CN220043757U - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
- Publication number
- CN220043757U CN220043757U CN202320729720.6U CN202320729720U CN220043757U CN 220043757 U CN220043757 U CN 220043757U CN 202320729720 U CN202320729720 U CN 202320729720U CN 220043757 U CN220043757 U CN 220043757U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board assembly
- connection
- main body
- body part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000006260 foam Substances 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 20
- 239000010949 copper Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- 239000000741 silica gel Substances 0.000 description 14
- 229910002027 silica gel Inorganic materials 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 238000003466 welding Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 241000272165 Charadriidae Species 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model relates to a circuit board assembly and electronic equipment, wherein the circuit board assembly comprises a main body part and a connecting part, the connecting part is a metal piece and is used for installing an electric connecting piece, the main body part is provided with a protective film and a connecting end, the protective film covers part of the connecting end, and the connecting part is electrically connected with the connecting end which is not covered by the protective film. Through the design, the connecting end can be protected, and the electric connection stability of the circuit board and the connecting end is improved.
Description
Technical Field
The present utility model relates to the field of electronic products, and in particular, to a circuit board assembly and an electronic device.
Background
The circuit board is a common component in electronic equipment, and the substrate of the circuit board is provided with copper exposure for electrical connection with electronic devices. Since exposed copper is prone to rusting and the like, the surface of a circuit board is usually required to be treated, and the exposed copper is plated with gold, however, the cost of the method is high.
Disclosure of Invention
The utility model provides a circuit board assembly and electronic equipment, which are used for protecting a circuit board and reducing cost.
The present utility model provides a circuit board assembly, comprising:
a main body part, the surface of which is provided with a connecting end;
the connecting part is arranged on the main body part and is used for being electrically connected with the electric connecting piece;
the main body part is provided with a protective film, the protective film covers part of the connecting end, the connecting part is a metal piece, and the connecting part is electrically connected with the part of the connecting end which is not covered by the protective film.
The connecting end can be protected by the protective film, the possibility of rusting and the like of the connecting end is reduced, and therefore the stability of the circuit board assembly is improved, and the service life is prolonged. The connecting piece is connected with the link that is not covered by the protection film, can reduce the influence of protection film to the electric connection stability between connecting portion and the link, moreover, the connecting portion can also increase the connection area of electric connecting piece and circuit board to be favorable to improving the stability of electric connection, simultaneously, compare in carrying out the gilding mode at the surface of link, the cost that adopts the protection film is lower, accords with actual use demand more.
In one possible embodiment, the connection portion is electrically connected to the connection terminal through a surface assembly technique.
Through such design can make connecting piece and link welding, compare in the mode of bonding, welded electric connection performance is better, and is comparatively stable moreover, and life is longer, can be favorable to further improving the stability of electric connection. The SMT technology has the advantages of higher assembly density, better reliability and lower cost, is convenient for automatic production, is beneficial to improving the production efficiency, and meets the actual use requirement better.
In one possible embodiment, in the projection in the thickness direction of the circuit board, the projection area of the connection portion is larger than the projection area of the electrical connection member.
The relative position precision requirement between the connecting part and the electric connecting piece can be reduced through the design, so that the assembly difficulty is reduced, and the processing efficiency is improved.
In one possible embodiment, in the projection along the thickness direction of the circuit board assembly, the projection area of the connection portion is m, and 12 square millimeters is equal to or less than m is equal to or less than 30 square millimeters.
This way, the connection portion can have a sufficient connection area for connection with the electrical connector.
In one possible embodiment, the connection portion includes a body portion and a support portion that are connected to each other, the body portion is configured to be electrically connected to the electrical connector, the support portion is electrically connected to the connection end, and a space is provided between the body portion and the body portion along a thickness direction of the circuit board assembly.
Through the design, the space occupied by the connecting part on the circuit board can be reduced, and the position between the body part and the main body part can be used for setting electronic devices and/or wiring by carrying out overhead design on the body part, so that the space of the circuit board assembly is saved, and the practical use requirement is met.
