CN213094563U

CN213094563U - Electronic equipment

Info

Publication number: CN213094563U
Application number: CN202022412667.6U
Authority: CN
Inventors: 张东
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2021-04-30
Anticipated expiration: 2030-10-26

Abstract

The embodiment of the application provides electronic equipment, relates to the technical field of communication equipment, and solves the problem that electronic elements arranged on a suspended part of a PCB are stressed greatly. The electronic equipment comprises a mainboard; the frame plate is arranged opposite to the main plate; the electronic element is arranged on one side, close to the frame plate, of the main board; the support frame is arranged on one side, close to the main board, of the frame plate; wherein, the support frame is abutted against the electronic element. This application embodiment makes the support frame support the electronic component who sets up on the mainboard through setting up the support frame on the frame plate, has avoided electronic component's unsettled state, has reduced this electronic component's atress.

Description

Electronic equipment

Technical Field

The application relates to the technical field of communication equipment, in particular to electronic equipment.

Background

Along with the development of society, electronic equipment has become an indispensable product in people's life, and electronic equipment has more and more powerful functions, and various electronic components must be equipped for realizing these powerful functional electronic equipment, and along with the arrival of the 5G era, the number of electronic components further sharply increases. Install the mainboard in the electronic equipment, the most 3D frame structure that adopts of newest mainboard design, this structure is similar "sandwich", sets up relatively through the frame plate between the multilayer PCB board, sets up components and parts on the PCB board that sets up relatively, and mainboard PCB's area can be reduced in this kind of design, improves the integrated level to can increase the flexibility of PCB design.

However, since the PCBs of the above structure are supported by the frame plates, and the frame plates are usually only distributed around the PCBs, the middle area of the PCBs disposed opposite to each other is suspended in a large area, and electronic components are also mounted on the suspended portion, but the electronic components are also in a suspended state, when the electronic device drops, the suspended portion of the PCBs and the supported portion of the PCBs are not uniformly stressed, so that the PCBs of the suspended portion are deformed by the forces such as inertia force, and further, the electronic components disposed on the suspended portion of the PCBs are greatly stressed, which may damage the connections between the PCBs and the electronic components mounted on the suspended portion of the PCBs, and thus the electronic components may not work normally, or even the electronic components may be damaged by the forces, which may affect the service life of the electronic device.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide electronic equipment which can solve the problem that an electronic element arranged on a suspended part of a PCB is stressed greatly.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including:

a main board;

the frame plate is arranged opposite to the main plate;

the electronic element is arranged on one side, close to the frame plate, of the main board;

the support frame is arranged on one side, close to the main board, of the frame plate; wherein, the support frame is abutted against the electronic element.

The technical scheme adopted by the embodiment of the application can achieve the following beneficial effects:

the embodiment of the application provides electronic equipment, which comprises a mainboard; the frame plate is arranged opposite to the main plate; the electronic element is arranged on one side, close to the frame plate, of the main board; the support frame is arranged on one side, close to the main board, of the frame plate; wherein, the support frame is abutted against the electronic element. This application embodiment makes the support frame support the electronic component who sets up on the mainboard through setting up the support frame on the frame plate, has avoided electronic component's unsettled state, has reduced this electronic component's atress.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is an isometric view of the support frame;

FIG. 3 is a cross-sectional view of the support bracket of FIG. 2;

FIG. 4 is an isometric view of a support provided in accordance with another embodiment of the present application;

FIG. 5 is a cross-sectional view of the support bracket of FIG. 4;

FIG. 6 is an isometric view of a support provided in accordance with yet another embodiment of the present application;

fig. 7 is a schematic structural diagram of an electronic device according to yet another embodiment of the present application;

FIG. 8 is a schematic view of the shape of the support at room temperature;

FIG. 9 is a schematic view of the shape of the support stand during heating of the weld.

Description of reference numerals:

1. a main board; 2. a frame plate; 3. an electronic component; 4. a support frame; 5. a side wall; 6. connecting the end faces; 7. a flexible layer; 8. a silica gel pad.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 9, the embodiment of the present application provides a protection structure for an electronic component 3, including a main board 1, a frame board 2 and a supporting frame 4, the main board 1 is a PCB board supported by one layer of a multi-layer main board structure, and serves as a carrier for the electronic component 3, a plurality of electronic components 3 can be disposed on both sides of the main board 1.

Frame plate 2 can be for setting up shielding lid or PCB board on the mainboard 1, frame plate 2 with mainboard 1 sets up relatively, and when frame plate 2 was the PCB board, be provided with the connecting piece between frame plate 2 and the mainboard 1, the connecting piece was followed mainboard 1 and frame plate 2's marginal position sets up, reaches mainboard 1 with the purpose that sets up relatively between frame plate 2. Meanwhile, in order to reduce the thickness of the entire motherboard, the electronic component 3 is not usually disposed on the side of the chassis 2 close to the motherboard 1, and the electronic component 3 is disposed only on the side of the chassis 2 away from the motherboard 1.

