CN111245162A - Excitation module of generator for vehicle - Google Patents
Excitation module of generator for vehicle Download PDFInfo
- Publication number
- CN111245162A CN111245162A CN202010225905.4A CN202010225905A CN111245162A CN 111245162 A CN111245162 A CN 111245162A CN 202010225905 A CN202010225905 A CN 202010225905A CN 111245162 A CN111245162 A CN 111245162A
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- 230000005284 excitation Effects 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000005347 demagnetization Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
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- H02K11/046—
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K19/00—Synchronous motors or generators
- H02K19/16—Synchronous generators
- H02K19/36—Structural association of synchronous generators with auxiliary electric devices influencing the characteristic of the generator or controlling the generator, e.g. with impedances or switches
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Synchronous Machinery (AREA)
Abstract
The invention discloses a generator excitation module for a vehicle, which comprises a frame and at least one semiconductor unit welded on the frame, wherein the semiconductor unit comprises at least one chip and at least one jumper wire, one pole of the chip is welded on the frame, the other pole of the chip is welded with the jumper wire, and the tail end of the jumper wire is welded on the frame.
Description
Technical Field
The invention relates to the technical field of excitation systems of vehicle generators, in particular to an excitation module of a vehicle generator.
Background
The generator excitation system is a general name of a power supply for supplying excitation current to a synchronous generator and accessory equipment thereof, the excitation system is an important component of the generator, and has great influence on the safe and stable operation of a power system and the generator, and the excitation system has the following main functions: 1) correspondingly adjusting the exciting current according to the change of the load of the generator so as to maintain the terminal voltage as a given value; 2) controlling reactive power distribution among generators in parallel operation; 3) the static stability of the parallel operation of the generators is improved; 4) transient stability of parallel operation of the generators is improved; 5) when the generator has a fault inside, the demagnetization is carried out to reduce the fault loss degree; 6) and implementing maximum excitation limitation and minimum excitation limitation on the generator according to the operation requirement.
As shown in fig. 1, the field diode is a common original used for rectification in the field circuit, the field diode in the field circuit of the vehicle-mounted generator is often made into a structure in which a plurality of diodes are welded to the same frame, and the field module is made by plastic-sealing the diode area on the frame, so that the installation is facilitated and the working efficiency of the field diode during working is improved, but the field module with the structure has the following disadvantages:
1. because the excitation module is limited by the installation space, the volume of the excitation module needs to be kept in a certain range, and the rectifier diode needs to be transversely arranged and welded on the frame, so that the excitation module meets the size requirement, but the diode is transversely arranged, at the moment, a chip in the diode is positioned at a position vertical to the surface of the frame, the size of the chip in the diode is limited to be smaller, and the performance of the excitation module is limited;
2. because the volume of the diode is limited, the volume of an internal chip is limited, the heat dissipation area of the chip is small, the heat dissipation performance is poor, and the reliability and the failure rate of the excitation module are reduced and increased;
3. before the rectifier diodes are welded on the frame, pins at two ends of the rectifier diodes need to be cut off, and then the pins are manually welded on the frame.
Disclosure of Invention
The embodiment of the application aims to provide a generator excitation module for a vehicle, and solves the problems of limited chip size, poor heat dissipation and low manufacturing efficiency in the prior art.
The utility model provides a car generator excitation module, includes a frame and at least one semiconductor unit of welding on the frame, the semiconductor unit includes an at least chip and an at least wire jumper, a utmost point welding of chip is in on the frame, another utmost point welding has the wire jumper, the end welding of wire jumper is in on the frame.
In the embodiment of the application, the area of the frame can be fully utilized by directly welding the chip to the frame, so that the maximum area of the chip is increased, and the heat dissipation area of the chip is also increased; the appearance of the frame can be designed in a targeted manner according to the size and the shape of the chip so as to improve the overall utilization rate of the frame; the chip is directly welded on the frame, so that the diode does not need to be trimmed and welded, the production process is simplified, and the manufacturing efficiency is improved.
On the basis of the technical scheme, the embodiment of the application can be further improved as follows:
further, the number of the semiconductor units is at least three, and the semiconductor units are arranged at intervals.
