CN220063864U - Silicon wafer edge defect detection device - Google Patents
Silicon wafer edge defect detection device Download PDFInfo
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- CN220063864U CN220063864U CN202321598012.XU CN202321598012U CN220063864U CN 220063864 U CN220063864 U CN 220063864U CN 202321598012 U CN202321598012 U CN 202321598012U CN 220063864 U CN220063864 U CN 220063864U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 99
- 239000010703 silicon Substances 0.000 title claims abstract description 99
- 238000001514 detection method Methods 0.000 title claims abstract description 59
- 230000007547 defect Effects 0.000 title claims abstract description 17
- 230000007704 transition Effects 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 38
- 238000000576 coating method Methods 0.000 claims description 38
- 238000009434 installation Methods 0.000 claims description 31
- 238000001914 filtration Methods 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 63
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000003708 edge detection Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model provides a silicon wafer edge defect detection device, and belongs to the technical field of silicon wafer detection and separation; the key points of the technical scheme are as follows: the device comprises a conveying streamline, a transverse substrate, an adjusting assembly, a left edge element detecting assembly, a right edge element detecting assembly, a shooting assembly, a light source mounting vertical plate, a mirror group structure and a light source assembly; the utility model is provided with a light source assembly, a lens group structure and a shooting assembly, wherein the light source assembly is matched with the lens group structure, the upper edge surface, the side edge and the lower edge surface of the silicon wafer are lightened, and the lens group structure introduces a light source into the shooting assembly at the same time, so that the upper edge surface, the side edge and the lower edge surface of the silicon wafer are detected, and the side edge comprises a transition part of a straight edge and a chamfer edge; therefore, the device eliminates the risk of missed detection by completely detecting the edge part of the silicon wafer.
Description
Technical Field
The utility model relates to the technical field of silicon wafer detection and separation, in particular to a silicon wafer edge defect detection device.
Background
Silicon wafers are widely used as important solar cell raw materials in the production and manufacture of solar cells, circuit boards and other products. In the production process of the silicon wafer, the silicon wafer sorting machine is used as terminal equipment for quality control to detect and sort quality grades in the aspects of silicon wafer size, edge breakage, silicon falling, dirt, hidden cracks, holes, resistivity and the like so as to ensure the quality of products such as solar cells, circuit boards and the like manufactured by the silicon wafer.
The silicon chip sorting machine generally consists of three parts, namely feeding, detecting and discharging sorting; the edge detection of the detection part mainly completes the detection of defects such as edge breakage, silicon drop and the like of the edge; the silicon wafer in the solar energy field is square or rectangular, and when four angles of the silicon wafer are 45 degrees blunted, the edge of the silicon wafer has risks of silicon falling and edge breakage. In order to cope with such a risk, early technologies moved and scanned two parallel sides of a silicon wafer at one station (moved silicon wafer), such as a left and right edge breakage detection device as mentioned in patent (CN 216323446U), which describes a left and right edge breakage detection device composed of a left detection mechanism, a right detection mechanism, a slide rail, and the like. Left detection mechanism sets up on the slide rail with right detection mechanism, and two detection mechanism set up in opposite directions, and arbitrary detection mechanism includes: detecting a camera, a point laser, a light source and an adjusting component; the light source can be adjusted relative to the first fixed plate; the point laser and the detection camera can be respectively adjusted relative to the second fixed plate; the adjustment assembly includes: fixing base and regulating part. According to the device, the left detection mechanism and the right detection mechanism are used for detecting the edge breakage of the conveyed silicon wafers, so that the silicon wafers which do not meet the requirements can be sorted out, and the yield of the silicon wafers from the factory is improved. However, the patent detection mechanism does not detect the transition part of the edge and the chamfer and the broken edge of the chamfer edge, particularly the transition part of the edge and the chamfer is easy to break by slight impact in the production process, and the patent device lacks the capability of detecting the defect. The CN207183213U and CN215496642U patents have the same problems as the CN216323446U patent device described above, and the edge and the transition portion of the chamfer and the edge of the chamfer lack of detection capability, and there is a risk of missing detection.
