CN112309951A - Semiconductor device paster device - Google Patents
Semiconductor device paster device Download PDFInfo
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- CN112309951A CN112309951A CN202011115625.4A CN202011115625A CN112309951A CN 112309951 A CN112309951 A CN 112309951A CN 202011115625 A CN202011115625 A CN 202011115625A CN 112309951 A CN112309951 A CN 112309951A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the field of semiconductor devices, in particular to a semiconductor device chip mounting device which comprises a base, a workbench, two lifting mechanisms, two clamping mechanisms, two lifting mechanisms, two moving mechanisms, four chip mounting moving mechanisms and chip mounting mechanisms, wherein the workbench is fixedly arranged above the base, the two lifting mechanisms are symmetrically and fixedly arranged on one side of the workbench, the two clamping mechanisms are respectively and fixedly connected with one lifting mechanism, the two moving mechanisms are arranged on the workbench, the four lifting mechanisms are arranged, the four lifting mechanisms are symmetrically arranged on one side of the workbench in pairs, the chip mounting moving mechanisms are arranged between the two moving mechanisms, the chip mounting mechanisms are fixedly arranged below the chip mounting moving mechanisms, and the problem of position deviation during chip mounting and the chip mounting efficiency are improved through the matching of the upper parts And accuracy.
Description
Technical Field
The invention relates to the field of semiconductor devices, in particular to a semiconductor device surface mounting device.
Background
Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. The semiconductor material of the semiconductor device is silicon, germanium or gallium arsenide, and can be used as a material for a rectifier, an oscillator, a light emitter, an amplifier, a photodetector, or the like.
At present, the paster of the semiconductor device is mostly processed by the manual work, the manual work is carried out for a long time for paster operation, big errors are easily generated, the paster of the semiconductor device is irregular, the semiconductor device is generally manually fixed when the paster, and the position deviation easily occurs when the manual work is used for fixing the semiconductor for a long time, so that the paster is mistakenly generated.
Disclosure of Invention
The invention aims to solve the technical problems that manual long-time surface mounting is easy to cause irregular surface mounting of a semiconductor device and position offset is easy to occur in semiconductor fixing.
In order to solve the technical problems, the invention provides the following technical scheme: a semiconductor device chip mounting device comprises a base, a workbench, a lifting mechanism, a clamping mechanism, a moving mechanism, a lifting mechanism, a chip mounting moving mechanism and a chip mounting mechanism, the base is arranged on the ground, the workbench is fixedly arranged above the base, the two lifting mechanisms are symmetrically arranged on one side of the workbench and are respectively and fixedly connected with the workbench, the two clamping mechanisms are respectively and fixedly connected with a lifting mechanism, the number of the moving mechanisms is two, the two moving mechanisms are arranged on the workbench, the number of the lifting mechanisms is four, the four lifting mechanisms are symmetrically arranged on one side of the workbench in pairs, the patch moving mechanism is arranged between the two moving mechanisms, and the patch mechanism is fixedly arranged below the patch moving mechanism.
Further, the base is rectangular, four support columns are arranged below the base, and the four support columns are symmetrically and fixedly arranged below the base.
Further, the workstation is the rectangle, the fixed top that sets up at the base of workstation, the workstation top is provided with four backup pads, four two bisymmetry settings of backup pad are on the workstation, four the shifting chute has all been seted up in the backup pad.
Furthermore, each lifting mechanism comprises a lifting bottom plate, a lifting top plate, a lifting moving plate, a lifting screw rod, a lifting auxiliary screw rod and a lifting motor, the lifting bottom plate is fixedly arranged at one side of the workbench, the lifting top plate is correspondingly arranged above the lifting bottom plate, the lifting moving plate is arranged between the lifting bottom plate and the lifting top plate, one end of the lifting screw rod is connected with one side of the lifting top plate, the other end of the lifting screw rod penetrates through the lifting moving plate to be rotationally connected with the lifting bottom plate, two lifting auxiliary screw rods are arranged on one side of each lifting screw rod respectively and are fixedly connected with the lifting bottom plate, the lifting motor is fixedly arranged above the lifting top plate, and the output end of the lifting motor is fixedly connected with one end of the lifting screw rod.