In one possible embodiment, the distance between the body portion and the main body portion is n in the thickness direction of the circuit board assembly, and 0.5 mm n is 1.5 mm.
Through the design, enough space can be formed between the main body part and the main body part for carrying out traveling wires and/or arranging electronic devices, so that the space utilization rate of the main body part can be improved, and the practical use requirements can be met.
In one possible embodiment, the connection portion includes a plurality of the support portions, and each of the support portions is disposed at intervals along a circumferential direction of the body portion.
Through the design, the stability of connection of the connecting part and the main body part can be improved, so that the possibility that the connecting part inclines and falls off from the main body part is reduced, and the practical use requirement is met better.
In one possible embodiment, the protective film is an organic solder mask.
An organic film is formed on the surface of copper in a chemical mode, has hot spots such as oxidation resistance, thermal shock resistance and corrosion resistance, and can be used for protecting the copper so as to reduce the possibility of rusting of the surface of the copper in a normal environment. In the subsequent welding process, the organic film can be removed by the soldering flux, so that the copper surface can be exposed, the influence of the protective film on the welding of the connecting end and the connecting part is reduced, the copper surface of the connecting end can be combined with molten soldering tin in a short time to form a firm welding spot, and the connecting part and the connecting end have high connection stability.
The utility model also provides electronic equipment, which comprises the circuit board assembly.
In one possible embodiment, the electronic device includes a screen assembly and an electrical connector, the screen assembly being electrically connected to the connection portion of the circuit board assembly by the electrical connector.
Through the design, the stability of the electric connection between the screen component and the circuit board component can be improved.
In one possible embodiment, the electrical connection is a conductive foam.
The screen component can be electrically connected with the connecting part through the conductive foam, and then is electrically connected with the connecting end of the circuit board. The conductive foam can play roles of damping, buffering, decompressing and the like, so that the possibility of damage to the screen component and the circuit board component can be reduced, and the service lives of the screen component and the circuit board component can be prolonged. In addition, the conductive foam has elasticity, and the restoring force generated when the conductive foam deforms can act on the circuit board and the screen assembly, so that the stability of connection of the circuit board and the screen assembly is improved, and the conductive foam meets the actual use requirements better.
The utility model provides a circuit board assembly and electronic equipment, wherein the circuit board assembly comprises a main body part and a connecting part, the connecting part is a metal piece and is used for installing an electric connecting piece, the main body part is provided with a protective film and a connecting end, the protective film covers part of the connecting end, and the connecting part is electrically connected with the connecting end which is not covered by the protective film. Through the design, the connecting end can be protected, and the electric connection stability of the circuit board and the connecting end is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.
Drawings
Fig. 1 is a schematic view of a first embodiment of a circuit board assembly according to the present utility model;
fig. 2 is a schematic diagram of a second embodiment of a circuit board assembly according to the present utility model;
fig. 3 is a schematic diagram of a third embodiment of a circuit board assembly according to the present utility model.
Reference numerals:
1-a main body part, 11-wiring and 12-connecting ends; 2-connecting part, 21-body part, 22-supporting part; 3-electrical connectors; 4-electronic device.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
Detailed Description
For a better understanding of the technical solution of the present utility model, the following detailed description of the embodiments of the present utility model refers to the accompanying drawings.
Along with the development of technology, electronic devices such as mobile phones, tablet computers and notebook computers are increasingly widely applied, and important components in the electronic devices are arranged on a circuit board, wherein the circuit board comprises a substrate and copper exposure used for electrically connecting electronic devices, and the electronic devices can be integrated on the circuit board to realize operations such as electric connection and grounding. In order to protect the exposed copper, a circuit board can be treated by using a electroless gold (ENIG) process, and a layer of nickel alloy is wrapped on the surface of the copper so as to reduce the possibility of rusting and the like of the exposed copper in the use process. The nickel-gold process includes the steps of immersing in an electrolyte that dissolves nickel during immersion and affects the performance of the surface treatment of the circuit board if the dissolution reaction is not controlled. Therefore, the method has the advantages of complex process flow, high processing difficulty and high cost. In the related art, the electric connection function can be realized through the conductive silica gel by installing the conductive silica gel on the surface of the circuit board. The surface layer of the conductive silica gel comprises metal materials such as gold, nickel, copper and the like, and is used as a medium to realize a conductive function, and the silica gel with high temperature resistance is used as an elastic material. The conductive silica gel can be adhered with exposed copper of the circuit board through adhesives such as silica gel glue. The colloidal silica may be used to provide a repulsive force when the circuit board is connected to the antenna waiting connection object. The conductive silica gel can be deformed in a compression mode and the like, and resilience force generated by deformation can act on the circuit board and the object to be connected, so that the stability of connection of the circuit board and the object to be connected is improved. The conductive material utilizes the elasticity of the conductive silica gel to provide resilience force to realize the electrical connection of the conductive silica gel to the antenna waiting for the connection object. When the circuit board is used as electromagnetic interference (electromagnetic interference, EMI) shielding ground, when electronic equipment such as a mobile phone, a tablet computer, a notebook computer and the like with the circuit board receives impact, the conductive silica gel can also play a role in buffering, and the possibility of damage to the circuit board and the electronic device caused by external impact is reduced. But the conductive silica gel can appear laxing, ageing scheduling problem under long-term compression state, and in addition, electron device can produce heat at the during operation, leads to the ambient temperature that conductive silica gel is located to rise, aggravates the ageing degree of conductive silica gel easily, appears phenomena such as stress relaxation, and then appears the condition such as bad contact easily, can cause the influence to connection stability, influences the performance of the electron device who is connected with the circuit board. In addition, the conductive silica gel is mounted on the circuit board in a bonding manner, and when the adhesive is aged, the stability of connection between an object to be connected and the circuit board is also affected, so that the performances of antenna receiving and transmitting signals, electromagnetic compatibility (electro magnetic compatibility, EMC), electromagnetic interference and the like are affected.
In view of the above, the embodiment of the utility model provides a circuit board assembly and an electronic device for protecting the circuit board assembly and improving the reliability of electrical connection.
As shown in fig. 1, the embodiment of the utility model provides a circuit board assembly, wherein the circuit board assembly includes a main body portion 1 and a connection portion 2, the main body portion 1 may be a printed circuit board (printed circuit board, PCB), the main body portion 1 may have a substrate provided with a connection end 12, the connection portion 2 is mounted on the main body portion 1 and is used for electrically connecting with an electrical connector 3, the electrical connector 3 may be an electrical connection auxiliary material such as conductive foam, and the connection end 12 may be copper exposure of the circuit board assembly. The main body portion 1 is provided with a protective film (not shown in the drawing), a part of the connection terminals 12 is covered with the protective film, and a part of the connection terminals 12 is not covered with the protective film. The connection portion 2 is a metal member, and the connection portion 2 is electrically connected to the connection end 12 not covered by the protection film.
The connecting end 12 can be protected by arranging the protective film, the possibility of rusting and the like of the connecting end 12 is reduced, and therefore the stability of the circuit board assembly is improved, and the service life is prolonged. Meanwhile, when the electrical connector 3 is mounted on the main body 1 by means of adhesion, the protection film affects the stability of the electrical connection between the electrical connector 3 and the connection terminal 12. Therefore, in the solution provided in the embodiment of the present utility model, the connection portion 2 is connected with the connection end 12 not covered by the protection film, which can reduce the influence of the protection film on the stability of the electrical connection between the connection portion 2 and the connection end 12, and further reduce the influence of the protection film on the stability of the electrical connection between the electrical connector 3 and the circuit board assembly, and the connection portion 2 can also increase the connection area between the electrical connector 3 and the circuit board, thereby being beneficial to improving the stability of the electrical connection, and meanwhile, compared with the manner of gold plating on the surface of the connection end 12, the cost of adopting the protection film is lower, and more meets the actual use requirement.