Further, the frame is integrated into one piece spare, and the frame comprises polarity linkage segment one, polarity linkage segment two and two polarity linkage segment three, polarity linkage segment two, two polarity linkage segment three intervals set up in one side of polarity linkage segment one, just the polarity linkage segment is two in between the polarity linkage segment three, polarity linkage segment three is kept away from the one end of polarity linkage segment one all with polarity linkage segment two is kept away from the one end of polarity linkage segment two is connected, the other end of polarity linkage segment three with polarity linkage segment one is connected, just the other end of polarity linkage segment three with leave the clearance between the polarity linkage segment two, adopt this step's beneficial effect to segment the frame, be convenient for subsequent processing and welding.
Furthermore, one pole of the semiconductor unit is welded on the first polarity connecting section, and the other pole of the semiconductor unit is respectively welded on the second polarity connecting section or the third polarity connecting section.
Further, the negative pole welding of chip is in polarity linkage segment one, and anodal welding has the wire jumper, the end welding of wire jumper is in polarity linkage segment two or polarity linkage segment is last, adopts this step's beneficial effect to be through the negative pole and the frame welding of chip, can improve the heat-sinking capability like this.
Further, the frame is a galvanized iron plate.
Furthermore, the positioning holes are formed in the first polarity connecting section, the second polarity connecting section and the third polarity connecting section, the assembling holes are formed in the second polarity connecting section and the third polarity connecting section, and the step has the advantage of being convenient for assembling and using subsequent modules.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
1. according to the embodiment of the application, the chip is directly welded on the frame, so that the area of the frame can be fully utilized, the maximum area of the chip is increased conveniently, and the performance of the excitation module is improved;
2. the embodiment of the application facilitates the use of a chip with a larger size, and simultaneously enables the chip to directly radiate heat through metal, so that the radiating effect is better, and the stability of the chip is improved;
3. according to the embodiment of the application, the production process is simplified, the production cost is reduced and the production efficiency is improved in a mode of welding the chip and the jumper wire.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of an internal structure of an excitation module in the prior art;
FIG. 2 is a schematic view of a first structure of the present invention;
FIG. 3 is a second structural diagram of the present invention;
fig. 4 is a schematic three-dimensional structure of the present invention.
Reference numerals:
1-a frame; 2-a semiconductor unit; 3-assembling holes; 4-positioning holes;
101-polar connection segment one; 102-polarity connecting segment two; 103-polarity connecting section three;
201-chip; 202-jumper.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The embodiment of the application provides a generator excitation module for a vehicle, which solves the problems of limited chip size, poor heat dissipation and low manufacturing efficiency in the prior art.
The general idea of the embodiment of the application is as follows: the chip is directly welded on the frame, so that the chip can fully utilize the area of the frame, the maximum area of the chip borne by the frame can be greatly increased, and the performance of the excitation module is improved;
in order to better understand the technical solutions, the technical solutions will be described in detail below with reference to the drawings and the detailed description.
Example (b):
as shown in fig. 2 and 4, the embodiment of the present application discloses a generator excitation module for a vehicle, which includes a frame 1 and at least one semiconductor unit 2 welded on the frame 1, where the semiconductor unit 2 includes at least one chip 201 and at least one jumper 202, one pole of the chip 201 is welded on the frame 1, the other pole of the chip is welded with the jumper 202, and a tail end of the jumper 202 is welded on the frame 1; the embodiment of the application changes the assembly form of the existing excitation module, changes the existing diode assembly into the direct assembly of the chip 201, and the chip 201 is directly welded with the frame 1, so that the chip 201 can fully utilize the area of the frame 1, the maximum area of the chip 201 borne by the frame 1 can be greatly increased, and meanwhile, the chip 201 can radiate heat through the frame 1, thereby improving the heat radiation capability of the chip 201 in many aspects, reducing the failure rate of the chip 201, improving the reliability of the chip 201, and the chip 201 is directly welded to the frame 1 without trimming and then welding the diode, thereby simplifying the production process, improving the production efficiency, and greatly reducing the processing cost; the soldering in the embodiment of the present application is a well-known technique in the semiconductor processing industry, i.e., soldering by using solder paste, and is not described herein again.
