CN220067387U - Radio frequency module packaging structure of sound surface filter and electronic equipment - Google Patents
Radio frequency module packaging structure of sound surface filter and electronic equipment Download PDFInfo
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- CN220067387U CN220067387U CN202320652331.8U CN202320652331U CN220067387U CN 220067387 U CN220067387 U CN 220067387U CN 202320652331 U CN202320652331 U CN 202320652331U CN 220067387 U CN220067387 U CN 220067387U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 238000002955 isolation Methods 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000004033 plastic Substances 0.000 description 7
- 238000012858 packaging process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Abstract
The utility model relates to the technical field of semiconductor packaging, in particular to a radio frequency module packaging structure of a sound surface filter and electronic equipment. The structure comprises a substrate, wherein the substrate is provided with a first surface and a second surface which are opposite, and an electrode area is arranged on the first surface of the substrate; at least one filter chip, the filter chip is installed on the first surface of the substrate, one surface of the filter chip facing the substrate is provided with an interdigital transducer and a first salient point, the first salient point is connected with the electrode area, and a gap is reserved between one surface of the filter chip facing the substrate and the substrate; at least one non-filter chip embedded in the substrate, wherein a second bump is arranged on one surface of the non-filter chip facing the substrate, and the second bump is connected with the electrode area; the isolation film is arranged on the first surface of the substrate, the filter chip and the non-filter chip, and a closed cavity is formed between the filter chip and the substrate and between the filter chip and the isolation film. The radio frequency module packaging structure of the sound surface filter has high reliability.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a radio frequency module packaging structure of a sound surface filter and electronic equipment.
Background
Along with the development of the rf front-end module and the demand of the application terminal for the light and thin application, the corresponding package integration level is higher and higher. The high-integration radio frequency front end module needs to put different chips/components into the same package, wherein one of the components is a surface acoustic wave filter chip, and the working principle is that an input end IDT receives a voltage signal to enable a piezoelectric material to generate mechanical pressure and propagate along the surface in an acoustic wave mode, the acoustic wave amplitude in the vertical direction is fast fading, and an output end IDT receives the acoustic wave in the horizontal direction and converts the acoustic wave into an electric signal. Therefore, other substances cannot be contacted on the surface of the IDT, and enough cavities are ensured to work normally.
Therefore, in the prior art, in order to allow a specific frequency component in a signal to pass through and greatly attenuate or filter other frequency components, a closed cavity needs to be formed at the bottom of the filter chip so that the filter chip can ensure normal operation. However, in the isolation film coating process, other non-filter chips such as switches and power amplifiers are also coated with the isolation film, and the bottom of the non-filter chip also forms a cavity, so that the cavity at the bottom of the non-filter chip cannot be filled with plastic packaging materials in the subsequent plastic packaging process. In operation, the cavity at the bottom of the non-filter chip influences the reliability of the whole filter module, and finally causes the quality problem of the product. The specific expression is as follows: the cavity at the bottom of the non-filter chip is subjected to multiple high-temperature processes in the condition of incomplete vacuum, and the internal gas expands to cause the breakage of the product explosion plate.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art, and provides a packaging structure of a radio frequency module of a sound meter filter and electronic equipment, so as to solve the problem that the radio frequency module of the sound meter filter in the prior art cannot fill cavities at the bottom of other chips, and improve the reliability of the radio frequency module of the sound meter filter.
In order to solve the technical problems, the utility model adopts the following technical scheme:
an acoustic surface filter radio frequency module package structure, comprising:
a substrate having opposite first and second surfaces, the first surface of the substrate having electrode regions thereon;
the filter chip is arranged on the first surface of the substrate, an interdigital transducer and a first salient point are arranged on one surface of the filter chip, which faces the substrate, the first salient point is connected with the electrode area, and a gap is reserved between one surface of the filter chip, which faces the substrate, and the substrate;
the non-filter chip is embedded in the substrate, a second salient point is arranged on one surface of the non-filter chip, facing the substrate, and the second salient point is connected with the electrode area;
the isolation film is arranged on the first surface of the substrate, the filter chip and the non-filter chip, and a closed cavity is formed between the filter chip and the substrate and between the filter chip and the isolation film.
In a more preferred embodiment, the upper surface of the non-filter chip is flush with the first surface of the substrate.
In a more preferred embodiment, the upper surface of the non-filter chip is higher than the first surface of the substrate.
In a more preferred embodiment, the lower surface of the non-filter chip is flush with the first surface of the substrate.
In a more preferred embodiment, the first bumps are provided in a plurality, and the first bumps are uniformly distributed around the interdigital transducer.
In a more preferred embodiment, a solder mask layer is disposed on the first surface of the substrate and around the electrode region.