The electronic component 3 is arranged on one side of the main board 1 close to the frame plate 2, that is, the electronic component 3 is arranged between the main board 1 and the frame plate 2, and the electronic component 3 is arranged on the main board 1; furthermore, considering the factors of cost and actual installation, it is not necessary to provide a corresponding support frame 4 for each electronic component 3 mounted on the PCB, and the electronic component 3 abutting against the support frame 4 should be a more important electronic component 3, for example, the electronic component 3 is a chip or the like.

The support frame 4 is arranged on one side, close to the main board 1, of the frame plate 2; the support frame 4 abuts against the electronic element 3, that is, the support frame 4 is arranged on the frame plate 2, and the support frame 4 contacts with the electronic element 3, so that the electronic element 3 can be supported.

This application embodiment is through setting up support frame 4 on frame plate 2, make support frame 4 support the electronic component 3 of setting on mainboard 1, electronic component 3's unsettled state has been avoided, make support frame 4 can share the stress on the PCB circuit board that part is in unsettled state, the degree that PCB circuit board atress and warp has been reduced, and then the power that electronic component 3 that support frame 4 supported received has been reduced, it is more reliable to make mainboard 1 and the electronic component 3's of installing on it in the unsettled region be connected, guarantee that electronic component 3 can normally work, also can guarantee that above-mentioned electronic component 3 can not receive the power and damage, the life of the electronic equipment who has above-mentioned electronic component 3 protective structure has been guaranteed.

In a specific embodiment, as shown in fig. 1, from top to bottom be frame plate 2 in proper order, set up in support frame 4 on frame plate 2, with support frame 4 offsets and sets up chip and mainboard 1 on the mainboard 1, wherein, support frame 4 supports the chip, through support frame 4 will mainboard 1 with the drive-by-wire part of frame plate 2 couples together and forms a whole, has reduced mainboard 1 or any single atress of frame plate 2 to protect the chip, avoided reliable connection between chip and the mainboard 1, and guaranteed the structural stability of chip itself.

Optionally, the supporting frame 4 has a bottom plate contacting the electronic component 3 and at least 2 oppositely disposed side walls 5, the bottom plate is connected to the frame plate 2 through the side walls 5, specifically, the supporting frame 4 is a plate-shaped structure, one side of the supporting frame 4 extends out of at least one pair of side walls 5 towards a direction close to the frame plate 2, the pair of side walls 5 are oppositely disposed, the side walls 5 are fixedly connected to the frame plate 2, wherein the supporting frame 4 may be a rectangular plate or the like, the side walls 5 are formed by bending two ends of the rectangular plate, all the side walls 5 are fixed to the frame plate 2, and the bent side walls 5 support the rest of the rectangular plate, so that the supported part is abutted against the electronic component 3; the side walls 5 can be a pair or two pairs, namely four edges of the rectangular plate are bent; the other side of the support frame 4 is abutted against the electronic element 3, and the stress area of the support frame and the electronic element 3 can be increased as much as possible, so that the stress of a unit area is reduced, the damage of the support frame 4 to the electronic element 3 is ensured, and materials can be saved when the support frame 4 is of the structure.

Optionally, the tip of bottom plate is buckled and is extended formation lateral wall 5, lateral wall 5 is straight structure, promptly lateral wall 5 itself does not buckle, for example, support frame 4 is the rectangular plate, directly buckles the edge of rectangular plate once, makes the part of buckling be lateral wall 5 and rectangular plate main part and form the right angle relation, and the support of this moment is straight structure promptly, works as when lateral wall 5 is straight structure, only need with the edge of support frame 4 buckle when processing can, processing is simple and convenient, when lateral wall 5 is fixed with frame plate 2, can adopt the welded mode, with the tip and the frame plate 2 fixed connection of lateral wall 5.

It is optional, lateral wall 5 is buckled into stair structure, forms the zigzag structure between support frame 4 and the lateral wall 5, stair structure has connection terminal surface 6, the lower terminal surface of zigzag promptly, even the terminal surface is a plane, connection terminal surface 6 attached in on the frame plate 2, can increase the area of being connected of lateral wall 5 and frame plate 2, make support frame 4's support more reliable, and support frame 4 passes through connection terminal surface 6 with frame plate 2 is through modes fixed connection such as welding, also can make fixed connection's part increase, can make support frame 4's fixed more reliable.

Optionally, the support frame 4 includes a flexible layer 7, the flexible layer 7 with the electronic component 3 offsets, the flexible layer 7 can be insulating, high temperature resistant materials such as insulating varnish, high temperature gummed paper, polyimide, offset through above-mentioned flexible layer 7 and electronic component 3, can protect electronic component 3 better, avoid electronic equipment to suffer the impact or have the damage of support frame 4 to electronic component 3 under the circumstances such as tolerance.

Optionally, the support frame 4 includes the silica gel pad 8, the silica gel pad 8 prolongs its length direction and has seted up the through-hole, the silica gel pad 8 passes through the through-hole cover is located on the support frame 4, the silica gel pad 8 with electronic component 3 offsets, and lateral wall 5 through buckling on the support frame 4 promptly will the silica gel pad 8 cover is in on the support frame 4, can avoid silica gel pad 8 to be heated when high temperature welding components and parts and drop, just the silica gel pad 8 is flexible material, make the silica gel pad 8 with electronic component 3 offsets, can play the effect of buffering, protects electronic component 3.

Optionally, the support frame 4 includes the silica gel pad 8, the silica gel pad 8 with support frame 4 formula structure as an organic whole is in through compression molding technology promptly set up the silica gel pad 8 on the support frame 4, make the silica gel pad 8 forms an organic whole structure with support frame 4, and the silica gel pad 8 is heated and drops when high temperature welding components and parts, will the silica gel pad 8 with electronic component 3 offsets, because the silica gel pad 8 is flexible material, can play the effect of buffering, protects electronic component 3.

Optionally, the support frame 4 with be provided with silica gel pad 8 between the frame plate 2, make silica gel pad 8 is connected with support frame 4 and frame plate 2 respectively, because frame plate and silica gel all have better coefficient of heat conductivity, electronic component 3 leads the heat on frame plate 2 through support frame 4, and the corresponding region of frame plate 2 can increase the thermal effluvium of accelerating such as copper post and copper skin, reduces the chip temperature, is favorable to the heat dissipation, wherein, support frame 4 is preferred to adopt the metal material.

Further, when the support frame 4 is sleeved with the silica gel pad 8, the thickness of the silica gel pad 8 can be controlled, so that the silica gel pad 8 is in contact with the frame plate 2, and a good heat dissipation effect is achieved.

Optionally, the support frame 4 is made of a shape memory alloy, preferably, the support frame 4 is made of a two-way memory effect shape memory alloy, the support frame 4 is guaranteed to be capable of contacting the electronic component 3 at normal temperature, but since the height of the electronic component 3 has a certain tolerance, it is possible that the support frame 4 pushes the chip to make the joint between the motherboard 1 and the frame plate 2 float in the process of connecting the motherboard 1 and the frame plate 2, and it is possible that a solder ball between the frame plates will be subjected to a cold solder joint or a false solder joint, when the support frame 4 is made of the two-way memory effect shape memory alloy, the support frame 4 is heated to recover a high-temperature phase shape in the process of welding the motherboard 1 and the frame plate 2, as shown in fig. 8 and 9, the support frame 4 is inclined, the height direction is reduced, the floating due to the support frame 4 is avoided, and after the welding is completed, the temperature is reduced, and the, it is ensured that the support 4 can be supported to the chip.

Optionally, the support frame 4 is welded to the frame plate 2, and the support frame 4 is welded to the frame plate 2 by using soldering tin, so that the support frame 4 can be reliably fixed.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device, comprising:

a main board;

the frame plate is arranged opposite to the main plate;

the support frame, the support frame set up in the frame plate is close to mainboard one side, just the support frame with electronic component offsets.

2. The electronic device of claim 1, wherein the support frame has a bottom plate in contact with the electronic component and at least 2 oppositely disposed side walls, the bottom plate being connected to the chassis plate through the side walls.

3. The electronic device of claim 2, wherein an end of the bottom plate is bent and extended to form the side wall.

4. The electronic device of claim 2, wherein the side wall is bent into a step structure, the step structure having a connection end surface, and the connection end surface is attached to the chassis and fixedly connected with the chassis.

5. The electronic device of any of claims 1-4, wherein the support frame comprises a flexible layer that abuts the electronic component.

6. The electronic device according to any one of claims 2-4, wherein the support frame comprises a silicone pad, the silicone pad has a through hole, the silicone pad is sleeved on the support frame through the through hole, and the silicone pad abuts against the electronic component.

7. The electronic device according to any one of claims 2-4, wherein the support frame comprises a silicone pad, the silicone pad and the support frame are of an integrated structure, and the silicone pad abuts against the electronic component.

8. The electronic device according to any of claims 2-4, wherein a silicone pad is disposed between the support frame and the shelf plate.

9. The electronic device of any one of claims 2-4, wherein the material of the support frame is a shape memory alloy.

10. The electronic device of claim 1, wherein the support bracket is welded to the chassis.