CN219834452U - Printed circuit board with heat conduction structure - Google Patents
Printed circuit board with heat conduction structure Download PDFInfo
- Publication number
- CN219834452U CN219834452U CN202320374693.5U CN202320374693U CN219834452U CN 219834452 U CN219834452 U CN 219834452U CN 202320374693 U CN202320374693 U CN 202320374693U CN 219834452 U CN219834452 U CN 219834452U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- support
- fixedly connected
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000009434 installation Methods 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a printed circuit board with a heat conduction structure, and relates to the field of printed circuit boards. The printed circuit board with the heat conducting structure comprises a board body, wherein an installation sleeve is sleeved on the surface of the board body, a first support is fixedly connected with the upper surface of the installation sleeve, a first radiating fin is fixedly connected with the upper surface of the first support, a second support is fixedly connected with the lower surface of the installation sleeve, and a second radiating fin is fixedly connected with the lower surface of the second support. This printed circuit board with heat conduction structure, through installing cover, first support, first fin, second support, second fin, push pedal, guide arm, spacing groove, spring and the pull rod between mutually supporting, reach and can provide heat conduction cooling effect for printed circuit board, easily install the heat conduction structure on the circuit board of different thickness simultaneously and use, solved current printed circuit board in use and easily produced higher temperature, the problem that continuous high temperature environment can cause the circuit board to damage.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a printed circuit board with a heat conduction structure.
Background
PCB (PrintedCircuitBoard) the Chinese name printed circuit board, also called printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrically interconnecting electronic components. Because it is made by electronic printing, it is called "printed" circuit board, and the current printed circuit board is easy to generate higher temperature in use, and the continuous high temperature environment can cause the damage of circuit board.
Disclosure of Invention
The utility model aims to provide a printed circuit board with a heat conduction structure, which solves the problem that the current printed circuit board is easy to generate higher temperature in use and the circuit board is damaged in a continuous high-temperature environment.
Technical proposal
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a printed circuit board with heat conduction structure, includes the plate body, the installation cover has been cup jointed on the surface of plate body, the last fixed surface of installation cover is connected with first support, the last fixed surface of first support is connected with first fin, the lower fixed surface of installation cover is connected with the second support, the lower fixed surface of second support is connected with the second fin, the interior bottom wall fixedly connected with spring of installation cover, the top fixedly connected with push pedal of spring, the upper surface of push pedal and the lower surface overlap joint of plate body.
Further, a pull rod is fixedly connected to the right side of the push plate.
Further, a limit groove is formed in the inner bottom wall of the mounting sleeve, a guide rod is movably connected in the limit groove, and the top end of the guide rod is fixedly connected with the lower surface of the push plate.
The utility model provides a printed circuit board with a heat conducting structure. The beneficial effects are as follows:
this printed circuit board with heat conduction structure, through installing cover, first support, first fin, second support, second fin, push pedal, guide arm, spacing groove, spring and the pull rod between mutually supporting, reach and can provide heat conduction cooling effect for printed circuit board, easily install the heat conduction structure on the circuit board of different thickness simultaneously and use, solved current printed circuit board in use and easily produced higher temperature, the problem that continuous high temperature environment can cause the circuit board to damage.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a front view of the structure of the present utility model.
The novel heat exchanger comprises a plate body 1, a mounting sleeve 2, a first bracket 3, a first radiating fin 4, a second bracket 5, a second radiating fin 6, a push plate 7, a guide rod 8, a limit groove 9, a spring 10 and a pull rod 11.
Detailed Description
As shown in fig. 1-2, the embodiment of the utility model provides a printed circuit board with a heat conducting structure, which comprises a board body 1, wherein the surface of the board body 1 is sleeved with a mounting sleeve 2, the upper surface of the mounting sleeve 2 is fixedly connected with a first bracket 3, the upper surface of the first bracket 3 is fixedly connected with a first radiating fin 4, the lower surface of the mounting sleeve 2 is fixedly connected with a second bracket 5, the lower surface of the second bracket 5 is fixedly connected with a second radiating fin 6, the inner bottom wall of the mounting sleeve 2 is fixedly connected with a spring 10, the top end of the spring 10 is fixedly connected with a push plate 7, the right side of the push plate 7 is fixedly connected with a pull rod 11, the inner bottom wall of the mounting sleeve 2 is provided with a limit groove 9, the inside of the limit groove 9 is movably connected with a guide rod 8, the top end of the guide rod 8 is fixedly connected with the lower surface of the push plate 7, and the upper surface of the push plate 7 is lapped with the lower surface of the board body 1.
Working principle: the pull rod 11 is pulled downwards to insert the plate body 1 into the installation sleeve 2, then the pull rod 11 is released, at the moment, the spring 10 releases the elastic force to push the push plate 7 to move upwards, the push plate 7 can prop against the surface of the plate body 1, so that the installation sleeve 2 is fixed on the surface of the plate body 1, and when the plate body 1 works and generates temperature, the temperature can be absorbed and dispersed by the first bracket 3, the first radiating fin 4, the second bracket 5 and the second radiating fin 6.
Claims (3)
1. Printed circuit board with heat conduction structure, including plate body (1), its characterized in that: the mounting sleeve (2) has been cup jointed on the surface of plate body (1), the last fixed surface of installation sleeve (2) is connected with first support (3), the last fixed surface of first support (3) is connected with first fin (4), the lower fixed surface of installation sleeve (2) is connected with second support (5), the lower fixed surface of second support (5) is connected with second fin (6), the interior bottom wall fixedly connected with spring (10) of installation sleeve (2), the top fixedly connected with push pedal (7) of spring (10), the upper surface of push pedal (7) and the lower surface overlap joint of plate body (1).
2. A printed circuit board with thermally conductive structure as claimed in claim 1 wherein: the right side of the push plate (7) is fixedly connected with a pull rod (11).
3. A printed circuit board with thermally conductive structure as claimed in claim 1 wherein: the inner bottom wall of the mounting sleeve (2) is provided with a limit groove (9), the inside of the limit groove (9) is movably connected with a guide rod (8), and the top end of the guide rod (8) is fixedly connected with the lower surface of the push plate (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320374693.5U CN219834452U (en) | 2023-03-03 | 2023-03-03 | Printed circuit board with heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320374693.5U CN219834452U (en) | 2023-03-03 | 2023-03-03 | Printed circuit board with heat conduction structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219834452U true CN219834452U (en) | 2023-10-13 |
Family
ID=88277187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320374693.5U Active CN219834452U (en) | 2023-03-03 | 2023-03-03 | Printed circuit board with heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219834452U (en) |
-
2023
- 2023-03-03 CN CN202320374693.5U patent/CN219834452U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |