CN112601411B

CN112601411B - Circuit board structure and electronic equipment

Info

Publication number: CN112601411B
Application number: CN202011411868.2A
Authority: CN
Inventors: 王利军
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2022-08-16
Anticipated expiration: 2040-12-04
Also published as: CN112601411A

Abstract

The application discloses circuit board structure and electronic equipment. The circuit board structure comprises a circuit board support, a first circuit board, a second circuit board and a contact support. The circuit board support comprises a first mounting wall and a second mounting wall which are opposite to each other, and the first circuit board is mounted on the circuit board support and located between the first mounting wall and the second mounting wall. The second circuit board is arranged at an interval with the first circuit board, is arranged on the circuit board support and is positioned between the first installation wall and the second installation wall, the contact support is arranged on the circuit board support and is positioned between the first installation wall and the second installation wall and between the first circuit board and the second circuit board, the contact support comprises a connecting piece, and the connecting piece is respectively abutted against the first circuit board and the second circuit board so as to electrically connect the first circuit board and the second circuit board. Therefore, the firmness of the circuit board structure is enhanced, and the cost is saved.

Description

Circuit board structure and electronic equipment

Technical Field

The present disclosure relates to electronic hardware, and more particularly, to a circuit board structure and an electronic device.

Background

Generally, an electronic component may be fixed on a Printed Circuit Board (PCB) by Surface Mount Technology (SMT) to form a main Board. With the increase of electronic components, the accommodation area of the PCB board of the mobile phone is limited. Therefore, in order to increase the accommodating area of the PCB, in the related art, the main board of the mobile phone includes a main PCB for accommodating electronic components, one or more sub-PCBs, and a middle frame for connecting the main PCB and the sub-PCBs. However, since the main PCB, the sub PCB, and the middle frame are connected by soldering, the pad is easily cracked and detached during a drop test, and the reliability is poor.

Disclosure of Invention

In view of the above, the present invention is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the invention aims to provide a circuit board structure and an electronic device.

The circuit board structure of the embodiment of the application includes:

a circuit board support including opposing first and second mounting walls;

a first circuit board mounted to the circuit board support between the first mounting wall and the second mounting wall;

the second circuit board is arranged at an interval with the first circuit board, is arranged on the circuit board bracket and is positioned between the first mounting wall and the second mounting wall; and

the contact support, the contact support mounting be in the circuit board support, the contact support is located first installation wall with just be located between the second installation wall first circuit board with between the second circuit board, the contact support includes the connecting piece, the connecting piece respectively with first circuit board with the conflict of second circuit board is so that first circuit board with the second circuit board electricity is connected.

The application also provides an electronic device, the electronic device comprises a shell and the circuit board structure, and the circuit board structure is installed on the shell.

In the circuit board structure and the electronic equipment of this application, through being connected first circuit board and second circuit board and the first installation wall of circuit board support and second installation wall in order to install on the circuit board support, can need not to fix through the welding, can guarantee firm in connection between first circuit board, second circuit board and the circuit board support, the rosin joint leads to appearing the fracture phenomenon when having avoided because of the welding to, the paster cost in later stage has been saved. Meanwhile, the first circuit board and the second circuit board can ensure communication between the first circuit board and the second circuit board through the electric shock support.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of a circuit board structure according to some embodiments of the present application;

FIG. 2 is a schematic view of an electronic device of some embodiments of the present application;

FIG. 3 is a schematic view of another structure of a circuit board structure according to some embodiments of the present application;

fig. 4 is a further structural schematic diagram of a circuit board structure according to some embodiments of the present application.

Description of the main element symbols:

the electronic device 100, the circuit board structure 10, the circuit board support 11, the first mounting wall 111, the first step surface 1111, the second step surface 1112, the second mounting wall 112, the third step surface 1121, the fourth step surface 1122, the body 113, the first circuit board 12, the first land 123, the first surface 121, the second surface 122, the second circuit board 13, the second land 133, the first surface 131, the second surface 132, the contact support 14, the connector 141, the contact 1411, the elastic member 1412, the link 1413, the mounting member 142, and the electronic element 15.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

Generally, electronic components may be fixed on a Printed Circuit Board (PCB) by Surface Mount Technology (SMT) to form a mobile phone motherboard. As the functions of the mobile phone are increased, the number of electronic components is also increased, and the accommodation area of a single PCB of the mobile phone is limited, so that, in order to increase the accommodation area of the PCB, in the related art, the main board of the mobile phone includes a main PCB for accommodating the electronic components, an auxiliary PCB, and a middle frame for connecting the main PCB and the auxiliary PCB. The main PCB and the auxiliary PCB are used for accommodating electronic components. The middle plate frame is used for fixing the main PCB and the auxiliary PCB and can be connected with the main PCB and the auxiliary PCB, so that electronic components of the main PCB and the auxiliary PCB can communicate. The two sides of the middle frame plate are provided with a plurality of welding pads, and the front side and the back side of the middle frame plate are respectively welded with the metal hole of the main PCB and the metal hole inside the auxiliary PCB, so that the middle frame plate, the main PCB and the auxiliary PCB are in point connection.