In one possible embodiment, the connection portion 2 is electrically connected to the connection terminal 12 by a surface mount technology (surface mounted technology, SMT).
Through such design can make connecting piece and link 12 welding, compare in the mode of bonding, welded electric connection performance is better, and is comparatively stable moreover, and life is longer, can be favorable to further improving electric connection's stability. The SMT technology has the advantages of higher assembly density, better reliability and lower cost, is convenient for automatic production, is beneficial to improving the production efficiency, and meets the actual use requirement better.
As shown in fig. 1, in one possible embodiment, the projected area of the connection portion 2 is larger than the projected area of the electrical connector 3 in the projection in the thickness direction of the circuit board.
The relative position precision requirement between the connecting part 2 and the electric connecting piece 3 can be reduced through the design, and the connecting part 2 has enough area for being connected with the electric connecting piece 3, so that the assembly difficulty is reduced, and the processing efficiency is improved.
In one possible embodiment, in the projection in the thickness direction of the circuit board, the projection area of the connection portion 2 is m, and 12 square millimeters.ltoreq.m.ltoreq.30 square millimeters.
The projected area of the connection portion 2 may be 12 square millimeters, 16 square millimeters, 22 square millimeters, 26 square millimeters, 30 square millimeters, or the like. This way, the connection part 2 can have a relatively large connection area for connection with the electrical connector 3.
In one possible embodiment, the connection portion 2 may be a rectangular sheet-like structure having a length of 3 mm and a width of 4 mm, or a rectangular sheet-like structure having a length of 5 mm and a width of 5 mm, or a rectangular sheet-like structure having a length of 6 mm and a width of 5 mm, etc. The actual size and the actual structure of the connection portion 2 may be set according to actual requirements.
As shown in fig. 2 and 3, in one possible embodiment, the connection portion 2 includes a body portion 21 and a support portion 22 that are connected to each other, wherein the body portion 21 is used for electrically connecting with the electrical connector 3, the support portion 22 is used for electrically connecting with the connection terminal 12, and a space is provided between the body portion 21 and the main body portion 1 along a thickness direction of the circuit board assembly.
Through such design can reduce the space that connecting portion 2 occupy at the circuit board, through carrying out built on stilts design with body portion 21, can make the position between body portion 21 and the main part 1 be used for setting up electronic device 4 and/or wiring 11 to be favorable to saving the space of circuit board subassembly, accord with actual use demand more.
In one possible embodiment, the distance between the body portion 21 and the main body portion 1 in the thickness direction of the circuit board assembly is n, and n satisfies: n is more than or equal to 0.5 mm and less than or equal to 1.5 mm.
The spacing between the body portion 21 and the main body portion 1 may be 0.5 mm, 0.7 mm, 0.9 mm, 1.1 mm, 1.3 mm, 1.5 mm, etc. Through the design, enough space can be provided between the main body part 1 and the main body part 21 for carrying out the traveling line 11 and/or arranging the electronic device 4, so that the space utilization rate of the main body part 1 can be improved, and the practical use requirement can be met better.
As shown in fig. 3, in one possible embodiment, the connection portion 2 includes a plurality of support portions 22, each support portion 22 being disposed at intervals along the circumferential direction of the body portion 21.
Through the design, the stability of connection between the connecting part 2 and the main body part 1 can be improved, so that the possibility that the connecting part 2 inclines and falls off from the main body part 1 is reduced, and the practical use requirement is met better.
In one possible embodiment, the protective film is an organic solder mask.
The surface treatment of the circuit board can be carried out by an organic solder mask (organic solderability preservatives, OSP) process, and an organic film is formed on the surface of copper in a chemical mode, so that the copper-free solder mask has hot spots such as oxidation resistance, thermal shock resistance and corrosion resistance, can be used for protecting copper, and can reduce the possibility of rusting of the surface of copper in a normal environment. In the subsequent welding process, the organic film can be removed by the soldering flux, so that the copper surface can be exposed, the influence of the protective film on the welding of the connecting end 12 and the connecting part 2 is reduced, the copper surface of the connecting end 12 can be combined with molten soldering tin in a short time to form a firm welding spot, and the connecting part 2 and the connecting end 12 have high connection stability.
