CN212393048U

CN212393048U - Circuit board with large contact area metal finger

Info

Publication number: CN212393048U
Application number: CN202020807278.0U
Authority: CN
Inventors: 陈定红
Original assignee: Changzhou Aohong Electronics Co ltd
Current assignee: Changzhou Aohong Electronics Co ltd
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2021-01-22
Anticipated expiration: 2030-05-15

Abstract

The utility model discloses a circuit board with large contact area metal finger, including circuit board basic unit, connecting portion, solder mask and alloy protective layer, connecting portion are located the right-hand member of circuit board basic unit, the solder mask is installed at the upper surface of circuit board basic unit, the alloy protective layer is installed above the solder mask on connecting portion, be equipped with metal finger connection structure on the connecting portion; the utility model relates to a circuit board technical field, the present case design is inside to inlay the dress in the middle of the nickel coating through the gilt layer, both can improve area of contact, can guarantee good contact conductivity nature again, and great improvement usage space has also saved the cost, and can improve anti-oxidant and corrosion resisting property through the inside alloy protection layer that is equipped with.

Description

Circuit board with large contact area metal finger

Technical Field

The utility model relates to a circuit board technical field specifically is a circuit board with big area of contact metal finger.

Background

In the field of circuit boards, a golden finger is often arranged on a circuit board which is provided with electronic components such as a memory bar, a display card, a network card and the like and is used as a connecting part between the circuit board and a slot, the golden finger consists of a plurality of golden conductive contact pieces, and the golden finger is formed by gold plating on the surface of the golden finger and arranging the conductive contact pieces in a finger shape, so that the golden finger circuit board is called as a golden finger circuit board.

SUMMERY OF THE UTILITY MODEL

The circuit board with the large contact area metal finger solves the existing defects, the existing circuit board with the small contact area has poor conductive contact performance, can not conduct electricity well, and is single in protection of the circuit and can not protect the circuit well.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a circuit board with a large-contact-area metal finger comprises a circuit board base layer, a connecting part, a solder mask and an alloy protective layer, wherein the connecting part is positioned at the right end of the circuit board base layer;

the metal finger connection structure includes: a first section, a second section, a nickel plating layer, a gold plating layer and a groove;

the first section and the second section are respectively arranged on the left side and the right side of the connecting part, the gold plating layer is embedded in the middle of the nickel plating layer, the nickel plating layer and the gold plating layer are both arranged above the first section and the second section, and the groove is formed in the middle of the second section and the second section.

Preferably, the height of the gold plating layer is higher than that of the nickel plating layer.

Preferably, the corners of the first section and the second section are in arc transition.

Preferably, the nickel plating layer and the gold plating layer are at a distance of 1-2mm from the edge of the connecting portion.

Preferably, the alloy protective layer is coated or plated over a surface of the solder resist layer.

Preferably, a flame retardant layer and a heat dissipation layer are sequentially arranged below the bottom of the circuit board substrate.

Advantageous effects

The utility model provides a circuit board with big area of contact metal finger. The novel nickel plating device has the advantages that the novel nickel plating device is designed to be internally embedded in the nickel plating layer through the gold plating layer, so that the contact area can be increased, good contact conductivity can be guaranteed, the use space is greatly increased, the cost is saved, the oxidation resistance and the corrosion resistance can be improved through the internally-arranged alloy protection layer, the use time is prolonged, the service life is prolonged, and the reliability is high.

Drawings

Fig. 1 is a schematic view of a top view structure of a circuit board with a large contact area metal finger according to the present invention.

Fig. 2 is a left side view structural diagram of a circuit board with a large contact area metal finger according to the present invention.

Fig. 3 is a schematic view of the structure of the circuit board with large contact area metal fingers according to the present invention.

In the figure: 1-circuit board base layer; 2-a connecting part; 3-a solder mask layer; 4-an alloy protective layer; 5-first stage; 6-a second stage; 7-nickel plating; 8-gold plating; 9-a groove; 10-a flame retardant layer; 11-heat sink layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a circuit board with a large-contact-area metal finger comprises a circuit board base layer 1, a connecting part 2, a solder mask layer 3 and an alloy protective layer 4, wherein the connecting part 2 is positioned at the right end of the circuit board base layer 1, the solder mask layer 3 is installed on the upper surface of the circuit board base layer 1, the alloy protective layer 4 is installed above the solder mask layer 3 on the connecting part 2, and a metal finger connecting structure is arranged on the connecting part 2;

it should be noted that, by those skilled in the art, the components in the present application are sequentially connected, and specific connection and operation sequence thereof should be referred to the following working principle, the detailed connection means is a technique known in the art, and the following description mainly describes the working principle and process, the circuit board base layer 1 is used as the main body of the circuit board, the connection part 2 is used for the end part of the circuit board for connecting with other parts, the solder mask layer 3 is arranged on the upper surface of the circuit board base layer 1, the component is used for protecting the circuit board base layer 1, the alloy protective layer 4 is arranged above the solder mask layer 3 on the connecting part 2, the circuit board is used for improving the wear resistance of the circuit board, enabling the application reliability of products to be higher, the connecting portion 2 is provided with the metal finger connecting structure, and the metal finger connecting structure is used for increasing the contact area, enabling contact to be more sufficient, and guaranteeing good conductivity.

Metal finger connection structure includes: a first section 5, a second section 6, a nickel-plated layer 7, a gold-plated layer 8 and a groove 9;

the first section 5 and the second section 6 are respectively arranged at the left side and the right side of the connecting part 2, the gold plating layer 8 is embedded in the middle of the nickel plating layer 7, the nickel plating layer 7 and the gold plating layer 8 are both arranged above the first section 5 and the second section 6, and the groove 9 is arranged at the middle position of the second section 6 and the second section 6;

it should be noted that the gold fingers are connected in two sections, the gold-plated layer 8 is embedded in the middle of the nickel-plated layer 7, and the nickel-plated layer 7 and the gold-plated layer 8 are both arranged above the first section 5 and the second section 6, so that the contact area is increased greatly, the conductivity is good, the cost is saved, and the groove 9 is arranged to facilitate connection and fixation.

In the specific implementation process, further, the height of the gold plating layer 8 is higher than that of the nickel plating layer 7, so that the gold plating layer 8 can be contacted first, and the contact performance is higher.

In the specific implementation process, furthermore, the corners of the first section 5 and the second section 6 are in arc transition, and the arc transition is arranged to avoid tearing, breakage and other conditions during the assembly of the golden finger.

In the specific implementation process, furthermore, the distance between the nickel plating layer 7 and the gold plating layer 8 is 1-2mm from the edge of the connecting part, and the distance is set so as to effectively avoid the occurrence of burrs at the edge of the gold finger piece in the plugging process, avoid the gold finger from falling off and prolong the service life.

In the specific implementation, further, an alloy protective layer 4 is coated or plated over the surface of the solder resist layer 3.

In the specific implementation process, furthermore, a flame-retardant layer 10 and a heat dissipation layer 11 are sequentially arranged below the bottom of the circuit board base layer 1, the flame-retardant layer 10 and the heat dissipation layer 11 are arranged to improve the heat dissipation performance of the circuit board, and the service life of the circuit board is prolonged.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The circuit board with the large contact area metal finger comprises a circuit board base layer (1), a connecting part (2), a solder mask layer (3) and an alloy protective layer (4), and is characterized in that the connecting part (2) is positioned at the right end of the circuit board base layer (1), the solder mask layer (3) is installed on the upper surface of the circuit board base layer (1), the alloy protective layer (4) is installed above the solder mask layer (3) on the connecting part (2), and the connecting part (2) is provided with a metal finger connecting structure;

the metal finger connection structure includes: a first section (5), a second section (6), a nickel-plated layer (7), a gold-plated layer (8) and a groove (9);

the first section (5) and the second section (6) are arranged on the left side and the right side of the connecting portion (2) respectively, the gold-plated layer (8) is embedded in the middle of the nickel-plated layer (7), the nickel-plated layer (7) and the gold-plated layer (8) are arranged above the first section (5) and the second section (6), and the groove (9) is formed in the middle of the second section (6) and the second section (6).

2. A wiring board with a large contact area metal finger according to claim 1, characterized in that the gold-plated layer (8) has a higher height than the nickel-plated layer (7).

3. The circuit board with the metal fingers with the large contact area according to claim 1, wherein the corners of the first section (5) and the second section (6) are in arc transition.

4. A wiring board with a large contact area metal finger according to claim 1, characterized in that the nickel (7) and gold (8) plates are at a distance of 1-2mm from the edge of the connection portion.

5. A wiring board with a large contact area metal finger according to claim 1, characterized in that the alloy protection layer (4) is coated or electroplated above the surface of the solder mask layer (3).

6. The circuit board with the metal fingers with the large contact area according to claim 1, wherein a flame retardant layer (10) and a heat dissipation layer (11) are sequentially arranged below the bottom of the circuit board base layer (1).