However, since the middle frame plate plays a role in fixing the main plate and the stacked plate, the requirements of structural strength, surface flatness, small deformation after high temperature during welding and the like of the middle frame plate are high, the manufacturing process is complex, a special die (jig) and a special welding mode are required to be ensured, the cost is much higher than that of general electronic component welding, and the processing cost is high. The middle frame plate and the laminated plate can be reliably welded, and the main PCB, the auxiliary PCB and the middle frame plate are connected and fixed through welding, so that a cold joint phenomenon possibly exists in welding, a welding pad is easy to crack and desolder when a drop test is carried out, and the reliability is poor. In addition, the welding area of the middle frame plate occupies more areas of the main plate and the stacked plate, which is not beneficial to the light and thin design of the mobile phone.

Referring to fig. 1, in view of the above, the present disclosure provides a circuit board structure 10, where the circuit board structure 10 includes a circuit board support 11, a first circuit board 12, a second circuit board 13, and a contact support 14. The circuit board support 11 includes a first mounting wall 111 and a second mounting wall 112 opposite to each other, and the first circuit board 12 is mounted on the circuit board support 11 between the first mounting wall 112 and the second mounting wall 113. The second circuit board 13 is disposed at an interval from the first circuit board 12, and is mounted on the circuit board support 11 and located between the first mounting wall 111 and the second mounting wall 112, the contact support 14 is mounted on the circuit board support 13, the contact support 14 is located between the first mounting wall 111 and the second mounting wall 112 and located between the first circuit board 12 and the second circuit board 13, the contact support 14 includes a connector 141, and the connector 141 is abutted against the first circuit board 12 and the second circuit board 13, respectively, so as to electrically connect the first circuit board 12 and the second circuit board 13.

Referring to fig. 2, the present embodiment further provides an electronic device 10, where the electronic device 10 includes a housing 20 and the circuit board structure 10, and the circuit board structure 10 is mounted on the housing 20 to be applied to the electronic device 100.

In the circuit board structure 10 and the electronic device 100 provided by the invention, the first circuit board 12 and the second circuit board 13 are connected with the first mounting wall 111 and the second mounting wall 112 of the circuit board support 11 to be mounted on the circuit board support 11, so that the first circuit board 12, the second circuit board 13 and the circuit board support 11 can be fixed without welding, the connection among the first circuit board 12, the second circuit board 13 and the circuit board support 11 is ensured to be firm, and the phenomenon of cracking caused by insufficient welding during welding is avoided. In addition, the accommodation areas of the first circuit board 12 and the second circuit board 13 can be increased, which is beneficial to the light and thin design of the electronic device 100. Meanwhile, the first circuit board 12 and the second circuit board 13 can ensure the electrical connection between the first circuit board 12 and the second circuit board 13 through the contact bracket 14, so that the communication path between the first circuit board 12 and the second circuit board 13 is shorter, and the signal quality is stronger.

The electronic device 100 may be, but is not limited to, a mobile phone, a tablet computer, a smart wearable device (smart watch, smart bracelet, smart helmet, smart glasses, etc.), a virtual reality device, or a head display device, etc. For example, in the present application, the electronic device 100 may be a mobile phone, and the circuit board structure 10 is applied to the mobile phone as a main board of the mobile phone.

Referring to fig. 3, specifically, the circuit board structure 10 includes a circuit board support 11, a first circuit board 12, a second circuit board 13, and a contact support 14.

Referring to fig. 4, the circuit board support 11 may be a middle frame of the mobile phone, that is, when the circuit board structure 10 is applied to the mobile phone, the middle frame of the mobile phone serves as the circuit board support 11, so that the circuit board support 11 may serve as a part of the mobile phone housing. The circuit board holder 11 includes a body 113, a first mounting wall 111, and a second mounting wall 112. Wherein, the first and

second mounting walls

111 and 112 extend from both ends of the body 113 along the direction aligned with the first and

second circuit boards

12 and 13. The circuit board support 11 may be formed by splicing the body 113, the first mounting wall 111 and the second mounting wall 112, or may be formed by an integrated process.