Further, each clamping mechanism comprises a telescopic cylinder, a telescopic rod, a telescopic plate, two adjusting parts and a clamping part, the telescopic cylinder is fixedly arranged on one side of the lifting movable plate, one end of the telescopic rod is fixedly connected with the output end of the telescopic cylinder, the telescopic plate is arranged on one side of the telescopic rod, the other end of the telescopic rod is fixedly connected with one side of the telescopic plate, the adjusting part is fixedly arranged on one side of the telescopic plate, the clamping part is fixedly arranged on one side of the adjusting part, the adjusting part comprises an adjusting fixed plate, an adjusting shaft and an adjusting motor, the adjusting fixed plates are provided with two adjusting fixed plates, the two adjusting fixed plates are symmetrically and fixedly arranged on the telescopic plate, the adjusting plate is arranged between the two adjusting fixed plates, and the adjusting shaft penetrates through the adjusting plate and is connected with the two adjusting fixed plates, the adjusting motor is fixedly arranged on one side of the adjusting fixed plate, the output end of the adjusting motor is fixedly connected with one end of the adjusting shaft, the clamping component comprises a clamping cylinder, a clamping seat, a moving shaft, a clamping push plate, a clamping fixed shaft, a clamping moving plate and a chuck, the clamping cylinder is fixedly arranged on one side of the adjusting plate, the clamping seat is arranged on one side of the clamping cylinder, sliding grooves are formed in two sides of the clamping seat, one end of the moving shaft is fixedly connected with the output end of the clamping cylinder, the other end of the moving shaft penetrates through the clamping seat, two grooves are symmetrically formed in the other end of the moving shaft, the clamping push plate is arranged on one side of the moving shaft, the two clamping plates are symmetrically arranged on one side of the clamping push plate, and the clamping fixed shaft is fixedly connected with the two grooves, the clamping movable plates are provided with two clamping movable plates which are respectively arranged in the sliding grooves, push plate sliding grooves are formed in the two clamping movable plates, the clamping push plates are in sliding fit with the two clamping movable plates, the number of the chucks is two, and the two chucks are respectively fixedly connected with the one clamping movable plate.
Further, each moving mechanism comprises a moving block, a moving rod, a translation block, a moving gear, a moving motor and a rack seat, two moving blocks are arranged and are arranged in a moving groove on one supporting plate in a sliding manner, two moving rods are arranged and are symmetrically arranged on a moving block, the two moving rods are fixedly connected with the moving block, the translation block is arranged on the two moving rods in a sliding manner, a translation groove is arranged on the translation block, the moving gear is arranged in the translation groove, the moving motor is arranged at one side of the translation block, the output end of the moving motor is fixedly connected with the moving gear, the rack seat is arranged below the movable gear and fixedly connected with one of the movable blocks, and the rack seat is meshed with the movable gear.
Furthermore, four rising mechanisms are respectively arranged on one side of a supporting plate, each rising mechanism comprises a rising fixed plate, a rising movable plate, a rising screw rod and a rising motor, the rising fixed plate is fixedly arranged at one end of the supporting plate, the rising movable plate is arranged on one side of the supporting plate, one end of the rising screw rod is rotatably connected with one side of the rising fixed plate, the rising motor is fixedly arranged at the other end of the supporting plate, and the other end of the rising screw rod penetrates through the rising movable plate and is fixedly connected with the output end of the rising motor.
Further, paster moving mechanism includes paster fixed plate, paster movable plate, paster fixing base, paster lead screw and paster motor, the paster fixed plate sets up two between the translation piece, paster fixed plate and a translation piece fixed connection, two paster movable plate grooves have been seted up to the symmetry on the paster fixed plate, the paster movable plate slides and sets up two the paster movable plate inslot, the paster fixing base sets up on a translation piece, the paster lead screw sets up the one side at the paster fixing base, the one end of paster lead screw with the paster fixing base rotates to be connected, the paster motor is fixed to be set up another on the translation piece, the other end of paster lead screw runs through the paster movable plate with the output fixed connection of paster motor.
