CN220087165U - Thermoelectric conversion device utilizing waste heat of industrial wastewater - Google Patents
Thermoelectric conversion device utilizing waste heat of industrial wastewater Download PDFInfo
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- CN220087165U CN220087165U CN202320189582.7U CN202320189582U CN220087165U CN 220087165 U CN220087165 U CN 220087165U CN 202320189582 U CN202320189582 U CN 202320189582U CN 220087165 U CN220087165 U CN 220087165U
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 37
- 239000002918 waste heat Substances 0.000 title claims abstract description 29
- 239000010842 industrial wastewater Substances 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 120
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000010248 power generation Methods 0.000 claims abstract description 17
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- 229910052799 carbon Inorganic materials 0.000 claims description 31
- 239000004744 fabric Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims 4
- 229920000573 polyethylene Polymers 0.000 claims 4
- 238000004378 air conditioning Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002440 industrial waste Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229960002796 polystyrene sulfonate Drugs 0.000 description 1
- 239000011970 polystyrene sulfonate Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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Abstract
The utility model discloses a thermoelectric conversion device utilizing industrial wastewater waste heat, which comprises a power generation unit, a heat collection part and a heat dissipation part, wherein the power generation unit comprises a P-type semiconductor element, an N-type semiconductor element, a first electrode, a second electrode and a circuit connecting piece, the circuit connecting piece is connected with the P-type semiconductor element and the N-type semiconductor element, the first electrode and the second electrode are used for being electrically connected with a load, a conductive film is arranged between one side surface of the first electrode and one side end of the P-type semiconductor element and/or between one side surface of the second electrode and one side end of the N-type semiconductor element in a contact manner, and the conductive film is made of poly (3, 4-ethylenedioxythiophene) -poly-P-styrene sulfonate material and can be contacted with steam; the heat collecting component is fixedly connected with the P-type semiconductor element and the N-type semiconductor element; the heat dissipation part is fixedly connected with the side surfaces of the first electrode and the second electrode. The thermoelectric conversion device utilizing the waste heat of the industrial wastewater can improve thermoelectric conversion efficiency.
Description
Technical Field
The utility model relates to the technical field of thermoelectric conversion, in particular to a thermoelectric conversion device utilizing waste heat of industrial wastewater.
Background
The high-efficiency conversion and recycling of various industrial waste heat can further reduce production energy consumption and create a certain economic value, the thermoelectric conversion technology is used for industrial waste heat recycling, and is an energy utilization mode capable of effectively creating economic value, for example, a waste heat power generation device provided by patent CN206180898U recycles low-grade heat energy through a PN junction power generation unit to generate power, wherein a P-type semiconductor material and an N-type semiconductor material are directly contacted with an electrode metal sheet, and under the condition of recycling industrial waste water waste heat, the thermoelectric conversion efficiency is lower, and the waste heat of industrial waste water cannot be fully recycled.
Disclosure of Invention
The utility model aims to provide a thermoelectric conversion device utilizing waste heat of industrial wastewater, so as to solve the problems in the prior art and improve thermoelectric conversion efficiency.
In order to achieve the above object, the present utility model provides the following solutions:
the utility model provides a thermoelectric conversion device utilizing industrial wastewater waste heat, which comprises a power generation unit, a heat collection part and a heat dissipation part, wherein the power generation unit comprises a P-type semiconductor element, an N-type semiconductor element, a first electrode, a second electrode and a circuit connecting piece, the first electrode and the second electrode are respectively positioned at the same side of the P-type semiconductor element and the N-type semiconductor element, the circuit connecting piece is positioned at the other side of the P-type semiconductor element and the N-type semiconductor element and is connected with the P-type semiconductor element and the N-type semiconductor element, the first electrode and the second electrode are used for being electrically connected with a load, a conductive film is arranged between one side surface of the first electrode and one side end of the P-type semiconductor element and/or between one side surface of the second electrode and one side end of the N-type semiconductor element in a contact manner, the conductive film adopts poly (3, 4-ethylenedioxythiophene) -poly-styrene sulfonate material, and the conductive film can be contacted with steam; the heat collecting component is fixedly connected with the side end of the circuit connecting piece, which is away from the P-type semiconductor element and the N-type semiconductor element; the heat collecting part is used for transferring the heat of the absorbed heat source to the P-type semiconductor element and the N-type semiconductor element; the heat dissipation component is fixedly connected with the side faces, away from the P-type semiconductor element and the N-type semiconductor element, of the first electrode and the second electrode, and is used for dissipating heat from the side ends, away from the heat collection component, of the P-type semiconductor element and the N-type semiconductor element.
Preferably, the conductive film is disposed between the first electrode and the P-type semiconductor element and between the second electrode and the N-type semiconductor element.
Preferably, the first electrode and the second electrode are fixedly connected with the heat dissipation component in an insulating manner.
Preferably, the circuit connector is fixedly connected with the heat collecting component in an insulating manner.
Preferably, the first electrode includes a first carbon cloth and a first metal sheet, the second electrode includes a second carbon cloth and a second metal sheet, the first metal sheet and the second metal sheet are respectively electrically connected with the first carbon cloth and the second carbon cloth and are used for being electrically connected with the load, one side surface of the first carbon cloth and one side surface of the second carbon cloth are fixedly connected with the heat dissipation part, and the other side surfaces of the first carbon cloth and the second carbon cloth are respectively electrically connected with the two conductive films.
Preferably, the P-type semiconductor element adopts an antimony doped bismuth telluride P-type semiconductor element, and the N-type semiconductor element adopts a selenium doped bismuth telluride N-type semiconductor element.
Preferably, the heat collecting member is provided as a nickel plate.
Preferably, the heat dissipation part is an aluminum cavity, and one side of the heat dissipation part, which faces away from the power generation unit, is open.
Preferably, the solar heat collector further comprises an encapsulation shell, wherein the encapsulation shell is fixedly arranged between the heat collecting part and the heat radiating part and encloses a containing cavity, and the power generation unit is arranged in the containing cavity; the packaging shell is provided with a through hole capable of communicating the outside with the accommodating cavity, and the through hole can be filled with steam so that the conductive film is in contact with the steam.
Preferably, the number of the through holes is plural, and each of the through holes is flush with the conductive film and opposite to the conductive film.
Compared with the prior art, the utility model has the following technical effects:
the utility model provides a thermoelectric conversion device utilizing industrial wastewater waste heat, wherein a heat collecting component absorbs waste heat of a heat source and transmits the heat to one ends of a P-type semiconductor element and an N-type semiconductor element through a circuit connecting piece, so that one ends of the P-type semiconductor element and the N-type semiconductor element are hot ends, the circuit connecting piece can be connected with the P-type semiconductor element and the N-type semiconductor element in a circuit mode, the other ends of the P-type semiconductor element and the N-type semiconductor element are connected with a heat radiating component through a first electrode and a second electrode, heat is radiated through the heat radiating component, cold ends of the other ends of the P-type semiconductor element and the N-type semiconductor element are enabled to generate temperature differences, and therefore potential differences are formed at two ends of a PN junction galvanic couple arm formed by the P-type semiconductor element and the N-type semiconductor element, current or voltage is generated and transmitted to a load through the first electrode and the second electrode; the conductive film is arranged between the P-type semiconductor element and the first electrode or between the N-type semiconductor element and the second electrode, and is made of poly (3, 4-ethylenedioxythiophene) -poly-P-styrene sulfonate, so that the conductive film has good flexibility, good ductility and flexible installation, and can be contacted with steam, and under the condition that the conductive film encounters moisture, water molecules enable sulfonic groups of the conductive film to release movable protons, the movable protons enhance conductivity, current generated by PN junctions can be better conducted, output voltage or output current is improved, energy loss of heat energy in the conversion and conduction processes is reduced, and therefore the purpose of improving thermoelectric conversion efficiency is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an axial measurement structure of a thermoelectric conversion device (with a package removed) using waste heat of industrial wastewater according to an embodiment;
fig. 2 is a schematic structural diagram of a heat dissipating component according to a first embodiment;
fig. 3 is a schematic structural diagram of a package according to a first embodiment.
Icon: 1-a thermoelectric conversion device utilizing the residual heat of industrial wastewater; 10-a power generation unit; 11-P type semiconductor element; a 12-N type semiconductor element; 13-a first electrode; 131-a first carbon cloth; 132-a first metal sheet; 14-a second electrode; 141-a second carbon cloth; 142-a second metal sheet; 15-circuit connection; 16-a conductive film; 20-a heat collecting member; 30-a heat sink member; 40, packaging the shell; 41-through holes.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model aims to provide a thermoelectric conversion device utilizing waste heat of industrial wastewater, so as to solve the problems in the prior art and improve thermoelectric conversion efficiency.
