CN218918881U

CN218918881U - Double-core bypass diode

Info

Publication number: CN218918881U
Application number: CN202223463178.9U
Authority: CN
Inventors: 陈刚; 武建国
Original assignee: Changzhou Starsea Electronics Co ltd
Current assignee: Changzhou Starsea Electronics Co ltd
Priority date: 2022-12-25
Filing date: 2022-12-25
Publication date: 2023-04-25
Anticipated expiration: 2032-12-25

Abstract

The utility model discloses a double-core bypass diode, which comprises a first substrate and a second substrate; the first substrate is provided with a first tin storage tank, a first converging tank and an aluminum strip bonding area, the first converging tank is arranged on the right side of the first tin storage tank, the right inner wall of the first converging tank is provided with a sawtooth edge, and the aluminum strip bonding area is arranged on the right side of the first converging tank; the second substrate is provided with a second tin storage groove, a second converging groove and a core particle placing area, the second converging groove is arranged on the right side of the core particle placing area, the second tin storage groove is arranged on the right side of the second converging groove, the core particle placing area is provided with two core particles, and each core particle is electrically connected with the aluminum ribbon bonding area through an aluminum ribbon. The utility model provides a double-core bypass diode, both ends of which can be riveted with a junction strip, so that the double-core bypass diode is convenient for customers to use, saves installation space, has better heat dissipation effect, and has a more firm and stable product structure.

Description

Double-core bypass diode

Technical Field

The utility model relates to a dual-core bypass diode.

Background

At present, along with the continuous development of power electronic devices at home and abroad, the modern application of power electronics is more and more extensive, some functional power periods or modules become the dominant direction in the future, and the main development trend in the future gradually approaches to the directions of greenization, high-frequency, standard modularization, intellectualization, low power consumption and the like.

In recent years, diodes are commonly used as bypass diodes in photovoltaic modules, and the quality of the bypass diodes has a great influence on the electrical performance and the safety performance of the modules. Bypass diodes are mainly used for bypass switches of solar panels in photovoltaic applications. The solar panel is usually composed of a series of arrays of cells of solar cells, all of which are subjected to the same irradiation and action under optimal conditions, operating at the same current level.

However, the existing bypass diode has high heating power, so that the existing bypass diode has poor heat dissipation effect and high thermal resistance, and the product structure is not firm enough, the stability is poor, and the service life and the performance of the product are affected.

Disclosure of Invention

The utility model aims to solve the technical problems of overcoming the defects of the prior art and providing the double-core bypass diode, wherein both ends of the double-core bypass diode can be riveted with the junction band, so that the double-core bypass diode is convenient for customers to use, saves installation space, has better heat dissipation effect and has more firm and stable product structure.

In order to solve the technical problems, the technical scheme of the utility model is as follows:

a dual-core bypass diode includes a first substrate and a second substrate;

the first substrate is provided with a first tin storage tank, a first converging tank and an aluminum strip bonding area, the first converging tank is arranged on the right side of the first tin storage tank, the right inner wall of the first converging tank is provided with a sawtooth edge, and the aluminum strip bonding area is arranged on the right side of the first converging tank;

the second substrate is provided with a second tin storage tank, a second converging tank and a core particle placing area, the second converging tank is arranged on the right side of the core particle placing area, the second tin storage tank is arranged on the right side of the second converging tank, the core particle placing area is provided with two core particles, and each core particle is electrically connected with an aluminum belt bonding area through an aluminum belt;

and plastic package shells are coated on the peripheries of the first converging groove, the aluminum belt bonding area, the aluminum belt, the core particle placing area and the core particles.

Further, a first U-shaped groove is formed in the end portion of the first base plate.

Further, one end of the first substrate is provided with a plurality of first positioning holes.

Further, a second U-shaped groove is formed in the end portion of the second base plate.

Further, one end of the second substrate is provided with a plurality of second positioning holes.

Further, the first tin storage tank and the second tin storage tank are all non-hollowed grooves, and the first tin storage tank and the second tin storage tank are used for storing tin blocks.

Further, the first converging groove and the second converging groove are hollow grooves, and the first converging groove and the second converging groove are used for the converging belt to pass through.

By adopting the technical scheme, the utility model adopts two substrates, the end part of each substrate is provided with the U-shaped groove, and the two ends of each substrate can be riveted with the converging belt, so that the positive electrode and the negative electrode can be omitted during use, and the installation and the use are more flexible and convenient. The two grooves are connected in parallel with the Schottky core particles, so that the heat dissipation of the diode is facilitated, and the thermal resistance is reduced. Chu Xicao is additionally arranged, so that the contact area is increased, the client is convenient to weld well, and the heat dissipation performance and stability are better. The right side inner wall of the first converging groove is provided with the sawtooth edge, and the sawtooth edge is coated in the plastic package shell, so that the binding force of the plastic package shell is increased, and the product is firmer and more stable.

Drawings

FIG. 1 is a schematic diagram of a dual-core bypass diode according to the present utility model;

fig. 2 is a schematic structural diagram of the inside of the plastic package housing of the present utility model.

Detailed Description

In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments that are illustrated in the appended drawings.

As shown in fig. 1 and 2, the present embodiment provides a dual-core bypass diode including a first substrate 1 and a second substrate 2 disposed apart from each other in the left-right direction. As shown in fig. 1, a first U-shaped groove 11 is provided at an end of the first substrate 1, and a plurality of first positioning holes 12 are provided at one end of the first substrate 1. The end of the second base plate 2 is provided with a second U-shaped groove 21, and one end of the second base plate 2 is provided with a plurality of second positioning holes 22. The U-shaped grooves are formed in the end portions of the two substrates, so that the two ends of the double-core bypass diode can be riveted with the converging strips, the locating pins can be penetrated into the locating holes for installation and fixation, and the double-core bypass diode is more flexible and convenient to install and use without dividing the anode and the cathode during use.

As shown in fig. 1 and 2, a first tin storage tank 3, a first sink 4 and an aluminum ribbon bonding area 5 are disposed on a first substrate 1 in this embodiment, the first sink 4 is disposed on the right side of the first tin storage tank 3, and a saw-tooth edge 41 is disposed on the right inner wall of the first sink 4. The first tin storage tank 3 of this embodiment is a non-hollowed groove for storing tin blocks, the first converging tank 4 is a hollowed groove, and the first converging tank 4 is used for passing through a converging belt. After the converging belt passes through the converging groove, the connecting and fixing of the converging belt is facilitated through the tin block welding on the tin storage groove, the tin block is stored through the tin storage groove, the contact area is increased, good welding of a client is facilitated, and better heat dissipation performance and stability are achieved.

As shown in fig. 1 and 2, the second substrate 2 of the present embodiment is provided with a second tin storage tank 6, a second converging tank 7 and a core particle placing area 8, the second converging tank 7 is disposed on the right side of the core particle placing area 8, and the second tin storage tank 6 is disposed on the right side of the second converging tank 7. The second tin storage tank 6 of the embodiment is a non-hollowed groove, the second converging tank 7 is a hollowed groove, and the second converging tank 7 is used for the converging belt to pass through. The second tin storage tank 6 is used for storing tin blocks, and after the converging belt passes through the converging tank, the converging belt is welded on the tin storage tank through the tin blocks, so that the connecting and fixing of the converging belt are facilitated.

As shown in fig. 2, the aluminum ribbon bonding area 5 of the present embodiment is disposed on the right side of the first sink 4, and the core particle placement area 8 is provided with two core particles 81, and each core particle 81 is electrically connected to the aluminum ribbon bonding area 5 through one aluminum ribbon 82. In the embodiment, the groove schottky core particles 81 are adopted, the forward voltage drop is small, the current resistance is large, the reverse current is small, the temperature characteristic curve is good, and the diode heat dissipation is facilitated by adopting a mode that two core particles 81 are connected in parallel.

As shown in fig. 1 and 2, the outer circumferences of the first sink 4, the aluminum ribbon bonding region 5, the aluminum ribbon 82, the core particle placement region 8, and the core particle 81 of the present embodiment are covered with the plastic package case 9. The plastic package shell 9 adopts the epoxy resin with excellent heat conduction performance, has higher purity, reduces Na and CL ions to the minimum, has better cohesiveness with the substrate metal, and because the saw-tooth edge 41 is arranged on the right inner wall of the first converging groove 4, the saw-tooth edge 41 is coated in the epoxy resin, the binding force of the plastic package shell 9 is increased, and the product is firmer and more stable. The plastic package housing 9 can increase the heat dissipation efficiency of the tube body and reduce the thermal resistance. The method adopts an advanced MGP die to carry out die pressing during processing, and is characterized by multi-cylinder and multi-die, high accuracy of the MGP die, no wire pressing and saving the consumption of epoxy resin black glue. After molding, the plastic package housing 9 has small stress and low shrinkage, and can not cause the module to warp to a larger extent.

The technical problems, technical solutions and advantageous effects solved by the present utility model have been further described in detail in the above-described embodiments, and it should be understood that the above-described embodiments are only illustrative of the present utility model and are not intended to limit the present utility model, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. A dual-core bypass diode, characterized by: it comprises a first substrate (1) and a second substrate (2);

the novel tin storage device comprises a first substrate (1), and is characterized in that a first tin storage tank (3), a first converging tank (4) and an aluminum strip bonding area (5) are arranged on the first substrate (1), the first converging tank (4) is arranged on the right side of the first tin storage tank (3), a sawtooth edge (41) is arranged on the inner wall on the right side of the first converging tank (4), and the aluminum strip bonding area (5) is arranged on the right side of the first converging tank (4);

the second substrate (2) is provided with a second tin storage tank (6), a second converging tank (7) and a core particle placing area (8), the second converging tank (7) is arranged on the right side of the core particle placing area (8), the second tin storage tank (6) is arranged on the right side of the second converging tank (7), the core particle placing area (8) is provided with two core particles (81), and each core particle (81) is electrically connected with the aluminum tape bonding area (5) through an aluminum tape (82);

the plastic package structure is characterized in that the peripheries of the first sink (4), the aluminum belt bonding area (5), the aluminum belt (82), the core particle placing area (8) and the core particles (81) are coated with plastic package shells (9).

2. The dual-core bypass diode of claim 1, wherein: the end part of the first base plate (1) is provided with a first U-shaped groove (11).

3. The dual-core bypass diode of claim 1, wherein: one end of the first substrate (1) is provided with a plurality of first positioning holes (12).

4. The dual-core bypass diode of claim 1, wherein: the end part of the second base plate (2) is provided with a second U-shaped groove (21).

5. The dual-core bypass diode of claim 1, wherein: one end of the second substrate (2) is provided with a plurality of second positioning holes (22).

6. The dual-core bypass diode of claim 1, wherein: the first tin storage tank (3) and the second tin storage tank (6) are non-hollowed grooves, and the first tin storage tank (3) and the second tin storage tank (6) are used for storing tin blocks.

7. The dual-core bypass diode of claim 1, wherein: the first converging groove (4) and the second converging groove (7) are hollow grooves, and the first converging groove (4) and the second converging groove (7) are used for a converging belt to pass through.