CN219737596U - High-frequency small Pitch coaxial test socket - Google Patents
High-frequency small Pitch coaxial test socket Download PDFInfo
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- CN219737596U CN219737596U CN202321200629.1U CN202321200629U CN219737596U CN 219737596 U CN219737596 U CN 219737596U CN 202321200629 U CN202321200629 U CN 202321200629U CN 219737596 U CN219737596 U CN 219737596U
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- guide frame
- hole
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- 238000012360 testing method Methods 0.000 title claims abstract description 50
- 239000003292 glue Substances 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 5
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Abstract
The utility model belongs to the technical field of chip test application, and particularly discloses a high-frequency small Pitch coaxial test socket which comprises a power spring pin, a chip positioning cavity, a plurality of signal spring pin through grooves, a power spring pin slot, a socket upper cover with a through hole, a socket lower cover plate with a through hole, an inner hexagon screw, a gasket, a nut and the like. The utility model has the beneficial effects that: the combined design structure is adopted for the socket guide frame, the socket lower cover plate with the through holes and the like which are matched for use, so that the combined type socket guide frame is convenient to manufacture and assemble and use rapidly; the socket guide frame, the socket lower cover plate with the through holes and the like adopt all-metal design structures, so that the crosstalk influence in the test is effectively reduced, and the socket guide frame has higher strength and good thermal conductivity and manufacturability; the through hole socket upper cover fixed orifices, the glue layer in the through hole socket lower cover plate fixed orifices can also ensure the accurate alignment of the signal spring needle in the chip positioning cavity on the basis of improving the assembly property, ensure the impedance characteristic of the signal transmission path and meet the high-frequency signal requirement.
Description
Technical Field
The utility model belongs to the technical field of chip test application, and particularly relates to a high-frequency small Pitch coaxial test socket which is suitable for coaxial test of high-frequency 0.50mm Pitch.
Background
The coaxial test socket is a component for testing by placing the DDR chip in the test socket and transmitting test data to test equipment, namely, in the production and manufacture process of the DDR chip, the simulation environment test is carried out to realize the high-standard production and manufacture of the DDR chip
The existing coaxial test socket has the following defects: 1. signal loss during transmission; 2. the impedance matching is very poor; 3. the distance between the chip balls is more and more near, and the structural design is inconvenient, so that the problems of inaccurate functional test data, low detection efficiency and the like are directly caused.
Based on the above problems, the present utility model provides a high frequency small Pitch coaxial test socket.
Disclosure of Invention
The utility model aims to: aiming at the defects of the prior art, the utility model provides the high-frequency small Pitch coaxial test socket, which meets the increasing demands of small Pitch high-speed data and analog integrated circuits, solves the loss of high-frequency signals in the transmission process, meets the demand of accurate impedance matching in the transmission process, and solves the detection problem of high-performance chips with high performance but pin ball spacing of 0.50mm in the current market.
The technical scheme is as follows: the utility model provides a high-frequency small Pitch coaxial test socket, which comprises a power spring needle, a signal spring needle, a socket guide frame, a chip body to be tested and a chip tin ball, wherein a chip positioning cavity is arranged in the symmetrical central line of the socket guide frame, a plurality of signal spring needle through grooves are arranged in the chip positioning cavity, power spring needle slots are arranged on the outer layer of the plurality of signal spring needle through grooves in the chip positioning cavity, a socket upper cover with a through hole is arranged on the bottom surface of the chip positioning cavity, a socket lower cover plate with a through hole is arranged on the bottom surface of the socket upper cover with a through hole, socket guide frame fixing holes, socket upper cover fixing holes with a through hole and socket lower cover plate with a through hole are respectively arranged on the outer layers of the socket guide frame, the socket upper cover with a through hole and the socket lower cover plate with a through hole, and the socket upper cover fixing holes with a through hole are assembled by using inner hexagon screws, gaskets and fastening nuts; the power spring needle and the signal spring needle are respectively placed in the signal spring needle through groove and the power spring needle slot in the vertical direction, the chip body to be tested is placed in the chip positioning cavity, one end of the crown of the power spring needle and one end of the crown of the signal spring needle are respectively contacted with the chip solder balls on one surface of the chip body to be tested, and the arc head of the power spring needle and the arc head of the signal spring needle are respectively contacted with the test PCB.
According to the technical scheme, the size of the signal spring needle through groove is smaller than that of the power spring needle slot; wherein, the surface of the power spring pin slot is plated with an oxidation insulating layer.
According to the technical scheme, the high-frequency small Pitch coaxial test socket further comprises a glue layer which is injected into the inner wall of the upper cover fixing hole of the socket with the through hole and the inner wall of the lower cover plate fixing hole of the socket with the through hole.
According to the technical scheme, the high-frequency small Pitch coaxial test socket further comprises socket guide frame pin holes, socket upper covers with holes, socket lower cover plate pin holes with holes, and pins for limiting assembly of the socket guide frame, the socket upper covers with holes and the socket lower cover plate through the socket guide frame pin holes, the socket upper covers with holes and the socket lower cover plate pin holes with holes.
According to the technical scheme, the high-frequency small Pitch coaxial test socket further comprises socket guide frame screw holes and socket upper cover screw holes which are arranged in the socket guide frame and the socket upper cover with the through holes in a contraposition mode, and bolts for fixedly assembling the socket guide frame and the socket upper cover with the through holes through the socket guide frame screw holes and the socket upper cover screw holes.
According to the technical scheme, the high-frequency small Pitch coaxial test socket further comprises a flat head screw hole of the upper cover of the through hole socket, a flat head screw hole of the lower cover plate of the through hole socket and a flat head screw fixedly assembled with the upper cover of the through hole socket and the lower cover plate of the through hole socket.
Compared with the prior art, the high-frequency small Pitch coaxial test socket has the beneficial effects that: 1. the combined design structure is adopted, so that the combined type socket guide frame, the upper cover with the through holes, the lower cover plate with the through holes and the like are convenient to manufacture and assemble and use rapidly; 2. the socket guide frame, the upper cover with the through holes, the lower cover plate with the through holes and the like are of all-metal design structures, so that the crosstalk influence in the test is effectively reduced, and the socket guide frame has higher strength and good thermal conductivity and manufacturability; 3. the upper cover fixing hole of the socket with the through hole and the glue layer (made of low dielectric constant material) in the lower cover plate fixing hole of the socket with the through hole can also ensure accurate alignment of the signal spring needle in the chip positioning cavity on the basis of improving the assembly property, ensure the impedance characteristic of a signal transmission path and meet the requirement of high-frequency signals (make up the defects of a plastic socket).
Drawings
In order to more clearly describe the embodiments of the present utility model or the technical solutions in the prior art, the following will be made
The drawings that are required for the embodiments are briefly described, and it is apparent that the drawings in the following description are merely some embodiments of the present utility model and that other drawings may be obtained from these drawings without inventive effort to those of ordinary skill in the art.
FIG. 1 is a schematic diagram of a split front view of a high frequency small Pitch coaxial test socket of the present utility model;
FIG. 2a is a schematic diagram showing the structure of the chip body to be tested, the chip solder ball, the power spring pins, the signal spring pins and the like before pressing during testing;
FIG. 2b is a schematic diagram showing the structure of the chip body to be tested, the chip solder ball, the power spring pins, the signal spring pins and the like after pressing during testing;
wherein, the serial numbers in the figure are as follows: 1-power spring pins, 11-chip tin balls, 13-flat head screws, 13-bolts, 2-signal spring pins, 3-socket guide frames, 31-signal spring pin through slots, 32-power spring pin slots, 33-socket guide frame fixing holes, 34-socket guide frame screw holes, 35-glue layers, 36-socket guide frame pin holes, 37-chip positioning cavities, 38-oxidation insulating layers, 4-through hole socket lower cover plates, 41-through hole socket lower cover plate fixing holes, 42-through hole socket lower cover plate pin holes, 43-through hole socket lower cover plate flat head screw holes, 5-through hole socket upper covers, 51-through hole socket upper cover fixing holes, 52-through hole socket upper cover screw holes, 53-through hole socket upper cover pin holes, 54-through hole socket upper cover flat head screw holes, 6-hexagon screws, 7-pins, 8-chip bodies to be measured, 9-gaskets and 10-nuts.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present utility model are included in the protection scope of the present utility model.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms of "top", "bottom", "one side", "the other side", "front", "rear", "middle portion", "inner", "top", "bottom", etc., are directions or positional relationships based on the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Example 1
The high-frequency small Pitch coaxial test socket shown in fig. 1, 2a and 2b comprises a power spring pin 1, a signal spring pin 2, a socket guide frame 3, a chip body 8 to be tested and a chip tin ball 11,
a chip positioning cavity 37 is arranged in the symmetrical center line of the socket guide frame 3,
a plurality of signal spring needle through grooves 31 are arranged in the chip positioning cavity 37,
the chip positioning cavity 37 is internally provided with a power spring pin slot 32 at the outer layer of the signal spring pin through slots 31,
the bottom surface of the chip positioning cavity 37 is provided with a socket upper cover 5 with a through hole,
the bottom surface of the upper cover 5 with the through hole is provided with a lower cover plate 4 with the through hole,
the outer layers of the socket guide frame 3, the upper socket cover 5 and the lower socket cover plate 4 are respectively provided with a socket guide frame fixing hole 33, an upper socket cover fixing hole 51 and a lower socket cover plate fixing hole 41,
the socket guide frame 3, the socket upper cover 5 with the through holes, the socket lower cover plate 4 with the through holes are fastened and assembled through the socket guide frame fixing holes 33, the socket upper cover fixing holes 51 with the through holes and the socket lower cover plate fixing holes 41 with the through holes by using the socket head cap screws 6, the gaskets 9 and the nuts 10.