In order that the above-recited objects, features and advantages of the present utility model will become more readily apparent, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description.
Example 1
Referring to fig. 1 to 3, the thermoelectric conversion device 1 includes a power generation unit 10, a heat collecting component 20 and a heat dissipating component 30, wherein the power generation unit 10 includes a P-type semiconductor element 11, an N-type semiconductor element 12, a first electrode 13, a second electrode 14 and a circuit connecting piece 15, the first electrode 13 and the second electrode 14 are respectively located at the same side of the P-type semiconductor element 11 and the N-type semiconductor element 12, the circuit connecting piece 15 is located at the other side of the P-type semiconductor element 11 and the N-type semiconductor element 12 and is connected with the P-type semiconductor element 11 and the N-type semiconductor element 12, the first electrode 13 and the second electrode 14 are used for being electrically connected to a load, a conductive film 16 is provided between one side surface of the first electrode 13 and one side end of the P-type semiconductor element 11 and/or between one side surface of the second electrode 14 and one side end of the N-type semiconductor element 12, and the conductive film 16 is made of poly 3, 4-ethylenedioxythiophene-poly-P-styrene sulfonate; the heat collecting part 20 is fixedly connected with the side ends of the circuit connecting piece 15, which are away from the P-type semiconductor element 11 and the N-type semiconductor element 12; the heat collecting member 20 is used to transfer the heat of the absorbed heat source to the P-type semiconductor element 11 and the N-type semiconductor element 12; the heat dissipation component 30 is fixedly connected with the side surfaces of the first electrode 13 and the second electrode 14, which are away from the P-type semiconductor element 11 and the N-type semiconductor element 12, and is used for dissipating heat from the side ends of the P-type semiconductor element 11 and the N-type semiconductor element 12, which are away from the heat collection component 20.
The heat collecting part 30 absorbs the waste heat of the heat source and transmits the heat to one ends of the P-type semiconductor element 11 and the N-type semiconductor element 12 through the circuit connecting piece 15, so that one ends of the P-type semiconductor element 11 and the N-type semiconductor element 12 are hot ends, the circuit connecting piece 15 and the P-type semiconductor element 11 and the N-type semiconductor element 12 can be connected in a circuit, the other ends of the P-type semiconductor element 11 and the N-type semiconductor element 12 are connected with the heat radiating part 30 through the first electrode 13 and the second electrode 14, the heat is radiated through the heat radiating part 30, the cold ends of the other ends of the P-type semiconductor element 11 and the N-type semiconductor element 12 are enabled to generate temperature differences at the two ends of the P-type semiconductor element 11 and the N-type semiconductor element 12, and thus the potential difference formed at the two ends of a PN junction couple arm formed by the P-type semiconductor element 11 and the N-type semiconductor element 12 is enabled to generate current or voltage, and the current or voltage is transmitted to a load through the first electrode 13 and the second electrode 14; the conductive film 16 is arranged between the P-type semiconductor element 11 and the first electrode 13 or between the N-type semiconductor element 12 and the second electrode 14, the conductive film 16 is made of poly (3, 4-ethylenedioxythiophene) -poly-P-styrenesulfonate, the conductive film 16 can be in contact with steam, under the condition that the conductive film 16 encounters moisture, water molecules enable sulfonic groups of the conductive film 16 to release movable protons, the movable protons enhance conductivity, current generated by PN junctions can be better conducted, output voltage or output current is improved, energy loss of heat energy in the conversion and conduction processes is reduced, and therefore the purpose of improving thermoelectric conversion efficiency is achieved.
Specifically, the thermoelectric conversion device 1 using the waste heat of the industrial wastewater provided in the present embodiment may be mainly applied to the use of the waste heat of the industrial wastewater, and may directly use the steam generated by the evaporation of the wastewater itself.
In particular, the circuit connection 15 may be provided as a metal sheet.
The material of the conductive film 16 is not limited to poly (3, 4-ethylenedioxythiophene) -poly-p-styrenesulfonate, and may be any material that can enhance the conductivity of the device when exposed to moisture.
