heat dissipation hole, and the second heat dissipation layer is provided with a second heat dissipation hole.
Preferably, the first heat dissipation holes and the second heat dissipation holes are designed in a round hole structure, and the first heat dissipation holes and the second heat dissipation holes are distributed in a rectangular array.
Preferably, the first heat absorbing layer and the second heat absorbing layer are designed in the same structure, and the first heat absorbing layer and the second heat absorbing layer are parallel to each other.
Preferably, the first heat-resistant layer and the second heat-resistant layer are made of oxygen resin materials, the first heat-resistant layer and the metal electrode coating are connected through adhesive, and the second heat-resistant layer and the dielectric film are connected through adhesive.
Preferably, the positive electrode electric layer and the negative electrode electric layer are designed in the same structure, and the positive electrode electric layer and the negative electrode electric layer are parallel to each other.
Preferably, the clamping blocks are connected with the clamping grooves in a clamping way, the clamping blocks are in uniform array respectively, and the outer diameter of each clamping block is smaller than the inner diameter of each clamping groove.
In the technical scheme, the utility model has the technical effects and advantages that:
through the setting of first heat dissipation layer, first heat-absorbing layer and first heat-resisting layer, owing to the first heat-absorbing layer that sets up in metal electrode cladding material top, the second heat-absorbing layer that sets up in dielectric film below can absorb partial heat through first heat-absorbing layer and second heat-absorbing layer, realizes the transfer of heat, and rethread first heat dissipation layer and second heat dissipation layer give off the heat to can improve the heat resistance of film through first heat-resisting layer and second heat-resisting layer, thereby strengthened the high temperature resistance of film.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram showing a three-dimensional structure of a first heat dissipation layer and a first heat dissipation hole according to the present utility model;
FIG. 3 is a schematic diagram of a second heat dissipation layer and a second heat dissipation hole according to the present utility model;
FIG. 4 is an enlarged perspective view of the structure shown in FIG. 2A according to the present utility model;
fig. 5 is a schematic perspective view of a latch and a slot according to the present utility model.
Reference numerals illustrate:
1. a metal electrode coating; 2. a dielectric film; 3. a first heat dissipation layer; 4. a first heat radiation hole; 5. a second heat dissipation layer; 6. a second heat radiation hole; 7. a first heat sink layer; 8. a second heat sink layer; 9. a first heat-resistant layer; 10. a second heat-resistant layer; 11. a negative electrode layer; 12. a positive electrode layer; 13. a clamping block; 14. a clamping groove.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
The utility model provides a high-temperature-resistant metallized film for a capacitor, which is shown in fig. 1-5, and comprises a metal electrode coating 1, a dielectric film 2, a first heat dissipation layer 3, a first heat absorption layer 7 and a first heat resistance layer 9, wherein the dielectric film 2 is arranged below the metal electrode coating 1, the first heat absorption layer 7 is arranged above the metal electrode coating 1, the second heat absorption layer 8 is arranged below the dielectric film 2, the first heat dissipation layer 3 is arranged above the first heat absorption layer 7, the second heat dissipation layer 5 is arranged at the bottom of the second heat absorption layer 8, the first heat resistance layer 9 is arranged below the metal electrode coating 1, the second heat resistance layer 10 is arranged above the dielectric film 2, the negative electrode electric layer 11 is arranged below the first heat resistance layer 9, the positive electrode electric layer 12 is arranged above the second heat resistance layer 10, the clamping block 13 is arranged below the negative electrode electric layer 11, and the clamping groove 14 is formed at the contact position of the clamping block 13 and the positive electrode electric layer 12.
The first heat dissipation layer 3 and the second heat dissipation layer 5 are formed by the same structural design, the first heat dissipation layer 3 and the second heat dissipation layer 5 are connected to the first heat absorption layer 7 and the second heat absorption layer 8 in a viscose pasting mode, the first heat dissipation layer 3 is provided with the first heat dissipation holes 4, the second heat dissipation layer 5 is provided with the second heat dissipation holes 6, the first heat dissipation holes 4 and the second heat dissipation holes 6 are formed by the circular hole structural design, and the first heat dissipation holes 4 and the second heat dissipation holes 6 are distributed in a rectangular array.
The first heat absorption layer 7 and the second heat absorption layer 8 are formed by the same structural design, the first heat absorption layer 7 and the second heat absorption layer 8 are parallel to each other, the first heat-resistant layer 9 and the second heat-resistant layer 10 are made of oxygen resin materials, the first heat-resistant layer 9 and the metal electrode coating 1 are connected through adhesive, the second heat-resistant layer 10 and the dielectric film 2 are connected through adhesive, the positive electrode electric layer 12 and the negative electrode electric layer 11 are formed by the same structural design, the positive electrode electric layer 12 and the negative electrode electric layer 11 are parallel to each other, clamping blocks 13 and clamping grooves 14 are connected in a clamping mode, the clamping blocks 13 are in uniform arrays respectively, and the outer diameter of the clamping blocks 13 is smaller than the inner diameter of the clamping grooves 14.
