CN214185748U - Automatic cutting device for semiconductor materials - Google Patents
Automatic cutting device for semiconductor materials Download PDFInfo
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- CN214185748U CN214185748U CN202022706347.1U CN202022706347U CN214185748U CN 214185748 U CN214185748 U CN 214185748U CN 202022706347 U CN202022706347 U CN 202022706347U CN 214185748 U CN214185748 U CN 214185748U
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- rod
- fixedly connected
- base
- cutting device
- slider
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 title claims abstract description 42
- 230000003028 elevating effect Effects 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
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Abstract
The utility model discloses a semiconductor material automatic cutting device, the on-line screen storage device comprises a base, the bottom is close to the first cylinder of lateral wall fixedly connected with in the base, the first slider of first cylinder telescopic link terminal surface fixedly connected with, first slider top is rotated and is connected with first dwang, the one end that first slider was kept away from to first dwang is provided with the elevating platform, and with elevating platform bottom sliding connection, the position that first slider was kept away from to the bottom in the base rotates and is connected with the second dwang, the one end that the base was kept away from to the second dwang is to rotate with the elevating platform bottom and is connected, the elevating platform top is close to lateral wall fixedly connected with fixed block, the position fixedly connected with second cylinder of fixed block is kept away from at the elevating platform top. A semiconductor material automatic cutting device, not only can carry out more accurate cutting to semiconductor material to can be to the perfect cutting of its inferior nature under the effect of centre gripping.
Description
Technical Field
The utility model relates to a semiconductor cutting technical field especially relates to a semiconductor material automatic cutting device.
Background
The semiconductor thermoelectric material is a semiconductor material with a large thermoelectric effect, which is also called a thermoelectric material, and can directly convert heat energy into electric energy, or directly generate refrigeration from the electric energy when the semiconductor thermoelectric material plate is used, and a cutting device is used for cutting the semiconductor thermoelectric material plate according to the required size.
Some semiconductor material cutting device that present comparison is common, probably the effect is not too ideal when cutting, need carry out cutting many times to it for efficiency reduces to owing to not having certain fixing device at the in-process of cutting, can lead to because the skew and the condition of taking place the cutting failure, consequently, the utility model provides a semiconductor material automatic cutting device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an automatic cutting device for semiconductor materials.
In order to achieve the above purpose, the utility model adopts the following technical scheme: an automatic cutting device for semiconductor materials comprises a base, wherein a first air cylinder is fixedly connected to the bottom of the base close to the side wall, a first slider is fixedly connected to the end face of a telescopic rod of the first air cylinder, a first rotating rod is rotatably connected to the top of the first slider, a lifting table is arranged at one end of the first rotating rod, which is far away from the first slider, and is in sliding connection with the bottom of the lifting table, a second rotating rod is rotatably connected to the position of the bottom of the base, which is far away from the first slider, and is rotatably connected with the bottom of the lifting table, a fixed block is fixedly connected to the top of the lifting table close to the side wall, a second air cylinder is fixedly connected to the position of the top of the lifting table, which is far away from the fixed block, a second slider is fixedly connected to the end face of a telescopic rod of the second air cylinder, a first groove rod is symmetrically and fixedly connected to the top of the base, which is close to the side wall, the utility model discloses a laser emitter, including base, first recess pole, first motor drive end fixedly connected with second recess pole, the inside sliding connection of first recess pole has first slide bar, the position fixedly connected with second recess pole of first recess pole is kept away from at the base top, the inside sliding connection of second recess pole has the second slide bar, second recess pole lateral wall fixedly connected with first motor, first motor drive end fixedly connected with first threaded rod, first threaded rod runs through the second slide bar, second slide bar top fixedly connected with dead lever, first slide bar top is fixed connection with the dead lever bottom, dead lever lateral wall fixedly connected with second motor, second motor drive end fixedly connected with second threaded rod, second threaded rod threaded connection has laser emitter.
As a further description of the above technical solution:
the first sliding block is connected with the inner bottom of the base in a sliding mode.
As a further description of the above technical solution:
the middle part of first dwang and the middle part of second dwang are to rotate and connect, and first dwang and second dwang all run through the top of base.
As a further description of the above technical solution:
the first threaded rod is in threaded connection with the second sliding rod.
As a further description of the above technical solution:
the second sliding block is in sliding connection with the top of the lifting platform.
As a further description of the above technical solution:
the laser emitter penetrates through the bottom of the fixing rod and is in sliding connection with the fixing rod.
