CN218956062U

CN218956062U - Laser chip test system

Info

Publication number: CN218956062U
Application number: CN202320048823.6U
Authority: CN
Inventors: 黄蓓; 莫庆伟; 刘锐
Original assignee: Zhejiang Laoying Semiconductor Technology Co ltd
Current assignee: Zhejiang Laoying Semiconductor Technology Co ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-05-02
Anticipated expiration: 2033-01-09

Abstract

The utility model discloses a laser chip testing system, which relates to the technical field of laser chip testing and comprises optical power testing equipment, optical waveform testing equipment, a beam splitter, a collimating lens and a power supply, wherein the power supply supplies power to a laser chip to be tested, one side of the collimating lens is used for setting the laser chip to be tested, the other side of the collimating lens is provided with the beam splitter, and two output light paths of the beam splitter are respectively provided with the optical power testing equipment and the optical waveform testing equipment. And the device is respectively used for testing the optical waveform and the optical power of the chip, so that the synchronous test of the optical waveform and the optical power of the chip is realized.

Description

Laser chip test system

Technical Field

The utility model relates to the technical field of laser chip testing, in particular to a laser chip testing system.

Background

Analysis of the LIV test data can determine characteristics of the laser, including non-linear characteristics of the critical current, quantum efficiency, and output of the generated laser, optical waveform testing systems and methods. The LIV test data is an important indicator for evaluating the performance of laser devices. Through LIV test performance, the working voltage, current and optical power of the laser device can be known, and the attenuation trend of the device can be known. Current LIV tests are typically tested using an integrating sphere/optical power meter. The optical waveform test evaluates the rising edge and the falling edge of the laser, and excessively slow rising and falling speeds block the frequency of light emission and limit the application scene and effect. The main test equipment is an optical waveform detector. The two test contents are the main means of laser evaluation and the test contents.

The laser waveform and optical power test are all performed by separate devices. For a complete test sample, two sets of equipment are required to be used for testing, after one test is finished, the tested equipment is required to be disassembled or a light source is required to be moved to carry out next test content, so that the light type and the test condition cannot be guaranteed to be the same environment, and the test accuracy of the product is affected.

Disclosure of Invention

Aiming at the technical problem that the testing conditions are not in the same environment and the testing accuracy of products is affected, the utility model provides a laser chip testing system which can realize the rapid and accurate testing of the performance of laser products at a chip level through a new optical waveform and power testing scheme and improve the testing capability of the products. The two tests can be synchronously performed, so that the test efficiency of the product can be improved, and the test accuracy of the product can be ensured.

In order to solve the problems, the technical scheme provided by the utility model is as follows:

the utility model provides a laser chip test system, includes optical power test equipment, optical waveform test equipment, beam splitter, collimating mirror and power, wherein, the power is for waiting to test laser chip power supply, and collimating mirror one side is used for setting up waiting to test laser chip, and the collimating mirror opposite side is equipped with the beam splitter, two output light paths of beam splitter are equipped with optical power test equipment and optical waveform test equipment respectively.

The power supply supplies power to the laser chip to be tested, light rays emitted by the laser chip to be tested pass through the collimating lens and then reach the beam splitter, and two beams of light rays emitted by the beam splitter are respectively irradiated on the optical power testing equipment and the optical waveform testing equipment.

Optionally, the optical power testing device is a waveform detector.

Optionally, the optical power test device is one of an optical power meter, a thermal power meter and a silicon optical power meter.

Optionally, the transmittance and reflectance of the beam splitter is greater than or equal to 9:1.

optionally, an attenuation sheet is arranged between the beam splitter and the optical waveform testing equipment. One of the two light beams emitted by the beam splitter irradiates the light waveform testing equipment through the attenuation sheet.

Optionally, the optical fiber testing device further comprises a focusing lens, wherein the focusing lens is arranged between the attenuation sheet and the optical waveform testing device and is used for focusing light rays.

Optionally, the laser chip testing device further comprises a driving circuit, wherein the driving circuit is respectively connected with the laser chip to be tested and a power supply.

Optionally, the collimator also comprises a chip fixing position, wherein the chip fixing position is positioned at one end of the collimator.

Optionally, the laser chip to be tested is a vertical cavity surface emitting laser array.

Optionally, a first collimating lens is arranged between the focusing lens and the attenuation sheet to adjust light.

Compared with the prior art, the technical scheme provided by the utility model has the following beneficial effects:

(1) The embodiment of the application provides a laser chip test system, which belongs to the technical field of VCSEL test systems, and particularly relates to an LIV of a laser device, namely, the LIV is used for simultaneously measuring the output power characteristics of electricity and light. Such a test can be performed at any stage of production but is first used for the selection of laser diodes, i.e. to exclude bad diodes in advance.