Disclosure of Invention
The utility model aims to provide a silicon wafer edge defect detection device which is used for solving the problems set forth in the background technology. In order to achieve the above purpose, the present utility model provides the following technical solutions: including being used for transmitting the transport streamline of silicon chip, still including being located transport streamline below horizontal base plate, horizontal base plate's both ends top pass through distance adjustment subassembly install left side arris component detection subassembly and with the right side arris component detection subassembly of left side arris component detection subassembly symmetrical design, left side arris component detection subassembly including install in shooting subassembly and light source installation riser at adjustment subassembly top, the light source installation riser deviate from one side of shooting subassembly is installed and is used for detecting the mirror group structure of upper edge face, side arris limit and lower edge face of silicon chip, the silicon chip can pass the mirror group structure, still be equipped with on the light source installation riser with a plurality of light source subassemblies of mirror group structure complex.
Further, the adjusting assembly comprises an adjusting screw arranged at the end part of the transverse substrate, a camera mounting block fixedly connected with the shooting assembly, an excessive bottom plate fixedly connected to the lower part of the camera mounting block and a slide block mounting plate fixedly connected to the bottom of the excessive bottom plate, a slide block is fixedly connected to the bottom of the slide block mounting plate, a slide rail meshed with the slide block is arranged at the top of the transverse substrate, and the end part of the adjusting screw abuts against the end part of the excessive bottom plate.
Further, the shooting assembly comprises a camera fixedly connected above the excessive bottom plate through the camera mounting block and a lens mounted on the camera, and the lens is aligned to the lens group structure.
Further, the excessive bottom plate is close to the tip both sides of adjusting screw are equipped with the locking board, be equipped with the notch on the locking board, the locking bolt passes the notch with the excessive bottom plate is connected.
Further, the tip of excessive bottom plate with light source installation riser rigid coupling, the light source subassembly including install respectively in light source installation riser top with the light source mounting panel on the slider mounting panel tip, install high-bright spot light source on the light source mounting panel, high-bright spot light source aims at the mirror group structure.
Further, the lower part of the light source installation vertical plate is fixedly connected with a lens group seat and a light filtering seat respectively, the light filtering seat is positioned above the lens group seat, a light filter is installed on the light filtering seat, and an edge front coating reflecting mirror is installed on the lens group seat.
Further, the mirror group structure is still including installing in the edge face speculum group installation piece on the mirror group seat, be equipped with the second silicon chip groove on the edge face speculum group installation piece, still be equipped with half mirror and edge face front coating film speculum on the edge face speculum group installation piece, the top light that the light source subassembly sent is through the half mirror of top in proper order half mirror, the half mirror of edge face, below of silicon chip, edge face front coating film speculum with shooting subassembly.
Further, the mirror group structure is including installing in the edge mirror group mount pad on the mirror group seat, edge mirror group mount pad includes edge mirror group installation piece, be equipped with first silicon chip groove on the edge mirror group installation piece, install first preceding coating film speculum, second preceding coating film speculum on the edge mirror group installation piece, the light that the light source subassembly sent is passed through in proper order first preceding coating film speculum the chamfer edge of silicon chip the second preceding coating film speculum the light filter the coating film speculum before the edge with shooting subassembly.
Further, a straight edge reflector is further arranged on the edge reflector group mounting block, and light emitted by the light source component sequentially passes through the straight edge reflector, the straight edge of the silicon wafer, the second front coating reflector, the optical filter, the front coating reflector and the shooting component.
Compared with the prior art, the utility model has the beneficial effects that:
the utility model is provided with a light source assembly, a lens group structure and a shooting assembly, wherein the light source assembly is matched with the lens group structure, the upper edge surface, the side edge and the lower edge surface of the silicon wafer are lightened, and the lens group structure introduces a light source into the shooting assembly at the same time, so that the upper edge surface, the side edge and the lower edge surface of the silicon wafer are detected, and the side edge comprises a transition part of a straight edge and a chamfer edge; therefore, the device eliminates the risk of missed detection by completely detecting the edge part of the silicon wafer.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of a right edge element detection assembly according to the present utility model;
FIG. 3 is a schematic view of the light path of straight edge detection;
FIG. 4 is a schematic diagram of an optical path for edge face detection;
FIG. 5 is an enlarged schematic view of an optical path of edge face detection;
FIG. 6 is an enlarged schematic view of the straight edge light path;
FIG. 7 is an enlarged schematic view of the optical path of the chamfered edge;
FIG. 8 is an isometric view of a lens assembly structure of the present utility model;
fig. 9 is another isometric view of the lens assembly structure of the present utility model.
Wherein: 1. a transport flow line; 2. a left edge element detection component; 3. a right edge element detection component; 4. a lateral substrate; 5. an adjustment assembly; 6. a slide rail; 7. a silicon wafer; 8. a camera; 9. a lens; 10. a camera mounting block; 11. a transition floor; 12. a light source mounting vertical plate; 13. a high-bright point light source; 14. a light source mounting plate; 15. a locking plate; 16. a locking bolt; 17. edge reflector group mounting blocks; 18. a diffusion plate; 19. a diffusion plate seat; 20. a light filtering seat; 21. adjusting a screw; 22. a slider mounting plate; 23. a lens group seat; 24. a half-mirror; 25. a reflecting mirror coated on the front surface of the edge; 26. a reflecting mirror coated on the front edge; 27. a light filter; 28. a second front coated mirror; 29. a straight edge mirror; 30. a first front coated mirror; 31. an edge reflector group mounting seat; 32. edge surface mirror group installation piece.
Detailed Description
In order to further describe the technical means and effects adopted by the present utility model for achieving the intended purpose, the following detailed description will refer to the specific implementation, structure, characteristics and effects according to the present utility model with reference to the accompanying drawings and preferred embodiments.
Examples: referring to fig. 1-8, a silicon wafer edge defect detecting device includes a transport streamline 1 for transporting a silicon wafer 7, where the transport streamline 1 may use an existing output streamline; the utility model also comprises a transverse base plate 4 positioned below the conveying streamline 1, wherein the transverse base plate 4 can be fixedly arranged on related parts of the production streamline of the silicon wafer 7 so as to facilitate the production of the silicon wafer 7; the top parts of two ends of the transverse substrate 4 are provided with a left edge element detection assembly 2 and a right edge element detection assembly 3 which is symmetrically designed with the left edge element detection assembly 2 through a distance adjustment assembly 5, the structures and the operation modes of the two detection assemblies are the same, and the two detection assemblies are symmetrically designed relative to a conveying streamline 1 so as to detect two edge surfaces, a straight edge, a chamfer transition part and a chamfer edge of a silicon wafer 7; the left side edge element detection assembly 2 comprises a shooting assembly and a light source installation vertical plate 12 which are arranged at the top of the adjustment assembly 5, one side of the light source installation vertical plate 12, which is away from the shooting assembly, is provided with a mirror group structure for detecting the upper edge surface, the side edge and the lower edge surface of the silicon wafer 7, the silicon wafer 7 can pass through the mirror group structure, the light source installation vertical plate 12 is also provided with a plurality of light source assemblies matched with the mirror group structure, wherein the light source assemblies are matched with the mirror group structure, and the mirror group structure guides a light source into the shooting assembly while brightening the upper edge surface, the side edge surface and the lower edge surface of the silicon wafer 7 so as to carry out shooting detection on the upper edge surface, the side edge surface and the lower edge surface of the silicon wafer 7, and the side edge comprises a transition part of a straight edge and a chamfer edge; the device eliminates the risk of missed inspection by completely inspecting the edge portion of the silicon wafer 7.
The adjusting assembly 5 comprises an adjusting screw 21 arranged at the end part of the transverse base plate 4, a camera mounting block 10 fixedly connected with the shooting assembly, an excessive base plate 11 fixedly connected below the camera mounting block 10 and a slide block mounting plate 22 fixedly connected to the bottom of the excessive base plate 11, a slide block is fixedly connected to the bottom of the slide block mounting plate 22, a slide rail 6 meshed with the slide block is arranged at the top of the transverse base plate 4, the end part of the adjusting screw 21 props against the end part of the excessive base plate 11, wherein the adjusting screw 21 can be connected with the transverse base plate 4 through an adjusting plate, the adjusting screw 21 is in threaded connection with the adjusting plate, the extending distance of the adjusting screw 21 relative to the adjusting plate can be changed by screwing the adjusting screw 21, so that the excessive base plate 11 can be pushed to move, the shooting assembly, the lens group structure and the light source assembly can be moved, and the adaptability of the device to silicon wafers 7 with different sizes can be improved; the two sides of the end part of the transition bottom plate 11, which is close to the adjusting screw 21, are provided with locking plates 15, the locking plates 15 are provided with notches, locking bolts 16 penetrate through the notches to be connected with the transition bottom plate 11, and when the adjusting assembly 5 is adjusted according to the size of the silicon wafer 7, the locking bolts 16 can be screwed down, so that the transition bottom plate 11 is fixed, and further, the shooting assembly, the lens group structure and the light source assembly are fixed; the shooting assembly comprises a camera 8 fixedly connected above an excessive base plate 11 through a camera mounting block 10 and a lens 9 mounted on the camera 8, the lens 9 is aligned to a lens group structure, a precondition is provided for detection of a silicon wafer 7, the camera 8 adopts a 2K line scanning camera, the lens 9 adopts a lens with the size of 40mm, and light rays emitted by the light source assembly are reflected to the lens 9 through the lens group structure and are collected by the camera 8.
In the utility model, the end part of the transition baseplate 11 is fixedly connected with the light source mounting vertical plate 12, the light source assembly comprises a light source mounting plate 14 which is respectively mounted on the top of the light source mounting vertical plate 12 and the end part of the slide block mounting plate 22, a high-brightness point light source 13 is mounted on the light source mounting plate 14, the high-brightness point light source 13 is aligned with a lens group structure, a light source is provided for shooting of a shooting assembly, three high-brightness point light sources 13 are arranged, two high-brightness point light sources are positioned above the silicon wafer 7, one high-brightness point light source 13 positioned below the silicon wafer 7 and the high-brightness point light source 13 above are symmetrically designed, the two high-brightness point light sources 13 which are symmetrically designed are used for detecting two edge surfaces, and the rest high-brightness point light source 13 is used for detecting straight edges and chamfer transition parts and chamfer edges.
The lower part of the light source mounting vertical plate 12 is fixedly connected with a lens group seat 23 and a light filtering seat 20 respectively, the light filtering seat 20 is positioned above the lens group seat 23, a light filter 27 is arranged on the light filtering seat 20, an edge front coating reflecting mirror 26 is arranged on the lens group seat 23, the light filter 27 filters out other light rays which do not meet the refraction angle, the concentration degree of the light rays entering the edge front coating reflecting mirror 26 is improved, and the edge front coating reflecting mirror 26 is used for detecting the refraction of the light rays when the edges of the silicon wafer 7 are chamfered, so that the light rays enter the lens 9; in the utility model, the mirror group structure comprises an edge mirror group mounting seat 31 mounted on a mirror group seat 23, the edge mirror group mounting seat 31 comprises an edge mirror group mounting block 17, a first silicon wafer groove is arranged on the edge mirror group mounting block 17, and when a silicon wafer 7 is transmitted to the mirror group structure through a conveying streamline 1, the silicon wafer 7 passes through the first silicon wafer groove and moves out of the mirror group structure; the edge reflector group mounting block 17 is provided with a first front coating reflector 30 and a second front coating reflector 28, and light emitted by the high-brightness point light source 13 sequentially passes through the first front coating reflector 30, the chamfer edges of the silicon wafer 7, the second front coating reflector 28, the optical filter 27, the edge front coating reflector 26 and the lens 9, and in addition, the first front coating reflector 30 is provided with two symmetrical groups, and the front chamfer edges and the rear chamfer edges in the silicon wafer 7 can be lightened, so that the detection quality of the silicon wafer 7 is improved; the edge reflector group mounting block 17 is further provided with a straight edge reflector 29, and light emitted by the high-brightness point light source 13 sequentially passes through the straight edge reflector 29, the straight edge of the silicon wafer 7, the second front film-plating reflector 28, the optical filter 27, the edge front film-plating reflector 26 and the lens 9, and finally is collected by the camera 8, and the chamfer edge and the straight edge of the silicon wafer 7 are detected, so that the combination of the straight edge reflector and the lens can detect the chamfer transition part, and the detection quality of the device is improved.
The mirror group structure further comprises an edge surface mirror group mounting block 32 which is mounted on the mirror group seat 23, a second silicon wafer groove is formed in the edge surface mirror group mounting block 32, a half mirror 24 and an edge surface front coating mirror 25 are arranged on the edge surface mirror group mounting block 32, wherein the edge front coating mirror 26 is mounted on the edge surface mirror group mounting block 32, and the edge surface mirror group mounting block 32 is provided with an upper half mirror 24 and a lower half mirror 24 which are symmetrically designed; the light emitted by the high-bright point light source 13 above the silicon wafer 7 sequentially passes through the upper half mirror 24, the edge surface of the silicon wafer 7, the lower half mirror 24, the edge surface front coating mirror 25 and the lens 9; the light emitted by the high-brightness point light source 13 below the silicon wafer 7 sequentially passes through the lower half mirror 24, the edge surface of the silicon wafer 7, the upper half mirror 24, the edge surface front coating mirror 25 and the lens 9, and is collected by the camera 8 so as to realize the detection of the upper edge surface and the lower edge surface.
Principle of operation
Firstly, according to the size of a silicon wafer 7, an adjusting screw 21 is screwed, the extending distance of the adjusting screw 21 relative to an adjusting plate can be changed, so that an excessive bottom plate 11 is pushed to move, a shooting assembly, a lens group structure and a light source assembly are further moved to proper positions, then a locking bolt 16 is screwed, the excessive bottom plate 11 is fixed, then a high-brightness point light source 13, a camera 8 and a conveying streamline 1 are started, the edge part of the silicon wafer 7 moves into a first silicon wafer groove and penetrates through the first silicon wafer groove, and in the process, light of the high-brightness point light source 13 positioned below the silicon wafer 7 passes through a chamfer edge of the silicon wafer 7, a second front coating mirror 28, a light filter 27, an edge front coating mirror 26 and a lens 9 after passing through a first front coating mirror 30, and is collected by the camera 8; the light of the high-bright point light source 13 below passes through the straight edge reflecting mirror 29, the straight edge of the silicon wafer 7, the second front coating reflecting mirror 28, the optical filter 27, the edge front coating reflecting mirror 26 and the lens 9 and is collected by the camera 8, and the transition part of the straight edge and the chamfer edge can be easily collected by the lens 9 through the structures of the straight edge and the chamfer edge in the moving process; meanwhile, light emitted by the high-brightness point light source 13 positioned above in the symmetrical design sequentially passes through the semi-transparent mirror 24 above, the edge surface of the silicon wafer 7, the semi-transparent mirror 24 below, the film coating mirror 25 in front of the edge surface and the lens 9 and is collected by the camera 8, and light emitted by the high-brightness point light source 13 positioned below in the symmetrical design sequentially passes through the semi-transparent mirror 24 below, the edge surface of the silicon wafer 7, the semi-transparent mirror 24 above, the film coating mirror 25 in front of the edge surface and the lens 9 and is collected by the camera 8, so that the detection of the upper edge surface and the lower edge surface is realized; the device detects the transition parts of the upper edge surface, the lower edge surface, the straight edge, the chamfer edge and the straight edge and the chamfer edge of the silicon wafer 7; the device eliminates the risk of missing the device by detecting the edge portion of the complete silicon wafer 7.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "upper," "lower," "left," "right," "front," "back," and the like are used herein for illustrative purposes only.
Claims (9)
1. The utility model provides a silicon chip edge defect detection device, includes transport streamline (1) that are used for transmitting silicon chip (7), its characterized in that: the silicon wafer structure comprises a silicon wafer (7), and is characterized by further comprising a transverse substrate (4) positioned below the conveying streamline (1), wherein a left side edge element detection assembly (2) and a right side edge element detection assembly (3) symmetrically designed with the left side edge element detection assembly (2) are installed at the tops of the two ends of the transverse substrate (4) through a distance adjustment assembly (5), the left side edge element detection assembly (2) comprises a shooting assembly and a light source installation vertical plate (12) which are installed at the tops of the adjustment assembly (5), one side of the light source installation vertical plate (12) deviating from the shooting assembly is provided with a mirror group structure for detecting the upper edge surface, the side edge surface and the lower edge surface of the silicon wafer (7), the silicon wafer (7) can penetrate through the mirror group structure, and a plurality of light source assemblies matched with the mirror group structure are further arranged on the light source installation vertical plate (12).
2. The silicon wafer edge defect detection device according to claim 1, wherein: the adjusting assembly (5) comprises an adjusting screw (21) arranged at the end part of the transverse substrate (4), a camera mounting block (10) fixedly connected with the shooting assembly, a transition bottom plate (11) fixedly connected to the lower part of the camera mounting block (10) and a slide block mounting plate (22) fixedly connected to the bottom of the transition bottom plate (11), a slide block is fixedly connected to the bottom of the slide block mounting plate (22), a slide rail (6) meshed with the slide block is arranged at the top of the transverse substrate (4), and the end part of the adjusting screw (21) abuts against the end part of the transition bottom plate (11).
3. The silicon wafer edge defect detection device according to claim 2, wherein: the shooting assembly comprises a camera (8) fixedly connected above the excessive base plate (11) through the camera mounting block and a lens (9) mounted on the camera (8), and the lens (9) is aligned to the lens group structure.
4. The edge defect detection device of a silicon wafer (7) according to claim 2, characterized in that: the two sides of the end part of the transition bottom plate (11) close to the adjusting screw (21) are provided with locking plates (15), the locking plates (15) are provided with notches, and locking bolts (16) penetrate through the notches to be connected with the transition bottom plate (11).
5. The silicon wafer edge defect detection device according to claim 2, wherein: the end of the transition bottom plate (11) is fixedly connected with the light source installation vertical plate (12), the light source assembly comprises light source installation plates (14) which are respectively installed on the top of the light source installation vertical plate (12) and the end of the sliding block installation plate (22), a highlight point light source (13) is installed on the light source installation plates (14), and the highlight point light source (13) is aligned with the lens group structure.
6. The silicon wafer edge defect detection device according to claim 1, wherein: the lower part of the light source installation vertical plate (12) is fixedly connected with a lens group seat (23) and a light filtering seat (20) respectively, the light filtering seat (20) is positioned above the lens group seat (23), a light filter (27) is installed on the light filtering seat (20), and an edge front coating reflecting mirror (26) is installed on the lens group seat (23).
7. The silicon wafer edge defect detection device according to claim 6, wherein: the mirror group structure is characterized by further comprising an edge surface mirror group installation block (32) arranged on the mirror group seat (23), a second silicon wafer groove is formed in the edge surface mirror group installation block (32), a semi-transparent semi-reflecting mirror (24) and an edge surface front coating mirror (25) are further arranged on the edge surface mirror group installation block (32), and light emitted by the light source component passes through the semi-transparent semi-reflecting mirror (24) above, the semi-transparent semi-reflecting mirror (24) at the edge surface and the lower side of the silicon wafer (7), the edge surface front coating mirror (25) and the shooting component in sequence.
8. The silicon wafer edge defect detection apparatus according to claim 7, wherein: the mirror group structure is including installing in edge mirror group mount pad (31) on mirror group seat (23), edge mirror group mount pad (31) include edge mirror group installation piece (17), be equipped with first silicon chip groove on edge mirror group installation piece (17), install first preceding coating film speculum (30), second preceding coating film speculum (28) on edge mirror group installation piece (17), the light that the light source subassembly sent is passed through in proper order first preceding coating film speculum (30) chamfer edge of silicon chip (7) second preceding coating film speculum (28) light filter (27) coating film speculum (26) before the edge with shooting subassembly.
9. The silicon wafer edge defect detection device according to claim 8, wherein: the edge reflector group mounting block (17) is further provided with a straight edge reflector (29), and light emitted by the light source component sequentially passes through the straight edge reflector (29), a straight edge of the silicon wafer (7), the second front coating reflector (28), the optical filter (27), the edge front coating reflector (26) and the shooting component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321598012.XU CN220063864U (en) | 2023-06-21 | 2023-06-21 | Silicon wafer edge defect detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321598012.XU CN220063864U (en) | 2023-06-21 | 2023-06-21 | Silicon wafer edge defect detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220063864U true CN220063864U (en) | 2023-11-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321598012.XU Active CN220063864U (en) | 2023-06-21 | 2023-06-21 | Silicon wafer edge defect detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220063864U (en) |
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2023
- 2023-06-21 CN CN202321598012.XU patent/CN220063864U/en active Active
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