The power spring needle 1 and the signal spring needle 2 are respectively vertically placed in the signal spring needle through groove 31 and the power spring needle slot 32, the chip body 8 to be tested is placed in the chip positioning cavity 37, one end of a crown of the power spring needle 1 and one end of a crown of the signal spring needle 2 are respectively contacted with the chip solder ball 11 on one surface of the chip body 8 to be tested, and the arc head of the power spring needle 1 and the arc head of the signal spring needle 2 are respectively contacted with a test PCB (neither of which is marked in a test PCB diagram and does not affect the disclosure of the technical scheme of the utility model).
In addition, the preferred signal pogo pin through slot 31 is smaller in size than the power pogo pin slot 32; wherein, the surface of the power spring pin slot 32 is plated with an oxide insulating layer 38 to meet the impedance matching in the transmission process and the high-frequency signal requirement.
Example two
On the basis of the first embodiment, the high-frequency small Pitch coaxial test socket further comprises a glue layer 35 injected into the inner wall of the upper cover fixing hole 51 of the socket with the through hole and the lower cover fixing hole 41 of the socket with the through hole, and the glue layer 35 isolates the signal spring needle 2 from the upper cover fixing hole 51 of the socket with the through hole and the lower cover fixing hole 41 of the socket with the through hole, so that the impedance characteristic of a signal transmission path is ensured, and the signal spring needle 2 is inserted into the glue layer 35 (hole-shaped) during assembly.
In addition, the preferred high-frequency small Pitch coaxial test socket further comprises socket guide frame pin holes 36, socket upper cover pin holes 53 and socket lower cover plate pin holes 42 which are arranged in the socket guide frame 3, the socket upper cover 5 and the socket lower cover plate 4 in an aligned mode, and pins 7 which are used for limiting and assembling the socket guide frame 3, the socket upper cover 5 and the socket lower cover plate 4 through the socket guide frame pin holes 36, the socket upper cover pin holes 53 and the socket lower cover plate pin holes 42, so that quick assembly and disassembly dimension detection of the socket guide frame 3, the socket upper cover 5 and the socket lower cover plate 4 are realized.
In addition, the preferred high-frequency small Pitch coaxial test socket further comprises socket guide frame screw holes 34 and socket upper cover screw holes 52 which are arranged in the socket guide frame 3 and the socket upper cover 5 in a counterpoint mode, and bolts 13 for fixedly assembling the socket guide frame 3 and the socket upper cover 5 through the socket guide frame screw holes 34 and the socket upper cover screw holes 52, so that quick assembly and disassembly maintenance of the socket guide frame 3 and the socket upper cover 5 with holes is realized.
In addition, the coaxial test socket of preferred high frequency little Pitch still includes counterpoint setting up band-pass hole socket upper cover flat screw hole 54, band-pass hole socket lower cover plate flat screw hole 43 in band-pass hole socket upper cover 5, band-pass hole socket lower cover plate 4 to and through band-pass hole socket upper cover flat screw hole 54, band-pass hole socket lower cover plate flat screw hole 43 with band-pass hole socket upper cover 5, band-pass hole socket lower cover plate 4 fixed assembly's flat screw 12, realizes band-pass hole socket upper cover 5, band-pass hole socket lower cover plate 4's quick combination assembly and dismantles and examines the dimension.
The working principle or the structural principle of the high-frequency small Pitch coaxial test socket with the structure is as follows:
firstly, the power spring needle 1 and the signal spring needle 2 are vertically assembled into a power spring needle slot 32 and a signal spring needle through slot 31 of an upper socket cover 5 with a through hole and a lower socket cover plate 4 with a through hole;
then, placing the chip body 8 to be tested in a chip positioning cavity 37 of the socket guide frame 3, connecting one ends of crowns of the power spring needle 1 and the signal spring needle 2 to a chip solder ball 11 (solder ball), and connecting one ends of circular arcs below the power spring needle 1 and the signal spring needle 2 to a test PCB;
finally, the chip body 8 to be tested, the chip solder ball 11, the power spring needle 1 and the signal spring needle 2 are compressed up/down to a test state, so that the measurement high-frequency data is transmitted to the test equipment.
It should be noted that in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a coaxial test socket of little Pitch of high frequency, includes power spring needle (1), signal spring needle (2), socket guide frame (3), awaits measuring chip body (8) and chip tin ball (11), its characterized in that:
a chip positioning cavity (37) is arranged in the symmetrical central line of the socket guide frame (3),
a plurality of signal spring needle through grooves (31) are arranged in the chip positioning cavity (37),
the chip positioning cavity (37) is internally provided with a power spring pin slot (32) at the outer layer of the plurality of signal spring pin through slots (31),
the bottom surface of the chip positioning cavity (37) is provided with an upper cover (5) with a socket,
the bottom surface of the upper cover (5) of the socket with the vent is provided with a lower cover plate (4) of the socket with the vent,
the outer layers of the socket guide frame (3), the upper cover (5) with the holes and the lower cover plate (4) with the holes are respectively provided with a socket guide frame fixing hole (33), an upper cover fixing hole (51) with the holes and a lower cover plate fixing hole (41) with the holes,
the socket guide frame (3), the socket upper cover (5) with the through holes and the socket lower cover plate (4) with the through holes are tightly assembled through socket guide frame fixing holes (33), socket upper cover fixing holes (51) with the through holes and socket lower cover plate fixing holes (41) with the through holes by using socket head cap screws (6), gaskets (9) and nuts (10);
the power spring needle (1) and the signal spring needle (2) are respectively vertically placed in the signal spring needle through groove (31) and the power spring needle slot (32), the chip body (8) to be tested is placed in the chip positioning cavity (37), one end of the crown of the power spring needle (1) and one end of the crown of the signal spring needle (2) are respectively contacted with the chip tin ball (11) on one surface of the chip body (8) to be tested, and the arc head of the power spring needle (1) and the arc head of the signal spring needle (2) are respectively contacted with the test PCB.
2. The high frequency small Pitch coaxial test socket of claim 1, wherein: the size of the signal spring pin through groove (31) is smaller than that of the power spring pin slot (32);
wherein, the surface of the power spring pin slot (32) is plated with an oxidation insulating layer (38).
3. The high frequency small Pitch coaxial test socket of claim 1 or 2, wherein: the high-frequency small Pitch coaxial test socket further comprises a glue layer (35) injected into the inner wall of the socket upper cover fixing hole (51) with the through hole and the socket lower cover plate fixing hole (41) with the through hole.
4. The high frequency small Pitch coaxial test socket of claim 3, wherein: the high-frequency small Pitch coaxial test socket further comprises socket guide frame pin holes (36), socket upper cover pin holes (53) and socket lower cover plate pin holes (42) which are arranged in the socket guide frame (3), the socket upper cover with holes (5) and the socket lower cover plate with holes (4) in a counterpoint mode, and pins (7) for limiting assembly of the socket guide frame (3), the socket upper cover with holes (5) and the socket lower cover plate with holes (4) are formed through the socket guide frame pin holes (36), the socket upper cover pin holes (53) and the socket lower cover plate pin holes (42).
5. The high frequency small Pitch coaxial test socket of claim 4, wherein: the high-frequency small Pitch coaxial test socket further comprises socket guide frame screw holes (34) and socket upper cover screw holes (52) which are arranged in the socket guide frame (3) and the socket upper cover (5) with holes in an aligned mode, and bolts (13) for fixedly assembling the socket guide frame (3) and the socket upper cover (5) with holes through the socket guide frame screw holes (34) and the socket upper cover screw holes (52) with holes.
6. The high frequency small Pitch coaxial test socket of claim 5, wherein: the high-frequency small Pitch coaxial test socket further comprises a flat head screw hole (54) of the upper cover plate (43) of the through hole socket and a flat head screw (12) for fixedly assembling the upper cover plate (5) of the through hole socket and the lower cover plate (4) of the through hole socket, and the flat head screw hole (54) of the upper cover plate (43) of the through hole socket and the flat head screw hole (43) of the lower cover plate (4) of the through hole socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321200629.1U CN219737596U (en) | 2023-05-18 | 2023-05-18 | High-frequency small Pitch coaxial test socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321200629.1U CN219737596U (en) | 2023-05-18 | 2023-05-18 | High-frequency small Pitch coaxial test socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219737596U true CN219737596U (en) | 2023-09-22 |
Family
ID=88054812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321200629.1U Active CN219737596U (en) | 2023-05-18 | 2023-05-18 | High-frequency small Pitch coaxial test socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219737596U (en) |
-
2023
- 2023-05-18 CN CN202321200629.1U patent/CN219737596U/en active Active
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