In a more preferred embodiment, the material of the solder mask layer is a dry film, a DAF film, an insulating tape, an epoxy film, a phenolic film, a polyimide film or a liquid crystal polymer film.
In a more preferred embodiment, a gap is formed between the side of the filter chip facing the substrate and the solder mask layer, and the distance from the lower surface of the filter chip to the upper surface of the solder mask layer is 10 μm to 30 μm.
In a more preferred embodiment, the non-filter chip is a chip of a power amplifier, a radio frequency switch, a low noise amplifier.
In a more preferred embodiment, the outer edge of the non-filter chip coincides with the nearest outer edge of the first bump on the filter chip adjacent to the side of the outer edge in the vertical direction of the substrate.
In a more preferred embodiment, the isolation film is attached to the first surface of the substrate, the filter chip and the non-filter chip by vacuum film pressing.
An electronic device is provided with the radio frequency module packaging structure of the acoustic surface filter.
In summary, the present utility model includes at least one of the following beneficial technical effects:
1. the non-filter chip is embedded in the substrate, so that the bottom of the non-filter chip is completely filled, and the reliability of the product is improved;
2. the difficulty of the packaging process is effectively reduced.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
FIG. 1 is a schematic diagram of a substrate structure of an embedded non-filter chip according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a filter chip according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a substrate structure for forming a solder mask according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of a substrate structure on which a filter chip is mounted according to an embodiment of the present utility model;
FIG. 5 is a schematic structural diagram of a package structure of a radio frequency module of a sound surface filter according to an embodiment of the present utility model;
fig. 6 is a schematic structural diagram of a radio frequency module package structure of a saw filter according to another embodiment of the present utility model;
FIG. 7 is a schematic diagram of a structure in which a non-filter chip is fully embedded in a substrate;
FIG. 8 is a schematic diagram of a non-filter chip partially embedded in a substrate;
fig. 9 is a schematic diagram illustrating a structure of a non-filter chip and a filter chip on a substrate.
Reference numerals:
10. a substrate; 10a, a first surface; 10b, a second surface; 11. a solder mask layer; 12. an electrode region; 20. a filter chip; 21. an interdigital transducer; 22. a first bump; 23. closing the cavity; 30. a non-filter chip; 31. a second bump; 40. a separation film; 50. and (5) plastic sealing layer.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", etc., are orientation or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Referring to fig. 1-6, the present embodiment provides a packaging structure of a radio frequency module of a saw filter, the packaging structure includes: a substrate 10, at least one filter chip 20 (3 filter chips are schematically shown in this embodiment), at least one non-filter chip 30 (1 non-filter chip is schematically shown in this embodiment), and an isolation film 40.
The substrate 10 may be a composite layer formed by RDL wiring layer process, as shown in fig. 1 and 2, the substrate 10 has a first surface 10a and a second surface 10b opposite to each other, the first surface 10a of the substrate 10 is provided with a solder mask 11 and an electrode area 12, the solder mask 11 around the electrode area 12 may be made of different materials according to requirements, for example, a dry film, a DAF film, a green paint, an insulating tape, an epoxy film, a phenolic resin film, a polyimide film, a liquid crystal polymer film, or the like; the electrode region 12 is used for connection with each chip.
As shown in fig. 3, the filter chip 20 is a sound meter filter chip, and as a preferred embodiment, the filter chip 20 is mounted on the first surface 10a of the substrate 10, the filter chip 20 may be mounted on the first surface 10a of the substrate 10 in a flip-chip manner, and an interdigital transducer 21 and a first bump 22 are disposed on a surface of the filter chip 20 facing the substrate 10; the interdigital transducer 21 is used for realizing the filtering function of the filter chip 20, and the first salient points 22 are connected with the electrode area 12 and used for realizing the connection of the filter chip 20 with the outside; a gap is provided between the second surface 10b of the filter chip 20 and the solder resist layer 11.
The non-filter chip 30 is embedded in the substrate 10, specifically, as shown in fig. 1, a second bump 31 is disposed on a surface of the non-filter chip 30 facing the substrate 10, and the second bump 31 is connected to the electrode area 12, that is, the second bump 31 is connected to an electrode for connecting the non-filter chip 30 preset on the substrate 10, so as to connect the non-filter chip 30 to the outside. The embedding process of the non-filter chip 30 may be to embed and package the non-filter chip 30 on the substrate 10 by means of RDL wiring lamination; in this embodiment, the non-filter chip 30 may be a chip of a power amplifier, a radio frequency switch, or a low noise amplifier, or may be another type of chip.
The isolation film 40 may be an epoxy resin film, as shown in fig. 5, which is used for protecting and fixing the filter chip 20 and the non-filter chip 30, and the isolation film 40 is pressed on the first surface 10a of the substrate 10, the filter chip 20 and the non-filter chip 30 entirely, so that a closed cavity 23 is formed between the filter chip 20 and the substrate 10 and between the isolation film 40.
As a preferred embodiment of the present utility model, as shown in fig. 6, the package structure further includes: a plastic layer 50, the plastic layer 50 covering the outer surface of the separation film 40; in view of the fact that the thickness of the isolation film 40 is thin, the protection capability of the components is relatively weak, and therefore, the upper surface of the isolation film 40 is subjected to plastic molding by compression mold (compression molding process), so that the plastic layer 50 is formed, and better electrical protection is achieved for the filter chip 20 and the non-filter chip 30.
According to the utility model, the first salient points 22 are arranged on the filter chip 20, and the filter chip 20 and the non-filter chip 30 are both flip-chip mounted on the substrate 10, so that a certain gap is kept between the filter chip 20 and the substrate 10; then, the isolation film 40 is directly attached to the substrate 10 with the filter chip 20 and the non-filter chip 30 on the whole surface, so that the filter chip 20 and the substrate 10 form a closed cavity 23, and the non-filter chip 30 is embedded/pre-embedded in the substrate 10, so that a cavity is not formed between the non-filter chip 30 and the substrate 10 in the packaging process of completing the whole radio frequency module, thereby improving the reliability of the whole filter module.
As a preferred embodiment provided by the present utility model, the first bumps 22 are provided in a plurality, and the plurality of first bumps 22 are uniformly arranged around the interdigital transducer 21, so that the connection between the filter chip 20 and the substrate 10 is more reliable. Specifically, the first bump 22 in this embodiment may be a solder ball and is manufactured by a stencil printing process, so that the processing process of the radio frequency module packaging structure is simpler, and the product is safer and more reliable.
As a preferred embodiment provided by the present utility model, the height of the closed cavity 23 (i.e. the distance between the lower surface of the filter chip 20 and the upper surface of the solder mask 11) is above 10 μm and below 30 μm, so that the spacer film 40 can be ensured to be filled only in the gap between the edge position of the filter chip 20 and the solder mask 11, and not to flow into the closed cavity 23 too much, thereby not only having a better sealing effect on the closed cavity 23, but also avoiding the influence on the performance of the filter chip 20, and if the gap height is too small, the distance between the solder mask 11 and the interdigital transducer 21 is small, so that the signal transmission is affected.
As a preferred embodiment provided by the present utility model, as shown in fig. 7, the upper surface 30a of the non-filter chip 30 is flush with the first surface 10a of the substrate 10, that is, the non-filter chip 30 is in an implementation form of being completely embedded in the substrate 10, so that the cavity between the lower surface of the non-filter chip 30 and the substrate 10 is filled with a filler, thereby further improving reliability;
alternatively, as another embodiment provided by the present utility model, as shown in fig. 8, the upper surface of the non-filter chip 30 is higher than the first surface 10a of the substrate 10, and the lower surface of the non-filter chip 30 is flush with the first surface 10a of the substrate 10, that is, the non-filter chip 30 is in an implementation state of not being completely embedded in the substrate 10, only the portion below the lower surface of the non-filter chip 30 is embedded in the substrate 10, so that the cavity between the lower surface of the non-filter chip 30 and the substrate 10 can be filled, thereby further improving the reliability; also, in view of making the chip as a whole flatter after integration as much as possible and reducing the projecting stress, the upper surface of the non-filter chip 30 is preferably lower than the upper surface of the filter chip 20 at the time of embedding.
As a preferred embodiment provided by the present utility model, the distance between the adjacent non-filter chips 30 and the filter chip 20 in this embodiment is 20 μm or more and 50 μm or less.
In particular, as shown in fig. 9, in order to achieve miniaturization of the package structure size, one filter chip and one non-filter chip are adjacent in the vertical direction of the substrate 10, and an edge on one side of the non-filter chip 30 may overlap with an outer edge of the first bump 22 closest to the non-filter chip 30 on the filter chip 30.
In the present embodiment, the filter chip 20 is flip-chip mounted on the first surface 10a of the substrate 10 by a surface mounting technology, which is beneficial to improving the assembly density of the rf module and reducing the volume and weight of the electronic product; and automation is easy to realize, production efficiency is improved, and cost is reduced. Preferably, the isolation film 40 of the present embodiment is attached to the substrate 10, the filter chip 20 and the non-filter chip 30 by means of vacuum film pressing (e.g., using a vacuum film pressing machine), so as to facilitate vacuumizing, heating, pressurizing, etc. the isolation film 40.
The packaging process of the radio frequency module packaging structure of the acoustic surface filter is as follows:
step 1, providing a substrate 10, embedding and packaging a non-filter chip 30 on the substrate 10 in a RDL wiring lamination and lamination manner;
step 2, arranging a solder mask layer 11 and an electrode area 12 on the front surface of a substrate 10; at least one filter chip 20 provided with first bumps 22 is provided at the same time;
step 3, flip-chip bonding the filter chip 20 on the first surface 10a of the substrate 10 by a surface mount technology, wherein the plurality of first bumps 22 are respectively connected with the corresponding electrode regions 12;
step 4, attaching the isolation film 40 on the substrate 10, the filter chip 20 and the non-filter chip 30 in a vacuum film pressing mode, so that a closed cavity 23 is formed between the bottom of the filter chip 20 and the substrate 10;
and 5, performing plastic package molding on the component covered with the isolation film to complete the radio frequency module package.
The embodiment of the utility model also provides electronic equipment, which is provided with the radio frequency module packaging structure of the sound surface filter, and by adopting the packaging structure, the damage to a chip during packaging is reduced, the process cost is reduced, and the reliability and the production efficiency of products are improved.
In addition, it should be understood by those skilled in the art that although many problems exist in the prior art, each embodiment or technical solution of the present utility model may be modified in only one or several respects, without having to solve all technical problems listed in the prior art or the background art at the same time. Those skilled in the art will understand that nothing in one claim should be taken as a limitation on that claim.
Although terms such as substrate, first surface, second surface, solder mask, electrode region, filter chip, interdigital transducer, first bump, non-filter chip, second bump, isolation film, closed cavity, etc., are more used herein, the possibility of using other terms is not precluded. These terms are used merely for convenience in describing and explaining the nature of the utility model; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present utility model; the terms first, second, and the like in the description and in the claims of embodiments of the utility model and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (10)
1. The utility model provides a sound table wave filter radio frequency module packaging structure which characterized in that includes:
a substrate having opposite first and second surfaces, the first surface of the substrate having electrode regions thereon;
the filter chip is arranged on the first surface of the substrate, an interdigital transducer and a first salient point are arranged on one surface of the filter chip, which faces the substrate, the first salient point is connected with the electrode area, and a gap is reserved between one surface of the filter chip, which faces the substrate, and the substrate;
the non-filter chip is embedded in the substrate, a second salient point is arranged on one surface of the non-filter chip, facing the substrate, and the second salient point is connected with the electrode area;
the isolation film is arranged on the first surface of the substrate, the filter chip and the non-filter chip, and a closed cavity is formed between the filter chip and the substrate and between the filter chip and the isolation film.
2. The acoustic surface filter radio frequency module package structure of claim 1, wherein: the upper surface of the non-filter chip is flush with the first surface of the substrate.
3. The acoustic surface filter radio frequency module package structure of claim 1, wherein: the upper surface of the non-filter chip is higher than the first surface of the substrate.
4. The acoustic surface filter radio frequency module package structure of claim 3, wherein: the lower surface of the non-filter chip is flush with the first surface of the substrate.
5. The acoustic surface filter radio frequency module package structure of claim 1, wherein: a solder mask layer is arranged on the first surface of the substrate and is positioned around the electrode region.
6. The acoustic surface filter radio frequency module package structure of claim 5, wherein: the material of the solder mask layer is a dry film, a DAF film, an insulating tape, an epoxy resin film, a phenolic resin film, a polyimide film or a liquid crystal polymer film.
7. The acoustic surface filter radio frequency module package structure of claim 5, wherein: a gap is formed between one surface of the filter chip, which faces the substrate, and the solder mask layer, and the distance from the lower surface of the filter chip to the upper surface of the solder mask layer is 10-30 mu m.
8. The acoustic surface filter radio frequency module package structure of claim 1, wherein: the non-filter chip is a chip of a power amplifier, a radio frequency switch and a low noise amplifier.
9. The acoustic surface filter radio frequency module package structure of claim 1, wherein: in the vertical direction of the substrate, the outer edge of the non-filter chip coincides with the nearest outer edge of the first bump on the filter chip adjacent to the outer edge.
10. An electronic device, characterized by having a sound surface filter radio frequency module package structure according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320652331.8U CN220067387U (en) | 2023-03-29 | 2023-03-29 | Radio frequency module packaging structure of sound surface filter and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320652331.8U CN220067387U (en) | 2023-03-29 | 2023-03-29 | Radio frequency module packaging structure of sound surface filter and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN220067387U true CN220067387U (en) | 2023-11-21 |
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| CN202320652331.8U Active CN220067387U (en) | 2023-03-29 | 2023-03-29 | Radio frequency module packaging structure of sound surface filter and electronic equipment |
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| Country | Link |
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| CN (1) | CN220067387U (en) |
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