Further, paster mechanism includes paster bottom plate, paster rotating electrical machines and paster ware, the paster bottom plate with paster movable plate fixed connection, the paster rotating electrical machines is fixed to be set up on the paster bottom plate, the paster ware is fixed to be set up on the output of paster rotating electrical machines.
Compared with the prior art, the invention has the beneficial effects that:
the clamping mechanism comprises a clamping component, a moving shaft, a clamping fixed shaft, a clamping push plate, a clamping moving plate, a clamping base, a clamping cylinder and a clamping moving plate, wherein the clamping cylinder is arranged on the clamping component, the moving shaft is enabled to push the clamping fixed shaft, the clamping fixed shaft is matched with the clamping plate, the clamping push plate is enabled to move on the clamping moving plate, the clamping moving plate slides in a groove in the clamping base, and meanwhile the clamping moving plate drives a chuck to.
Secondly, through cooperation between moving mechanism, the mechanism that rises and the paster moving mechanism can automatically regulated paster mechanism's height and position, make paster mechanism can carry out the paster to the semiconductor device that clamping mechanism clamped more easily and handle, improved the efficiency of paster.
Thirdly, the paster mechanism can carry out paster to the most semiconductor device automatically, has solved the artifical condition that the paster error appears in long-time work, has improved the quality and the efficiency of paster.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic overall perspective view of the present invention;
FIG. 2 is a partial perspective view of the present invention;
FIG. 3 is a schematic perspective view of the lifting mechanism and clamping mechanism of the present invention;
FIG. 4 is a schematic perspective view of an adjustment member and a clamping member of the present invention;
FIG. 5 is a perspective view of the moving mechanism and the patch moving mechanism of the present invention;
fig. 6 is a schematic perspective view of a mounting mechanism.
The reference numbers in the figures are: base 1, support column 101, table 2, support plate 201, moving groove 2011, lifting mechanism 3, lifting bottom plate 31, lifting top plate 32, lifting moving plate 33, lifting screw 34, lifting auxiliary screw 35, lifting motor 36, clamping mechanism 4, air shrinkage cylinder 41, telescopic rod 42, telescopic plate 43, adjusting part 44, adjusting fixing plate 441, adjusting plate 442, adjusting shaft 443, adjusting motor 444, clamping part 45, clamping cylinder 451, clamping seat 452, sliding groove 4521, moving shaft 453, recess 4531, clamping push plate 46, push plate sliding groove 461, clamping plate 47, clamping fixing shaft 48, clamping moving plate 49, clamping head 410, moving mechanism 5, moving block 51, moving rod 52, translation block 53, translation groove 54, moving gear 55, moving motor 56, rack seat 57, lifting mechanism 6, lifting fixing plate 61, lifting moving plate 62, lifting screw 63, lifting motor 64, The chip mounting device comprises a chip mounting moving mechanism 7, a chip mounting fixing plate 71, a chip mounting moving plate 72, a chip mounting moving plate slot 721, a chip mounting fixing seat 73, a chip mounting screw rod 74, a chip mounting motor 75, a chip mounting mechanism 8, a chip mounting bottom plate 81, a chip mounting rotating motor 82 and a chip mounting device 83.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 6, a semiconductor device mounting device includes a base 1, a worktable 2, two lifting mechanisms 3, two clamping mechanisms 4, two moving mechanisms 5, two lifting mechanisms 6, a mounting moving mechanism 7 and a mounting mechanism 8, wherein the base 1 is disposed on the ground, the worktable 2 is fixedly disposed above the base 1, the two lifting mechanisms 3 are symmetrically disposed at one side of the worktable 2, the two lifting mechanisms 3 are respectively and fixedly connected with the worktable 2, the lifting mechanisms 3 are used for moving the clamping mechanisms 4, the clamping mechanisms 4 are provided with two, the two clamping mechanisms 4 are respectively and fixedly connected with the lifting mechanisms 3, the clamping mechanisms 4 are used for clamping semiconductors, the moving mechanisms 5 are provided with two, the two moving mechanisms 5 are disposed on the worktable 2, the mobile mechanism 5 is used for enabling the patch mobile mechanism 7 to move, the lifting mechanisms 6 are four, four the lifting mechanisms 6 are symmetrically arranged on one side of the workbench 2 in pairs, the lifting mechanisms 6 are used for enabling the mobile mechanism 5 to move up and down, the patch mobile mechanisms 7 are arranged between the two mobile mechanisms 5, the patch mechanisms 8 are fixedly arranged below the patch mobile mechanisms 7, the patch mechanisms 8 are used for carrying out semiconductor device patch, the semiconductor devices can be automatically fixed through the clamping mechanisms 4, the problem of position deviation during patch is solved, patch can be automatically carried out through the patch device, and compared with manual patch, the efficiency and accuracy of a patch bar are improved.
The base 1 is the rectangle, base 1 below is provided with four support columns 101, four the fixed below that sets up at base 1 of two bisymmetry of support column 101, base 1 is used for supporting workstation 2. Workstation 2 is the rectangle, workstation 2 is fixed to be set up in the top of base 1, 2 tops of workstation are provided with four backup pads 201, four two bisymmetry settings of backup pad 201 are on workstation 2, four the shifting chute 2011 has all been seted up on the backup pad 201.
Each lifting mechanism 3 comprises a lifting bottom plate 31, a lifting top plate 32, a lifting moving plate 33, lifting screw rods 34, lifting auxiliary screw rods 35 and a lifting motor 36, the lifting bottom plate 31 is fixedly arranged at one side of the workbench 2, the lifting top plate 32 is correspondingly arranged above the lifting bottom plate 31, the lifting moving plate 33 is arranged between the lifting bottom plate 31 and the lifting top plate 32, one end of each lifting screw rod 34 is connected with one side of the lifting top plate 32, the other end of each lifting screw rod 34 penetrates through the lifting moving plate 33 to be rotatably connected with the lifting bottom plate 31, two lifting auxiliary screw rods 35 are arranged, the two lifting auxiliary screw rods 35 are respectively arranged at one side of each lifting screw rod 34, the two lifting auxiliary screw rods 35 are fixedly connected with the lifting bottom plate 31, and the lifting motor 36 is fixedly arranged above the lifting top plate 32, the output end of the lifting motor 36 is fixedly connected with one end of the lifting screw rod 34, and when the lifting motor 36 is started, the lifting screw rod 34 drives the lifting moving plate 33 to move up and down on the two lifting auxiliary screw rods 35, so that the clamping mechanism 4 can be moved conveniently.
Each clamping mechanism 4 comprises a telescopic cylinder 41, a telescopic rod 42, a telescopic plate 43, an adjusting part 44 and a clamping part 45, the telescopic cylinder 41 is fixedly arranged on one side of the lifting moving plate 33, one end of the telescopic rod 42 is fixedly connected with the output end of the telescopic cylinder 41, the telescopic plate 43 is arranged on one side of the telescopic rod 42, the other end of the telescopic rod 42 is fixedly connected with one side of the telescopic plate 43, the adjusting part 44 is fixedly arranged on one side of the telescopic plate 43, the clamping part 45 is fixedly arranged on one side of the adjusting part 44, the adjusting part 44 comprises an adjusting fixing plate 441, an adjusting plate 442, an adjusting shaft 443 and an adjusting motor 444, the adjusting fixing plates 441 are arranged in two numbers, the two adjusting fixing plates 441 are symmetrically and fixedly arranged on the telescopic plate 43, and the adjusting plate 442 is arranged between the two adjusting fixing plates 441, the adjusting shaft 443 penetrates through the adjusting plate 442 to be connected with two adjusting fixing plates 441, the adjusting motor 444 is fixedly arranged on one side of one adjusting fixing plate 441, an output end of the adjusting motor 444 is fixedly connected with one end of the adjusting shaft 443, the clamping member 45 comprises a clamping cylinder 451, a clamping seat 452, a moving shaft 453, a clamping push plate 46, a clamping plate 47, a clamping fixing shaft 48, a clamping moving plate 49 and a clamping head 410, the clamping cylinder 451 is fixedly arranged on one side of the adjusting plate 442, the clamping seat 452 is arranged on one side of the clamping cylinder 451, sliding grooves 4521 are formed in two sides of the clamping seat 452, one end of the moving shaft 453 is fixedly connected with the output end of the