CN219978464U - Test equipment - Google Patents

Abstract

The utility model relates to the technical field of lasers, in particular to test equipment for a semiconductor laser. The testing equipment provided by the utility model comprises a workbench, a probe, a first light guide piece, a second light guide piece, a third light guide piece, a first measuring piece, a second measuring piece, a third measuring piece and a fourth measuring piece, wherein the shell is arranged on the workbench; according to the embodiment, the first measuring piece, the second measuring piece and the third measuring piece can be used for respectively measuring the light intensity in different sections of the whole light path, so that whether the components in the light path of the section have faults or not can be judged. Compared with the existing semiconductor laser abnormality detection mode, the detection equipment provided by the utility model can detect whether the semiconductor laser has abnormality or not, and can also detect that the optical element in a certain section of optical path has abnormality, so that a foundation can be provided for subsequent overhaul, and the overhaul efficiency is improved.

Description

Test equipment

Technical Field

The utility model relates to the technical field of lasers, in particular to test equipment.

Background

Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as the working substance. The semiconductor laser has small volume and long service life, and can be pumped by adopting a simple current injection mode, so that the semiconductor laser has wide application in the aspects of laser communication, optical storage, optical gyro, laser printing, distance measurement, radar and the like.

The existing semiconductor laser needs to be tested after assembly is completed to remove defective products, at present, production equipment is generally adopted to power up a chip of the semiconductor laser, then a power meter is arranged on a light path of the chip to measure power, when the measured power is not in a preset power range value interval, the chip of the semiconductor laser is judged to have problems, the semiconductor laser is classified into the defective product area, but the light path of the semiconductor laser comprises a plurality of optical lens structures, and the existing detection equipment cannot detect which part in the light path has faults.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: the existing production equipment is used for supplying power to a chip of the semiconductor laser, and a power meter is used for detecting the light intensity of a light path, so that whether the light path corresponding to the chip has a problem or not can only be judged, but the specific optical component in the light path cannot be determined to have a fault.

(II) technical scheme

In order to solve the technical problem, a test equipment for semiconductor laser, semiconductor laser includes casing, laser chip, first fast axis collimating mirror, first slow axis collimating mirror, speculum, anti-reflection piece, second fast axis collimating mirror and second slow axis collimating mirror, laser chip, first fast axis collimating mirror, first slow axis collimating mirror, speculum, anti-reflection piece second fast axis collimating mirror and second slow axis collimating mirror set gradually along the light path in the casing, first fast axis collimating mirror and first slow axis collimating mirror with laser chip one-to-one sets up, test equipment includes: the device comprises a workbench, a probe, a first light guide piece, a second light guide piece, a third light guide piece, a first measuring piece, a second measuring piece, a third measuring piece and a fourth measuring piece, wherein the shell is arranged on the workbench; the first measuring piece, the second measuring piece, the third measuring piece and the fourth measuring piece are all positioned on the outer side of the shell;

the probe, the first light guide piece, the second light guide piece and the third light guide piece can all be lifted, and the probe is used for being electrically connected with the laser chip;

when the first light guide piece and the second light guide piece are both lowered to the working positions, the first measuring piece, the first light guide piece, the second light guide piece and the second measuring piece are positioned on the same straight line;

when the first light guide piece descends between the first fast axis collimating mirror and the first slow axis collimating mirror, the first light guide piece is used for guiding light in a light path into the first measuring piece;

the second light guide piece is used for guiding light in the light path to the second measuring piece when being lowered to the rear side of the reflecting mirror;

when the third light guide piece descends to the front side of the anti-reflection sheet; for guiding light in the light path to the third measuring member;

the fourth measuring piece is positioned at the outer side of the workbench and corresponds to the output end of the semiconductor laser;

the first measuring piece, the second measuring piece, the third measuring piece and the fourth measuring piece are all used for measuring the light intensity in the corresponding light path.

According to one embodiment of the utility model, the first, second, third and fourth measuring members are power meters.

According to one embodiment of the utility model, the first, second and third light guides are periscopes.

According to one embodiment of the utility model, each periscope is connected with a bracket respectively, and each bracket is connected with a first driving mechanism respectively, and the first driving mechanism is used for driving the corresponding bracket to lift.

According to one embodiment of the utility model, a containing groove with an open upper end is formed in the shell, and the first measuring piece, the second measuring piece and the fourth measuring piece are all positioned on the outer side of the workbench and higher than the upper end edge of the containing groove; the third measuring piece is arranged on the workbench.