(2) The laser chip testing system provided by the embodiment of the application is simultaneously used for testing the optical waveform and the optical power of the chip respectively, so that the synchronous test of the optical waveform and the optical power of the chip is realized.

Drawings

Fig. 1 is a schematic diagram of a laser chip testing system according to an embodiment of the present utility model.

Fig. 2 is a schematic diagram of a second embodiment of a laser chip testing system according to the present utility model.

Detailed Description

For a further understanding of the present utility model, the present utility model will be described in detail with reference to the drawings and examples.

The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the utility model are shown in the drawings. The first, second, etc. words are provided for convenience in describing the technical scheme of the present utility model, and have no specific limitation, and are all generic terms, and do not constitute limitation to the technical scheme of the present utility model. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. The technical schemes in the same embodiment and the technical schemes in different embodiments can be arranged and combined to form a new technical scheme without contradiction or conflict, which is within the scope of the utility model.

Example 1

Referring to fig. 1-2, a laser chip testing system comprises an optical power testing device 2, an optical waveform testing device 3, a beam splitter 5, a collimating lens 4 and a power supply 8, wherein the power supply 8 supplies power to a laser chip to be tested, one side of the collimating lens 4 is used for setting the laser chip to be tested, the other side of the collimating lens 4 is provided with the beam splitter 5, and two output light paths of the beam splitter 5 are respectively provided with the optical power testing device 2 and the optical waveform testing device 3.

The power supply 8 supplies power to the laser chip to be tested, and light rays emitted by the laser chip to be tested pass through the collimating lens 4 to the beam splitter 5, and two beams of light rays emitted by the beam splitter 5 are respectively irradiated on the optical power testing equipment 2 and the optical waveform testing equipment 3. The waveform and power synchronous test of the laser chip is realized, the accuracy and the rapidity of the test are ensured, and the whole system structure is compact. The collimating lens 4 is used for adjusting light rays emitted by the laser chip to be tested, the beam splitter 5 divides the light rays adjusted by the collimating lens 4 into two beams, the two beams of light rays are respectively irradiated on the optical power testing equipment 2 and the optical waveform testing equipment 3, and meanwhile, the two beams of light rays are respectively used for testing the optical waveform and the optical power of the chip, so that the synchronous test of the optical waveform and the optical power of the chip is realized.

The present embodiment belongs to the technical field of VCSEL test systems, and in particular relates to an LIV of a laser device, where the basic detection of the laser diode is an optical-current-voltage (LIV) curve, i.e. measuring the output power characteristics of both electricity and light. Such a test can be performed at any stage of production but is first used for the selection of laser diodes, i.e. to exclude bad diodes in advance.

And (3) carrying out current scanning on the tested device, recording the voltage of each step of scanning, and simultaneously monitoring the light output power by using an instrument. This test is preferably performed in a pulsed fashion at the beginning of production, before the laser diode is assembled into the module. At this point the diode is still in its original state, pulse detection is necessary because the component has no temperature control circuit at this point. If tested with direct current, at least their characteristics are altered and at worst they are damaged. In subsequent production, when they are installed in a module with temperature control, the test can be performed with direct current and the results can be compared with pulse tests. In addition, some diodes can pass the dc test but cannot pass the pulse test.

As an alternative implementation of this embodiment, the optical power testing device 2 is a waveform detector.

As an alternative implementation of this embodiment, the optical power testing device 2 is one of an optical power meter, a thermal power meter and a silicon optical power meter.

As an optional implementation manner of this embodiment, the transmittance and reflectance of the beam splitter 5 is equal to or greater than 9:1.

as an alternative implementation manner of this embodiment, an attenuation sheet 6 is disposed between the beam splitter 5 and the optical waveform testing device 3, and one of two beams of light emitted by the beam splitter 5 irradiates the optical waveform testing device 3 through the attenuation sheet 6.

As an alternative to this embodiment, a focusing lens 7 is also included, said focusing lens 7 being arranged between the attenuation sheet 6 and the optical waveform testing apparatus 3. For focusing the light.

As an alternative implementation of this embodiment, the laser chip to be tested and the power supply 8 are connected to each other by a driving circuit.

As an alternative implementation of this embodiment, the collimator lens further comprises a chip fixing unit 1, where the chip fixing unit 1 is located at one end of the collimator lens 4.

As an alternative implementation manner of this embodiment, the laser chip to be tested is a vertical cavity surface emitting laser array.

As an alternative implementation manner of this embodiment, a collimator lens is disposed between the focusing lens 7 and the attenuation sheet 6 to adjust light.