During processing, a protective film can be firstly generated on the surface of the main body part 1, the protective film can be melted in the connection position of the connecting end 12 and the connecting part 2 in the welding process through SMT process, so that the connecting part 2 can be directly contacted with the connecting end 12 and welded, the influence of the protective film on the electric connection stability between the connecting part 2 and the connecting end 12 is reduced, all the connecting ends 12 can be covered firstly when the protective film is arranged, the protective film in the corresponding area is melted in the welding process, the possibility of exposure of the connecting ends 12 in other positions can be reduced, the protection effect of the protective film on the connecting ends 12 is improved, and the practical use requirement is met.
Based on the circuit board assembly provided by the above embodiments, the embodiment of the present utility model further provides an electronic device, where the electronic device includes the circuit board assembly according to any one of the above embodiments, and since the circuit board assembly has the above technical effects, the electronic device including the circuit board assembly also has corresponding technical effects, which are not described herein again.
In one possible implementation, the electronic device may be a cell phone, tablet computer, notebook computer, or the like. The electronic equipment comprises a screen component and an electric connecting piece 3, wherein the screen component is electrically connected with the connecting part 2 of the circuit board component through the electric connecting piece 3.
The design can improve the stability of the electric connection between the screen component and the circuit board component, and more meets the actual use requirement
In one possible embodiment, the electrical connection 3 may be a conductive foam.
The screen component can be electrically connected with the connecting part 2 through conductive foam, and then is electrically connected with the connecting end 12 of the circuit board. The conductive foam can play roles of damping, buffering, decompressing and the like, so that the possibility of damage to the screen component and the circuit board component can be reduced, and the service lives of the screen component and the circuit board component can be prolonged. In addition, the conductive foam has elasticity, and the restoring force generated when the conductive foam deforms can act on the circuit board and the screen assembly, so that the stability of connection of the circuit board and the screen assembly is improved, and the conductive foam meets the actual use requirements better.
The embodiment of the utility model provides a circuit board assembly and electronic equipment, wherein the circuit board assembly comprises a main body part 1 and a connecting part 2, the connecting part 2 is a metal piece and is used for installing an electric connecting piece 3, the main body part 1 is provided with a protective film and a connecting end 12, the protective film covers part of the connecting end 12, and the connecting part 2 is electrically connected with the connecting end 12 which is not covered by the protective film. By the design, the connecting end 12 can be protected, and the stability of the electric connection between the circuit board and the connecting end 12 is improved.
The foregoing is merely a specific implementation of the embodiment of the present utility model, but the protection scope of the embodiment of the present utility model is not limited to this, and any changes or substitutions within the technical scope disclosed in the embodiment of the present utility model should be covered in the protection scope of the embodiment of the present utility model. Therefore, the protection scope of the embodiments of the present utility model shall be subject to the protection scope of the claims.
Claims (11)
1. A circuit board assembly, the circuit board assembly comprising:
a main body part (1), wherein a connecting end (12) is arranged on the surface of the main body part (1);
the connecting part (2), the said connecting part (2) is installed in the said body part (1), is used for electrically connecting with electric connector (3);
the connecting device comprises a main body part (1), a connecting end (12) and a connecting part (2), wherein the main body part (1) is provided with a protective film, the protective film covers part of the connecting end (12), the connecting part (2) is a metal piece, and the connecting part (2) is electrically connected with the part, which is not covered by the protective film, of the connecting end (12).
2. Circuit board assembly according to claim 1, wherein the connection portion (2) is electrically connected to the connection terminal (12) by means of surface assembly technology.