According to one embodiment of the utility model, an optical fiber port is arranged on the side wall of the shell at the rear side of the second slow axis collimating mirror, and the fourth measuring piece is used for measuring the light intensity of the light rays led out from the optical fiber port.

According to one embodiment of the utility model, the probe is provided with two symmetrical chip sets, and each chip set comprises at least one laser chip; the first fast axis collimating lens, the first slow axis collimating lens, the reflecting mirror, the first slow axis collimating lens and the first fast axis collimating lens are sequentially arranged between the two laser chips corresponding to the two rows of chip sets;

when the first light guide piece and the second light guide piece are both descended, the first light guide piece and the second light guide piece are positioned on two opposite sides of the reflecting mirror.

According to one embodiment of the utility model, the test apparatus further comprises a second driving mechanism, each of the probes is connected to one of the second driving mechanisms, and the second driving mechanism is used for driving the probes to move up and down.

According to one embodiment of the utility model, the second driving mechanism comprises a driving motor and a ball screw, and the driving motor is in transmission connection with the probe through the ball screw.

According to one embodiment of the utility model, the test apparatus further comprises a third drive mechanism capable of driving the stage to move left and right in a direction along the optical path between the mirror and the second slow axis collimator.

The utility model has the beneficial effects that: the testing equipment provided by the utility model comprises a workbench, a probe, a first light guide piece, a second light guide piece, a third light guide piece, a first measuring piece, a second measuring piece, a third measuring piece and a fourth measuring piece, wherein the shell is arranged on the workbench; the first measuring piece, the second measuring piece, the third measuring piece and the fourth measuring piece are all positioned on the outer side of the shell; in the embodiment, the fourth measuring piece can measure the light intensity output by the whole semiconductor laser, and the comparison is carried out between the light intensity of the whole semiconductor laser and the preset light intensity of the semiconductor laser to judge whether the whole semiconductor laser is qualified or not; when judging that the light intensity of the semiconductor laser is abnormal, detecting whether the laser chip and the first fast axis collimating mirror are abnormal or not through a first measuring part, detecting whether the reflecting mirror is abnormal or not through a second measuring part, detecting whether the first slow axis collimating mirror is abnormal or not through a third measuring part, and judging that one or some parts of the anti-reflection sheet, the second fast axis collimating mirror and the second slow axis collimating mirror are abnormal if the parts are not abnormal; compared with the existing semiconductor laser abnormality detection mode, the detection equipment provided by the utility model can detect whether the semiconductor laser has abnormality or not, and can also detect that the optical element in a certain section of optical path has abnormality, so that a foundation can be provided for subsequent overhaul, and the overhaul efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of a test apparatus according to one embodiment of the present utility model;

fig. 2 is an enlarged view of a portion a of fig. 1;

FIG. 3 is a top view of a test apparatus provided in one embodiment of the present utility model;

fig. 4 is an enlarged view of a portion B of fig. 3;

fig. 5 is an enlarged view of a portion C of fig. 3;

FIG. 6 is a perspective view of another view of a test apparatus according to one embodiment of the present utility model.

Icon: 1-a workbench; 11-a housing; a 111-laser chip; 112-a first fast axis collimator; 113-a first slow axis collimator; 114-a mirror; 115-anti-reflection sheet; 116-a second fast axis collimator; 117-a second slow axis collimator; 12-a third measurement member; 13-a third drive mechanism;

2-a first measuring member; 3-a second measuring member; 4-fourth measuring member; 5-probe; 6-a first light guide; 7-a second light guide; 71-periscope; 72-a bracket; 8-third light guide.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model can be more clearly understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings, and in which the features of the embodiments of the utility model are illustrated in the appended drawings without departing from the scope of the appended claims. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 6, the present utility model provides a test apparatus for a semiconductor laser including a housing 11, a laser chip 111, a first fast axis collimator lens 112, a first slow axis collimator lens 113, a reflecting mirror 114, an anti-reflection sheet 115, a second fast axis collimator lens 116, and a second slow axis collimator lens 117, the laser chip 111, the first fast axis collimator lens 112, the first slow axis collimator lens 113, the reflecting mirror 114, the anti-reflection sheet 115, the second fast axis collimator lens 116, and the second slow axis collimator lens 117 being sequentially disposed in the housing 11 along an optical path, the first fast axis collimator lens 112 and the first slow axis collimator lens 113 being disposed in one-to-one correspondence with the laser chip 111, the test apparatus comprising: the measuring device comprises a workbench 1, a probe 5, a first light guide piece 6, a second light guide piece 7, a third light guide piece 8, a first measuring piece 2, a second measuring piece 3, a third measuring piece 12 and a fourth measuring piece 4, wherein a shell 11 is arranged on the workbench 1; the first measuring piece 2, the second measuring piece 3, the third measuring piece 12 and the fourth measuring piece 4 are all positioned outside the shell 11; the probe 5, the first light guide 6, the second light guide 7 and the third light guide 8 can all be lifted and lowered, and the probe 5 is used for being electrically connected with the laser chip 111; when the first light guide member 6 and the second light guide member 7 are both lowered to the working positions, that is, when the first light guide member 6 and the second light guide member 7 are both lowered to the positions located in the light path, the first measuring member 2, the first light guide member 6, the second light guide member 7 and the second measuring member are located on the same straight line; when the first light guide member 6 descends between the first fast axis collimator lens 112 and the first slow axis collimator lens 113, the light in the light path is guided to the first measuring member 2; when the second light guide 7 descends to the rear side of the reflecting mirror 114, the light in the optical path is guided to the second measuring member 3; when the third light guide 8 is lowered to the front side of the anti-reflection sheet 115; for guiding light in the light path to the third measuring member 12; the fourth measuring piece 4 is positioned at the outer side of the workbench 1 and corresponds to the output end of the semiconductor laser; the first measuring member 2, the second measuring member 3, the third measuring member 12 and the fourth measuring member 4 are each configured to measure the light intensity in the corresponding light path.

In this embodiment, the front and back of the optical path means that the side close to the laser chip 111 in the optical path is the front, and the side relatively far from the laser chip 111 in the optical path is the back; the test apparatus includes: the measuring device comprises a workbench 1, a probe 5, a first light guide piece 6, a second light guide piece 7, a third light guide piece 8, a first measuring piece 2, a second measuring piece 3, a third measuring piece 12 and a fourth measuring piece 4, wherein a shell 11 is arranged on the workbench 1; the first measuring piece 2, the second measuring piece 3, the third measuring piece 12 and the fourth measuring piece 4 are all positioned outside the shell 11; when the test equipment is used for detecting whether the semiconductor laser is abnormal, the probe 5 is firstly contacted with the laser chip 111, the laser chip 111 is electrically connected with the probe 5, the probe 5 supplies power to the laser chip 111, the laser chip 111 is electrified to emit light, the light beam is compressed in the vertical direction through the first fast axis collimating mirror 112, then the light beam is compressed in the horizontal direction through the first slow axis collimating mirror 113, the light beam is reflected by the reflecting mirror 114 and sequentially emitted through the anti-reflection sheet 115, the second fast axis collimating mirror 116 and the second slow axis collimating mirror 117, the fourth measuring piece 4 is positioned on the outer side of the shell 11, the light intensity in the light path of the semiconductor laser is measured through the fourth measuring piece 4, then the light intensity is compared with the preset light intensity output by the semiconductor laser of the type, and when the difference value between the light intensity and the light intensity exceeds a specified range value, the semiconductor laser is judged to be abnormal.

Then the first light guide member 6 is controlled to descend, the first light guide member 6 is located between the first fast axis collimating mirror 112 and the first slow axis collimating mirror 113, the light beam passing through the first fast axis collimating mirror 112 is led into the first measuring member 2 through the first light guide member 6, at this time, the light beam does not pass through the first slow axis collimating mirror 113 and the reflecting mirror 114, the anti-reflection sheet 115, the second fast axis collimating mirror 116 and the second slow axis collimating mirror 117 at the rear end of the first slow axis collimating mirror 113, the light intensity in the light path is detected through the first measuring member 2, and compared with the preset light intensity of each laser chip, if the difference value exceeds the specified range value, it is judged that the light path between the laser chip 111 and the first slow axis collimating mirror 113 is abnormal, and in this light path, only the first fast axis collimating mirror 112 is judged that the first fast axis collimating mirror 112 is abnormal, or the laser chip 111 and the first fast axis collimating mirror 112 are abnormal at the same time.