The first mounting wall 111 includes a first step surface 1111 and a second step surface 1112, the first step surface 1111 and the second step surface 1112 are disposed along the arrangement direction of the first mounting wall 111 and the second mounting wall 112 in a staggered manner, and the second step surface 1112 is disposed on a side of the first step surface 1111 away from the body 113. The second mounting wall 112 includes a third step surface 1121 and a fourth step surface 1122, which are disposed along the arrangement direction of the first mounting wall 111 and the second mounting wall 112 in a staggered manner, and the first step surface 1111 is flush with the third step surface 1121, and the second step surface 1112 is flush with the third step surface 1121.

The first circuit board 12 is a printed circuit board, and the first circuit board 12 is spaced apart from the body 113 and disposed between the first mounting wall 111 and the second mounting wall 112. The first circuit board 12 includes a first surface 121 and a second surface 122 opposite to each other, wherein the first surface 121 faces the body 113. The first surface 121 of the first circuit board 12 is attached to the first step surface 1111 and the third step surface 1121.

The second circuit board 13 is a printed circuit board, the second circuit board 13 is disposed at a side of the first circuit board 12 away from the body 113 at intervals, and is disposed between the first mounting wall 111 and the second mounting wall 112, and a length of the second circuit board 13 along the direction of the body 113 is longer than that of the first circuit board 12.

Further, the second circuit board 13 includes a first surface 131 and a second surface 132 opposite to each other, wherein the first surface 131 of the second circuit board 13 faces the second surface 122 of the first circuit board 12, and the first surface 131 of the second circuit board 13 is attached to the second step surface 1112 and the fourth step surface 1122 respectively. The connection manner may be screw connection, clamping connection, riveting connection, and the like, and the specific connection manner is not limited, for example, in this application, the second circuit board 13 may be mounted to the second step surface 1112 and the fourth step surface 1114 by using a screw connection manner.

Referring to fig. 4, a contact holder 14 is disposed between the first circuit board 12 and the second circuit board 13, and the contact holder 14 is used to electrically connect the first circuit board 12 and the second circuit board 13, so that the first circuit board 12 and the second circuit board 13 can communicate through the contact holder 14.

The contact holder 14 includes a mounting member 142 and a connecting member 141. The mounting member 142 is substantially in a long strip shape, two ends of the mounting member 142 are respectively connected to the first mounting wall 111 and the second mounting wall 112, the connection manner may be welding, riveting, screwing, or the like, specifically, the connection manner is not limited, and the mounting member 142 may be made of an insulating material such as a plastic plate or glass.

The connection member 141 is mounted on the mounting member 142 and is disposed perpendicular to the mounting member 142. The connectors 141 may be located at any position between the first circuit board 12 and the second circuit board 13, the number of the connectors 141 is not limited, for example, the number of the connectors 141 may be 5, 6, 7, 10, 11, or 15 or more, and two ends of the connectors 141 respectively abut against the second surface 122 of the first circuit board 12 and the first surface 131 of the second circuit board 13 to achieve communication with the first circuit board 12 and the second circuit board 13. It can be understood that, since the position of the connector 141 can be anywhere between the second circuit board 13 and the first circuit board 12, the position is more flexible, and the overall signal path from the first circuit board 12 to the second circuit board 13 can be ensured to be shorter by the connector 141, so that the signal quality between the first circuit board 12 and the second circuit board 13 is better.

The connecting member 141 may be made of a conductive metal material such as copper, iron, aluminum, etc., and the specific material is not limited, so that the first circuit board 12 and the second circuit board 13 can be electrically connected.

In some embodiments, the first circuit board 12 includes a first pad 123, the second circuit board 13 includes a second pad 133, and the two ends of the connecting member 141 are respectively connected to the first pad 123 and the second pad 133.

Specifically, the first pads 123 and the second pads 133 may be formed by a gold plating process, wherein the first pads 123 are disposed on the second surface 122 of the first circuit board 12, and the second pads 133 are disposed on the first surface 131 of the second circuit board 13. The first pad 123 and the second pad 133 include a plurality of pads, and each of the first pad 123 and the second pad 133 is disposed correspondingly. Both ends of each connecting member 141 are respectively connected to a corresponding first pad 123 and a corresponding second pad 133.

Referring further to fig. 4, in some embodiments, the connection element 141 includes an elastic element 1412 and a contact 1411, wherein the elastic element 1412 is used for abutting the contact 1411 against the first pad 123 and the second pad 133.

Specifically, the plurality of elastic members 1412 and the contact 1411 are symmetrically disposed at both ends of the connection member 141, one end of which is disposed near the first land 123 and the other end of which is disposed near the second land 133. One end of the contact 1411 close to the first pad 123 abuts against the first pad 123, the other end of the contact 1411 is connected with the elastic member 1412, and the elastic member 1412 is in a compressed state, so that elastic deformation is generated to press the contact 1411 against the first pad 123. One end of the contact 1411 close to the second land 133 abuts against the first land 123, the other end of the contact 1411 is connected with the elastic member 1412, the elastic member 1412 is in a compressed state to generate elastic deformation to press the contact 1411 against the second land 133, and thus, the contact 1411 is respectively pressed against the first land 123 and the second land 133 through the elastic member 1412, so that the contact support 14 is connected with the first circuit board 12 and the second circuit board 13 without adopting a welding mode, thereby avoiding poor welding strength caused by a cold joint phenomenon during welding, and effectively buffering the influence of external force, thereby always keeping the contact 1411 reliably connected with the first land 123 and the second land 133. The elastic member 1412 may be a spring.

In some embodiments, the connection element 141 may further include a link 1413, and the elastic element 1412 is fixed to the mounting element 142 by the link 1413, specifically, the link 1413 may be a conductive metal rod passing through the mounting element 142, and one end of the link 1413 is connected to the elastic element 1412 near the first circuit board 12 and the other end is connected to the elastic element 1412 near the second circuit board 13.

Referring further to fig. 3, in some embodiments, the circuit board structure 10 further includes an electronic component 15, and the electronic component 15 is mounted on the first circuit board 12 and the second circuit board 13.

The electronic component 15 may include, but is not limited to, a graphics processor, a central processor, a wireless internet access (Wi-Fi) module, a bluetooth module, or a GPS module, etc. Electronic components 15 may be mounted to the first and second sides of the first circuit board 12, and electronic components 15 may also be mounted to the second side of the second circuit board 13. The electronic components 15 are mounted on the first circuit board 12 and the second circuit board 13 by the SMT pick and place process.

In some embodiments, the second circuit board 13 includes a plurality of second circuit boards 13, and the plurality of second circuit boards 13 are arranged at intervals along the connection direction of the connector 141.

As can be appreciated, as the number of electronic components 15 increases, the first circuit board 12 and the second circuit board 13 may still be unable to accommodate the electronic components 15. Therefore, in order to further increase the amount of accommodation of the electronic components 15 by the circuit board structure 10, a plurality of second circuit boards 13 may be provided at intervals in the connecting direction with the first circuit board 12. And, a contact bracket 14 is further provided between the adjacent second circuit boards 13, so that electrical connection between the plurality of second circuit boards 13 can be achieved.

The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent application shall be subject to the appended claims.

Claims

1. A circuit board structure, comprising:

a circuit board support including opposing first and second mounting walls;

a contact holder mounted to the circuit board holder, the contact holder being positioned between the first mounting wall and the second mounting wall and between the first circuit board and the second circuit board, the contact holder including a connector that respectively abuts against the first circuit board and the second circuit board to electrically connect the first circuit board and the second circuit board; the first circuit board comprises a first bonding pad, the second circuit board comprises a second bonding pad, and two ends of the connecting piece are respectively connected with the first bonding pad and the second bonding pad;

the connecting piece comprises an elastic piece and a contact piece, and the elastic piece is used for enabling the contact piece to abut against the first bonding pad and the second bonding pad;

the contact support further comprises a mounting member disposed at a space between the first circuit board and the second circuit board and mounted on the first mounting wall and the second mounting wall; the connecting piece further comprises a connecting rod, and the elastic piece is fixed on the mounting piece through the connecting rod.

2. The circuit board structure of claim 1, wherein said connector comprises a plurality, and said first pad and said second pad comprise a plurality, each of said connectors corresponding to one of said first pad and one of said second pad, and a plurality of said connectors are disposed opposite to the corresponding ones of said first pad and said second pad.

3. The circuit board structure according to claim 1, wherein the first mounting wall includes a first step surface and a second step surface which are arranged in a staggered manner, the second mounting wall includes a third step surface and a fourth step surface which are arranged in a staggered manner, the first step surface and the third step surface are flush, the second step surface and the fourth step surface are flush, the first circuit board includes a first surface and a second surface which are opposite to each other, the first surface of the first circuit board is respectively arranged in a fit manner with the first step surface and the third step surface, and the first pad is arranged on the second surface of the first circuit board.

4. The circuit board structure of claim 3, wherein the second circuit board includes a first face, the second circuit board is mounted to the second stepped face and the fourth stepped face by screws, and the second land is disposed on the first face of the second circuit board.

5. The circuit board structure of claim 1, wherein the circuit board structure further comprises electronic components mounted on the first circuit board and the second circuit board.

6. The circuit board structure of claim 5, wherein the second circuit board includes a plurality of second circuit boards, the plurality of second circuit boards being arranged at intervals along a connection direction of the connector.

7. An electronic device, characterized in that the electronic device comprises a housing and a circuit board arrangement according to any of claims 1-6, which circuit board arrangement is mounted on the housing.