The utility model discloses following beneficial effect has:
1. this utility model provides a semiconductor material automatic cutting device uses through setting up two screw drive equipment cooperations for can carry out the cutting of any pattern when cutting the semiconductor, screw drive can reach more accurate cutting effect when the cutting simultaneously, thereby makes the whole process of cutting the semiconductor material need not operate repeatedly.
2. This utility model provides a semiconductor material automatic cutting device, through setting up a elevating gear for when needs cutting, can be applicable to different semiconductor materials, and increase a clamping device on this basis, make semiconductor material can not lead to cutting error and extravagant semiconductor material because of unexpected the removal by the in-process of cutting.
Drawings
Fig. 1 is a front sectional view of an automatic cutting device for semiconductor materials according to the present invention;
fig. 2 is a side sectional view of an automatic cutting device for semiconductor materials according to the present invention;
fig. 3 is a schematic structural diagram of an automatic cutting device for semiconductor materials according to the present invention.
Illustration of the drawings:
1. a base; 2. a first cylinder; 3. a first slider; 4. a first rotating lever; 5. a second rotating lever; 6. a lifting platform; 7. a fixed block; 8. a second cylinder; 9. a second slider; 10. a first groove stem; 11. a first slide bar; 12. a second groove stem; 13. a second slide bar; 14. a first motor; 15. a first threaded rod; 16. fixing the rod; 17. a second motor; 18. a second threaded rod; 19. a laser emitter.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides an embodiment: an automatic cutting device for semiconductor materials comprises a base 1 for bearing the operation of the whole device, a first air cylinder 2 is fixedly connected to the bottom of the base 1 near the side wall, a first slide block 3 is fixedly connected to the end face of a telescopic rod of the first air cylinder 2 and is used for being connected with a first rotating rod 4, the acting force of the first air cylinder 2 on the first slide block 3 can enable the first rotating rod 4 to rotate, the top of the first slide block 3 is rotatably connected with the first rotating rod 4 for adjusting the height of a lifting platform 6, a lifting platform 6 is arranged at one end of the first rotating rod 4 far away from the first slide block 3 and is used for bearing the semiconductor materials to be cut and is in sliding connection with the bottom of the lifting platform 6, a second rotating rod 5 is rotatably connected to the bottom of the base 1 far away from the first slide block 3 and is used for adjusting the height of the lifting platform 6 by matching with the first rotating rod 4, one end of the second rotating rod 5 far away from the bottom of the base 1 is rotatably connected with the bottom of the lifting platform 6, a fixed block 7 is fixedly connected to the top of the lifting platform 6 near the side wall and is used for matching with a second slide block 9 to fix a required semiconductor material, a second air cylinder 8 is fixedly connected to the position of the top of the lifting platform 6 far from the fixed block 7, a second slide block 9 is fixedly connected to the end face of a telescopic rod of the second air cylinder 8 and is used for pushing the semiconductor material so as to match with the fixed block 7 to fix the semiconductor material, a first groove rod 10 is symmetrically and fixedly connected to the top of the base 1 near the side wall and is used for facilitating the movement of the first groove rod 11, a first slide rod 11 is slidably connected to the inside of the first groove rod 10 and is used for connecting a fixed rod 16 and carrying the movement of the first groove rod, a second groove rod 12 is fixedly connected to the position of the top of the base 1 far from the first groove rod 10 and is used for moving the second slide rod 13, a second slide rod 13 is slidably connected to the inside of, a first motor 14 is fixedly connected to the side wall of the second groove rod 12, a first threaded rod 15 is fixedly connected to the driving end of the first motor 14, a second slide rod 13 can slide in the second groove rod 12 conveniently, the first threaded rod 15 penetrates through the second slide rod 13, a fixed rod 16 is fixedly connected to the top of the second slide rod 13, a laser emitter 19 can slide in the fixed rod 16 conveniently, the top of the first slide rod 11 is fixedly connected to the bottom of the fixed rod 16, a second motor 17 is fixedly connected to the side wall of the fixed rod 16, a second threaded rod 18 is fixedly connected to the driving end of the second motor 17 and used for driving the laser emitter 19 in threaded connection to move back and forth in the fixed rod 16, a laser emitter 19 is in threaded connection with the second threaded rod 18 and used for emitting laser to cut a semiconductor material, the first slider 3 is in sliding connection with the inner bottom of the base 1 and is convenient for rotating the first rotating rod 4, the middle of the first rotating rod 4 is rotatably connected with the middle of the second rotating rod 5, height required for adjustment convenient to mutually support, and first dwang 4 and second dwang 5 all run through the top of base 1, first threaded rod 15 is threaded connection with second slide bar 13, the second slide bar 13 round trip's of being convenient for removal, second slider 9 is sliding connection with the top of elevating platform 6, be convenient for to the rational regulation of elevating platform 6 height, laser emitter 19 runs through the bottom of dead lever 16, and be sliding connection with dead lever 16, be convenient for cut semiconductor material.
