CN113109610B - RF bare chip flat probe test tool - Google Patents
RF bare chip flat probe test tool Download PDFInfo
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- CN113109610B CN113109610B CN202110365272.1A CN202110365272A CN113109610B CN 113109610 B CN113109610 B CN 113109610B CN 202110365272 A CN202110365272 A CN 202110365272A CN 113109610 B CN113109610 B CN 113109610B
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- probe
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- pcb
- stick
- test tool
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06788—Hand-held or hand-manipulated probes, e.g. for oscilloscopes or for portable test instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a flat probe test tool for an RF (radio frequency) bare chip, which comprises a positioning groove, wherein the positioning groove is arranged in the center of a base, a rotatable chip fixing pressing block is arranged on the upper end surface of the base beside a positioning groove opening, a detection positioning sliding groove is arranged on the upper end surface of the base and surrounds the positioning groove opening, a chip probe assembly is arranged in the detection positioning sliding groove, a probe carrying platform, a PCB (printed circuit board), a probe rod and a probe rod pressing plate are respectively laminated and arranged on the chip probe assembly from bottom to top, a probe with an arc low head is arranged at the front end of the strip-shaped elastic probe rod, the strip-shaped elastic probe rod is pressed on the PCB by the probe pressing plate through a screw, and a conductive circuit of the PCB is connected with the probe rod to realize the leading-in and the output of chip signals. The invention realizes the compression joint interconnection of the flat probe assembly and the bare chip bonding pad, reaches equipment with various performance requirements, has high testing speed, does not need to build a probe station complex environment, has simple and easy configuration requirements, low cost and flexible operation steps, and is suitable for batch testing.
Description
Technical Field
The invention relates to an RF bare chip flat probe test tool, which is applied to test performance verification of bare chip indexes.
Background
For the measurement of a chip, the current main test equipment is also a probe station; the probe station is complex to operate for a complex module bare chip, low in testing efficiency, high in price and not easy to transport. The complex and extremely harsh operation flow of the probe station cannot meet the requirements of mass delivery and rapid verification of product performance in military and aerospace environments.
Disclosure of Invention
The invention aims to provide an RF bare chip flat probe testing tool, which is different from the precise testing of a probe station, improves the testing efficiency by the application of combining a bare chip testing probe and a PCB under the testing environment with low cost, microcosmic and quick verification, and is suitable for mass production.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a flat probe test fixture for an RF bare chip is arranged under a microscope and operated manually, and comprises a positioning groove for placing a chip, wherein the positioning groove is arranged in the center of a base, a rotatable chip fixing pressing block is arranged on the upper end surface of the base beside a positioning groove opening, the fixing pressing block is firstly rotated to open the positioning groove opening, the fixing pressing block is rotated to press the chip to fix the chip through screw compression after the chip is placed in the positioning groove opening, a detection positioning chute is arranged on the upper end surface of the base around the positioning groove opening and corresponds to a measured point of the chip, a chip probe assembly is arranged in the detection positioning chute, the chip probe assembly is fixed in the detection positioning chute in a front-back sliding manner, a probe for the chip probe assembly can slide back and forth, and the front-back contact point adjustment of the probe and the chip can be realized, the chip probe assembly is respectively provided with a probe carrying platform and a probe carrying platform from bottom to top in a laminated manner, PCB board, probe stick and probe stick clamp plate, probe microscope carrier sits to crouch in surveying location spout, the probe stick is electrically conductive rectangular shape elasticity probe stick, the front end of rectangular shape elasticity probe stick is provided with the probe of toper circular arc downwarping low head, the lower terminal surface of probe clamp plate is provided with the rectangular shape recess corresponding with the probe stick shape, rectangular shape elasticity probe stick is withheld to the rectangular shape recess of probe clamp plate, and with rectangular shape elasticity probe stick crimping on PCB board through the screw, it can control the fine motion to loosen screw probe clamp plate and drive rectangular shape elasticity probe stick, control the fine motion and be used for probe and chip to control the contact point adjustment, the leading-in and the output of chip signal are realized to the conductive circuit connection probe stick of PCB board.
The scheme is further as follows: the tail end side of the probe carrying platform is provided with a longitudinal strip-shaped hole, a fixing screw of the probe carrying platform penetrates through the longitudinal strip-shaped hole and is screwed into a screw hole formed in the base, a transverse strip-shaped hole is formed in the probe pressing plate, the fixing screw of the probe pressing plate penetrates through the transverse strip-shaped hole and a screw hole formed in the probe carrying platform, the chip probe assembly is adjusted in a front-back sliding mode through the longitudinal strip-shaped hole formed in the tail end side of the probe carrying platform, and the strip-shaped elastic probe rod is adjusted in a left-right micro-motion mode through the transverse strip-shaped hole formed in the probe pressing plate.
The scheme is further as follows: the chip probe assembly comprises a plurality of power supply probe assemblies and two radio frequency probe assemblies, wherein a connecting line plug connected with a PCB is arranged on each power supply probe assembly, each radio frequency probe assembly is provided with an SMA connector connected with the PCB, each connecting line plug is used for connecting a power supply signal, and each SMA connector is used for outputting a radio frequency RF signal.
The scheme is further as follows: the base is provided with a power signal access port, and the power signal access port is connected with a connecting plug through a plug connecting cable.
The scheme is further as follows: the probe rod is a beryllium copper probe rod.
The scheme is further as follows: the probe rod is a long-strip-shaped probe rod with a flat and rectangular cross section, and the flat thickness is not more than 0.3 mm.
The scheme is further as follows: the probe point of the conical downward bending low head at the front end of the long strip-shaped probe rod is at least 2mm lower than the lower end face of the long strip-shaped probe rod.
The scheme is further as follows: the length of the strip-shaped probe rod extending out of the end face of the PCB enables the extending section of the probe rod to have elasticity when the arc low-head probe touches and presses the chip.
The invention can realize the power-on and RF signal extraction capability on the bare chip bonding pad of 0.1mm multiplied by 0.1mm, so that the complex and expensive probe station is switched to the bare chip board end tool which has low cost and realizes the rapid verification of the chip performance.
The invention realizes the compression joint interconnection with the bare chip bonding pad through the special debugging of the flat probe component and reaches the equipment with various performance requirements, compared with the traditional method, the invention has the following advantages:
1) the test speed is high, a complex environment of a probe station is not required to be built, the assembly requirement is simple, the cost is low, the operation steps are flexible, and the test device is suitable for batch test.
2) The fixture can be designed in a customized mode aiming at different bare chip components, and is flexible to apply.
The invention is described in detail below with reference to the figures and examples.
Drawings
FIG. 1 is a schematic view of a test fixture according to the present invention;
FIG. 2 is a schematic view of the test fixture chip of the present invention in a compressed state, and an enlarged view of portion A of FIG. 1;
FIG. 3 is an exploded view of the test fixture of the present invention;
FIG. 4 is a schematic diagram of an exploded structure of a probe assembly of the present invention;
FIG. 5 is a schematic top view of a chip probe assembly according to the present invention;
FIG. 6 is a side view of the probe assembly of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present embodiment, it should be noted that the terms "connected" and "disposed" should be interpreted broadly, for example, the "connection" may be a wire connection or a mechanical connection; the 'placing' can be fixedly connected placing or integrally formed placing. The specific meanings of the above terms in the present embodiment can be understood by those of ordinary skill in the art according to specific situations.
The utility model provides a flat probe test fixture of naked chip of RF, test fixture sets up manual operation under the microscope, as shown in fig. 1 and fig. 2, test fixture is including the constant head tank 1 of placing the chip, and constant head tank 1 sets up the central authorities at a base 2, and wherein, the base up end other at the location notch is provided with rotatable chip fixed briquetting 3, and chip fixed briquetting 3 is two, and two chip fixed briquetting 3 set up relatively at the location notch. When fixing the chip, the chip fixing pressing block 3 firstly rotates to open the positioning slot, after the chip 4 is placed in the positioning slot, the fixing pressing block is rotated to press on the chip to tightly press and fix the chip through the screw penetrating through the through hole 5, when rotating, the screw in the through hole 5 needs to be loosened, as shown in figure 3, the base 2 is assembled by the base upper body 201 and the base lower body 202, the positioning slot is arranged on the platform 203 protruding in the center of the base lower body 202, the upper end surface of the base is provided with a detecting and positioning chute 204 around the positioning slot, the detecting and positioning chute 204 is arranged corresponding to the measured point of the chip, namely the chip has a plurality of measured points, the plurality of detecting and positioning chutes 204 are arranged corresponding to the measured point, the detecting and positioning chute is provided with a chip probe component 6, the chip probe component can be fixed in the detecting and positioning chute in a front-back sliding manner, the probe used for the chip probe component can slide back and forth, and back, and forth contact point adjustment of the chip, as shown in fig. 4, the chip probe assembly is respectively laminated from bottom to top with a probe carrier 601, a PCB 602, a probe rod 603 and a probe rod pressing plate 604, the probe carrier 601 sits and lies in the probing and positioning chute 204, the PCB 602 is provided with a conductive copper foil 602-1, the probe rod 603 is a conductive strip-shaped elastic probe rod, the front end of the strip-shaped elastic probe rod is provided with a probe 603-1 with a conical arc bending downward and a low head, the lower end surface of the probe pressing plate 604 is provided with a strip-shaped groove 604-1 corresponding to the shape of the probe rod, the strip-shaped groove of the probe pressing plate buckles the strip-shaped elastic probe rod, and the strip-shaped elastic probe rod is pressed on the PCB by a screw 605 so that the probe rod 603 is in contact with the conductive copper foil 602-1 on the PCB 602 and is conducted, the screw pressing plate is loosened to drive the strip-shaped elastic probe rod to be capable of jogged left and right, and left and right for the adjustment of left and right contact points of the probe and the chip, the conductive circuit of the PCB is connected with the probe rod to realize the leading-in and the output of chip signals.
Wherein: a longitudinal elongated hole 601-1 is formed in the tail end side of the probe carrier, a probe carrier fixing screw 606 penetrates through the longitudinal elongated hole and is screwed into a screw hole formed in the base, a transverse elongated hole 604-2 is formed in the probe pressing plate, a probe pressing plate fixing screw 605 penetrates through the transverse elongated hole and is screwed into the screw hole 601-2 formed in the probe carrier through the PCB, the chip probe assembly is adjusted in a front-back sliding mode through the longitudinal elongated hole formed in the tail end side of the probe carrier, and the elongated elastic probe rod is adjusted in a left-right micro-motion mode through the transverse elongated hole formed in the probe pressing plate.
In this embodiment: the chip probe assembly comprises a plurality of power supply probe assemblies and two radio frequency probe assemblies, wherein a connecting line plug 602-2 connected with a PCB is arranged on each power supply probe assembly, each radio frequency probe assembly is provided with an SMA connector 7 connected with the PCB, each connecting line plug is used for connecting a power supply signal, and each SMA connector is used for outputting a radio frequency RF signal. The base is provided with power signal access ports 8, the number of the power signal access ports 8 is two in the embodiment, the two power signal access ports are arranged on the diagonal side of the base and used for conveniently leading a test power supply into a test tool, and the power signal access ports are connected with a connecting plug through plug-in connecting cables 9.
As the strip-shaped elastic probe rod, a beryllium copper probe rod is adopted in the embodiment, and the beryllium copper has good elasticity and low resistance conductivity.
Wherein: the cross section of the long-strip-shaped probe rod is a flat rectangular long-strip-shaped probe rod with the thickness not more than 0.3 mm. As shown in FIG. 6, the bending angle R of the tapered downward bending low-head probe at the front end of the elongated probe bar is 120 degrees +/-2 degrees, the tip 603-1 of the low head is at least 2mm lower than the lower end face of the elongated probe bar, and the diameter of the tip 603-1 is 7 microns. The measure for controlling the elasticity is that the length of the elongated probe bar extending out of the end face of the PCB enables the extending section of the probe bar to have elasticity when the arc low-head probe touches and presses the chip, wherein the length of the elongated probe bar is at least 15mm, and the length of the extending section is at least 5 mm.
Embodiments combine the probe with the PCB to achieve interconnection of the tapered portion of the probe with the die pad under a high power microscope. Assembling a probe assembly (figure 1) by the flat probe and the PCB through a mechanical structure, and manually finding under a microscope to realize fine adjustment and compression joint of the relative positions of the probe and a chip bonding pad; the area of a chip bonding pad is 0.1 multiplied by 0.1mm, after a probe is required to be connected with the bonding pad during assembly, the scratch area of the probe is controlled to be 25% of that of the bonding pad, so that the head of the probe is designed very finely, the flat probe designed currently is beryllium bronze, through mechanical simulation analysis, the head of the probe is in an arc shape at present, the diameter of the tip of the probe is 7 to 10 micrometers, the flat thickness of the flat probe is controlled to be 0.3mm, the pressure applied to the chip bonding pad is 0.13N, the pre-deformation is 0.1mm, the problem of later-stage electroplating of the probe is considered, metal through holes are additionally formed in the probe, and later-stage wire threading and electroplating of an electroplating manufacturer are facilitated.