Example 2

The laser chip testing system of the embodiment comprises the following components:

the optical power testing apparatus includes, but is not limited to: a thermal power meter, a silicon optical power meter.

Optical waveform testing device: a waveform detector.

Collimating lens

Beam splitter: the transmittance is more than or equal to 90 percent, the reflectivity is less than or equal to 10 percent, namely the transmittance is more than or equal to 9 percent: 1

Attenuation sheet

Focusing lens

Power supply

The laser chip to be tested: a Vertical Cavity Surface Emitting Laser (VCSEL) array, the chip having the following features:

the array unit is an emergent light area, and the envelope boundary of the emergent light area is rectangular;

at least one emission hole is contained in one emergent light area;

all emitting holes in one emitting light area are electrically connected in parallel;

the emergent light intervals are electrically connected in an independent relationship, and are generally connected by a common cathode;

the arrangement of the exit light areas is not exclusive.

Example 3

As in fig. 1: the laser chip test system of the embodiment is a multi-parameter test system of VCSEL, and the test method of the system comprises the following steps:

the power supply 8 is turned on to set a certain driving current value, and the VCSEL light source 1 is powered on and turned on. The VCSEL light source emits light rays to form collimated parallel light beams through the collimating lens 4, the parallel light beams split the light rays through the beam splitting lens 5, the light beams are grabbed by the waveform detector 3, the waveform form of the light rays is read out, and the rising edge and the falling edge of the VCSEL laser are evaluated. The second light speed is collected by the power meter 2 to obtain the corresponding light power parameter. The above tests are all tested under the same test conditions, and the parameters of the two tests can be evaluated in a one-to-one correspondence manner.

Example 4

As in fig. 2: the multi-parameter testing system of the VCSEL of the present embodiment is optimized on the basis of embodiment 3, so that the first laser beam can be completely received by the optical wave shaper, and the corresponding method of the system is more accurate than that of embodiment 1, and the method includes the steps of:

the power supply 8 is turned on to set a certain driving current value, and the VCSEL light source 1 is powered on and turned on. The VCSEL light source emits light rays to form collimated parallel light beams through the collimating lens 4, the parallel light beams split the light rays through the beam splitting lens 5, the light beams firstly pass through the attenuation sheet 6 and then are subjected to light type focusing shrinkage through the focusing lens 7, the light beams after shrinkage can be completely grabbed by the waveform detector, the waveform shape is read, and the rising edge and the falling edge of the VCSEL laser are evaluated. And collecting the second light speed by a power meter to obtain a corresponding light power parameter. The above tests are all tested under the same test conditions, and the parameters of the two tests can be evaluated in a one-to-one correspondence manner. The chip optical waveform and optical power test is synchronously tested, so that the accuracy and the rapidity of the test are ensured. The miniaturization of the whole test fixture is realized.

The utility model and its embodiments have been described above by way of illustration and not limitation, and the utility model is illustrated in the accompanying drawings and described in the drawings in which the actual structure is not limited thereto. Therefore, if one of ordinary skill in the art is informed by this disclosure, the structural mode and the embodiments similar to the technical scheme are not creatively designed without departing from the gist of the present utility model.

Claims

1. The laser chip testing system is characterized by comprising optical power testing equipment, optical waveform testing equipment, a beam splitter, a collimating lens and a power supply, wherein the power supply supplies power for a laser chip to be tested, one side of the collimating lens is used for setting the laser chip to be tested, the beam splitter is arranged on the other side of the collimating lens, and two output light paths of the beam splitter are respectively provided with the optical power testing equipment and the optical waveform testing equipment.

2. The laser chip testing system of claim 1, wherein the optical power testing device is a waveform detector.

3. The laser chip testing system of claim 1, wherein the optical power testing device is one of an optical power meter, a thermal power meter, and a silicon optical power meter.

4. The laser chip testing system according to claim 1, wherein the reflectivity of the beam splitter is equal to or greater than 9:1.

5. the laser chip testing system according to claim 1, wherein an attenuation sheet is arranged between the beam splitter and the optical waveform testing device.

6. The laser chip testing system of claim 5, further comprising a focusing lens disposed between the attenuator and the optical waveform testing apparatus for focusing the light.

7. The laser chip testing system of claim 1, further comprising a driving circuit, wherein the driving circuit is respectively connected to the laser chip to be tested and a power supply.

8. The laser chip testing system of any one of claims 1-7, further comprising a chip-securing location, the chip-securing location being located at one end of the collimating mirror.

9. A laser chip testing system according to any of claims 1-7, wherein the laser chip to be tested is a vertical cavity surface emitting laser array.

10. The system of claim 6, wherein a first collimator is disposed between the focusing lens and the attenuator.