3. Circuit board assembly according to claim 1, characterized in that the projected area of the connection part (2) in the projection in the thickness direction of the circuit board is larger than the projected area of the electrical connection (3).
4. The circuit board assembly according to claim 1, characterized in that the projected area of the connection portion (2) in the projection in the thickness direction of the circuit board assembly is m, and 12 square millimeters is ∈m.ltoreq.30 square millimeters.
5. Circuit board assembly according to any of claims 1 to 4, wherein the connection part (2) comprises a body part (21) and a support part (22) connected to each other, the body part (21) being adapted to be electrically connected to the electrical connector (3), the support part (22) being electrically connected to the connection end (12), the body part (21) being spaced apart from the body part (1) in the thickness direction of the circuit board assembly.
6. The circuit board assembly according to claim 5, wherein a distance between the body portion (21) and the main body portion (1) in a thickness direction of the circuit board assembly is n, and n is 0.5 mm.ltoreq.n.ltoreq.1.5 mm.
7. The circuit board assembly according to claim 5, wherein the connection portion (2) includes a plurality of the support portions (22), each of the support portions (22) being disposed at intervals along a circumferential direction of the body portion (21).
8. The circuit board assembly according to any one of claims 1 to 4, wherein the protective film is an organic solder mask.
9. An electronic device comprising the circuit board assembly of any one of claims 1 to 8.
10. The electronic device according to claim 9, characterized in that the electronic device comprises a screen assembly and an electrical connection (3), the screen assembly being electrically connected to the connection (2) of the circuit board assembly by means of the electrical connection (3).
11. The electronic device according to claim 9, characterized in that the electrical connection (3) is a conductive foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320729720.6U CN220043757U (en) | 2023-03-23 | 2023-03-23 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320729720.6U CN220043757U (en) | 2023-03-23 | 2023-03-23 | Circuit board assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220043757U true CN220043757U (en) | 2023-11-17 |
Family
ID=88744673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320729720.6U Active CN220043757U (en) | 2023-03-23 | 2023-03-23 | Circuit board assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220043757U (en) |
-
2023
- 2023-03-23 CN CN202320729720.6U patent/CN220043757U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100659826B1 (en) | Circuit board of battery pack | |
| JP3554350B2 (en) | Surface mountable integrated circuit package with integrated battery mount | |
| KR20150123169A (en) | Cable connector assembly for a communication system | |
| CN213694596U (en) | Circuit board structure and electronic equipment | |
| JP2012146573A (en) | Flat cable and connection structure between flat cable and printed wiring board | |
| US6071130A (en) | Surface mounted contact block | |
| KR20180002491A (en) | Electric connecting terminal for metal case | |
| US8902605B2 (en) | Adapter for plated through hole mounting of surface mount component | |
| CN201112976Y (en) | Electric connector | |
| JP2010530601A (en) | Connector and circuit board for interconnecting surface mount devices | |
| KR20110105152A (en) | Large capacity memory module mounting device for portable terminal | |
| US10034373B2 (en) | Circuit board secured to battery cell using a circuit board through hole and methods for welding the circuit board | |
| CN220043757U (en) | Circuit board assembly and electronic equipment | |
| CN111491439A (en) | Circuit board assembly and electronic equipment | |
| CN101022189A (en) | Electric connector | |
| WO2022042472A1 (en) | Chip packaging module and electronic device | |
| CN110012614A (en) | A kind of circuit board, circuit board assemblies, electronic equipment and welding method | |
| CN213662046U (en) | Circuit board assembly and electronic device | |
| CN210093654U (en) | Double-sided PCB with stable bonding pad structure | |
| CN213755123U (en) | Flexible circuit board, display module and terminal | |
| CN211090145U (en) | Circuit board and electronic equipment | |
| US7053314B1 (en) | Methods and apparatus for providing a signal to a circuit board component | |
| CN102111955B (en) | Connecting structure and connecting method for PCB | |
| JP3272655B2 (en) | Printed wiring board connector | |
| CN220359427U (en) | Flexible circuit board for battery module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |