CN220105658U - OCP card heat radiation structure - Google Patents
OCP card heat radiation structure Download PDFInfo
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- CN220105658U CN220105658U CN202321695367.0U CN202321695367U CN220105658U CN 220105658 U CN220105658 U CN 220105658U CN 202321695367 U CN202321695367 U CN 202321695367U CN 220105658 U CN220105658 U CN 220105658U
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- connecting plate
- heat conduction
- ocp card
- conduction connecting
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- 230000005855 radiation Effects 0.000 title claims abstract description 5
- 238000000926 separation method Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 3
- 239000000725 suspension Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 11
- 238000009434 installation Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
Aiming at the problem that the heat dissipation effect of the conventional OCP card is poor, the utility model provides the heat dissipation structure of the OCP card, which can improve the heat dissipation effect of the OCP card and relates to the technical field of servers. This OCP card heat radiation structure, including setting up the radiator on the OCP card mainboard body, radiator and be located and be provided with the heat conduction connecting plate that forms by the heat conduction material preparation between the separation blade of mainboard body rear end, the heat conduction connecting plate on can be with the heat transfer on the radiator to the separation blade. The heat dissipation structure of the OCP card can improve the heat dissipation effect of the OCP card and reduce the heat dissipation risk of the high-wattage OCP card.
Description
Technical Field
The utility model relates to the technical field of servers, in particular to an OCP card heat dissipation structure.
Background
With the advancement of technology, OCP cards have been increasingly powered up. In most systems, the OCP card is at the rear of the system, so that when the air flow reaches the OCP card, the air flow has heat exchange with the CPU and the heat sink of the memory, so that the temperature is high, and the heat dissipation effect on the OCP card is poor.
Based on the above limitations, there has been a great risk of heat dissipation for high wattage OCP cards.
Disclosure of Invention
Aiming at the problem that the existing OCP card is poor in heat dissipation effect, the heat dissipation structure of the OCP card can improve the heat dissipation effect of the OCP card and reduce the heat dissipation risk of the high-wattage OCP card.
The technical scheme adopted for solving the technical problems is as follows:
the utility model provides a OCP card heat radiation structure, includes the radiator that sets up on the OCP card mainboard body, radiator and be located and be provided with the heat conduction connecting plate that forms by the heat conduction material preparation between the separation blade of mainboard body rear end, the heat conduction connecting plate on can be with the heat transfer on the radiator to the separation blade.
Further, two heat conducting connecting plates are arranged between the radiator and the baffle plate, and the two heat conducting connecting plates are symmetrically arranged on the left side and the right side of the OCP card.
Further, a plurality of first fins are arranged on the inner side surface of the heat conduction connecting plate.
Further, the radiator comprises a bottom plate and second fins arranged on the bottom plate, and the front end part of the heat conducting connecting plate is clamped between two adjacent second fins.
Further, the heat conducting connecting plate is fixedly connected with the radiator through a first fastening structure.
Further, the first fastening structure comprises a first screw and a locking nut arranged on the first screw, and the heat conducting connecting plate is reliably clamped between two adjacent second fins at the end part under the locking force of the locking nut.
Further, two second fins adjacent to the heat-conducting connecting plate are provided with mounting notches for accommodating the first screws, and the heat-conducting connecting plate is provided with first mounting holes for accommodating the first screws.
Further, the limiting groove used for accommodating the lock nut is formed in the side face, located on the side, on the back of the heat conduction connecting plate, of the second fin on the inner side of the heat conduction connecting plate, and the rotation of the lock nut can be limited by the limiting groove.
Further, the baffle plate is provided with a vertical plate on the outer side of the heat conducting connecting plate, the suspension end of the vertical plate is provided with an elastic pressing plate, the outer side face of the heat conducting connecting plate is provided with a pressing boss, the suspension end of the elastic pressing plate is pressed on the pressing boss, and a backward acting force is applied to the heat conducting connecting plate, so that the heat conducting connecting plate is reliably contacted with the baffle plate.
Further, a guide inclined plane is arranged at the lower end part of the front side surface of the pressing boss.
The beneficial effects of the utility model are as follows:
according to the OCP card heat dissipation structure provided by the embodiment of the utility model, the baffle plate is connected with the original heat radiator of the OCP card by the heat conduction connecting plate, so that the baffle plate becomes a part of the heat dissipation part. Therefore, the heat dissipation area can be effectively enlarged, the heat dissipation effect of the OCP card is improved, and the heat dissipation risk of the high-wattage OCP card is reduced.
Drawings
Fig. 1 is a schematic perspective view of an OCP card heat dissipating structure according to a first embodiment of the present utility model;
FIG. 2 is an enlarged schematic view of the portion A in FIG. 1;
FIG. 3 is an enlarged schematic view of the portion B of FIG. 1;
FIG. 4 is an enlarged schematic view of the portion C of FIG. 1;
fig. 5 is a top view of an OCP card heat dissipating structure according to a first embodiment of the present utility model;
FIG. 6 is a cross-sectional view A-A of FIG. 5;
FIG. 7 is an enlarged schematic view of the portion D of FIG. 5;
fig. 8 is a schematic perspective view of an OCP card heat dissipating structure according to a first embodiment of the present utility model with a heat conductive connecting plate removed;
FIG. 9 is an enlarged schematic view of portion E of FIG. 8;
fig. 10 is a schematic perspective view of a heat-conducting connection board according to a first embodiment of the utility model;
FIG. 11 is a diagram illustrating an installation process of an OCP card heat dissipation structure according to an embodiment of the present utility model;
fig. 12 is a schematic perspective view of a heat dissipation structure of an OCP card according to a second embodiment of the present utility model;
FIG. 13 is an enlarged schematic view of the portion F in FIG. 12;
fig. 14 is a schematic perspective view of a heat conductive connection board according to a second embodiment of the utility model.
In the figure: 1. a main board body; 2. an interface connector; 3. a baffle; 31. a vertical plate; 311. an elastic pressing plate; 4. a heat sink; 41. a bottom plate; 42. a second fin; 43. a mounting notch; 44. a limit groove; 5. a thermally conductive connecting plate; 51. a first fin; 52. a first mounting hole; 53. compressing the boss; 531. a guide slope; 54. a first ear plate; 61. a first screw; 62. a lock nut; 7. and a second screw.
Detailed Description
In order to make the technical solution of the present utility model better understood by those skilled in the art, the technical solution of the present utility model will be described in detail below with reference to the accompanying drawings in the embodiments of the present utility model, and the described embodiments are only some embodiments of the present utility model, not all embodiments of the present utility model. All other embodiments, which are obtained without inventive effort by a person skilled in the art on the basis of the embodiments of the present utility model, shall fall within the scope of protection of the present utility model.
For convenience of description, the coordinate system is defined as shown in fig. 1, and the left-right direction is a transverse direction, the front-back direction is a longitudinal direction, and the up-down direction is a vertical direction.
As shown in fig. 1, the OCP card includes a main board body 1 and an interface connector 2 set disposed on the main board body 1. The group of interface connectors 2 comprises a plurality of interface connectors 2. As a specific embodiment, the rear end of the interface connector 2 in this embodiment extends through the baffle 3 at the rear end of the main board body 1 to the rear side of the baffle 3. The baffle 3 is made of a metal material.
As shown in fig. 1 and 5, an OCP card heat dissipating structure includes a heat sink 4 provided on an OCP card motherboard 1, and the heat generated by the OCP card can be transferred to the heat sink 4. The heat radiator is characterized in that a heat conducting connecting plate 5 made of a heat conducting material is arranged between the heat radiator 4 and the baffle 3, one end of the heat conducting connecting plate 5 is in contact with the heat radiator 4, the other end of the heat conducting connecting plate 5 is in contact with the baffle 3, and heat transferred to the heat radiator 4 by the OCP card can be transferred to the baffle 3 through the heat conducting connecting plate 5.
By providing the heat-conducting connection plate 5, the baffle 3 can be a part of the heat-radiating component, so that the heat-radiating area is effectively enlarged, and the heat-radiating effect of the OCP card is improved.
As a specific implementation manner, two heat-conducting connection plates 5 are disposed between the heat sink 4 and the baffle 3 in this embodiment, and the two heat-conducting connection plates 5 are respectively located at two sides of the interface connector 2 set and symmetrically arranged about the symmetry plane of the OCP card.
Further, as shown in fig. 1 and 5, a plurality of first fins 51 arranged horizontally are uniformly distributed from top to bottom on the inner side surface of the heat-conducting connection plate 5 (the opposite side of the two heat-conducting connection plates 5 is taken as the inner side) at the rear side of the heat sink 4.
Thus, the heat conducting connection plate 5 not only serves as a heat conducting member to transfer heat from the radiator 4 to the baffle plate 3, but also serves as a heat radiating member, so that the heat radiating effect can be achieved when the airflow flows through the heat conducting connection plate 5, and the heat radiating area is further increased, and the heat radiating effect is improved.
Further, as shown in fig. 1, 2 and 3, the heat sink 4 includes a bottom plate 41 contacting the main board body 1 of the OCP card, the bottom plate 41 is provided with a plurality of second fins 42 extending in the front-rear direction, and the front end portion of the heat-conducting connecting plate 5 is sandwiched between two adjacent second fins 42. The bottom surface of the front end portion of the heat conducting connection plate 5 contacts with the bottom plate 41 of the radiator 4, the left side surface of the front end portion of the heat conducting connection plate 5 is attached to the second fin 42 located on the left side of the heat conducting connection plate 5, and the right side surface of the front end portion of the heat conducting connection plate 5 is attached to the second fin 42 located on the right side of the heat conducting connection plate 5.
In this way, the contact area between the heat-conductive connecting plate 5 and the heat sink 4 can be increased, thereby improving the heat transfer efficiency of heat from the heat sink 4 to the baffle 3.
Further, in order to secure the reliability of the connection between the heat conductive connection plate 5 and the connector. The heat conducting connecting plate 5 is fixedly connected with the radiator 4 through a first fastening structure.
As shown in fig. 1 and 2, as a specific embodiment, the first fastening structure in this embodiment includes a first screw 61 and a lock nut 62 provided on the first screw 61, and the heat-conductive connection plate 5 is reliably clamped between two adjacent second fins 42 at the end under the locking force of the lock nut 62.
Further, for convenience in installation, as shown in fig. 2 and 8, two second fins 42 adjacent to the heat-conducting connection plate 5 are provided with installation notches 43 for accommodating the first screws 61, and the upper ends of the installation notches 43 are opened. As shown in fig. 10, the heat-conducting connection plate 5 is provided with a first mounting hole 52 for accommodating the first screw 61.
As shown in fig. 11, when the heat conductive connection plate 5 is installed, first, the first screw 61 is first passed through the first installation hole 52 of the heat conductive connection plate 5, and the lock nut 62 is installed, and at this time, the distance between the lock nut 62 and the head of the first screw 61 is greater than the distance between the outer side surfaces of the adjacent two second fins 42. The heat-conductive connection plate 5 is then placed downward with the lock nuts 62 and the heads of the first screws 61 respectively located outside the two second fins 42 (inside the opposite side of the two second fins 42). When the lower surface of the heat-conducting connection plate 5 is brought into contact with the bottom plate 41 of the heat sink 4, the first screw 61 may be screwed.
Here, the space for accommodating the first screw 61 on the second fin 42 is designed as the mounting notch 43 with an open upper end, instead of the circular hole, because if designed as a circular hole, it is necessary to enlarge the interval between the second fins 42 to ensure that the first screw 61 can be smoothly inserted into the circular hole. Even if the first screw 61 is inserted from the outside, the lock nut 62 is inconvenient to install, subject to limitation of the installation space.
Further, as shown in fig. 3, 5 and 6, a limiting groove 44 for accommodating the lock nut 62 is disposed on a side surface of the second fin 42 located adjacent to the heat-conducting connection plate 5 and inside the heat-conducting connection plate 5 (on a side opposite to the two heat-conducting connection plates 5) and opposite to the heat-conducting connection plate 5, and the width of the limiting groove 44 is equal to the distance between opposite sides of the lock nut 62, and the limiting groove 44 can limit the rotation of the lock nut 62.
Thus, when the first screw 61 is locked, it is not necessary to fix the lock nut 62 by a tool such as a wrench, and then rotate the first screw 61. At the beginning of installation, the lock nut 62 can be clamped into the limit groove 44 by adjusting the angle of the lock nut 62, and then the rotation of the lock nut 62 can be limited by the limit groove 44, and only the first screw 61 is required to be rotated by a tool.
Further, in order to ensure that the rear end of the heat conduction connection plate 5 can be reliably contacted with the baffle 3, thereby ensuring the heat transfer effect. A second fastening structure is arranged between the heat conduction connecting plate 5 and the baffle 3, and under the locking action of the second fastening structure, the rear end face of the heat conduction connecting plate 5 is reliably contacted with the baffle 3.
As shown in fig. 4 and 7, as a specific embodiment, a vertical plate 31 extending perpendicularly to the front side of the baffle 3 is disposed on the front side of the baffle 3 and located on the outer side of the heat-conducting connection plate 5 (on the inner side opposite to the two heat-conducting connection plates 5), and an elastic pressing plate 311 extending obliquely inwards and backwards is disposed at the suspended end of the vertical plate 31. The outer side surface of the heat conducting connection plate 5 is provided with a pressing boss 53, and the suspension end of the elastic pressing plate 311 is pressed on the front side surface of the pressing boss 53, so as to apply a backward acting force to the heat conducting connection plate 5, thereby enabling the heat conducting connection plate 5 to reliably contact with the baffle 3.
As shown in fig. 8 and 9, the vertical plate 31 and the elastic pressing plate 311 are integrally formed, and are manufactured by bending, and the vertical plate 31 and the elastic pressing plate 311 are part of the body of the baffle 3.
Further, as shown in fig. 4, a lower end portion of the front side surface of the pressing boss 53 is provided with a guide slope 531. This enables the pressing boss 53 to smoothly enter between the elastic pressing plate 311 and the blocking piece 3 when the heat conductive connecting plate 5 is placed downward. As the heat conducting connection plate 5 moves downwards, the suspended end of the elastic pressing plate 311 gradually contacts with the front side surface of the pressing boss 53, and the elastic pressing plate 311 is tightly supported, so that the elastic pressing plate 311 is elastically deformed, and an elastic force is applied to the heat conducting connection plate 5, so that the rear end surface of the heat conducting connection plate 5 is reliably contacted with the baffle plate 3.
Example two
As shown in fig. 14, the front end portion of the heat-conducting connection plate 5 is provided with a first ear plate 54, and as shown in fig. 12 and 13, the first ear plate 54 is fixedly connected with the bottom plate 41 of the heat sink 4 by a second screw 7.
The rest of the structure is the same as that of the first embodiment.
Example III
The outer side surface of the rear end part of the heat conduction connecting plate 5 is provided with a second lug plate, and the second lug plate is fixedly connected with the baffle 3 through a third screw.
The rest of the structure is the same as that of the first embodiment.
On the basis of the embodiment provided by the utility model, other embodiments obtained by combining, splitting, recombining and other means of the embodiment of the utility model do not exceed the protection scope of the utility model.
The foregoing detailed description of the embodiments of the present utility model has been provided for the purpose of illustrating the purposes, technical solutions and advantages of the embodiments of the present utility model, and is not intended to limit the scope of the embodiments of the present utility model, i.e., any modifications, equivalent substitutions, improvements, etc. made on the basis of the embodiments of the present utility model should be included in the scope of the embodiments of the present utility model.
Claims (10)
1. An OCP card heat radiation structure which characterized in that: including setting up radiator (4) on OCP card mainboard body (1), radiator (4) and be located and be provided with between separation blade (3) of mainboard body (1) rear end and make heat conduction connecting plate (5) that become by heat conduction material, heat conduction connecting plate (5) can be with the heat transfer on radiator (4) to separation blade (3).
2. The OCP card heat dissipating structure of claim 1, wherein: two heat conduction connecting plates (5) are arranged between the radiator (4) and the baffle (3), and the two heat conduction connecting plates (5) are symmetrically arranged on the left side and the right side of the OCP card.
3. The OCP card heat dissipating structure of claim 1, wherein: a plurality of first fins (51) are arranged on the inner side surface of the heat conduction connecting plate (5).
4. The OCP card heat dissipating structure of claim 1, wherein: the radiator (4) comprises a bottom plate (41) and second fins (42) arranged on the bottom plate (41), and the front end part of the heat conduction connecting plate (5) is clamped between two adjacent second fins (42).
5. The OCP card heat dissipating structure of claim 4, wherein: the heat conduction connecting plate (5) is fixedly connected with the radiator (4) through a first fastening structure.
6. The OCP card heat dissipating structure of claim 5, wherein: the first fastening structure comprises a first screw (61) and a locking nut (62) arranged on the first screw (61), and the heat conducting connecting plate (5) is reliably clamped between two adjacent second fins (42) positioned at the end part under the locking force of the locking nut (62).
7. The OCP card heat dissipating structure of claim 6, wherein: two second fins (42) adjacent to the heat conduction connecting plate (5) are provided with mounting notches (43) for accommodating the first screws (61), and the heat conduction connecting plate (5) is provided with first mounting holes (52) for accommodating the first screws (61).
8. The OCP card heat dissipating structure of claim 7, wherein: adjacent to the heat conduction connecting plate (5), a limit groove (44) for accommodating the lock nut (62) is formed in the side face, located on one side of the back side of the heat conduction connecting plate (5), of the second fin (42) on the inner side of the heat conduction connecting plate (5), and the limit groove (44) can limit rotation of the lock nut (62).
9. The OCP card heat dissipating structure of claim 1, wherein: the baffle plate (3) on be located the outside of heat conduction connecting plate (5) is provided with riser (31), the suspension end of riser (31) is provided with elastic pressing plate (311), be provided with on the lateral surface of heat conduction connecting plate (5) and compress tightly boss (53), just the suspension end of elastic pressing plate (311) compress tightly compressing tightly boss (53), and to heat conduction connecting plate (5) exert backward effort, thereby make heat conduction connecting plate (5) and baffle plate (3) reliable contact.
10. The OCP card heat dissipating structure of claim 9, wherein: the lower end part of the front side surface of the pressing boss (53) is provided with a guide inclined surface (531).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321695367.0U CN220105658U (en) | 2023-06-30 | 2023-06-30 | OCP card heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321695367.0U CN220105658U (en) | 2023-06-30 | 2023-06-30 | OCP card heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220105658U true CN220105658U (en) | 2023-11-28 |
Family
ID=88843544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321695367.0U Active CN220105658U (en) | 2023-06-30 | 2023-06-30 | OCP card heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220105658U (en) |
-
2023
- 2023-06-30 CN CN202321695367.0U patent/CN220105658U/en active Active
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