When the light intensity measured by the first measuring element 2 is not abnormal, it is determined that the light path between the laser chip 111 and the first slow axis collimating mirror 113 is normal, at this time, the first light guiding element 6 is lifted, the second light guiding element 7 is controlled to descend, the second light guiding element 7 is located at the rear end of the reflecting mirror 114, but the second light guiding element 7 is not located at the rear end of the anti-reflection sheet 115, wherein the light beam emitted by the laser chip 111 irradiates onto the reflecting mirror 114 and turns over 90 degrees and irradiates onto the anti-reflection sheet 115, and then sequentially passes through the second fast axis collimating mirror 116 and the second slow axis collimating mirror 117 to be emitted, that is, the light path of the semiconductor laser is a right-angle light path, that is, the light emitted by the laser chip 111 sequentially passes through the first fast axis collimating mirror 112, the first slow axis collimating mirror 113 and then irradiates onto the reflecting mirror 114, and then sequentially passes through the anti-reflection sheet 115, the second fast axis collimating mirror 116 and the second slow axis collimating mirror 117 to be emitted. While the second measuring element 3 is arranged on the way the laser chip 111 extends to the first fast axis collimator 112 (i.e. the first light guide 6 and the second light guide 7 are symmetrical with respect to the mirror 114, i.e. the first measuring element 2 and the second measuring element 3 are also symmetrically arranged). When the second measuring element 3 can detect the light intensity, it is indicated that there is a problem of light leakage at the reflecting mirror 114, that is, the light beam emitted by the laser chip 111 is not completely reflected by the reflecting mirror 114 into the subsequent light path, but a part of the light beam passes through the reflecting mirror 114 to directly irradiate the second light guiding element 7 along the original light path, and the light beam is guided onto the second measuring element 3 through the second light guiding element 7.

When the second measuring element 3 does not detect the light intensity, that is, after judging that the reflecting mirror 114 does not have light leakage, the second measuring element 3 is controlled to rise, and the third light guiding element 8 is controlled to fall, the third light guiding element 8 is positioned at the front side of the anti-reflection sheet 115, that is, the third light guiding element 8 is positioned between the reflecting mirror 114 and the anti-reflection sheet 115, the third light guiding element 8 guides the light beam reflected by the reflecting mirror 114 to the third measuring element 12, the light intensity measured by the third measuring element 12 is compared with the light intensity of the preset laser chip 111, and when the difference value of the light intensity and the light intensity exceeds the required difference value range, and the reflecting mirror 114 does not have light leakage, the first slow axis collimating mirror 113 is judged to have abnormality.

When the laser chip 111, the first fast axis collimator lens 112, the first slow axis collimator lens 113, and the reflecting mirror 114 in the optical path of the front side of the anti-reflection sheet 115 are all normal, it can be determined that an abnormality exists in one or more of the anti-reflection sheet 115, the second fast axis collimator lens 116, and the second slow axis collimator lens 117.

According to one embodiment of the utility model, the first measuring member 2, the second measuring member 3, the third measuring member 12 and the fourth measuring member 4 are power meters; the power in the light path is measured by the power meter, so that the light intensity in the corresponding light path can be measured; of course, in the present embodiment, the first measuring member 2, the second measuring member 3, the third measuring member 12 and the fourth measuring member 4 may also be other structures for measuring light intensity, such as a laser intensity tester, an optical image tester, etc.

According to one embodiment of the present utility model, as shown in fig. 1, 3 and 6, a receiving groove with an open upper end is formed in the housing 11, a heat sink is disposed in the receiving groove, the laser chip 111 is disposed on the heat sink, the first fast axis collimating mirror 112, the first slow axis collimating mirror 113, the reflecting mirror 114, the anti-reflection sheet 115, the second fast axis collimating mirror 116 and the second slow axis collimating mirror 117 are also disposed on the heat sink, optionally, as shown in fig. 1, 3 and 6, the housing 11 includes a bottom plate and side walls disposed at edges of the bottom plate, wherein the bottom plate is rectangular, four side walls are connected to the upper end of the corresponding bottom plate, and the four side walls form a rectangular frame shape, the first measuring element 2, the second measuring element 3 and the fourth measuring element 4 are all located outside the workbench 1 and higher than the upper end edge of the accommodating groove, that is, the first measuring element 2, the second measuring element 3 and the fourth measuring element 4 are all located outside the housing 11, so as to avoid shielding light transmission, and when the light intensity of a certain section of light path needs to be measured, the light beam needs to be reflected into the first measuring element 2, the second measuring element 3 or the fourth measuring element 4 outside, so that in the embodiment, the periscope 71 is adopted to reflect the light beam to the outside of the housing 11 (that is, the first measuring element 2, the second measuring element 3 or the third measuring element 12 which make the light beam upward reflect in the first measuring element 2, the second measuring element 3 or the third measuring element 12), and the periscope 71 can raise the incident light beam.