clamping cylinder 451, the other end of the moving shaft 453 penetrates through the clamping seat 452, two grooves 4531 are symmetrically formed in the other end of the moving shaft 453, the clamping push plate 46 is arranged at one side of the moving shaft 453, two clamping plates 47 are arranged, two clamping plates 47 are symmetrically arranged at one side of the clamping push plate 46, the clamping fixing shaft 48 penetrates through two grooves 4531 to be fixedly connected with the clamping plates 47, two clamping moving plates 49 are arranged, two clamping moving plates 49 are respectively arranged in one sliding groove 4521, push plate sliding grooves 461 are respectively arranged on the two clamping moving plates 49, the clamping push plate 46 is in sliding fit with the two clamping moving plates 49, two chucks 410 are arranged, the two chucks 410 are respectively and fixedly connected with one clamping moving plate 49, the clamping cylinder 451 pushes the moving shaft 453 to push the clamping fixing shaft 48, the clamping fixing shaft 48 is matched with the clamping plates 47, and the clamping push plate 46 is moved on the clamping moving plates 49, the clamping moving plate 49 slides in the groove 4531 of the clamping seat 452, and simultaneously the clamping moving plate 49 drives the chuck 410 to fix the semiconductor device, so that the semiconductor device can be stably fixed through the matching among the above parts, and compared with manual fixing, the semiconductor device fixing device is more convenient and stable.
Each moving mechanism 5 comprises two moving blocks 51, two moving rods 52, a translation block 53, two moving gears 55, two moving motors 56 and a rack seat 57, the two moving blocks 51 are arranged in a moving groove 2011 on one supporting plate 201 in a sliding manner, the two moving rods 52 are arranged on one moving block 51, the two moving rods 52 are symmetrically arranged on one moving block 51, the two moving rods 52 are fixedly connected with one moving block 51, the translation block 53 is arranged on the two moving rods 52 in a sliding manner, a translation groove 54 is formed in the translation block 53, the moving gear 55 is arranged in a translation groove 54, the moving motor 56 is arranged on one side of the translation block 53, the output end of the moving motor 56 is fixedly connected with the moving gear 55, the rack seat 57 is arranged below the moving gear 55, and the rack seat 57 is fixedly connected with one moving block 51, the rack seat 57 is meshed with the moving gear 55, when the moving motor 56 is started, the moving gear 55 moves on the rack seat 57, meanwhile, the translation blocks 53 move on the moving rods 52, and through the matching among the parts, the patch mechanism 8 can be effectively moved, so that the patch mechanism 8 can work better, and the patch efficiency is improved.
The four ascending mechanisms 6 are respectively arranged on one side of a supporting plate 201, each ascending mechanism 6 comprises an ascending fixed plate 61, an ascending moving plate 62, an ascending screw rod 63 and an ascending motor 64, the ascending fixed plate 61 is fixedly arranged at one end of the supporting plate 201, the ascending moving plate 62 is arranged on one side of the supporting plate 201, one end of the ascending screw rod 63 is rotatably connected with one side of the ascending fixed plate 61, the ascending motor 64 is fixedly arranged at the other end of the supporting plate 201, the other end of the ascending screw rod 63 penetrates through the ascending moving plate 62 and is fixedly connected with the output end of the ascending motor 64, and the ascending motor 64 is started to enable the ascending screw rod 63 to drive the ascending moving plate 62 to move.
