CN219944971U

CN219944971U - Semiconductor wafer cutting machine

Info

Publication number: CN219944971U
Application number: CN202321584671.8U
Authority: CN
Inventors: 张满; 隋永新; 盛天岐; 刘京强
Original assignee: Chaoyang Tongmei Crystal Technology Co ltd
Current assignee: Chaoyang Tongmei Crystal Technology Co ltd
Priority date: 2023-06-20
Filing date: 2023-06-20
Publication date: 2023-11-03
Anticipated expiration: 2033-06-20

Abstract

The utility model discloses a semiconductor wafer cutting machine which comprises a fixed seat, wherein the right side of the top of the fixed seat is fixedly connected with a box body, the top of an inner cavity of the box body is fixedly connected with a second air cylinder, the bottom of the second air cylinder is fixedly connected with a sliding plate, the left side of the sliding plate penetrates through the outer part of the box body and is fixedly connected with a bearing seat, and the top of the left side of the inner cavity of the bearing seat is fixedly connected with a first air cylinder. According to the utility model, by adding the adjusting structure, the operator can adjust the cutting angle according to the self requirement, so that the cutting efficiency is improved, the cutting accuracy is improved, the working efficiency of the operator is improved, the working efficiency of equipment is improved, the trouble of the operator is solved, the requirement of the operator is met, the structure is simple to operate, the later period is easy to maintain, convenience is brought to the maintenance work of the operator, and the time of the operator is saved.

Description

Semiconductor wafer cutting machine

Technical Field

The utility model relates to the technical field of semiconductor wafers, in particular to a semiconductor wafer cutting machine.

Background

Semiconductor wafers refer to materials with conductivity between conductors and insulators at normal temperature, and are also called wafers because of their round shape, and various circuit element structures which can be processed on silicon chips are widely used in various fields;

the utility model discloses a CN217394074U, which comprises a first box body, wherein a first rotating motor is fixedly arranged on the first box body, a first lead screw is fixedly connected with the first rotating motor, a first moving block is slidably connected with the first lead screw, a supporting rod and a telescopic rod are fixedly connected with the first moving block, the supporting rod is slidably connected with a laser cutter, a high-definition camera is fixedly arranged on the peripheral surface of the supporting rod, a mechanical arm and a second rotating motor are fixedly arranged at the bottom end of the first box body, a second lead screw is fixedly connected with the output end of the second rotating motor, a second moving block is slidably connected with the second lead screw, a rotating motor is arranged in the second moving block, and the upper end of the rotating motor is fixedly connected with an objective table.

The file realizes automatic cutting, reduces the working strength and improves the cutting precision, but does not have the function of adjustment, so that the requirement of a user cannot be met in the using process, and the using efficiency of equipment is reduced.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model aims to provide a semiconductor wafer cutting machine which achieves the function of adjustment.

(II) technical scheme

The utility model provides a semiconductor wafer cutting machine which comprises a fixed seat, wherein the right side of the top of the fixed seat is fixedly connected with a box body, the top of an inner cavity of the box body is fixedly connected with a second air cylinder, the bottom of the second air cylinder is fixedly connected with a sliding plate, the left side of the sliding plate penetrates through to the outer part of the box body and is fixedly connected with a bearing seat, the top of the left side of the inner cavity of the bearing seat is fixedly connected with a first air cylinder, the right side of the first air cylinder is fixedly connected with a sliding rod, the bottom of the sliding rod is fixedly connected with a sliding sleeve, the inner cavity of the sliding sleeve is sleeved with a sliding rod, the bottom of the sliding sleeve is fixedly connected with a fixed rod, the bottom of the fixed rod penetrates through to the outer part of the bearing seat and is fixedly connected with a fixed plate, the bottom of the fixed plate is fixedly provided with a laser cutting mechanism, and the left side of the top of the fixed seat is fixedly connected with a placing table.

As the preferable scheme, all around of fixing base bottom all fixedly connected with fixed column, the bottom fixedly connected with slipmat of fixed column.

As the preferable scheme, the top of bearing seat inner chamber has seted up first spout, the top fixedly connected with first slider of slide bar, and the surface sliding connection of first slider is in the inner chamber of first spout.