In this embodiment, the first light guide member 6 and the second light guide member 7 are capable of refracting the light beam back to the incident direction after the light beam rises to a height, that is, the refracted light beam and the incident light beam are parallel to each other and opposite in direction after the light beam passes through the first light guide member 6 and the second light guide member 7. Taking the first light guide 6 as an example for specific explanation, it is assumed that the first light guide 6 is located at the left side of the laser chip 111 after being lowered, at this time, the first measuring element 2 and the laser chip 111 are located at the right side of the first light guide 6 at the same time, the right laser chip 111 is energized to emit light and then transmits the light to the left, the light is compressed by the first fast axis collimating mirror 112 and the first slow axis collimating mirror 113 in sequence and then irradiates into the first light guide 6, after the light is lifted by the first light guide 6, the light beam is transmitted to the right side and then irradiates into the first measuring element 2 at the right side, and the light intensity is detected by the first measuring element 2.

In this embodiment, after the third light guide 8 can raise the light beam by a height, the light beam is continuously transmitted along the transmission direction of the original light, that is, the third light guide 8 only changes the light transmission height, but does not change the light transmission direction. For example, the light entering the third light guide 8 from the left side passes through the third light guide 8 and is further transmitted to the left side after being lifted by the third light guide 8. Specifically, in this embodiment, the third light guide 8 descends between the reflecting mirror 114 and the anti-reflection sheet 115, the propagation direction of the light beam reflected by the reflecting mirror 114 is turned over by 90 ° for transmission, then enters into the descending third light guide 8, continues to transmit along the original propagation direction after the third light guide 8 is lifted up, and guides the light beam to the third measuring element 12 located at the outer side, and the light intensity is measured by the third measuring element 12. In this embodiment, the third measuring element 12 is mounted on the table 1, and the third measuring element 12 is located at the rear end of the entire optical path of the semiconductor laser (i.e., at the rear side of the light outlet).

In this embodiment, an optical fiber port is disposed on the side wall of the housing 11 at the rear side of the second slow axis collimator 117, the third measuring element 12 is located at the rear side of the optical fiber port and is located at the outer side of the housing 11, wherein the fourth measuring element 4 is located at the outer side of the housing, the light beam emitted from the optical fiber port of the entire semiconductor laser light path is emitted through the optical fiber port, and meanwhile, an optical fiber is connected to the optical fiber port, and the light beam guided out from the optical fiber port on the right side of the housing 11 is transmitted to the fourth measuring element 4 through the optical fiber.

As shown in fig. 1, 2, 3 and 6, each periscope 71 is respectively connected with a bracket 72, and each bracket 72 is respectively connected with a first driving mechanism, and the first driving mechanism is used for driving the corresponding periscope 71 to lift; in this embodiment, the first driving mechanism drives the periscope 71 to lift, when the testing device does not work, the periscope 71 is in a lifting state, and when the semiconductor laser needs to be tested, the first driving mechanism controls the corresponding periscope 71 to lift, so that the light beam in each section of light path to be tested is reflected into the corresponding power meter, and the light intensity in the corresponding light path is measured by the power meter.

Alternatively, in this embodiment, the first driving mechanism may be a ball screw structure, where an output shaft of a driving motor of the first driving mechanism is connected with a screw rod in a transmission manner to drive the screw rod to rotate, the screw rod drives a nut to rotate, a fixed block is connected to the nut, and the fixed block is connected to the bracket 72 through a connecting rod, so as to drive the bracket 72 to rise or fall, and the bracket 72 drives the corresponding periscope 71 to rise or fall.

Of course, in this embodiment, the first driving mechanism may be another driving device, for example, the first driving mechanism is a cylinder or a hydraulic cylinder, and a piston rod of the cylinder or the hydraulic cylinder is connected to the bracket 72, so as to drive the bracket 72 to lift.