The patch moving mechanism 7 comprises a patch fixing plate 71, a patch moving plate 72, a patch fixing seat 73, a patch lead screw 74 and a patch motor 75, wherein the patch fixing plate 71 is arranged between the two translation blocks 53, the patch fixing plate 71 is fixedly connected with one translation block 53, the patch fixing plate 71 is symmetrically provided with two patch moving plate grooves 721, the patch moving plate 72 is slidably arranged in the two patch moving plate grooves 721, the patch fixing seat 73 is arranged on one translation block 53, the patch lead screw 74 is arranged on one side of the patch fixing seat 73, one end of the patch lead screw 74 is rotatably connected with the patch fixing seat 73, the patch motor 75 is fixedly arranged on the other translation block 53, and the other end of the patch lead screw 74 penetrates through the patch moving plate 72 and is fixedly connected with the output end of the patch motor 75, when the patch motor 75 is started, the patch lead screw 74 drives the patch moving plate 72 to move in the patch moving groove 2011 on the patch fixing plate 71, and through the cooperation among the parts, the patch mechanism 8 can be moved more conveniently, so that the patch mechanism 8 can work better.
The chip mounting mechanism 8 comprises a chip mounting bottom plate 81, a chip mounting rotating motor 82 and a chip mounting device 83, the chip mounting bottom plate 81 is fixedly connected with the chip mounting moving plate 72, the chip mounting rotating motor 82 is fixedly arranged on the chip mounting bottom plate 81, the chip mounting device 83 is fixedly arranged on the output end of the chip mounting rotating motor 82, the chip mounting device 83 is used for carrying out chip mounting on a semiconductor device, the chip mounting device 83 is rotated by starting the chip mounting rotating motor 82, the semiconductor device can be automatically subjected to chip mounting through the matching among the components, the chip mounting error is avoided compared with manual chip mounting, and the working efficiency of the chip mounting is improved.
A semiconductor device paster device theory of operation: when the semiconductor device is to be mounted, the clamp 410 of the clamping mechanism 4 firstly fixes the semiconductor device, then when the lifting motor 36 is started, the lifting screw 34 drives the lifting moving plate 33, the lifting moving plate 33 drives the clamping mechanism 4 to adjust the position on the two lifting auxiliary screw rods 35, then the telescopic cylinder 41 on the clamping mechanism 4 makes the telescopic rod 42 push the clamping component 45 to move to the proper position, then the moving mechanism 5 and the lifting mechanism 6 are matched, so that the chip mounting mechanism 8 is adjusted to a proper position, then the position of the chip mounting mechanism 8 is adjusted by the chip mounting moving mechanism 7, then the chip mounting mechanism 8 carries out chip mounting on the semiconductor device fixed by the clamping mechanism 4, when the angle of the semiconductor device needs to be adjusted, the adjustment motor 444 is started to make the adjustment shaft 443 drive the adjustment plate 442, and the adjustment plate 442 drives the clamping member 45 to adjust the angle.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A semiconductor device paster device is characterized by comprising a base (1), a workbench (2), lifting mechanisms (3), clamping mechanisms (4), moving mechanisms (5), a lifting mechanism (6), a paster moving mechanism (7) and a paster mechanism (8), wherein the base (1) is arranged on the ground, the workbench (2) is fixedly arranged above the base (1), the two lifting mechanisms (3) are arranged, the two lifting mechanisms (3) are symmetrically arranged on one side of the workbench (2), the two lifting mechanisms (3) are respectively and fixedly connected with the workbench (2), the two clamping mechanisms (4) are respectively and fixedly connected with one lifting mechanism (3), the two moving mechanisms (5) are respectively arranged on the workbench (2), the four lifting mechanisms (6) are arranged, the four lifting mechanisms (3) are symmetrically arranged on one side of the workbench (2) in pairs, the patch moving mechanisms (7) are arranged between the two moving mechanisms (5), and the patch mechanisms (8) are fixedly arranged below the patch moving mechanisms (7).
2. The semiconductor device chip device according to claim 1, wherein the base (1) is rectangular, four supporting columns (101) are arranged below the base (1), and the four supporting columns (101) are symmetrically and fixedly arranged below the base (1) in pairs.
3. The semiconductor device chip mounting device according to claim 2, wherein the workbench (2) is rectangular, the workbench (2) is fixedly arranged above the base (1), four support plates (201) are arranged above the workbench (2), the four support plates (201) are symmetrically arranged on the workbench (2) in pairs, and moving grooves (2011) are formed in the four support plates (201).
