CN213093180U

CN213093180U - Wafer fixing table, film sticking machine and dicing saw

Info

Publication number: CN213093180U
Application number: CN202120624923.XU
Authority: CN
Inventors: 同嘉锡
Original assignee: Xian Eswin Silicon Wafer Technology Co Ltd
Current assignee: Xian Eswin Silicon Wafer Technology Co Ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-04-30
Anticipated expiration: 2031-03-29

Abstract

The utility model discloses a wafer fixed station, sticking film machine and scribing machine, the wafer fixed station includes the base member, notch reference column, first reference column and second reference column, the notch reference column is fixed on the upper surface of base member, the distance of A point is d1 on the central line of notch reference column and the base member, the thickness of highly being less than or equal to wafer of notch reference column, seted up on the upper surface of base member firstly, the second locating hole, it is first, the second reference column detachably is installed respectively first, in the second locating hole, it is first, the distance of A point is d1 on the outer periphery of second reference column and the base member, it is first, the length that the second reference column exposes the base member upper surface all is less than or equal to the thickness of wafer. The film sticking machine and the dicing machine both comprise the wafer fixing table. The utility model provides a wafer fixed station, sticking film machine and scribing machine can pinpoint the wafer to can survey the actual oxygen content that the wafer set for the position.

Description

Wafer fixing table, film sticking machine and dicing saw

Technical Field

The utility model relates to a wafer detects technical field, especially relates to a wafer fixed station to and sticking film machine and scribing machine including this wafer fixed station.

Background

The main processing flow of the silicon polishing piece (such as a 12-inch silicon polishing piece) in the semiconductor field comprises the procedures of crystal growth, barreling, slicing, chamfering, grinding, polishing, cleaning, packaging and the like. Since customers usually have clear requirements on the oxygen content of the final product, and the oxygen content does not change with the progress of the process, the sampling and the detection of the oxygen content are usually performed after the crystal growth process. The method of detecting oxygen content in the semiconductor field is typically fourier infrared measurement (FTIR). According to the method, the content of oxygen in silicon is analyzed by utilizing the optical path difference through different transmissivity of different elements in the silicon. The method has the advantages of simple operation and no damage to the sample, and is widely applied to semiconductor wafer factories. However, for heavily doped wafers (silicon wafers), the infrared absorption of the oxygen element of the wafer itself is masked by the infrared absorption of the high concentration of carriers, so that the absorption peak of the oxygen element cannot be accurately received by FTIR, and therefore, for heavily doped wafers, the measurement cannot be performed by using an FTIR method. Measurements are typically made for heavily doped wafers at this time using Gas Fusion (GFA).

The principle of measuring the oxygen content of the wafer by the gas melting method is as follows: cutting the wafer at the test position into small pieces, and calcining the small pieces into gas by using a graphite crucible; by detecting CO and CO in the gas₂To further calculate the oxygen content in the original wafer sample. The customer specifies the test location, including the distance from the center point and the angle to the Notch opening, when he requests to test the oxygen content of the wafer. In order to cut the wafer, a wafer factory usually uses a dicing saw commonly used in the wafer factory to cut the wafer, the dicing saw uses a microscope to observe and align cutting channels between circuits for positioning aiming at the wafer with the chip circuits after photoetching, and the bare chips cannot be identified and positioned, so that when the wafer is cut, the positions of the selected samples cannot be accurately fixed, the positions of the selected samples have deviation, the accuracy of the measurement result of the oxygen content is influenced, and the measured oxygen content cannot truly reflect the actual oxygen content of the wafer at the positions.

Disclosure of Invention

The utility model aims at providing a wafer fixed station can pinpoint the wafer, when being applied to sticking film machine and scribing machine, can accurately acquire the wafer and set for the small piece of position to survey the wafer and set for the actual oxygen content of position.

In order to realize the above-mentioned purpose, the utility model provides a wafer fixed station, including base member, notch reference column, first locating column and second reference column, the upper surface of base member is the plane, the notch reference column is fixed on the upper surface of base member, the distance of A point is d1 on the central line of notch reference column and the base member, the thickness of highly being less than or equal to wafer of notch reference column, first locating hole and second locating hole have been seted up on the upper surface of base member, first locating column and second reference column detachably install respectively in first locating hole and second locating hole, the outer periphery of first locating column and second reference column with the distance of A point is d1 on the base member, first locating column and second reference column expose the length of base member upper surface all is less than or equal to the thickness of wafer.

Preferably, the distance between the outer circumferential surfaces of the first positioning column and the second positioning column is equal to twice d 1.

Preferably, the wafer fixing station further includes a third positioning column and a fourth positioning column, the upper surface of the base is provided with a third positioning hole and a fourth positioning hole, the third positioning column and the fourth positioning column are respectively detachably mounted in the third positioning hole and the fourth positioning hole, the distances between the outer circumferential surfaces of the third positioning column and the fourth positioning column and the point a on the base are both d2, and the lengths of the third positioning column and the fourth positioning column exposed out of the upper surface of the base are both less than or equal to the thickness of the wafer.

Preferably, the distance between the outer circumferential surfaces of the third positioning column and the fourth positioning column is equal to twice d 2.

Preferably, the notch positioning column, the first positioning column, the second positioning column, the third positioning column and the fourth positioning column are all made of PVDF or C-PVC materials.

Preferably, the base is a rectangular plate.

Preferably, two positioning grooves are formed in the front end face of the base body.

Preferably, the rear end face of the base body is provided with a yielding groove.

The utility model is different from the prior art in that the wafer fixing table provided by the utility model realizes the accurate positioning of the wafer by fixing the notch positioning column on the substrate, and the distance between the central line of the notch positioning column and the point A (such as the central point) on the substrate is d1 (d 1 is the radius of the wafer, such as 150 mm), and simultaneously by forming the first positioning hole and the second positioning hole on the substrate, and installing the first positioning column and the second positioning column in the first positioning hole and the second positioning hole respectively, the distance between the outer circumference of the first positioning column and the second positioning column and the point A on the substrate is d1, when the wafer is placed on the substrate, the notch positioning column is clamped on the notch opening of the wafer, and the edge of the wafer is aligned with the first positioning hole and the second positioning hole, and then the first positioning column and the second positioning column are placed into the first positioning hole and the second positioning hole respectively, therefore, the distance between each point on the wafer and the center point of the wafer and the angle between the point on the wafer and the notch opening can be determined, a small-size sample with a fixed position and a fixed crystalline phase can be obtained after film pasting and scribing processing, and the oxygen content concentration of the heavily doped wafer can be accurately obtained by measuring the sample by using an air melting method. Therefore the utility model provides a wafer fixed station can be to wafer pinpoint, when being applied to sticking film machine and scribing machine, can accurately acquire the wafer and set for the small piece of position to survey the wafer and set for the actual oxygen content of position.

Another object of the utility model is to provide a sticking film machine can realize the accurate positioning of wafer.

In order to achieve the above purpose, the technical solution of the present invention is realized as follows:

the utility model provides a film sticking machine, includes objective table, film book and foretell wafer fixed station, the film book is rotationally installed the one end of objective table, the mounting groove has been seted up on the objective table, wafer fixed station detachably installs in the mounting groove.

Yet another object of the present invention is to provide a dicing saw, which can accurately obtain the small piece of the wafer setting position, thereby measuring the actual oxygen content of the wafer setting position.

the utility model provides a dicing saw, includes the frame, installs transmission on the frame, install last scribing sword of transmission and foretell wafer fixed station, the mounting groove has been seted up on the frame, wafer fixed station detachably installs in the mounting groove.

The laminator and the dicing saw have the same technical advantages as the wafer fixing table in the prior art, and are not described herein again.

Drawings

Fig. 1 is a schematic structural diagram of a wafer fixing stage according to an embodiment of the present invention;

FIG. 2 is a rear view of the wafer mount;

FIG. 3 is a schematic structural view of a film sticking machine provided by the present invention;

FIG. 4 is a schematic view of a film structure of a wafer mounted on a wafer mounting table;

in the drawings, the components represented by the respective reference numerals are listed below:

1-wafer fixing table; 11-a substrate; 12-notch positioning column; 13-a first positioning column; 14-a second positioning column; 15-a first locating hole; 16-a second positioning hole; 17-a third positioning column; 18-a fourth positioning post; 19-a third positioning hole; 20-a fourth positioning hole;

21-a positioning groove; 3-a wafer; 4-an object stage; 5-film roll; 51-film.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

Referring to fig. 1 as appropriate, the wafer fixing stage according to the basic embodiment of the present invention includes a base 11, a notch positioning column 12, a first positioning column 13, and a second positioning column 14.

The substrate 11 is used for mounting a notch positioning column 12, a first positioning column 13 and a second positioning column 14, and for bearing the wafer 3 (silicon wafer), and may be made of PVDF or C-PVC material, so as to prevent the wafer 3 from being damaged or contaminated. The PVDF, i.e., polyvinylidene fluoride, is a highly non-reactive thermoplastic fluoropolymer; the C-PVC, namely chlorinated polyvinyl chloride, is a chlorinated modified product of PVC (polyvinyl chloride), and the chlorine content in the C-PVC can reach 66.5-74%. The matrix 11 made of PVDF or C-PVC material has excellent high temperature resistance and corrosion resistance, smooth surface and small mass.

The upper surface of base member 11 is the plane, notch reference column 12 is fixed on the upper surface of base member 11. The notch positioning column 12 may be integrated with the base 11, or may be fixed to the base 11 by means of adhesion or the like. The distance between the central line of the notch positioning column 12 and the point A on the substrate 11 is d 1. The point a may be the center point of the substrate 11, or may be another suitable point on the substrate 11. Where the distance d1 is determined based on the diameter of the wafer, d1 is half the diameter of the wafer, so that different sizes of wafers correspond to different values of d1, e.g., when the wafer diameter is 300mm, d1 is 150 mm; when the wafer diameter is 450 mm, d1 is 225 mm. The height of the notch positioning column 12 is smaller than or equal to the thickness of the wafer 3, that is, the top end of the notch positioning column 12 is lower than the upper surface of the wafer 3 placed on the substrate 11, or is flush with the upper surface of the wafer 3 placed on the substrate 11, so as to prevent the blue film from being attached to the wafer 3 when the wafer 3 is subjected to film attaching. The diameter of the notch positioning column 12 is determined according to the size of the notch opening on the wafer, and when the notch positioning column 12 is clamped on the notch opening, the distance between the central line of the notch positioning column 12 and the central point of the wafer 3 is equal to d 1. The notch is a small cut on a silicon ingot with the diameter of more than 200mm, and is used for marking the crystal orientation of the growing single crystal and helping to determine the arrangement position of a wafer in the subsequent process.

A first positioning hole 15 and a second positioning hole 16 are formed in the upper surface of the base 11, the first positioning column 13 and the second positioning column 14 are respectively detachably mounted in the first positioning hole 15 and the second positioning hole 16, the distances between the outer circumferential surfaces of the first positioning column 13 and the second positioning column 14 and the point a on the base 11 are both d1, and the lengths of the first positioning column 13 and the second positioning column 14 exposed out of the upper surface of the base 11 are both smaller than or equal to the thickness of the wafer 3. Wherein the size of the first positioning hole 15 may be slightly larger than the size of the first positioning column 13, for example, the diameter of the first positioning hole 15 may be 0.1mm larger than the diameter of the first positioning column 13; similarly, the size of the second positioning hole 16 may be slightly larger than the size of the second positioning pillar 14, for example, the diameter of the second positioning hole 16 may be 0.1mm larger than the diameter of the second positioning pillar 14; the size of the positioning hole is set to be slightly larger than that of the positioning column, so that the positioning column can be conveniently disassembled and assembled, and the positioning column can be suitable for fixing the wafer 3 with small fluctuation in diameter.

When the wafer fixing station provided by the above basic embodiment is used, the wafer 3 is clamped by the wafer clamping tool, the wafer 3 is placed on the substrate 11, the notch opening of the wafer 3 is clamped on the notch positioning column 12, the edge of the wafer 3 is approximately aligned with the first positioning hole 15 and the second positioning hole 16, and then the first positioning column 13 and the second positioning column 14 are respectively placed in the first positioning hole 15 and the second positioning hole 16, so that the wafer 3 is positioned. Since the wafer holding stage positions the wafer 3 by the notch positioning posts 12 on the base 11, and the center line of notch positioning column 12 is at a distance d1 from point a on substrate 11, meanwhile, the distance between the outer circumferential surfaces of the first positioning column 13 and the second positioning column 14 and the point a on the substrate 11 is also d1, therefore, when the wafer 3 is placed on the substrate 11, the notch opening of the wafer 3 is positioned by the notch positioning post 12, and at the same time, by positioning the first positioning column 13 and the second positioning column 14, the center point of the wafer 3 can be aligned with the point a on the substrate 11, so that the accurate positioning of the wafer 3 can be realized, so that the distance from each point on the wafer 3 to the center point of the wafer 3 and the angle to the notch can be determined, after film pasting and scribing processing are carried out, a small-size sample with a fixed position and a fixed crystalline phase can be obtained, and the accurate oxygen content concentration of the heavily doped wafer can be obtained by using the sample to carry out measurement by using an air fusion method.

In the present invention, the first positioning column 13 and the second positioning column 14 may be disposed at any suitable positions on the edge of the wafer 3. Preferably, as shown in fig. 1, the distance between the outer circumferential surfaces of the first positioning column 13 and the second positioning column 14 is equal to twice d1, that is, the first positioning column 13 and the second positioning column 14 are located on the extension line of the diameter of the wafer 3, so that the wafer placed on the substrate 11 can be better fixed.

Since the sampling station is in front of the wafer and there is a certain difference in diameter at different positions of the wafer, for example, corresponding to 300mm wafers, the diameter of the wafer varies between 300 and 301mm, therefore, in order to make the wafer fixing station provided by the present invention suitable for the wafer with larger size, it is further preferable that the wafer fixing station further includes a third positioning column 17 and a fourth positioning column 18, as shown in fig. 1 and 2, a third positioning hole 19 and a fourth positioning hole 20 are formed on the upper surface of the base 11, the third positioning column 17 and the fourth positioning column 18 are detachably mounted in the third positioning hole 19 and the fourth positioning hole 20 respectively, the distances between the outer circumferential surfaces of the third positioning column 17 and the fourth positioning column 18 and the point a on the base 11 are both d2, the lengths of the third positioning columns 17 and the fourth positioning columns 18 exposed out of the upper surface of the substrate 11 are both less than or equal to the thickness of the wafer 3. Where the distance d2 is determined based on the maximum diameter of the wafer, d2 is half the maximum diameter of the wafer, e.g., d2 is 150.5 mm when the maximum diameter of the wafer is 301 mm. Similarly, the size of the third positioning hole 19 may be slightly larger than that of the third positioning column 17, and the size of the fourth positioning hole 20 may be slightly larger than that of the fourth positioning column 18.

Because the notch is formed by cutting the wafer column, after the notch of the wafer at different positions on the wafer column is positioned by the notch positioning column, the distance between the central line of the notch positioning column and the central point of the wafer is kept unchanged. Therefore, when wafers at different positions on the same wafer cylinder are fixed, the distance between the center line of the notch positioning column and the point A can be kept unchanged. Therefore, in the above embodiment, the positions of the wafers can be accurately determined by the notch positioning column 12, the third positioning column 17, and the fourth positioning column 18.

It is further preferable that the distance between the outer circumferential surfaces of the third positioning column 17 and the fourth positioning column 18 is equal to twice d2, that is, the third positioning column 17 and the fourth positioning column 18 are located on an extension line of the diameter of the wafer 3, so as to better position the wafer 3.

The utility model discloses in, for protection wafer 3 does not receive the pollution or damage, it is the same with base member 11, notch reference column 12, first reference column 13, second reference column 14, third reference column 17 and fourth reference column 18 all adopt PVDF or C-PVC material preparation.

In the present invention, the base body 11 can be selected from various shapes, preferably, the base body 11 is a rectangular plate so as to be easily installed in the installation groove of the laminator or the slicer.

When the mounting groove size of sticking film machine or slicer is great, though wafer fixed station 1 can install in the mounting groove very easily, but wafer fixed station 1 location is more difficult, on this basis in the preferred embodiment of the utility model, as shown in fig. 1 set up two constant head tanks 21 on the preceding terminal surface of base member 11, with two constant head tanks 21 and the mounting groove of sticking film machine or slicer in the locating lever cooperation, can conveniently fix a position the wafer fixed station.

In another preferred embodiment of the present invention, a recess is formed on the rear end surface of the base 11. The relief groove extends up and down through the substrate 11 and is spaced from the point a on the substrate 11 by a distance less than d1 so that when the wafer 3 is placed on the substrate 11 by a holding tool (e.g., tweezers), the holding tool can be partially received in the relief groove to facilitate placement of the wafer 3.

The utility model discloses in, the size of first locating hole 15, second locating hole 16, third locating hole 19, fourth locating hole 20, first reference column 13, second reference column 14, third reference column 17, fourth reference column 18 and notch reference column 12 can adopt any suitable size, as long as can realize that wafer 3 fixes a position can. For example, the diameters of the first positioning hole 15, the second positioning hole 16, the third positioning hole 19 and the fourth positioning hole 20 are all 1mm, and the depths thereof are all 1 mm; the diameters of the first positioning column 13, the second positioning column 14, the third positioning column 17 and the fourth positioning column 18 are all 0.9 mm, and the lengths are all 1.5 mm; the diameter of notch positioning post 12 is 1 millimeter, and the height is 0.5 millimeter.

On the basis of the above embodiment, as shown in fig. 3, the utility model also provides a film sticking machine, this film sticking machine includes objective table 4, film book 5 and wafer fixed station 1. Wherein the object stage 4 is used for installing the film roll 5, the wafer fixing stage 1 and other components. The film roll 5 is rotatably mounted at one end of the objective table 4, a mounting groove is formed in the objective table 4, and the wafer fixing table 1 is detachably mounted in the mounting groove. When the film sticking machine is used, the wafer fixing table 1 is firstly placed on the installation groove, then the wafer 3 is placed on the wafer fixing table 1, the placing mode of the wafer 3 is the same as that described in the embodiment, and then the film 51 (such as blue film) on the film roll 5 is pulled out and covered on the wafer 3 and the wafer fixing table in a manual or automatic mode, as shown in fig. 4.

The utility model also provides a dicing saw, include the frame, install transmission on the frame, install last scribing sword of transmission and the wafer fixed station 1 of record in the above-mentioned embodiment. Wherein the transmission device comprises an x-direction transmission device and a y-direction transmission device so as to realize the movement of the scribing knife on the base along the x direction and the y direction. The x-direction transmission device and the y-direction transmission device can use the existing screw nut structure, or can use a stepping motor and the like which can output linear motion. The dicing blade may be rotated by a motor to dice the wafer 3, or the dicing blade may employ a laser cutting head. The base is provided with an installation groove, and the wafer fixing table 1 is detachably installed in the installation groove. When the dicing saw is used, the wafer fixing table 1 which is already pasted with films and is provided with the wafer 3 can be placed in the mounting groove, and then the dicing blade is driven to cut the wafer.

To sum up, the utility model provides a wafer fixed station 1 can fix the wafer (for example 12 inches bare chip) of various sizes on base member 11, after carrying out pad pasting, scribing processing, can obtain the small-size sample of fixed position, fixed crystalline phase, uses this sample to utilize the gas melting method to measure, can obtain the accurate oxygen content concentration of heavily mixing the wafer.

In the description of the present invention, it should be understood that the terms "inside" and "outside" are used for indicating the orientation or the positional relationship based on the orientation or the positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but not for indicating or implying that the indicated device must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts or intervening parts. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. The wafer fixing table is characterized by comprising a base body (11), a notch positioning column (12), a first positioning column (13) and a second positioning column (14), wherein the upper surface of the base body (11) is a plane, the notch positioning column (12) is fixed on the upper surface of the base body (11), the distance between the center line of the notch positioning column (12) and the point A on the base body (11) is d1, the height of the notch positioning column (12) is smaller than or equal to the thickness of a wafer (3), a first positioning hole (15) and a second positioning hole (16) are formed in the upper surface of the base body (11), the first positioning column (13) and the second positioning column (14) are detachably installed in the first positioning hole (15) and the second positioning hole (16) respectively, the distance between the outer circumferential surfaces of the first positioning column (13) and the second positioning column (14) and the point A on the base body (11) is d1, the lengths of the first positioning column (13) and the second positioning column (14) exposed out of the upper surface of the substrate (11) are smaller than or equal to the thickness of the wafer (3).

2. The wafer holder as claimed in claim 1, wherein the distance between the outer circumferential surfaces of the first positioning post (13) and the second positioning post (14) is equal to twice d 1.

3. The wafer fixing table according to claim 1, further comprising a third positioning column (17) and a fourth positioning column (18), wherein a third positioning hole (19) and a fourth positioning hole (20) are formed in the upper surface of the base (11), the third positioning column (17) and the fourth positioning column (18) are detachably mounted in the third positioning hole (19) and the fourth positioning hole (20), distances between the outer circumferential surfaces of the third positioning column (17) and the fourth positioning column (18) and a point a on the base (11) are d2, and lengths of the third positioning column (17) and the fourth positioning column (18) exposed out of the upper surface of the base (11) are less than or equal to the thickness of the wafer (3).

4. The platen as claimed in claim 3, wherein the distance between the outer circumferential surfaces of the third positioning pillars (17) and the fourth positioning pillars (18) is equal to twice d 2.

5. The wafer fixing table according to claim 3, wherein the notch positioning column (12), the first positioning column (13), the second positioning column (14), the third positioning column (17) and the fourth positioning column (18) are all made of PVDF or C-PVC materials.

6. Wafer table according to any of claims 1-5, characterized in that the base (11) is a rectangular plate.

7. A platen as claimed in claim 6, wherein the base (11) has two locating grooves (21) formed in its front face.

8. The platen according to claim 7, wherein the rear end face of the base (11) is formed with a relief groove.

9. A film sticking machine is characterized by comprising an object stage (4), a film roll (5) and a wafer fixing stage (1) according to any one of claims 1-8, wherein the film roll (5) is rotatably arranged at one end of the object stage (4), a mounting groove is formed in the object stage (4), and the wafer fixing stage (1) is detachably arranged in the mounting groove.

10. A dicing saw, comprising a base, a transmission device mounted on the base, a dicing blade mounted on the transmission device, and a wafer fixing stage (1) according to any one of claims 1 to 8, wherein the base is provided with a mounting groove, and the wafer fixing stage (1) is detachably mounted in the mounting groove.