In the alternative of this embodiment, preferably, the conductive film 16 is disposed between a side surface of the first electrode 13 and a side end of the P-type semiconductor element 11 and between a side surface of the second electrode 14 and a side end of the N-type semiconductor element 12, so as to further enhance conductivity of the whole device.
In the alternative of this embodiment, preferably, the first electrode 13 and the second electrode 14 are fixedly connected with the heat dissipation component 30 in an insulating manner, specifically, the first electrode 13 and the second electrode 14 are adhered to the heat dissipation component 30 through insulating glue, and the heat dissipation component 30 is prevented from affecting the circuit of the power generation component 10 while being fixedly connected.
In the alternative of this embodiment, preferably, the circuit connection member 15 is fixedly connected with the heat collecting member 20 in an insulating manner; specifically, the P-type semiconductor element 11 and the N-type semiconductor element 12 are bonded to the heat collecting member 20 by an insulating adhesive, and are fixedly connected while achieving insulation, so that the heat collecting member 20 is prevented from affecting the circuit of the power generating member 10.
In the alternative of the present embodiment, more preferably, the first electrode 13 includes a first carbon cloth 131 and a first metal sheet 132, the second electrode 14 includes a second carbon cloth 141 and a second metal sheet 142, the first metal sheet 132 and the second metal sheet 142 are respectively electrically connected with the first carbon cloth 131 and the second carbon cloth 141 and are used for being electrically connected with a load, one side surface of the first carbon cloth 131 and one side surface of the second carbon cloth 141 are fixedly connected with the heat dissipation component 30, and the other side surface of the first carbon cloth 131 and the other side surface of the second carbon cloth 141 are respectively electrically connected with the two conductive films 16; the first and second carbon cloths 131 and 141 are light and thin, easy to install, and the first and second metal sheets 132 and 142 facilitate connection loads.
Specifically, the first metal sheets 132 and the second metal sheets 142 may be both provided as copper sheets, and both provided as two, the two first metal sheets 132 are electrically connected with the positive electrode or the negative electrode of the external load, and the two second metal sheets 142 are electrically connected with the negative electrode or the positive electrode of the external load, respectively.
Further, the conductive film 16 has a size larger than that of the first carbon cloth 131 and the second carbon cloth 141, so that the conductivity is improved while the first carbon cloth 131 and the second carbon cloth 141 are electrically connected to the P-type semiconductor element 11 and the N-type semiconductor element 12.
In the alternative of the present embodiment, preferably, the P-type semiconductor element 11 is an antimony doped bismuth telluride P-type semiconductor element, and the N-type semiconductor element 12 is a selenium doped bismuth telluride N-type semiconductor element.
In the alternative of the present embodiment, it is preferable that the heat collecting member 20 is provided as a nickel plate having good heat conductivity.
In the alternative of this embodiment, preferably, referring to fig. 2, the heat dissipation component 30 is an aluminum cavity, and one side of the heat dissipation component 30 facing away from the power generation unit 10 is open, that is, the heat dissipation component 30 is configured as a bucket structure, so that the heat dissipation area is large, the heat dissipation effect is good, and the whole thermoelectric conversion device 1 using the waste heat of industrial wastewater is convenient to fix with other devices.
In an alternative of the present embodiment, referring to fig. 3, preferably, the thermoelectric conversion device 1 using waste heat of industrial wastewater provided in the present embodiment further includes a package shell 40 fixedly disposed between the heat collecting component 20 and the heat dissipating component 30 and enclosing a containing cavity, and the power generating unit 10 is disposed in the containing cavity; the package case 40 is provided with a through hole 41 capable of communicating the outside and the accommodating cavity, the through hole 41 can be filled with steam to enable the conductive film 16 to be in contact with the steam, the package case 40 can play a role in protecting the power generation unit 10, and meanwhile heat diffusion losses of the P-type semiconductor element 11 and the N-type semiconductor element 12 are reduced to affect thermoelectric conversion efficiency.
In the alternative of this embodiment, more preferably, the number of the through holes 41 is plural, and each through hole 41 is flush with the conductive film 16 and opposite to the conductive film 16, so that the steam can directly contact with and be absorbed by the conductive film 16 after entering the accommodating cavity; specifically, the number of the through holes 41 may be set according to actual demands.
The principles and embodiments of the present utility model have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present utility model; also, it is within the scope of the present utility model to be modified by those of ordinary skill in the art in light of the present teachings. In summary, the present description should not be construed as limiting the utility model.
