CN219876286U - ESD PAD structure of PCB board - Google Patents

Abstract

The utility model discloses an ESD PAD structure of a PCB, which comprises a PAD copper foil arranged on the surface of the PCB; at least one empty window area is arranged in the pad copper foil to separate the copper foils, and the separated copper foils are connected with each other. According to the utility model, the copper foil is separated through the empty window area, the tension of the copper foil is obviously weakened after the tension of the copper foil is reduced, the tension of the copper foil of the PAD is carried out on the PCB by static electricity, the problem of dishing in the production process is solved, the manufacturability of the PCB is improved, the problem that the expansion of copper and resin is inconsistent when the PCB is heated in the SMT stage is slowed down from the structural design, the flatness of the PCB surface is further improved, and the rejection rate is reduced.

Description

ESD PAD structure of PCB board

Technical Field

The utility model relates to the technical field of PCB bonding PADs, in particular to an ESD PAD structure of a PCB.

Background

A PCB is generally referred to as a circuit board, an Integrated Circuit (IC) is soldered on the PCB, and the PCB is a carrier of the Integrated Circuit (IC), so the PCB is also referred to as an integrated circuit board. The ESD PAD is an ESD electrostatic receiving PAD, and has the main functions of magnetic conduction or electrostatic conduction to prevent the component IC from being burnt out due to instant static electricity, and the ESD PAD is arranged on the surface of the PCB and is a PCB PAD. The PCB board containing the design of ESD electrostatic bearing PAD is widely applied to the field of electronic products, in particular to a touch PAD in a notebook computer.

At present, as shown in fig. 1, in the Layout of an integrated circuit board, an ESD PAD structure is usually designed to be a fully covered copper foil, that is, the copper foil is covered in the whole PAD, and in the actual production process, there is a problem that the tension is uneven due to the difference of the thermal expansion coefficients of the copper foil and resin, so that the problem that the other surface of the PCB corresponding to the generated PAD is concave, thereby affecting the flatness of the surface of the PCB.

Disclosure of Invention

The utility model aims to provide an ESD PAD structure of a PCB, improve ESD function PAD, solve the problem of sinking in the production process of the PCB and improve the flatness of the PCB.

In order to achieve the above purpose, the following technical scheme is adopted:

an ESD PAD structure of a PCB board comprises a PAD copper foil arranged on the surface of the PCB board; at least one empty window area is arranged in the pad copper foil to separate the copper foils, and the separated copper foils are connected with each other.

Preferably, the residual copper area in the pad copper foil accounts for more than 70% of the total pad copper foil area.

Preferably, the pad copper foil comprises a plurality of copper blocks separated by empty window areas, and the adjacent copper blocks are connected through at least one copper connecting arm.

Preferably, the pad copper foil comprises a plurality of copper lines connected with each other, and a plurality of empty window areas are formed among the copper lines.

Preferably, the edge of the pad copper foil is a closed copper edge structure.

By adopting the scheme, the utility model has the beneficial effects that:

because the PCB recess at the corresponding position of the PAD copper foil and the tension of the copper foil form a positive relation, the copper foil is separated through the hollow window area, the tension of the copper foil is obviously weakened after the tension of the copper foil is reduced, the tension of the copper foil of the electrostatic bearing PAD of the PCB can be effectively improved, the recess problem in the production process is solved, the manufacturability of the PCB is improved, the problem that the expansion of copper and resin is inconsistent when the PCB is heated in the SMT stage is relieved from the structural design, the flatness of the PCB surface is further improved, and the rejection rate is reduced.

Drawings

FIG. 1 is a prior art schematic diagram of the present utility model;

FIG. 2 is a schematic diagram of a circuit board structure according to an embodiment 1 of the present utility model;

FIG. 3 is a schematic diagram of a pad copper foil structure according to embodiment 1 of the present utility model;

fig. 4 is a schematic diagram of a circuit board structure according to embodiment 2 of the present utility model;

FIG. 5 is a schematic diagram of a pad copper foil structure according to embodiment 2 of the present utility model;

wherein, the attached drawings mark and illustrate:

1-a PCB board, 2-a pad copper foil,

3-hollow window area, 4-copper block,

5-copper connecting arm, 6-copper line,

7-copper edge.

Detailed Description

The utility model will be described in detail below with reference to the drawings and the specific embodiments.

Referring to fig. 1 to 5, the present utility model provides an ESD PAD structure of a PCB board, comprising a PAD copper foil 2 disposed on a surface of a PCB board 1; at least one empty window area 3 is arranged in the pad copper foil 2 to separate the copper foils, the separated copper foils are connected with each other, and the copper foils in the pad copper foil 2 are required to be connected with each other so as to achieve the function of leading out static electricity.

When the touch PCB 1 is produced, as the PAD copper foil 2 designed by ESD electrostatic bearing PAD is shown in figure 1, the whole PAD is covered with the copper foil, so that serious sinking problems occur in the production process, and the sinking problems are improved under the condition that the electric performance and SMT soldering tin property are not affected after the ESD PAD structure is designed. Through repeated design and test of various schemes, the design of the empty window area 3 in the pad copper foil 2 is finally obtained to separate the copper foils, and the obtained PCB 1 has good flatness and no recess.

The edge of the bonding pad copper foil 2 is designed to be of a closed copper edge 7 structure, so that the connection reliability of the separated copper foil is ensured, and the bonding pad copper foil is attractive. The area of the residual copper in the pad copper foil 2 is more than 70% of the area of the whole pad copper foil 2, and the residual copper refers to copper foil in other areas in the pad copper foil 2 after the empty window area 3 is opened in the pad copper foil 2. The whole area of the pad copper foil 2 is the sum of the area occupied by all the empty window areas 3 and the area occupied by the residual copper.

Example 1:

with continued reference to fig. 2 to 3, the pad copper foil 2 includes a plurality of copper blocks 4 separated by the hollow window region 3, and the adjacent copper blocks 4 are connected by at least one copper connecting arm 5.

The copper foil is divided into a plurality of copper blocks 4, a substrate gap (empty window area 3) of 15mil is formed between the adjacent copper blocks 4, and the copper blocks 4 and 4 are connected by a copper connecting arm 5 with a line width of 6mil, so that the copper foil is divided as much as possible on the premise of ensuring conductivity, thereby achieving the aims of reducing the copper foil tension and improving the dishing problem.

In this embodiment, the shape design and size of the hollow window region 3 are not limited, and a pattern may be etched. The residual copper area in the pad copper foil 2 occupies more than 70% of the whole area of the pad copper foil 2, so that the function of the pad can be better ensured.

Example 2:

with continued reference to fig. 4 to 5, the pad copper foil 2 includes a plurality of copper lines 6 connected to each other, and a plurality of empty window regions 3 are formed between the plurality of copper lines 6. The copper foil is divided into a plurality of copper lines 6, and the tension of the copper foil is dispersed on the premise of ensuring conductivity and tin soldering property, so that the tension of the copper foil is reduced, and the problem of dishing is solved.

In this embodiment, the copper lines 6 are connected and distributed horizontally and vertically to form a hollow grid, and the shape and size of the hollow grid are not limited, so that a pattern can be etched. The residual copper area in the pad copper foil 2 occupies more than 70% of the whole area of the pad copper foil 2, so that the function of the pad can be better ensured.

The foregoing description of the preferred embodiment of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (5)

1. The ESD PAD structure of the PCB board is characterized by comprising a PAD copper foil arranged on the surface of the PCB board; at least one empty window area is arranged in the pad copper foil to separate the copper foils, and the separated copper foils are connected with each other.

2. The ESD PAD structure of the PCB of claim 1, wherein the residual copper area in the PAD copper foil is more than 70% of the total PAD copper foil area.

3. The ESD PAD structure of the PCB of claim 2, wherein the PAD copper foil comprises a plurality of copper blocks separated by empty window regions, and adjacent copper blocks are connected by at least one copper connecting arm.

4. The ESD PAD structure of the PCB of claim 2, wherein the PAD copper foil comprises a plurality of copper lines connected to each other, a plurality of empty window areas being formed between the plurality of copper lines.

5. The ESD PAD structure of a PCB of claim 3 or 4, wherein the edge of the PAD copper foil is a closed copper edge structure.