CN220050345U - Welding equipment for chip copper foil substrate chip - Google Patents

Abstract

The utility model discloses welding equipment for a chip copper foil substrate chip, which comprises a base and a truss, wherein a wire feeder and a translation screw are arranged on the truss, a lifting screw is arranged on a sliding block of the translation screw, a wire feeding bracket and a soldering iron mechanism are arranged on the sliding block of the lifting screw, a wire feeding head is arranged on the wire feeding bracket, a soldering iron is arranged on the soldering iron mechanism, the wire feeding head is matched with the soldering iron, and the soldering iron is obliquely arranged and rotates by taking the center of the soldering iron mechanism as an axis, so that the soldering iron is far away from a body of the chip when pins on each side of the chip are welded, the chip is prevented from being burnt out.

Description

Welding equipment for chip copper foil substrate chip

Technical Field

The utility model relates to the technical field of copper foil substrate welding, in particular to welding equipment for a chip copper foil substrate chip.

Background

Copper foil base plates, also called copper clad plates, are the main manufacturing raw materials of circuit boards, and are commonly used for referring to various circuit boards. With the gradual development of industrial automation, various special production equipment gradually replaces manual operation.

The welding mode that the chip was adopted according to the encapsulation mode difference of chip on the copper foil base plate also is different, wherein because its pin is longer and be in the outside of chip to the chip of DIP and SO class encapsulation, adopt the flatiron to weld for saving manufacturing cost more, the flatiron of automatic tin welding machine that current is commonly used is fixed to be set up, to the welding four sides all have pin or pin arrangement direction and flatiron incline direction to cooperate not good (the flatiron is in the chip body side during welding) the chip that scalds easily, for this reason put forward a welding equipment for chip copper foil base plate chip to satisfy above-mentioned automatic welding demand of chip.

Disclosure of Invention

The utility model aims to provide a welding device for a chip copper foil substrate chip, so as to solve the problems in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a welding equipment for chip copper foil substrate chip, includes base and truss, the base sets up in the below of truss, be provided with sideslip mechanism on the base, be provided with the base plate cassette on the slider of sideslip mechanism, be provided with wire feeder and translation lead screw on the truss, the slider direction of motion of sideslip mechanism is perpendicular with the slider direction of motion of translation lead screw, be provided with lifting screw on the slider of translation lead screw, be provided with wire feeding support and flatiron mechanism on the slider of lifting screw, be provided with wire feeding head on the wire feeding support, be provided with the flatiron on the flatiron mechanism, wire feeding head cooperatees with the flatiron, the flatiron slope sets up and uses the center of flatiron mechanism as the axle center rotation.

Still further, send the silk support to include and send the silk extension board, it is provided with lead screw and lift extension board to send on the silk extension board, be provided with lift cylinder and slide on the lift extension board, slide and lift extension board sliding connection, the piston rod and the slide of lift cylinder are connected, be provided with on the slide and send a silk branch, send the one end and the slide rotation of silk branch to be connected, the other end is provided with and send the silk head installation pole, send the silk head installation pole to rotate with sending a silk branch to be connected, send the silk head to set up on sending the silk head installation pole.

Still further, the flatiron mechanism includes the backup pad, the below of backup pad is provided with the ring gear, the side of backup pad is provided with turns to the motor, turn to the output shaft and the ring gear meshing of motor, the outside of ring gear is provided with the flatiron support, the upper end and the ring gear fixed connection of flatiron support, the lower extreme is the arc and is provided with the spout on it, flatiron gliding setting is on the spout.

Still further, the base plate cassette includes the bottom plate, the diagonal angle of bottom plate is provided with right angle splint, the cross-section of right angle splint is L shape, be provided with the expansion groove on the bottom plate, the inboard of right angle splint is provided with the connecting rod, the connecting rod sets up in the inside of expansion groove, be provided with the extension spring in the expansion groove, the both ends of extension spring are connected with two relative connecting rods respectively.

Further, a smoke exhausting tube is arranged on the soldering iron support, and the wire feeding head and the end part of the soldering iron are arranged below the smoke exhausting tube.