4. The semiconductor device mounting device according to claim 1, wherein each of the lifting mechanisms (3) comprises a lifting bottom plate (31), a lifting top plate (32), a lifting moving plate (33), a lifting screw (34), two lifting auxiliary screws (35) and a lifting motor (36), the lifting bottom plate (31) is fixedly arranged at one side of the worktable (2), the lifting top plate (32) is correspondingly arranged above the lifting bottom plate (31), the lifting moving plate (33) is arranged between the lifting bottom plate (31) and the lifting top plate (32), one end of each lifting screw (34) is connected with one side of the lifting top plate (32), the other end of each lifting screw (34) penetrates through the lifting moving plate (33) to be rotatably connected with the lifting bottom plate (31), and two lifting auxiliary screws (35) are arranged, two supplementary lead screw (35) of going up and down set up respectively one side of lift lead screw (34), two supplementary lead screw (35) of going up and down and lifting bottom plate (31) fixed connection, elevator motor (36) are fixed to be set up in the top of lift roof (32), the output of elevator motor (36) and the one end fixed connection of lift lead screw (34).
5. The semiconductor device chip mounting device according to claim 1, wherein each clamping mechanism (4) comprises a telescopic cylinder (41), a telescopic rod (42), a telescopic plate (43), an adjusting component (44) and a clamping component (45), the telescopic cylinder (41) is fixedly arranged on one side of the lifting moving plate (33), one end of the telescopic rod (42) is fixedly connected with the output end of the telescopic cylinder (41), the telescopic plate (43) is arranged on one side of the telescopic rod (42), the other end of the telescopic rod (42) is fixedly connected with one side of the telescopic plate (43), the adjusting component (44) is fixedly arranged on one side of the telescopic plate (43), the clamping component (45) is fixedly arranged on one side of the adjusting component (44), and the adjusting component (44) comprises an adjusting fixing plate (441), an adjusting plate (442) and a clamping component (45), The adjusting device comprises adjusting shafts (443) and adjusting motors (444), two adjusting fixing plates (441) are arranged, the two adjusting fixing plates (441) are symmetrically and fixedly arranged on a telescopic plate (43), the adjusting plate (442) is arranged between the two adjusting fixing plates (441), the adjusting shafts (443) penetrate through the adjusting plates (442) and are connected with the two adjusting fixing plates (441), the adjusting motors (444) are fixedly arranged on one side of one adjusting fixing plate (441), the output ends of the adjusting motors (444) are fixedly connected with one end of the adjusting shaft (443), the clamping part (45) comprises a clamping cylinder (451), a clamping seat (452), a moving shaft (453), a clamping push plate (46), a clamping plate (47), a clamping fixing shaft (48), a clamping moving plate (49) and a clamping head (410), and the clamping cylinder (451) is fixedly arranged on one side of the adjusting plate (442), the clamping seat (452) is arranged on one side of a clamping cylinder (451), sliding grooves (4521) are formed in two sides of the clamping seat (452), one end of a moving shaft (453) is fixedly connected with the output end of the clamping cylinder (451), the other end of the moving shaft (453) penetrates through the clamping seat (452), two grooves (4531) are symmetrically formed in the other end of the moving shaft (453), a clamping push plate (46) is arranged on one side of the moving shaft (453), two clamping plates (47) are arranged, the two clamping plates (47) are symmetrically arranged on one side of the clamping push plate (46), the clamping fixing shaft (48) penetrates through the two grooves (4531) and is fixedly connected with the clamping plates (47), two clamping moving plates (49) are arranged, and the two clamping moving plates (49) are respectively arranged in one sliding groove (4521), push plate sliding grooves (461) are formed in the two clamping moving plates (49), the clamping push plates (46) are in sliding fit with the two clamping moving plates (49), the number of the clamping heads (410) is two, and the two clamping heads (410) are respectively fixedly connected with the one clamping moving plate (49).