According to one embodiment of the present utility model, the test apparatus further comprises a second driving mechanism, each of the probes 5 is connected to one of the second driving mechanisms, and the second driving mechanism is used for driving the probes 5 to move up and down; when the test equipment does not work, the probe 5 is positioned on the upper side of the shell 11 and is not in contact with the laser chip 111, namely, the laser chip 111 is not electrified, and when the test equipment works, the second driving mechanism drives the probe 5 to descend, the probe 5 is in contact with the laser chip 111, the laser chip 111 is electrified, and a light beam is emitted by the electrification of the laser chip 111. In this embodiment, the second driving mechanism may be a ball screw mechanism, and of course, the second driving mechanism may be another driving mechanism such as an air cylinder or a hydraulic cylinder.

According to one embodiment of the present utility model, as shown in fig. 1, 3 and 6, two probes 5 are provided, and two rows of symmetrical chip sets are provided in the housing 11, and each row of the chip sets includes at least one laser chip 111; the first fast axis collimating mirror 112, the first slow axis collimating mirror 113, the reflecting mirror 114, the first slow axis collimating mirror 113 and the first fast axis collimating mirror 112 are sequentially arranged between the two laser chips 111 corresponding to the two rows of chip sets; when the first light guide 6 and the second light guide 7 are lowered, the first light guide 6 and the second light guide 7 are located at opposite sides of the two reflecting mirrors 114. The semiconductor laser generally comprises a row of chip sets or two rows of chip sets, each row of chip sets comprises a plurality of laser chips 111, each laser chip 111 emits light, each laser chip 111 corresponds to a first fast axis collimating mirror 112, a first slow axis collimating mirror 113 and a reflecting mirror 114, and then light beams emitted by each laser chip 111 are reflected by the reflecting mirror 114, enter into an anti-reflection sheet 115 to be converged, and are sequentially emitted through a second fast axis collimating mirror 116 and a second slow axis collimating mirror 117 and then pass through an optical fiber port; when the existing semiconductor lasers are tested, production equipment is adopted for testing, and some semiconductor lasers are tested along with coupling production equipment, so that automatic switching of single and double rows cannot be realized, and if the light intensity of the laser chips 111 in the other row of chip sets is to be measured, the shell 11 of the semiconductor lasers needs to be manually turned 180 degrees horizontally, so that the testing efficiency is affected. The test device provided in this embodiment includes two probes 5, where the two probes 5 are respectively connected to a second driving mechanism, so that lifting can be independently controlled, and therefore, power can be supplied to the laser chips 111 in the two rows of chip sets through the two probes 5, and the test efficiency can be improved without manually turning over the housing 11 of the semiconductor laser during the test.

As shown in fig. 6, the test apparatus further comprises a third driving mechanism 13, and the third driving mechanism 13 is capable of driving the stage 1 to move along the direction of the optical path between the reflecting mirror 114 and the second slow axis collimator 117. In this embodiment, the third driving mechanism 13 may drive the worktable 1 to move in the horizontal plane, and therefore each group of chip sets includes a plurality of laser chips 111, so that the optical paths corresponding to each laser chip 111 need to be sequentially detected, that is, the first light guide 6, the second light guide 7, the third light guide 8, the first measuring element 2, the second measuring element 3, the third measuring element 12, and the fourth measuring element 4 are sequentially used to detect each laser chip 111, for example, the positions of the first light guide 6 and the second light guide 7 correspond to the positions of the optical paths of the first laser chip 111, after the optical paths of the first laser chip 111 are detected, the third driving mechanism 13 drives the worktable 1 to move, so that the positions of the first light guide 6 and the second light guide 7 correspond to the positions of the optical paths of the next laser chip 111, and then sequentially detects all the laser chips 111.

In this embodiment, the third driving mechanism 13 may drive the workbench 1 to move through a driving motor, for example, the driving motor is matched with a rack and pinion to drive the workbench 1 to move, however, in this embodiment, the third driving mechanism may also be other structures capable of driving the workbench 1 to move, for example, a conveyor belt, etc., so long as the design concept of the present utility model can be realized by driving the workbench 1 to move horizontally, which should belong to the protection scope of the present utility model.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or component in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly communicated or indirectly communicated through an intermediate medium, and can be communicated inside two pieces. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.