As the preferable scheme, the right side of box inner chamber has seted up the second spout, the right side fixedly connected with second slider of sliding plate, and the surface sliding connection of second slider is in the inner chamber of second spout.

As the preferable scheme, both sides of fixed plate bottom all fixedly connected with limiting plate, and the inboard fixedly connected with stopper of limiting plate.

As an optimal scheme, the surface of the box body is movably connected with a box door, and the surface of the box door is fixedly connected with a handle.

(III) beneficial effects

Compared with the prior art, the utility model provides the semiconductor wafer cutting machine, which has the following beneficial effects.

1. According to the utility model, by adding the adjusting structure, the operator can adjust the cutting angle according to the self requirement, so that the cutting efficiency is improved, the cutting accuracy is improved, the working efficiency of the operator is improved, the working efficiency of equipment is improved, the trouble of the operator is solved, the requirement of the operator is met, the structure is simple to operate, the later period is easy to maintain, convenience is brought to the maintenance work of the operator, and the time of the operator is saved.

2. According to the utility model, the first sliding groove is added, so that the first sliding block is convenient to limit, the sliding rod is prevented from shaking in the sliding process, the sliding stability of the sliding rod is improved, the trouble of a worker is solved, the sliding prevention pad is added, the sliding prevention device can play a role in stabilizing, the limiting plate and the limiting block are added, the limiting plate and the limiting block are used for stabilizing, and the box door and the handle are added, so that the detection and the maintenance of internal parts are facilitated.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a cross-sectional view of a carrier structure of the present utility model;

fig. 3 is a cross-sectional view of the structure of the case of the present utility model.

In the figure: 1. a fixing seat; 2. fixing the column; 3. a placement table; 4. a laser cutting mechanism; 5. a fixing plate; 6. a fixed rod; 7. a bearing seat; 8. a case; 9. a first cylinder; 10. a sliding sleeve; 11. a slide bar; 12. a slide bar; 13. a first chute; 14. a first slider; 15. a second cylinder; 16. a sliding plate; 17. a second chute; 18. and a second slider.

Detailed Description

Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.

In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-3, the present utility model: the utility model provides a semiconductor wafer cutting machine, including fixing base 1, the right side fixedly connected with box 8 at fixing base 1 top, the top fixedly connected with second cylinder 15 of box 8 inner chamber, the bottom fixedly connected with sliding plate 16 of second cylinder 15, the outside fixedly connected with who runs through to box 8 of sliding plate 16 bears seat 7, bear the left top fixedly connected with first cylinder 9 of seat 7 inner chamber, the right side fixedly connected with slide bar 12 of first cylinder 9, the bottom fixedly connected with sliding sleeve 10 of slide bar 12, the inner chamber cover of sliding sleeve 10 is equipped with slide bar 11, the bottom fixedly connected with dead lever 6 of sliding sleeve 10, the bottom fixedly connected with fixed plate 5 of outside fixedly connected with that bears seat 7 is run through to the bottom fixedly connected with laser cutting mechanism 4 of fixed plate 5, the left side fixedly connected with at fixing base 1 top places the platform 3.

Through above-mentioned technical scheme, through increasing the regulation structure, the staff can be according to self demand, adjust the angle of cutting, thereby improved the efficiency of cutting, also improved the precision of cutting simultaneously, not only improved staff's work efficiency, also improved the work efficiency of equipment simultaneously, solved staff's trouble, satisfied staff's demand, this structure easy operation, later stage also easy to maintain, it is convenient to bring for staff maintenance work, saved staff's time.

Specifically, all around of fixing base 1 bottom all fixedly connected with fixed column 2, the bottom fixedly connected with slipmat of fixed column 2.

Through the technical scheme, the anti-skid pad is added, so that the anti-skid pad can play a role in stabilization.

Specifically, a first chute 13 is formed at the top of the inner cavity of the bearing seat 7, a first slide block 14 is fixedly connected to the top of the slide rod 12, and the surface of the first slide block 14 is slidably connected to the inner cavity of the first chute 13.