The working principle of the utility model is as follows:
referring to the attached drawings 1-5 of the specification, when the device is used, firstly, the negative electrode electric layer 11, the positive electrode electric layer 12, the clamping block 13 and the clamping groove 14 are arranged between the metal electrode plating layer 1 and the dielectric film 2, so that the clamping block 13 and the clamping groove 14 are in proper matching connection, and the positive electrode electric layer 12 of the negative electrode electric layer 11 and the positive electrode electric layer 12 are mutually attracted, thereby improving the adhesive force between the metal electrode plating layer 1 and the dielectric film 2 and preventing the phenomenon of delamination caused by the gap generated by poor connectivity between the metal electrode plating layer 1 and the dielectric film 2;
referring to fig. 1-5 of the specification, when the device is used, a large amount of heat is generated by the capacitor to damage the film when the metallized film is used, so that the first heat absorption layer 7 arranged above the metal electrode coating 1, the second heat absorption layer 8 arranged below the dielectric film 2 can absorb part of the heat through the first heat absorption layer 7 and the second heat absorption layer 8, heat transfer is realized, the heat is dissipated through the first heat dissipation layer 3 and the second heat dissipation layer 5, and the heat resistance of the film can be improved through the first heat resistance layer 9 and the second heat resistance layer 10, so that the high temperature resistance of the film is enhanced.
Claims (8)
1. The utility model provides a high temperature resistant metallized film for condenser, includes metal electrode cladding material (1), dielectric film (2), first heat dissipation layer (3), first heat sink layer (7) and first heat-resisting layer (9), its characterized in that: the utility model discloses a solar cell module, including metal electrode cladding material (1), negative electrode dielectric layer (11), positive electrode dielectric layer (12), fixture block (13), heat dissipation layer (9) are provided with in the below of metal electrode cladding material (1), the top of metal electrode cladding material (1) is provided with dielectric film (2), the top of metal electrode cladding material (1) is provided with first heat-absorbing layer (7), the below of dielectric film (2) is provided with second heat-absorbing layer (8), the below of second heat-resisting layer (10) is provided with second heat-absorbing layer (8), the below of negative electrode dielectric layer (11) is provided with fixture block (13), fixture block (13) and positive electrode dielectric layer (12) contact position department has seted up draw-in groove (14).
2. The metallized film for a capacitor of claim 1, wherein: the first heat dissipation layer (3) and the second heat dissipation layer (5) are formed by the same structural design, and the first heat dissipation layer (3) and the second heat dissipation layer (5) are connected to the first heat absorption layer (7) and the second heat absorption layer (8) in a viscose pasting mode.
3. The metallized film for a capacitor of claim 2, wherein: the first radiating layer (3) is provided with a first radiating hole (4), and the second radiating layer (5) is provided with a second radiating hole (6).
4. A metallized film for a capacitor resistant to high temperatures as recited in claim 3, wherein: the first radiating holes (4) and the second radiating holes (6) are designed to be round-hole-shaped structures, and the first radiating holes (4) and the second radiating holes (6) are distributed in a rectangular array.
5. The metallized film for a capacitor of claim 1, wherein: the first heat absorption layer (7) and the second heat absorption layer (8) are designed to be of the same structure, and the first heat absorption layer (7) and the second heat absorption layer (8) are parallel to each other.
6. The metallized film for a capacitor of claim 1, wherein: the first heat-resistant layer (9) and the second heat-resistant layer (10) are made of oxygen-containing resin materials, the first heat-resistant layer (9) and the metal electrode coating (1) are connected through adhesive bonding, and the second heat-resistant layer (10) and the dielectric film (2) are connected through adhesive bonding.
7. The metallized film for a capacitor of claim 1, wherein: the positive electrode electric layer (12) and the negative electrode electric layer (11) are designed to be of the same structure, and the positive electrode electric layer (12) and the negative electrode electric layer (11) are parallel to each other.
8. The metallized film for a capacitor of claim 1, wherein: the clamping blocks (13) are connected with the clamping grooves (14) in a clamping mode, the clamping blocks (13) are in uniform array respectively, and the outer diameter of each clamping block (13) is smaller than the inner diameter of each clamping groove (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321398925.7U CN220138127U (en) | 2023-06-02 | 2023-06-02 | High-temperature-resistant metallized film for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321398925.7U CN220138127U (en) | 2023-06-02 | 2023-06-02 | High-temperature-resistant metallized film for capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220138127U true CN220138127U (en) | 2023-12-05 |
Family
ID=88963972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321398925.7U Active CN220138127U (en) | 2023-06-02 | 2023-06-02 | High-temperature-resistant metallized film for capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220138127U (en) |
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2023
- 2023-06-02 CN CN202321398925.7U patent/CN220138127U/en active Active
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