Claims (10)

1. The utility model provides a test equipment for semiconductor laser, semiconductor laser includes casing (11), laser chip (111), first fast axis collimating mirror (112), first slow axis collimating mirror (113), speculum (114), anti-reflection piece (115), second fast axis collimating mirror (116) and second slow axis collimating mirror (117), laser chip (111), first fast axis collimating mirror (112), first slow axis collimating mirror (113), speculum (114), anti-reflection piece (115) second fast axis collimating mirror (116) and second slow axis collimating mirror (117) set gradually along the light path in casing (11), first fast axis collimating mirror (112) and first slow axis collimating mirror (113) with laser chip (111) one-to-one sets up, its characterized in that, test equipment includes: the device comprises a workbench (1), a probe (5), a first light guide piece (6), a second light guide piece (7), a third light guide piece (8), a first measuring piece (2), a second measuring piece (3), a third measuring piece (12) and a fourth measuring piece (4), wherein a shell (11) is arranged on the workbench (1); the first measuring piece (2), the second measuring piece (3), the third measuring piece (12) and the fourth measuring piece (4) are all positioned on the outer side of the shell (11);

the probe (5), the first light guide piece (6), the second light guide piece (7) and the third light guide piece (8) can all be lifted, and the probe (5) is used for being electrically connected with the laser chip (111);

when the first light guide piece (6) and the second light guide piece (7) are both lowered to the working positions, the first measuring piece (2), the first light guide piece (6), the second light guide piece (7) and the second measuring piece (3) are positioned on the same straight line;

when the first light guide member (6) descends between the first fast axis collimating mirror (112) and the first slow axis collimating mirror (113), the first light guide member is used for guiding light in a light path into the first measuring member (2);

when the second light guide (7) descends to the rear side of the reflecting mirror (114), the second light guide is used for guiding light in a light path into the second measuring piece (3);

when the third light guide (8) descends to the front side of the anti-reflection sheet (115); for guiding light in the light path to a third measuring member (12);

the fourth measuring piece (4) is positioned at the outer side of the workbench (1) and corresponds to the output end of the semiconductor laser;

the first measuring piece (2), the second measuring piece (3), the third measuring piece (12) and the fourth measuring piece (4) are all used for measuring the light intensity in the corresponding light paths.

2. The test device according to claim 1, characterized in that the first measuring element (2), the second measuring element (3), the third measuring element (12) and the fourth measuring element (4) are power meters.

3. Test device according to claim 2, characterized in that the first (6), second (7) and third (8) light guides are periscopes (71).

4. A test apparatus according to claim 3, wherein each periscope (71) is connected to a respective carriage (72), and each carriage (72) is connected to a respective first drive mechanism for driving the respective carriage (72) up and down.

5. The test device according to claim 2, wherein an accommodation groove with an open upper end is formed inside the housing (11), and the first measuring member (2), the second measuring member (3) and the fourth measuring member (4) are located outside the table (1) and above an upper end edge of the accommodation groove; the third measuring element (12) is mounted on the table (1).

6. The test apparatus according to claim 5, wherein an optical fiber port is provided on a side wall of the housing (11) at a rear side of the second slow axis collimator lens (117), and the fourth measuring member (4) is configured to measure a light intensity of light guided out from the optical fiber port.

7. Test device according to claim 2, characterized in that said probes (5) are provided in two rows of symmetrical chipsets, each row of said chipsets comprising at least one laser chip (111), inside said housing (11); the first fast axis collimating mirror (112), the first slow axis collimating mirror (113), the reflecting mirror (114), the first slow axis collimating mirror (113) and the first fast axis collimating mirror (112) are sequentially arranged between the two laser chips (111) corresponding to the two rows of chip sets;

when the first light guide piece (6) and the second light guide piece (7) are both descended, the first light guide piece (6) and the second light guide piece (7) are positioned on two opposite sides of the reflecting mirror (114).

8. Test apparatus according to claim 7, characterized in that the test apparatus further comprises a second drive mechanism, each of the probes (5) being connected to one of the second drive mechanisms, respectively, for driving the probes (5) to move up and down.

9. The test apparatus according to claim 8, characterized in that the second drive mechanism comprises a drive motor and a ball screw, the drive motor being in driving connection with the probe (5) via the ball screw.

10. The test apparatus according to any one of claims 1 to 9, further comprising a third drive mechanism (13), the third drive mechanism (13) being capable of driving the stage (1) to move left and right in the direction of the optical path between the mirror (114) and the second slow axis collimator (117).