CN220177364U - Dispensing mechanism for semiconductor chip production - Google Patents
Dispensing mechanism for semiconductor chip production Download PDFInfo
- Publication number
- CN220177364U CN220177364U CN202321075928.7U CN202321075928U CN220177364U CN 220177364 U CN220177364 U CN 220177364U CN 202321075928 U CN202321075928 U CN 202321075928U CN 220177364 U CN220177364 U CN 220177364U
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- rod
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- fixedly connected
- output
- semiconductor chip
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000003139 buffering effect Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductor chips and discloses a dispensing mechanism for semiconductor chip production, which comprises a processing table and an equipment groove, wherein a placing groove is formed in the processing table, an output rod is rotatably connected in the placing groove, and a track groove is formed in the outer side of a rod body of the output rod. In the utility model, the semiconductor chip is placed above the sliding frame, the electric telescopic rod is further started to drive the output plate to descend and simultaneously drive the clamping plates at two sides to move so as to clamp the semiconductor chip, when the clamping force is overlarge, the clamping plates drive the sliding rod to slide outwards, and the springs are further compressed so that the clamping plates have a buffering force, thereby achieving the purposes of positioning the semiconductor chips with different sizes and preventing the chips from being damaged due to overlarge clamping force.
Description
Technical Field
The utility model relates to the technical field of semiconductor chips, in particular to a dispensing mechanism for semiconductor chip production.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors are widely used in the fields of radio, television and chip, and semiconductor chips are semiconductor devices which are manufactured by etching and wiring on semiconductor sheets and can realize certain functions, not only silicon chips, but also semiconductor materials such as gallium arsenide, germanium and the like.
The utility model discloses a semiconductor chip production in-process need use the point gum machine to carry out the point gum operation, traditional point gum machine can only carry out the point gum operation to the semiconductor substrate of same size mostly, and semiconductor substrate is comparatively fragile, and staff can't control its fixed dynamics when fixed to it, and very fragile base plate still need the manual work in-process to assist the point gum position simultaneously and adjusts, and manual labor intensity is higher, and the practicality is relatively poor.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a dispensing mechanism for semiconductor chip production.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a mechanism is glued with point in semiconductor chip production, includes processing platform and equipment groove, the standing groove has been seted up to the inside of processing platform, the inside rotation of standing groove is connected with the output pole, the track groove has been seted up in the body of rod outside of output pole, the inside sliding connection in track groove has the actuating lever, the one end fixedly connected with sliding frame of actuating lever, actuating lever cage is in the outside of output pole and sliding connection in the inside of standing groove, the output groove has all been seted up to the both sides of standing groove, both sides the equal fixedly connected with electric telescopic handle in inside top of output groove, both sides the equal fixedly connected with output plate in bottom of electric telescopic handle, both sides the inner of output plate all runs through one side of output groove and is fixed connection in the both sides of sliding frame respectively.
As a further description of the above technical solution:
the both sides the spout has all been seted up in the outside of output groove, both sides the inside of the equal equipment groove in bottom of spout is linked together, both sides the inside of spout is all sliding connection has L shape clamp lever.
As a further description of the above technical solution:
the two sides of the L-shaped clamping rod are connected with a sliding rod in a sliding manner on one side of the cross rod, one ends of the sliding rods on the two sides penetrate through the L-shaped clamping rod and are fixedly connected with clamping plates, and springs are arranged between the clamping plates and the sliding rods on the two sides.
As a further description of the above technical solution:
the two sides the montant bottom of L shape clamp lever is all fixedly connected with pinion rack, both sides the inboard meshing of pinion rack is connected with the fluted disc, the top middle part fixed connection of fluted disc is in the bottom of output rod.
As a further description of the above technical solution:
one end fixedly connected with backup pad of processing platform, the top fixedly connected with connecting plate of backup pad, the adjustment tank has been seted up at the middle part of connecting plate, the inside rotation of adjustment tank is connected with the screw rod.
As a further description of the above technical solution:
the body of rod outside threaded connection of screw rod has the slider, the outside sliding connection of slider is in the inside of adjustment tank, the bottom fixedly connected with hydraulic stem of slider, the bottom fixedly connected with point gum machine of hydraulic stem.
As a further description of the above technical solution:
one end of the screw rod penetrates through the connecting plate and the supporting plate and is fixedly connected with a motor, and a shell of the motor is fixedly connected with one end of the supporting plate.
The utility model has the following beneficial effects:
1. in the utility model, the semiconductor chip is placed above the sliding frame, the electric telescopic rod is further started to drive the output plate to descend, the sliding frame is further driven to descend through the output plate, the driving rod in the sliding frame moves along the track groove and drives the output rod to rotate, the fluted disc is further driven to rotate through the output rod, the toothed plates on two sides are further driven to move, the L-shaped clamping rod is further driven to move through the toothed plates on two sides, and the clamping plate moves to clamp the semiconductor chip, when the clamping force is overlarge, the clamping plate drives the sliding rod to slide outwards, and the spring is further compressed, so that the clamping plate has a buffering force, and the aims of positioning the semiconductor chips with different sizes and preventing the clamping force from overlarge damage to the chip are achieved.