The beneficial effects of the utility model are as follows:

this novel use is provided with the wire feed head on sending the silk support, sets up the flatiron on the flatiron mechanism, send the wire feed head and match with the flatiron, and the flatiron slope sets up and rotates as the axle center with the center of flatiron mechanism, has realized keeping away from the body of chip when the flatiron welds the pin on each edge of chip, avoids scalding bad chip, and this novel simple structure of use, chip welded application scope are wide to be favorable to popularization and application.

Drawings

Fig. 1 is a schematic structural diagram of a soldering apparatus for a chip copper foil substrate according to the present utility model.

Fig. 2 is a schematic structural diagram of a substrate holder of a soldering apparatus for a chip copper foil substrate according to the present utility model.

Fig. 3 is a schematic structural view of a wire feeding bracket of a soldering apparatus for a chip on a copper foil substrate according to the present utility model.

Fig. 4 is a schematic structural view of a soldering iron stand of a soldering apparatus for a chip on a copper foil substrate according to the present utility model.

In the figure: base 1, truss 2, wire feeder 3, translation screw 4, lifting screw 5, wire feed support 6, wire feed support 601, lifting support 602, guide screw 603, lifting cylinder 604, slide 605, wire feed support 606, wire feed mounting 607, wire feed 608, soldering iron mechanism 7, support plate 701, toothed ring 702, steering motor 703, soldering iron support 704, chute 705, soldering iron 706, smoke cartridge 8, substrate cartridge 9, bottom plate 901, right angle clamp 902, expansion slot 903, connecting rod 904, tension spring 905,

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Example 1

Referring to fig. 1, the present utility model provides a technical solution: the utility model provides a welding equipment for chip copper foil substrate chip, including base 1 and truss 2, base 1 installs in the below of truss 2, install base plate cassette 9 on the base 1, be provided with sideslip mechanism on the base 1, base plate cassette 9 installs on sideslip mechanism's slider, install wire feeder 3 and translation lead screw 4 on the truss 2, translation mechanism's slider direction of motion is perpendicular with translation lead screw 4's slider direction of motion, install lift lead screw 5 on translation lead screw 4's the slider, install wire feed holder 6 and flatiron mechanism 7 on lift lead screw 5's the slider, install smoke exhaust tube 8 on the flatiron mechanism 7, wire feed holder 6 and flatiron end on the flatiron mechanism 7 all are in smoke exhaust tube 8's below, translation lead screw 4 and lift lead screw 5's motor are servo motor.

Before welding, the chip is positioned on the copper foil substrate through dispensing and curing, and during welding, the copper foil substrate is mounted on the substrate clamping seat 9, the lifting screw 5 drives the wire feeding bracket 6 and the soldering iron mechanism 7 to the upper part of the chip, and the translation screw 4 and the traversing mechanism are mutually matched to drive the soldering iron to weld the pins of the chip on the copper foil substrate transversely and longitudinally.

Referring to fig. 2, the substrate holder 9 includes a base plate 901, the base plate 901 is fixedly connected with a slider of a traversing mechanism, a right-angle clamping plate 902 is mounted on a diagonal corner of the base plate 901, a telescopic groove 903 is formed in the base plate 901, a connecting rod 904 is mounted on an inner side of the right-angle clamping plate 902, the connecting rod 904 is arranged in the telescopic groove 903, a tension spring 905 is mounted in the telescopic groove 903, two ends of the tension spring 905 are respectively connected with two opposite connecting rods 904, the cross section of the right-angle clamping plate 902 is L-shaped, the connecting rod 904 is matched with the lower end of the right-angle clamping plate 902 to enable the right-angle clamping plate 902 to be kept on the base plate 901, and the right-angle clamping plate 902 clamps a copper foil substrate placed on the base plate 901 through the tension spring 905 when in use.

Referring to fig. 3, the wire feed bracket 6 includes a wire feed support plate 601, the wire feed support plate 601 is mounted on a slider of the lifting screw 5, a wire guide rod 603 and a lifting support plate 602 are mounted on the wire feed support plate 601, a lifting cylinder 604 and a sliding plate 605 are mounted on the lifting support plate 602, the sliding plate 605 is slidably connected with the lifting support plate 602, a piston rod of the lifting cylinder 604 is connected with the sliding plate 605, a wire feed support rod 606 is mounted on the sliding plate 605, one end of the wire feed support rod 606 is rotatably connected with the sliding plate 605, a wire feed mounting rod 607 is mounted at the other end, the wire feed mounting rod 607 is rotatably connected with the wire feed support rod 606, a wire feed 608 is mounted on the wire feed mounting rod 607, and an angle of the wire feed 608 is adjusted through the wire feed support rod 606 and the wire feed mounting rod 607 so as to be matched with a soldering iron.

Referring to fig. 4, the soldering iron mechanism 7 includes a support plate 701, the support plate 701 is mounted on a slider of the lifting screw 5, a smoke discharge tube 8 is vertically mounted on the support plate 701, a toothed ring 702 is mounted below the support plate 701, a steering motor 703 is mounted on a side surface of the support plate 701, an output shaft of the steering motor 703 is meshed with the toothed ring 702, a soldering iron support 704 is mounted on the outer side of the toothed ring 702, the upper end of the soldering iron support 704 is fixedly connected with the toothed ring 702, a sliding groove 705 is formed in the lower end of the soldering iron support, and the soldering iron 706 is slidably mounted on the sliding groove 705.

When the pins of the chip are welded, the steering motor 703 drives the soldering iron 706 to rotate by taking the smoke exhaust barrel 8 as the center, so that the soldering iron 706 is far away from the body of the chip when the pins on each side of the chip are welded, and the chip is prevented from being scalded.

The present utility model is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present utility model and the inventive concept thereof, can be replaced or changed within the scope of the present utility model.

Claims (5)

1. The utility model provides a welding equipment for chip type copper foil substrate chip, includes base and truss, the base sets up in the below of truss, its characterized in that: the device is characterized in that a traversing mechanism is arranged on the base, a substrate clamping seat is arranged on a sliding block of the traversing mechanism, a wire feeding machine and a translating screw rod are arranged on the truss, the moving direction of the sliding block of the traversing mechanism is perpendicular to that of the sliding block of the translating screw rod, a lifting screw rod is arranged on the sliding block of the translating screw rod, a wire feeding support and a soldering iron mechanism are arranged on the sliding block of the lifting screw rod, a wire feeding head is arranged on the wire feeding support, a soldering iron is arranged on the soldering iron mechanism, the wire feeding head is matched with the soldering iron, and the soldering iron is obliquely arranged and rotates by taking the center of the soldering iron mechanism as an axle center.

2. The soldering apparatus for a chip copper foil substrate according to claim 1, wherein: the wire feeding support comprises a wire feeding support plate, a wire guide rod and a lifting support plate are arranged on the wire feeding support plate, a lifting cylinder and a sliding plate are arranged on the lifting support plate, the sliding plate is in sliding connection with the lifting support plate, a piston rod of the lifting cylinder is connected with the sliding plate, a wire feeding support rod is arranged on the sliding plate, one end of the wire feeding support rod is connected with the sliding plate in a rotating mode, a wire feeding installation rod is arranged at the other end of the wire feeding support rod, the wire feeding installation rod is connected with the wire feeding support rod in a rotating mode, and the wire feeding head is arranged on the wire feeding installation rod.

3. The soldering apparatus for a chip copper foil substrate according to claim 2, wherein: the soldering iron mechanism comprises a supporting plate, a toothed ring is arranged below the supporting plate, a steering motor is arranged on the side face of the supporting plate, an output shaft of the steering motor is meshed with the toothed ring, a soldering iron support is arranged on the outer side of the toothed ring, the upper end of the soldering iron support is fixedly connected with the toothed ring, a sliding groove is formed in the lower end of the soldering iron support in an arc shape, and the soldering iron is arranged on the sliding groove in a sliding mode.

4. A soldering apparatus for a chip copper foil substrate according to any one of claims 1 to 3, wherein: the base plate clamping seat comprises a base plate, right angle clamping plates are arranged on opposite angles of the base plate, the cross sections of the right angle clamping plates are L-shaped, telescopic grooves are formed in the base plate, connecting rods are arranged on the inner sides of the right angle clamping plates, the connecting rods are arranged in the telescopic grooves, tension springs are arranged in the telescopic grooves, and two ends of each tension spring are connected with two opposite connecting rods respectively.

5. The soldering apparatus for a chip copper foil substrate according to claim 4, wherein: the soldering iron support is provided with a smoke exhausting tube, and the wire feeding head and the end part of the soldering iron are arranged below the smoke exhausting tube.