CN209929293U - A power module and inverter power unit - Google Patents

Abstract

The utility model discloses a power module, including shell, chip, input terminal, output terminal and control terminal, the chip sets up in the shell, input terminal output terminal with control terminal respectively with the chip electricity is connected and respectively fixed connection be in on the shell. The utility model also discloses an contravariant power unit, including a plurality of foretell power module, wherein a plurality of parallel connection between the power module. The utility model provides a power module is small and easily parallelly connected, connects in parallel through a plurality of power modules and forms contravariant power unit for when taking place to damage, need not wholly to change, can reduce the replacement cost of module in using.

Description

A power module and inverter power unit

technical field

The utility model relates to a power module and an inverter power unit.

Background technique

Power modules are required to have the characteristics of high power density, high reliability, high temperature resistance, and convenient application. The traditional power module usually encapsulates the entire application circuit in one module. When an abnormality occurs in the actual application and the module is damaged, it needs to be replaced as a whole.

The disclosure of the above background technology content is only used to assist the understanding of the concept and technical solution of the present invention, and it does not necessarily belong to the prior art of this patent application. If there is no clear evidence that the above content has been disclosed on the filing date of this patent application The above background art should not be used to evaluate the novelty and inventive step of the present application.

Utility model content

In order to solve the above-mentioned technical problems, the present invention proposes a power module with a small size and easy parallel connection. A plurality of power modules are connected in parallel to form an inverter power unit, so that when damage occurs, it is not necessary to replace the whole, which can reduce the cost of the modules in application. replacement cost.

In order to achieve the above object, the utility model adopts the following technical solutions:

The utility model discloses a power module, comprising a casing, a chip, an input terminal, an output terminal and a control terminal, the chip is arranged in the casing, the input terminal, the output terminal and the control terminal are respectively connected with the The chips are electrically connected and respectively fixedly connected to the casing.

Preferably, the chip adopts a silicon power device or a wide bandgap semiconductor power device.

Preferably, the input terminal includes an N terminal and a P terminal, the N terminal and the P terminal are respectively fixed on the first end of the casing, and the output terminal is fixed on the opposite side from the first end of the casing on the second end of the set.

Preferably, the casing is provided with a through hole, and the through hole leads from the first side surface of the casing to the second side surface.

Preferably, the power module includes a plurality of the control terminals, and the plurality of the control terminals are respectively fixed to the first side surface of the housing.

Preferably, the power module includes four control terminals, wherein two of the four control terminals are symmetrically arranged on both sides of the through hole.

Preferably, the input terminal, the output terminal and the control terminal are respectively electrically connected to the chip by means of lead frames or wire bonding.

Preferably, the chip adopts a ceramic copper clad laminate or an active metal brazed copper clad ceramic substrate; wherein the input terminal and the output terminal are directly connected to the ceramic copper clad laminate or active metal brazed copper clad ceramic substrate, respectively, and the The control terminal is connected to the ceramic copper clad plate or the active metal brazing copper clad ceramic substrate by means of crimping pins or welding.

Preferably, the thickness of the casing is 3-25 mm.

The utility model also discloses an inverter power unit, comprising a plurality of the above-mentioned power modules, wherein the plurality of the power modules are connected in parallel.

Compared with the prior art, the beneficial effects of the present utility model are: the power modules disclosed by the present utility model are easy to be connected in parallel, and can be connected in parallel to form application topologies such as three-phase inverters, full-bridge inverters, etc., according to actual application requirements; In the event of an abnormality, if an individual half-bridge unit is damaged, only the damaged module needs to be replaced instead of the overall replacement, which can reduce the replacement cost of the module in the application. At the same time, the power module proposed by the utility model is a basic unit in the inverter power unit. In a single module, the parallel connection of chips is reduced, the mutual influence between the parallel units in the module is reduced, and the current sharing application between the parallel units is improved.

Description of drawings

1 is a schematic structural diagram of a power module according to Embodiment 1 of the present invention;

Fig. 2 is the top schematic view in Fig. 1;

3 is a schematic structural diagram of a power module according to Embodiment 2 of the present invention;

FIG. 4 is a schematic top view of FIG. 2 .

Detailed ways

The present utility model will be further described below with reference to the accompanying drawings and in conjunction with the preferred embodiments.

As shown in FIG. 1, the power module according to the first embodiment of the present invention includes a casing 10, a chip (not shown in the figure), an input terminal 20, an output terminal 30 and a control terminal 40, wherein the chip is arranged in the casing 10, and the input terminal 20. The output terminal 30 and the control terminal 40 are respectively electrically connected to the chip and respectively fixedly connected to the casing 10; wherein the casing 10 has a thickness of 3-25 mm.

The input terminal 20 includes an N terminal 21 and a P terminal 22. The N terminal 21 is used to connect the negative potential of the power supply, and the P terminal 22 is used to connect to the positive potential of the power supply. The N terminal 21 and the P terminal 22 are respectively fixed to the first end of the housing 10. ; The output terminal 30 is fixed on the second end of the casing 10, wherein the first end of the casing 10 is arranged opposite to the second end.

The center of the casing 10 is provided with a through hole 11 , which leads from the first side of the casing 10 to the second side opposite to the first side, and the power module can be fixed through the through hole 11 . In this embodiment, the control terminals 40 include a first control terminal 41 , a second control terminal 42 , a third control terminal 43 and a fourth control terminal 44 , and the four control terminals 40 are the gates and sources of the power switches in the module. The pole control terminal connection ends are respectively fixed on the first side surface of the casing 10 . The first control terminal 41 and the second control terminal 42 are arranged on the left side of the through hole 11 , and the third control terminal 43 and the fourth control terminal 44 are symmetrically arranged on the right side of the through hole 11 , that is, two of the four control terminals 40 The two are symmetrically arranged on both sides of the through hole 11 to facilitate the installation of the module drive board.

In some examples, the input terminal 20 , the output terminal 30 and the control terminal 40 are respectively electrically connected to the chip by means of lead frame (LeadFrame) or wire bonding (Wire Bonding).

In some examples, the chip adopts a ceramic copper clad laminate (DBC) or an active metal brazed copper clad ceramic substrate (AMB), wherein the input terminal 20 and the output terminal 30 are directly connected to the DBC or AMB, respectively, and the control terminal 40 adopts a crimp lead The way of the pin (press fit pin) or the way of soldering is connected to the DBC or AMB.

In some instances, the chip may employ a silicon power device or a wide bandgap semiconductor power device, where the wide bandgap semiconductor power device may be a silicon carbide power device.

With reference to FIG. 2 , the N terminal 21 and the P terminal 22 are on the same horizontal plane, and at this time, the lead-out electrode channels of the N terminal 21 and the P terminal 22 are small.

As shown in FIG. 3 and FIG. 4 , it is the power module of the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that in this embodiment, the N terminal 21 and the P terminal 22 are not on the same horizontal plane, There is a certain height difference. At this time, the lead-out electrode channels of the N terminal 21 and the P terminal 22 can be larger, which is conducive to the passage of large current. In practical applications, the design of the first embodiment or the second embodiment can be adopted according to actual needs.

Another preferred embodiment of the present invention also discloses an inverter power unit, comprising a plurality of the above-mentioned power modules, wherein the plurality of power modules are connected in parallel.

Modules encapsulated by power devices can be widely used in photovoltaic, electric vehicles and other application fields. The module takes high power density and high reliability as the development route and goal. Modules with high power density and high reliability are conducive to reducing system size and improving system power density; especially in the field of inverter applications, high power density and high reliability modules are conducive to improving system performance. According to the application requirements of high power density and high reliability modules used in parallel, each embodiment of the present utility model proposes a small size and easy parallel connection power module, the power module can be connected in parallel to form a three-phase inverter, Application topologies such as full-bridge inverters; when an abnormality occurs in the actual application, if individual half-bridge units are damaged, only the damaged modules need to be replaced, and there is no need to replace the whole, which can reduce the replacement cost of modules in the application. At the same time, the power module proposed by the utility model is a basic unit in the inverter power unit. In a single module, the parallel connection of chips is reduced, the mutual influence between the parallel units in the module is reduced, and the current sharing application between the parallel units is improved.

The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be considered that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art to which the present invention belongs, under the premise of not departing from the concept of the present invention, several equivalent substitutions or obvious modifications can be made, and the performance or use is the same, which should be regarded as belonging to the present invention. protected range.

Claims (10)

1. A power module, characterized in that it comprises a casing, a chip, an input terminal, an output terminal and a control terminal, the chip is arranged in the casing, the input terminal, the output terminal and the control terminal are respectively They are electrically connected to the chip and are respectively fixedly connected to the casing. 2 . The power module according to claim 1 , wherein the chip adopts a silicon power device or a wide bandgap semiconductor power device. 3 . 3 . The power module according to claim 1 , wherein the input terminal comprises an N terminal and a P terminal, the N terminal and the P terminal are respectively fixed to the first end of the housing, and the output terminal 3 . The terminal is fixed to a second end opposite to the first end of the housing. 4 . The power module according to claim 1 , wherein a through hole is formed on the housing, and the through hole leads from the first side surface of the housing to the second side surface. 5 . 5 . The power module according to claim 4 , wherein the power module comprises a plurality of the control terminals, and the plurality of the control terminals are respectively fixed to the first side surface of the housing. 6 . 6 . The power module according to claim 5 , wherein the power module comprises four control terminals, wherein two of the four control terminals are symmetrically arranged on both sides of the through hole. 7 . 7 . The power module according to claim 1 , wherein the input terminal, the output terminal and the control terminal are respectively electrically connected to the chip by means of lead frames or wire bonding. 8 . 8 . The power module according to claim 1 , wherein the chip adopts a ceramic copper clad laminate or an active metal brazed copper clad ceramic substrate; wherein the input terminal and the output terminal are respectively directly connected to the ceramic copper clad laminate. 9 . Or on the active metal brazing copper clad ceramic substrate, the control terminal is connected to the ceramic copper clad plate or the active metal brazing copper clad ceramic substrate by means of crimping pins or welding. 9 . The power module according to claim 1 , wherein the casing has a thickness of 3-25 mm. 10 . 10. An inverter power unit, comprising a plurality of power modules according to any one of claims 1 to 9, wherein a plurality of the power modules are connected in parallel.

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