2. According to the utility model, the motor is started to drive the screw rod to rotate, the screw rod is used to drive the slide block to move, the slide block is further used to drive the hydraulic rod and the adhesive dispenser to move to the corresponding positions, and the hydraulic rod is further started to drive the adhesive dispenser to descend to dispense the adhesive on the semiconductor chip, so that the purpose of conveniently adjusting the adhesive dispensing position is achieved, and the labor force of workers is saved to a certain extent.
Drawings
Fig. 1 is a front view of a dispensing mechanism for semiconductor chip production according to the present utility model;
fig. 2 is a cross-sectional view of a dispensing mechanism for semiconductor chip production according to the present utility model;
fig. 3 is an exploded view of a dispensing mechanism for semiconductor chip production according to the present utility model;
FIG. 4 is an enlarged partial view of portion A of FIG. 3;
FIG. 5 is a cross-sectional view of a processing station of a dispensing mechanism for semiconductor chip production according to the present utility model;
fig. 6 is a rear view of a dispensing mechanism for semiconductor chip production according to the present utility model.
Legend description:
1. a processing table; 2. a placement groove; 3. a sliding frame; 4. an output slot; 5. an output board; 6. an electric telescopic rod; 7. a driving rod; 8. an output lever; 9. a track groove; 10. fluted disc; 11. a toothed plate; 12. an L-shaped clamping rod; 13. a slide bar; 14. a clamping plate; 15. a spring; 16. an equipment tank; 17. a chute; 18. a support plate; 19. a connecting plate; 20. a screw; 21. a slide block; 22. a motor; 23. a hydraulic rod; 24. and (5) a glue dispenser.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," "third," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-6, one embodiment provided by the present utility model is: a dispensing mechanism for semiconductor chip production comprises a processing table 1 and a device groove 16, wherein a placing groove 2 is formed in the processing table 1, an output rod 8 is rotatably connected in the placing groove 2, a track groove 9 is formed in the outer side of a rod body of the output rod 8, a driving rod 7 is slidably connected in the track groove 9, one end of the driving rod 7 is fixedly connected with a sliding frame 3, the driving rod 7 is covered on the outer side of the output rod 8 and is slidably connected in the placing groove 2, output grooves 4 are formed in two sides of the placing groove 2, electric telescopic rods 6 are fixedly connected to inner top ends of the output grooves 4 in two sides, output plates 5 are fixedly connected to two sides of the sliding frame 3 in a penetrating mode, inner ends of the output plates 5 penetrate through one sides of the output grooves 4 respectively, sliding grooves 17 are formed in the outer sides of the output grooves 4 in two sides, bottom ends of the sliding grooves 17 are communicated with the inner sides of the device groove 16, the inside of the slide grooves 17 on both sides is connected with an L-shaped clamping rod 12 in a sliding way, one side of a cross rod of the L-shaped clamping rod 12 on both sides is connected with a slide rod 13 in a sliding way, one end of the slide rod 13 on both sides penetrates through the L-shaped clamping rod 12 and is fixedly connected with a clamping plate 14, springs 15 are arranged between the clamping plate 14 on both sides and the slide rod 13 on both sides, the bottom ends of vertical rods of the L-shaped clamping rod 12 on both sides are fixedly connected with toothed plates 11, the inner sides of the toothed plates 11 on both sides are connected with a fluted disc 10 in a meshed way, the middle part of the top end of the fluted disc 10 is fixedly connected with the bottom end of an output rod 8, firstly, a semiconductor chip is placed above the sliding frame 3, an electric telescopic rod 6 is further started to drive the output plate 5 to descend, the output plate 5 is further driven to descend, the output rod 8 is further driven to rotate through a driving rod 7 in the sliding frame 3 to move along the inside of a track groove 9, the output rod 8 is further driven to rotate through the output rod 8, further drive both sides pinion rack 11 and remove, further drive L shape clamp lever 12 through both sides pinion rack 11 and remove and carry out the centre gripping to the semiconductor chip, when the clamping force is too big, splint 14 drive slide bar 13 outwards slide, further compress spring 15, can make splint 14 have a buffering power avoid damaging the semiconductor chip to the purpose to the semiconductor chip location of different sizes has been reached.
One end fixedly connected with backup pad 18 of processing platform 1, the top fixedly connected with connecting plate 19 of backup pad 18, the adjustment tank has been seted up at the middle part of connecting plate 19, the inside rotation in adjustment tank is connected with screw rod 20, the body of rod outside threaded connection of screw rod 20 has slider 21, the outside sliding connection of slider 21 is in the inside of adjustment tank, the bottom fixedly connected with hydraulic stem 23 of slider 21, the bottom fixedly connected with point gum ware 24 of hydraulic stem 23, the one end of screw rod 20 runs through connecting plate 19 and backup pad 18 and fixedly connected with motor 22, the shell fixed connection of motor 22 is in the one end of backup pad 18, through start motor 22, can make screw rod 20 pivoted drive slider 21 and remove, further drive hydraulic stem 23 and point gum ware 24 through slider 21 and remove to relevant position, further start hydraulic stem 23 drives the point gum ware 24 and descend and carry out the point to glue to the semiconductor chip, thereby the purpose of the adjustment position of being convenient for, and saving the workman to a certain extent.
