CN219841938U - Wafer film thickness measuring jig - Google Patents
Wafer film thickness measuring jig Download PDFInfo
- Publication number
- CN219841938U CN219841938U CN202222298821.0U CN202222298821U CN219841938U CN 219841938 U CN219841938 U CN 219841938U CN 202222298821 U CN202222298821 U CN 202222298821U CN 219841938 U CN219841938 U CN 219841938U
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- CN
- China
- Prior art keywords
- movable plate
- wafer
- film thickness
- measuring
- jig
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Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 70
- 239000000523 sample Substances 0.000 claims abstract description 19
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005247 gettering Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- A Measuring Device Byusing Mechanical Method (AREA)
Abstract
The utility model provides a wafer film thickness measuring jig, which comprises a bottom plate, a movable plate and a column. The bottom plate is provided with a runway groove for the movable plate to move. Concentric circle wafer placement areas of wafers with different sizes are arranged on the movable plate and are used for aligning the wafers with different sizes; the movable plate is also provided with a suction pen inlet and outlet groove for the suction pen to pick up and place the wafer. The upright post and the bottom plate are connected into a whole, and a telescopic support rod is arranged on the upright post for adjusting the position of the measuring probe. The telescopic support rod is positioned at a zero point position at ordinary times, corresponds to the center of the movable plate after the position is zeroed, and is used for measuring the film thickness of the center positions with different sizes; and moving the telescopic support rod to the groove with the corresponding size, and rotating the movable plate to measure the film thickness of any point on the equal-diameter circumference of the wafer. The jig has the advantages of being compatible in multiple sizes, capable of efficiently and accurately positioning the center positions and circumferences of wafers with different sizes, guaranteeing the consistency of measurement points, improving the accuracy of data acquisition, and avoiding errors and inefficiency of manual alignment.
Description
Technical Field
The utility model relates to film thickness measurement after a film forming process on a wafer surface, in particular to a wafer film thickness measurement jig.
Background
Semiconductor wafers often have a non-metallic film, such as a polysilicon film (gettering) or a silicon oxide film (back-sealing), grown on the backside of the wafer during fabrication, in order to control the amount of metal impurities in the wafer, or to prevent the escape of metal impurities from the wafer. The thickness of the nonmetallic film affects the gettering effect and the back-sealing effect, so a measuring device is required to precisely control the thickness of the nonmetallic film.
The simple instrument for measuring the waste metal film is sold in the market, and a wafer alignment device is usually not provided, so that a person can manually adjust the measuring point by feel during use. Manual adjustment of measurement points can lead to inconsistency of measurement points of each wafer, and large data fluctuation is unfavorable for accurate monitoring of nonmetallic film thickness and uniformity. For the same wafer with film thickness to be measured, because the process is manually operated, when operators are different each time, the measurement points of the wafer are different; because the wafer surface is not perfectly flat, the non-metallic film grown on the back side of the wafer has non-uniformity; when the measured points are different, the measured film thicknesses are different, and the collected data have errors, so that the yield of the produced products is affected. The manual operation has low working efficiency, large error and larger uncontrollability.
Disclosure of Invention
In order to improve the above situation, the present utility model is directed to a wafer film thickness measuring tool, which can be applied to wafer film thickness measurement, and has the functions of multi-dimension compatibility and accurate control of measuring points. The method avoids data fluctuation caused by searching the test point position by manual alignment, is favorable for accurately controlling the thickness of the film formed on the surface of the wafer, and improves the measurement efficiency.
The aim of the utility model can be achieved by the following technical scheme:
a wafer film thickness measuring jig is used for film thickness measurement after a wafer surface film forming process. The jig comprises: the device comprises a bottom plate, wherein a runway groove is formed on the bottom plate; the movable plate is provided with a plurality of wafer placement areas and a suction pen inlet and outlet groove; the device comprises a stand column, wherein a telescopic support rod is arranged on the stand column, and a plurality of grooves and measuring probes are arranged on the telescopic support rod.
The utility model adopts the technical scheme that: a runway groove is arranged on a bottom plate of the jig and is used for moving the movable plate and positioning the wafer. After the movable plate is zeroed, the center position of the movable plate is just under the position of the measuring probe after the telescopic support rod is zeroed, and the film thickness of the center point of wafers with different sizes can be measured.
The utility model adopts the technical scheme that: the movable plate of the jig is provided with a plurality of wafer placement areas, the wafer placement areas are a plurality of concentric circle clamping grooves and are used for placing wafers with different sizes, and after the position of the movable plate is reset to zero, the center of the wafer with any size can be directly under the probe after the position of the wafer is reset to zero.
The utility model adopts the technical scheme that: the suction pen inlet and outlet groove on the movable plate of the jig is used for taking and placing wafers.
The utility model adopts the technical scheme that: a telescopic support rod is arranged on the upright post of the jig, and a probe and a plurality of grooves are arranged on the telescopic support rod. When the telescopic support rod is at the zero position, the position of the measuring probe is right above the center of the movable plate after the position is reset to zero, and the measuring probe is used for measuring the film thickness of the center positions of wafers with different sizes; in addition, a plurality of grooves are formed in the telescopic supporting rod, the edges of wafers with different sizes correspond to each other, the telescopic supporting rod is moved to the grooves corresponding to the sizes of the wafers during measurement, and the movable plate is rotated, so that the film thickness of the point positions on the circumference of the equal diameter can be measured.
Based on the above, the utility model has the advantages and characteristics that the fixture is used, the functions of measuring point positions are compatible in multiple sizes and accurately controlled, and the situations of inaccurate manual measurement positioning and low efficiency can be avoided.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is an enlarged schematic view of a telescopic strut.
Reference numerals illustrate:
100 bottom plate
101 runway groove
201 upright post
202 telescopic strut
203 measuring probe
301 movable plate
302 suction pen inlet and outlet groove
303 wafer placement area
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be arbitrarily combined with each other.
A wafer film thickness measuring jig is shown in FIG. 1, and is composed of a base plate 100 with a runway groove 101, a column 201 with a telescopic strut 202 and a measuring probe 203, and a movable plate 301 with a suction pen inlet and outlet groove 302 and a wafer placement area 303. When measuring the film thickness of the wafer, a suction pen is used for entering and exiting the groove 302 along the suction pen, and the wafer with the film thickness to be measured is placed in a wafer placement area 303 with a corresponding size on the movable plate 301; the racetrack groove 101 on the base plate 100 is used for placing the movable plate 301, pushing the movable plate 301 to the initial position of zeroing, and the semicircle close to the upright 201 is the zeroing position of the movable plate 301 for positioning the wafer when measuring the thickness. After the movable plate 301 is zeroed, the center position of the movable plate is just under the position of the measuring probe 203 after the telescopic support rod 202 is zeroed, and at the moment, the film thickness of the center point of wafers with different sizes can be measured. The telescopic rod 202 is connected with the jig base plate 100 through the upright post 201, and a measuring probe 203 is placed at one end of the telescopic rod 202, so that a whole is formed; when the telescopic support rod 202 is at the zero position, the position of the measuring probe 203 is right above the center of the movable plate 301 after the position is reset to zero, and the measuring probe is used for measuring the film thickness of the center positions of wafers with different sizes; in addition, the telescopic support rod 202 is provided with a plurality of grooves (fig. 2), corresponding to the edges of wafers with different sizes, the telescopic support rod 202 is moved to the grooves (fig. 2) corresponding to the sizes of the wafers during measurement, and the movable plate is rotated, so that the film thickness of the point positions on the circumference of the constant diameter can be measured. At this time, the telescopic strut 202 is at the initial position, the measuring probe 203 is located right above the center of the movable plate 301, that is, right above the center of the wafer to be measured, and the film thickness at the center point of the wafer is measured; moving the telescopic strut 202 to the groove corresponding to the wafer size, the movable plate 301 is rotated to measure any point on the circumference of the equal diameter of the wafer edge.
The wafer film thickness measuring jig is used in combination with the film thickness measuring instrument, has the functions of multi-dimension compatibility and accurate control of measuring points, and can avoid the conditions of inaccurate manual measurement positioning and low efficiency.
Claims (7)
1. The wafer film thickness measuring jig is used for measuring the thickness of a wafer film and is characterized by comprising a bottom plate, a movable plate and a column, wherein a runway groove is formed in the bottom plate, the movable plate is placed on the runway groove, a plurality of wafer placement areas and a suction pen inlet and outlet groove are formed in the movable plate; the upright post is provided with a telescopic supporting rod, and the telescopic supporting rod is provided with a plurality of grooves and measuring probes.
2. The wafer film thickness measuring jig according to claim 1, wherein the base plate has a race track groove, the long axis of the race track groove has a semicircle at each end and a rectangular race track in the middle.
3. The wafer film thickness measuring jig according to claim 1, wherein the movable plate of the jig, a semicircle near the column is a zeroing position of the movable plate for wafer positioning when measuring thickness; after the movable plate is zeroed, the center position of the movable plate is just under the position of the measuring probe after the telescopic support rod is zeroed, and the film thickness of the center point of wafers with different sizes can be measured.
4. The wafer film thickness measuring jig according to claim 1, wherein the movable plate of the jig has a plurality of wafer placement areas of different sizes and a suction pen in-out slot.
5. The wafer film thickness measuring jig according to claim 1, wherein each wafer placement area of the jig is a concentric circular clamping groove for ensuring that after the movable plate is zeroed, a wafer of whatever size can be placed right under the probe after the movable plate is zeroed.
6. A wafer film thickness measuring jig according to claim 1, wherein the upright of the jig is provided with a telescopic strut for adjusting the position of the measuring probe.
7. The wafer film thickness measuring jig according to claim 1, wherein when the telescopic support rod on the upright post of the jig is at the zero position, the measuring probe is positioned right above the center of the movable plate after the position is zeroed, and is used for measuring the film thickness of the center positions of wafers with different sizes; in addition, a plurality of grooves are formed in the telescopic supporting rod, the edges of wafers with different sizes correspond to each other, the telescopic supporting rod is moved to the grooves corresponding to the sizes of the wafers during measurement, and the movable plate is rotated, so that the film thickness of the point positions on the circumference of the equal diameter can be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222298821.0U CN219841938U (en) | 2022-08-26 | 2022-08-26 | Wafer film thickness measuring jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222298821.0U CN219841938U (en) | 2022-08-26 | 2022-08-26 | Wafer film thickness measuring jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219841938U true CN219841938U (en) | 2023-10-17 |
Family
ID=88301740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222298821.0U Active CN219841938U (en) | 2022-08-26 | 2022-08-26 | Wafer film thickness measuring jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219841938U (en) |
-
2022
- 2022-08-26 CN CN202222298821.0U patent/CN219841938U/en active Active
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