Specifically, in the embodiment of the present application, the number of the semiconductor units 2 is at least three, and the semiconductor units are arranged at intervals, so that the performance of the excitation module can be ensured.
The frame 1 in the embodiment of the application is an integrally formed part, and the frame 1 includes a first polarity connecting section 101, a second polarity connecting section 102 and a third polarity connecting section 103, the second polarity connecting section 102 and the third polarity connecting section 103 are arranged at one side of the first polarity connecting section 101 at intervals, the second polarity connecting section 102 is located between the third polarity connecting sections 103, one end of the third polarity connecting section 103, which is far away from the first polarity connecting section 101, is connected with one end of the second polarity connecting section 102, which is far away from the second polarity connecting section 102, the other end of the third polarity connecting section 103 is connected with the first polarity connecting section 101, and a gap is reserved between the other end of the third polarity connecting section 103 and the second polarity connecting section 102;
the frame 1 in the embodiment of the application is divided into a plurality of parts, wherein the first polarity connecting section 101 is directly in welding contact with one electrode of the chip 201, so that the heat dissipation area is increased, the heat dissipation effect is improved, the failure rate of the chip 201 is reduced, and the reliability of the chip 201 is improved, meanwhile, the structure of the first polarity connecting section 101 can be changed, and the chip can be in a long strip shape only by ensuring that the chip has enough welding area, as shown in fig. 2, or in a shape with a protruding part shown in fig. 3, or in other shapes; the second polarity connecting section 102 and the third polarity connecting section 103 in the embodiment of the application can increase the heat dissipation area, and meanwhile, the embodiment of the application can be conveniently assembled with other parts, the specific shape structure can be a workpiece section with an assembly hole in the attached drawings 2 and 3, and can also be changed according to the requirements of customers, and only the welding area and the subsequent assembly area of the jumper wire need to be guaranteed.
The polarity connection mode of the frame 1 and the semiconductor unit 2 needs to ensure that the second polarity connection segment 102 and the third polarity connection segment 103 are both connected with the same pole of the semiconductor unit 2, and the first polarity connection segment 101 is connected with the other pole of the semiconductor unit 2.
Specifically, the negative electrode of the chip 201 is welded to the first polarity connection section 101, the positive electrode of the chip 201 is welded to the jumper 202, the tail end of the jumper 202 is welded to the second polarity connection section 102 or the third polarity connection section 103, and fig. 2 and 3 in the embodiment of the present application are the case where the number of the semiconductor units 2 is 3, that is, the jumper 202 welded to the middle chip 201 is connected to the second polarity connection section 102, and the chips 201 on the remaining two sides are connected to the third polarity connection section 103.
In the embodiment of the present application, the frame 1 is convenient to assemble with subsequent workpieces, the positioning holes 4 are all disposed on the first polarity connecting section 101, the second polarity connecting section 102 and the third polarity connecting section 103, the assembling holes 3 are disposed on the second polarity connecting section 102 and the third polarity connecting section 103, the positioning holes 4 are disposed on the outer side of the welding area of the chip 201, as shown in fig. 2 and 3, and the assembling holes 3 are disposed at the bottoms of the second polarity connecting section 102 and the third polarity connecting section 103, so as to avoid affecting the stability of the welding area of the module as much as possible.
Specifically, in the embodiment of the present application, the frame 1 is a galvanized iron plate, and other materials may also be used.
This application embodiment still need add the plastic envelope piece at the course of working, and the plastic envelope piece wraps up chip 201, wire jumper 202, locating hole 4 inside the plastic envelope piece, and then has improved the wholeness and the compactness of this kind of excitation module, and the addition of plastic envelope is prior art, and here is no longer repeated.
Compared with the prior art, the embodiment of the application has the following advantages:
1. in the embodiment of the application, the chip 201 is directly welded to the frame 1, so that the chip 01 can fully utilize the area of the frame 1, and the maximum area of the chip 201 borne by the frame 1 can be greatly increased, thereby improving the performance of the excitation module;
2. in the embodiment of the application, the surface area of the chip 201 can be increased, so that the heat dissipation area of the chip 201 is increased; because the chip 201 is directly welded to the structure of the frame 1, the chip 201 can radiate heat through the frame 1, so that the heat radiation capability of the chip 201 is improved in many ways, the failure rate of the chip 201 is reduced, and the reliability of the chip 201 is improved;
3. according to the embodiment of the application, the chip 201 is directly welded on the frame 1, and the diode is not required to be welded after being trimmed, so that the production process is simplified, the production efficiency is improved, and the processing cost is reduced.
In the description of the present invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (7)
1. The utility model provides a generator excitation module for vehicle, includes a frame and at least one welding semiconductor unit on the frame, semiconductor unit includes an at least chip and an at least wire jumper, a utmost point welding of chip is in on the frame, another utmost point welding has the wire jumper, the end welding of wire jumper is in on the frame.
2. The excitation module of generator for vehicle as claimed in claim 1, wherein said semiconductor units are at least three, and said semiconductor units are spaced apart.
3. The excitation module of the vehicle generator as claimed in claim 2, wherein the frame is an integrally formed member, and the frame is composed of a first polar connection section, a second polar connection section and two third polar connection sections, the second polar connection section and the two third polar connection sections are alternately disposed on one side of the first polar connection section, the second polar connection section is disposed between the third polar connection sections, one end of the third polar connection section, which is far away from the first polar connection section, is respectively connected with one end of the second polar connection section, which is far away from the first polar connection section, the other end of the third polar connection section is connected with the first polar connection section, and a gap is left between the other end of the third polar connection section and the second polar connection section.
4. The excitation module of the generator for vehicle as claimed in claim 3, wherein one pole of the semiconductor unit is welded to the first pole connection section, and the other pole is welded to the second pole connection section or the third pole connection section.
5. The excitation module of the vehicle generator according to claim 3 or 4, wherein the negative electrode of the chip is welded to the first polarity connection section, the positive electrode of the chip is welded to the jumper wire, and the tail end of the jumper wire is welded to the second polarity connection section or the third polarity connection section.
6. The excitation module of claim 5, wherein the frame is a galvanized iron plate.
7. The excitation module of the vehicle generator as claimed in claim 6, wherein the first, second and third polarity connection sections are provided with positioning holes, and the second and third polarity connection sections are provided with assembling holes.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010225905.4A CN111245162A (en) | 2020-03-26 | 2020-03-26 | Excitation module of generator for vehicle |
PCT/CN2020/131104 WO2021189885A1 (en) | 2020-03-26 | 2020-11-24 | Generator excitation module for vehicle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010225905.4A CN111245162A (en) | 2020-03-26 | 2020-03-26 | Excitation module of generator for vehicle |
Publications (1)
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CN111245162A true CN111245162A (en) | 2020-06-05 |
Family
ID=70880744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010225905.4A Withdrawn CN111245162A (en) | 2020-03-26 | 2020-03-26 | Excitation module of generator for vehicle |
Country Status (2)
Country | Link |
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CN (1) | CN111245162A (en) |
WO (1) | WO2021189885A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021189885A1 (en) * | 2020-03-26 | 2021-09-30 | 江苏英达富电子科技有限公司 | Generator excitation module for vehicle |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57148597A (en) * | 1981-03-09 | 1982-09-13 | Toshiba Corp | Exciter for generator |
CN2687947Y (en) * | 2004-03-20 | 2005-03-23 | 中国北车集团永济电机厂 | Excitation regulator for alternating-current generator |
CN104393806A (en) * | 2014-12-22 | 2015-03-04 | 株洲南车时代电气股份有限公司 | Excitation module and excitation system |
CN207053424U (en) * | 2017-07-26 | 2018-02-27 | 浙江汉博汽车传感器有限公司 | Automobile using pressure resistant type voltage regulator |
CN111245162A (en) * | 2020-03-26 | 2020-06-05 | 江苏英达富电子科技有限公司 | Excitation module of generator for vehicle |
-
2020
- 2020-03-26 CN CN202010225905.4A patent/CN111245162A/en not_active Withdrawn
- 2020-11-24 WO PCT/CN2020/131104 patent/WO2021189885A1/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021189885A1 (en) * | 2020-03-26 | 2021-09-30 | 江苏英达富电子科技有限公司 | Generator excitation module for vehicle |
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WO2021189885A1 (en) | 2021-09-30 |
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Application publication date: 20200605 |