Working principle: firstly, the semiconductor chip is placed above the sliding frame 3, the electric telescopic rod 6 is further started to drive the output plate 5 to descend, the sliding frame 3 is further driven to descend through the output plate 5, the driving rod 7 in the sliding frame 3 is further driven to move along the inside of the track groove 9 and drive the output rod 8 to rotate, the fluted disc 10 is further driven to rotate through the output rod 8, the two side toothed plates 11 are further driven to move, the L-shaped clamping rod 12 is further driven to move through the two side toothed plates 11 and the clamping plate 14 is further driven to move to clamp the semiconductor chip, when the clamping force is overlarge, the clamping plate 14 drives the sliding rod 13 to slide outwards, the spring 15 is further compressed, the clamping plate 14 can have a buffering force to avoid damaging the semiconductor chip, the motor 22 is further started to drive the screw 20 to rotate, the sliding block 21 is further driven to move through the screw 20, the hydraulic rod 23 and the adhesive dispenser 24 are further started to move to the corresponding positions through the sliding block 21, and the adhesive dispenser 24 is further driven to descend to dispense the semiconductor chip, so that the purposes of conveniently adjusting the adhesive positions and positioning the semiconductor chip with different sizes are achieved, and labor is saved to a certain extent.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. The utility model provides a semiconductor chip production is with point gum machine constructs, includes processing platform (1) and equipment groove (16), its characterized in that: the utility model discloses a processing platform, including processing platform (1), including processing platform, rack, driving rod (7), holding tank (2), output rod (8) are offered in the inside rotation of holding tank (2), track groove (9) have been offered in the body of rod outside of output rod (8), inside sliding connection in track groove (9) has driving rod (7), the one end fixedly connected with sliding frame (3) of driving rod (7), driving rod (7) cage is in the outside of output rod (8) and sliding connection in the inside of holding tank (2), output groove (4) have all been offered to the both sides of holding tank (2) the inside top of output groove (4) is all fixedly connected with electric telescopic handle (6), both sides the equal fixedly connected with output plate (5) in bottom of electric telescopic handle (6), both sides the both sides of one side of output groove (4) are all run through to the inner of output plate (5) respectively fixed connection in the both sides of sliding frame (3).
2. The dispensing mechanism for semiconductor chip manufacturing as recited in claim 1, wherein: the outside of both sides output groove (4) has all seted up spout (17), both sides the inside of the equal equipment groove (16) in bottom of spout (17) is linked together, both sides the inside of spout (17) is all sliding connection has L shape clamp lever (12).
3. The dispensing mechanism for semiconductor chip manufacturing as recited in claim 2, wherein: one side of a cross rod of the L-shaped clamping rod (12) at two sides is connected with a slide rod (13) in a sliding manner, one end of the slide rod (13) at two sides penetrates through the L-shaped clamping rod (12) and is fixedly connected with a clamping plate (14), and springs (15) are arranged between the clamping plate (14) and the slide rod (13) at two sides.
4. The dispensing mechanism for semiconductor chip manufacturing as recited in claim 2, wherein: the two sides the montant bottom of L shape clamp pole (12) is all fixedly connected with pinion rack (11), both sides the inboard meshing of pinion rack (11) is connected with fluted disc (10), the top middle part fixed connection of fluted disc (10) is in the bottom of output rod (8).
5. The dispensing mechanism for semiconductor chip manufacturing as recited in claim 1, wherein: one end fixedly connected with backup pad (18) of processing platform (1), the top fixedly connected with connecting plate (19) of backup pad (18), the adjustment tank has been seted up at the middle part of connecting plate (19), the inside rotation in adjustment tank is connected with screw rod (20).
6. The dispensing mechanism for semiconductor chip manufacturing as recited in claim 5, wherein: the rod body outside threaded connection of screw rod (20) has slider (21), the outside sliding connection of slider (21) is in the inside of adjustment tank, the bottom fixedly connected with hydraulic rod (23) of slider (21), the bottom fixedly connected with point gum machine (24) of hydraulic rod (23).
7. The dispensing mechanism for semiconductor chip manufacturing as recited in claim 5, wherein: one end of the screw rod (20) penetrates through the connecting plate (19) and the supporting plate (18) and is fixedly connected with the motor (22), and the shell of the motor (22) is fixedly connected with one end of the supporting plate (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321075928.7U CN220177364U (en) | 2023-05-08 | 2023-05-08 | Dispensing mechanism for semiconductor chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321075928.7U CN220177364U (en) | 2023-05-08 | 2023-05-08 | Dispensing mechanism for semiconductor chip production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220177364U true CN220177364U (en) | 2023-12-15 |
Family
ID=89108781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321075928.7U Active CN220177364U (en) | 2023-05-08 | 2023-05-08 | Dispensing mechanism for semiconductor chip production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220177364U (en) |
-
2023
- 2023-05-08 CN CN202321075928.7U patent/CN220177364U/en active Active
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