The working principle is as follows: firstly observing the semiconductor material to be cut, then placing the semiconductor material on a lifting platform 6, using a second air cylinder 8 to push a second slide block 9 to be matched with a fixed block 7 to fix the semiconductor material, then starting a first air cylinder 2 to push a first slide block 3 to drive a first rotating rod 4 to slide so as to adjust the required height, then starting a first motor 14 and a second motor 17, at the moment, a first threaded rod 15 connected with the driving end of the first motor 14 rotates, at the moment, a second sliding rod 13 connected with threads slides in a second groove rod 12, and at the same time, a second threaded rod 18 connected with the driving end of the second motor 17 rotates to drive a laser emitter 19 connected with threads to move back and forth in a fixed rod 16, and the semiconductor material can be cut by matching two rotating devices so as to achieve the required finished product, therefore, the utility model can precisely cut different patterns when the semiconductor material is cut, but also can be finished at one time under the clamping action.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The utility model provides a semiconductor material automatic cutting device, includes base (1), its characterized in that: the bottom is close to a first cylinder (2) fixedly connected with the side wall in the base (1), a first slider (3) is fixedly connected with the telescopic rod end face of the first cylinder (2), a first rotating rod (4) is rotatably connected with the top of the first slider (3), one end of the first rotating rod (4) far away from the first slider (3) is provided with a lifting platform (6) and is in sliding connection with the bottom of the lifting platform (6), the position of the bottom in the base (1) far away from the first slider (3) is rotatably connected with a second rotating rod (5), one end of the second rotating rod (5) far away from the bottom in the base (1) is rotatably connected with the bottom of the lifting platform (6), the top of the lifting platform (6) is close to the fixed block (7) fixedly connected with the side wall, and the position of the lifting platform (6) far away from the fixed block (7) is fixedly connected with a second cylinder (8), the end face of a telescopic rod of the second cylinder (8) is fixedly connected with a second sliding block (9), the top of the base (1) is close to a side wall and is fixedly connected with a first groove rod (10), the inside of the first groove rod (10) is slidably connected with a first sliding rod (11), the position, far away from the first groove rod (10), of the top of the base (1) is fixedly connected with a second groove rod (12), the inside of the second groove rod (12) is slidably connected with a second sliding rod (13), the side wall of the second groove rod (12) is fixedly connected with a first motor (14), a driving end of the first motor (14) is fixedly connected with a first threaded rod (15), the first threaded rod (15) penetrates through the second sliding rod (13), the top of the second sliding rod (13) is fixedly connected with a fixed rod (16), and the top of the first sliding rod (11) is fixedly connected with the bottom of the fixed rod (16), the side wall of the fixing rod (16) is fixedly connected with a second motor (17), the driving end of the second motor (17) is fixedly connected with a second threaded rod (18), and the second threaded rod (18) is in threaded connection with a laser emitter (19).
2. The automatic cutting device for semiconductor materials according to claim 1, characterized in that: the first sliding block (3) is in sliding connection with the inner bottom of the base (1).
3. The automatic cutting device for semiconductor materials according to claim 1, characterized in that: the middle part of first dwang (4) and the middle part of second dwang (5) are the rotation and connect, and first dwang (4) and second dwang (5) all run through the top of base (1).
4. The automatic cutting device for semiconductor materials according to claim 1, characterized in that: the first threaded rod (15) is in threaded connection with the second sliding rod (13).
5. The automatic cutting device for semiconductor materials according to claim 1, characterized in that: the second sliding block (9) is in sliding connection with the top of the lifting platform (6).
6. The automatic cutting device for semiconductor materials according to claim 1, characterized in that: the laser emitter (19) penetrates through the bottom of the fixing rod (16) and is connected with the fixing rod (16) in a sliding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022706347.1U CN214185748U (en) | 2020-11-20 | 2020-11-20 | Automatic cutting device for semiconductor materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022706347.1U CN214185748U (en) | 2020-11-20 | 2020-11-20 | Automatic cutting device for semiconductor materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214185748U true CN214185748U (en) | 2021-09-14 |
Family
ID=77646624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022706347.1U Expired - Fee Related CN214185748U (en) | 2020-11-20 | 2020-11-20 | Automatic cutting device for semiconductor materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214185748U (en) |
-
2020
- 2020-11-20 CN CN202022706347.1U patent/CN214185748U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210914 |