6. The semiconductor device chip mounting device according to claim 3, wherein each of the moving mechanisms (5) comprises two moving blocks (51), two moving rods (52), two translation blocks (53), two moving gears (55), a moving motor (56) and a rack holder (57), the two moving blocks (51) are slidably disposed in a moving groove (2011) of one of the support plates (201), the two moving rods (52) are symmetrically disposed on one moving block (51), the two moving rods (52) are fixedly connected with one moving block (51), the two translation blocks (53) are slidably disposed on the two moving rods (52), the translation block (53) is provided with a translation groove (54), and the moving gear (55) is disposed in a translation groove (54), the moving motor (56) is arranged on one side of the translation block (53), the output end of the moving motor (56) is fixedly connected with the moving gear (55), the rack seat (57) is arranged below the moving gear (55), the rack seat (57) is fixedly connected with one moving block (51), and the rack seat (57) is meshed with the moving gear (55).
7. The semiconductor device mounting device according to claim 6, wherein four of the lifting mechanisms (6) are respectively disposed on one side of a supporting plate (201), each of the lifting mechanisms (6) comprises a lifting fixing plate (61), a lifting moving plate (62), a lifting screw (63) and a lifting motor (64), the lifting fixing plate (61) is fixedly disposed on one end of the supporting plate (201), the lifting moving plate (62) is disposed on one side of the supporting plate (201), one end of the lifting screw (63) is rotatably connected with one side of the lifting fixing plate (61), the lifting motor (64) is fixedly disposed on the other end of the supporting plate (201), and the other end of the lifting screw (63) penetrates through the lifting moving plate (62) and is fixedly connected with an output end of the lifting motor (64).
8. The semiconductor device mounting device according to claim 7, wherein the mounting moving mechanism (7) comprises a mounting fixing plate (71), a mounting moving plate (72), a mounting fixing seat (73), a mounting screw (74) and a mounting motor (75), the mounting fixing plate (71) is disposed between the two translation blocks (53), the mounting fixing plate (71) is fixedly connected with one translation block (53), the mounting fixing plate (71) is symmetrically provided with two mounting moving plate slots (721), the mounting moving plate (72) is slidably disposed in the two mounting moving plate slots (721), the mounting fixing seat (73) is disposed on one translation block (53), the mounting screw (74) is disposed on one side of the mounting fixing seat (73), one end of the mounting screw (74) is rotatably connected with the mounting fixing seat (73), the patch motor (75) is fixedly arranged on the other translation block (53), and the other end of the patch lead screw (74) penetrates through the patch moving plate (72) and is fixedly connected with the output end of the patch motor (75).
9. The semiconductor device chip mounting device according to claim 8, wherein the chip mounting mechanism (8) comprises a chip mounting plate (81), a chip mounting rotating motor (82) and a chip mounting device (83), the chip mounting plate (81) is fixedly connected with the chip mounting moving plate (72), the chip mounting rotating motor (82) is fixedly arranged on the chip mounting plate (81), and the chip mounting device (83) is fixedly arranged at an output end of the chip mounting rotating motor (82).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011115625.4A CN112309951A (en) | 2020-10-19 | 2020-10-19 | Semiconductor device paster device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011115625.4A CN112309951A (en) | 2020-10-19 | 2020-10-19 | Semiconductor device paster device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112309951A true CN112309951A (en) | 2021-02-02 |
Family
ID=74327711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011115625.4A Withdrawn CN112309951A (en) | 2020-10-19 | 2020-10-19 | Semiconductor device paster device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112309951A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113103114A (en) * | 2021-04-17 | 2021-07-13 | 朱可欣 | Electric power fastener surface treatment device |
| CN114309313A (en) * | 2022-01-08 | 2022-04-12 | 安徽精晟模具有限公司 | Efficient movable mold forming device and using method thereof |
-
2020
- 2020-10-19 CN CN202011115625.4A patent/CN112309951A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113103114A (en) * | 2021-04-17 | 2021-07-13 | 朱可欣 | Electric power fastener surface treatment device |
| CN114309313A (en) * | 2022-01-08 | 2022-04-12 | 安徽精晟模具有限公司 | Efficient movable mold forming device and using method thereof |
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Application publication date: 20210202 |