Through above-mentioned technical scheme, through increasing first spout 13, be convenient for carry out spacingly to first slider 14, prevent that slide bar 12 from appearing the shake at gliding in-process, improved slide bar 12 gliding stability, solved staff's trouble.

Specifically, a second chute 17 is formed on the right side of the inner cavity of the box body 8, a second sliding block 18 is fixedly connected on the right side of the sliding plate 16, and the surface of the second sliding block 18 is slidably connected in the inner cavity of the second chute 17.

Through above-mentioned technical scheme, through increasing second spout 17, be convenient for carry out spacingly to second slider 18, improved the gliding stability of sliding plate 16.

Specifically, both sides of the bottom of the fixed plate 5 are fixedly connected with limiting plates, and the inner sides of the limiting plates are fixedly connected with limiting blocks.

Through above-mentioned technical scheme, through increasing limiting plate and stopper, can play firm effect.

Specifically, the surface of the box body 8 is movably connected with a box door, and the surface of the box door is fixedly connected with a handle.

Through above-mentioned technical scheme, through increasing chamber door and handle, be convenient for detect and maintain internals.

The working principle of the utility model is that; firstly, a user puts a semiconductor wafer on the surface of the placing table 3, secondly, the user starts a second air cylinder 15 through an external controller, pushes a sliding plate 16 to move through the second air cylinder 15, drives a bearing seat 7 to move through the sliding plate 16, drives a laser cutting mechanism 4 to move to a designated position through the bearing seat 7, then, the user simultaneously starts a first air cylinder 9 and the laser cutting mechanism 4 through the external controller, pushes a sliding rod 12 to move through the first air cylinder 9, drives a sliding sleeve 10 to move through the sliding rod 12, drives a fixed rod 6 to move through the sliding sleeve 10, drives a fixed plate 5 to move through the fixed plate 5, drives the laser cutting mechanism 4 to move to the designated position, and simultaneously cuts the semiconductor wafer through the laser cutting mechanism 4.

Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.

Claims

1. The utility model provides a semiconductor wafer cutting machine, includes fixing base (1), its characterized in that: the right side fixedly connected with box (8) at fixing base (1) top, the top fixedly connected with second cylinder (15) of box (8) inner chamber, the bottom fixedly connected with sliding plate (16) of second cylinder (15), the outside fixedly connected with that sliding plate (16) runs through to box (8) bears seat (7), the top fixedly connected with first cylinder (9) at bearing seat (7) inner chamber left side, the right side fixedly connected with sliding rod (12) of first cylinder (9), the bottom fixedly connected with sliding sleeve (10) of sliding rod (12), the inner chamber cover of sliding sleeve (10) is equipped with slide bar (11), the bottom fixedly connected with dead lever (6) of sliding sleeve (10), the bottom of dead lever (6) runs through to outside fixedly connected with fixed plate (5) of bearing seat (7), the bottom fixedly mounted of fixed plate (5) has laser cutting mechanism (4), the left side fixedly connected with of fixing base (1) top places platform (3).

2. A semiconductor wafer dicing machine according to claim 1, wherein: fixing columns (2) are fixedly connected to the periphery of the bottom of the fixing seat (1), and anti-slip pads are fixedly connected to the bottoms of the fixing columns (2).

3. A semiconductor wafer dicing machine according to claim 1, wherein: the top of the inner cavity of the bearing seat (7) is provided with a first sliding groove (13), the top of the sliding rod (12) is fixedly connected with a first sliding block (14), and the surface of the first sliding block (14) is slidably connected in the inner cavity of the first sliding groove (13).

4. A semiconductor wafer dicing machine according to claim 1, wherein: the right side of the inner cavity of the box body (8) is provided with a second chute (17), the right side of the sliding plate (16) is fixedly connected with a second sliding block (18), and the surface of the second sliding block (18) is slidably connected in the inner cavity of the second chute (17).

5. A semiconductor wafer dicing machine according to claim 1, wherein: both sides of fixed plate (5) bottom are all fixedly connected with limiting plate, and the inboard fixedly connected with stopper of limiting plate.

6. A semiconductor wafer dicing machine according to claim 1, wherein: the surface of the box body (8) is movably connected with a box door, and the surface of the box door is fixedly connected with a handle.