Claims (10)
1. A thermoelectric conversion device utilizing waste heat of industrial wastewater is characterized in that: comprising the following steps:
the power generation unit (10), the power generation unit (10) comprises a P-type semiconductor element (11), an N-type semiconductor element (12), a first electrode (13), a second electrode (14) and a circuit connecting piece (15), wherein the first electrode (13) and the second electrode (14) are respectively positioned on the same side of the P-type semiconductor element (11) and the N-type semiconductor element (12), the circuit connecting piece (15) is positioned on the other side of the P-type semiconductor element (11) and the N-type semiconductor element (12) and is connected with the P-type semiconductor element (11) and the N-type semiconductor element (12), the first electrode (13) and the second electrode (14) are used for being electrically connected to a load, a side surface of the first electrode (13) is contacted with one side end of the P-type semiconductor element (11) and/or a side surface of the second electrode (14) is contacted with one side end of the N-type semiconductor element (12), and a conductive film (16) -polyethylene sulfonate (4, 4-polyethylene sulfonate, 16-4-polyethylene sulfonate and a conductive film (16) can be contacted with the P-polyethylene sulfonate;
a heat collecting component (20), wherein the heat collecting component (20) is fixedly connected with the side end of the circuit connecting piece (15) which is away from the P-type semiconductor element (11) and the N-type semiconductor element (12); the heat collecting member (20) is used for transferring the heat of the absorbed heat source to the P-type semiconductor element (11) and the N-type semiconductor element (12); a kind of electronic device with high-pressure air-conditioning system
The heat dissipation component (30), the heat dissipation component (30) with first electrode (13) with second electrode (14) deviate from the side fixed connection of P type semiconductor component (11) with N type semiconductor component (12), and be used for to P type semiconductor component (11) with N type semiconductor component (12) deviate from the side of heat collection part (20) and dispel the heat.
2. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the conductive film (16) is disposed between one side surface of the first electrode (13) and one side end of the P-type semiconductor element (11) and between one side surface of the second electrode (14) and one side end of the N-type semiconductor element (12).
3. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the first electrode (13) and the second electrode (14) are fixedly connected with the heat dissipation component (30) in an insulating mode.
4. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the circuit connecting piece (15) is fixedly connected with the heat collecting component (20) in an insulating way.
5. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 2, wherein: the first electrode (13) comprises a first carbon cloth (131) and a first metal sheet (132), the second electrode (14) comprises a second carbon cloth (141) and a second metal sheet (142), the first metal sheet (132) and the second metal sheet (142) are respectively electrically connected with the first carbon cloth (131) and the second carbon cloth (141) and are used for being electrically connected with a load, one side surface of the first carbon cloth (131) and one side surface of the second carbon cloth (141) are fixedly connected with the heat dissipation part (30), and the other side surfaces of the first carbon cloth (131) and the second carbon cloth (141) are respectively electrically connected with the two conductive films (16).
6. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the P-type semiconductor element (11) adopts an antimony-doped bismuth telluride P-type semiconductor element, and the N-type semiconductor element (12) adopts a selenium-doped bismuth telluride N-type semiconductor element.
7. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the heat collecting member (20) is provided as a nickel plate.
8. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the heat dissipation part (30) is arranged into an aluminum cavity, and one side of the heat dissipation part (30) away from the power generation unit (10) is open.
9. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 1, wherein: the heat-collecting component comprises a heat-radiating component (30) and a heat-collecting component (20), and is characterized by further comprising an encapsulation shell (40), wherein the encapsulation shell (40) is fixedly arranged between the heat-collecting component (20) and the heat-radiating component (30) and encloses a containing cavity, and the power-generating unit (10) is arranged in the containing cavity; the packaging shell (40) is provided with a through hole (41) which can be communicated with the outside and the accommodating cavity, and the through hole (41) can be filled with steam so that the conductive film (16) is in contact with the steam.
10. The thermoelectric conversion device utilizing waste heat of industrial wastewater according to claim 9, wherein: the number of the through holes (41) is plural, and each through hole (41) is flush with the conductive film (16) and opposite to the conductive film (16).
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CN202320189582.7U CN220087165U (en) | 2023-02-13 | 2023-02-13 | Thermoelectric conversion device utilizing waste heat of industrial wastewater |
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