Through with flat probe subassembly, through the crimping interconnection of special configuration debugging realization and bare chip pad to reach the equipment of each performance requirement, compare test speed with traditional method fast, need not to build probe platform complex environment, the configuration requirement is simple and easy, with low costs, the operating procedure is nimble, is fit for batch test. Moreover, the fixture can be designed in a customized manner aiming at different bare chip components, and the application is flexible.
Claims (8)
1. A RF bare chip flat probe test tool is provided, the test tool is arranged under a microscope for manual operation, the test tool comprises a positioning groove for placing a chip, the positioning groove is arranged at the center of a base, and is characterized in that a rotatable chip fixing pressing block is arranged on the upper end surface of the base beside a positioning notch, the fixing pressing block is firstly rotated to open the positioning notch, the fixing pressing block is rotated to press the chip to fix the chip through screw compression after the chip is placed in the positioning notch, a detection positioning chute is arranged on the upper end surface of the base around the positioning notch and corresponds to a measured point of the chip, a chip probe assembly is arranged in the detection positioning chute, the chip probe assembly is fixed in the detection positioning chute in a front-back sliding manner, the front-back sliding manner is used for adjusting the front and back contact points of the probe and the chip, the chip probe is respectively laminated from bottom to top and provided with a probe carrier, PCB board, probe stick and probe stick clamp plate, probe microscope carrier sits to crouch in surveying location spout, the probe stick is electrically conductive rectangular shape elasticity probe stick, the front end of rectangular shape elasticity probe stick is provided with the probe of toper downwarping low head, the lower terminal surface of probe clamp plate is provided with the rectangular shape recess corresponding with the probe stick shape, rectangular shape elasticity probe stick is withheld to the rectangular shape recess of probe clamp plate, and with rectangular shape elasticity probe stick crimping on PCB board through the screw, it can control the fine motion to loosen screw probe clamp plate and drive rectangular shape elasticity probe stick, control the fine motion and be used for probe and chip to control the contact point adjustment, the conducting wire of PCB board is connected the probe stick and is realized leading-in and output of chip signal.
2. The test tool according to claim 1, wherein a longitudinal elongated hole is formed in the tail end side of the probe carrier, a probe carrier fixing screw penetrates through the longitudinal elongated hole and is screwed into a screw hole formed in the base, a transverse elongated hole is formed in the probe pressing plate, the probe pressing plate fixing screw penetrates through the transverse elongated hole and penetrates through the PCB and is screwed into the screw hole formed in the probe carrier, the chip probe assembly is adjusted by sliding back and forth through the longitudinal elongated hole formed in the tail end side of the probe carrier, and the elongated elastic probe rod is adjusted by micro-moving left and right through the transverse elongated hole formed in the probe pressing plate.
3. The test tool according to claim 1, wherein the chip probe assembly comprises a plurality of power supply probe assemblies and two radio frequency probe assemblies, a connecting plug connected with a PCB is arranged on each power supply probe assembly, the radio frequency probe assemblies are provided with SMA connectors connected with the PCB, the connecting plugs are used for connecting power supply signals, and the SMA connectors are used for outputting radio frequency RF signals.
4. The test tool according to claim 3, wherein a power signal access port is arranged on the base and is connected with the connecting plug through a plug connecting cable.
5. The test fixture of claim 1 wherein the probe bar is a beryllium copper probe bar.
6. The test tool according to claim 1 or 5, wherein the probe rod is an elongated elastic probe rod with a cross section of a flat rectangular shape, and the flat thickness is not more than 0.3 mm.
7. The test tool according to claim 1 or 5, wherein the tapered downward-bending low-head probe tip at the front end of the elongated elastic probe rod is at least 2mm lower than the lower end face of the elongated probe rod.
8. The test fixture of claim 1, wherein the length of the elongated resilient probe bar extending from the end surface of the PCB is such that the extending section of the probe bar is resilient when the arcuate low-head probe touches and presses against the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110365272.1A CN113109610B (en) | 2021-04-06 | 2021-04-06 | RF bare chip flat probe test tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110365272.1A CN113109610B (en) | 2021-04-06 | 2021-04-06 | RF bare chip flat probe test tool |
Publications (2)
| Publication Number | Publication Date |
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| CN113109610A CN113109610A (en) | 2021-07-13 |
| CN113109610B true CN113109610B (en) | 2021-10-26 |
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| CN202110365272.1A Active CN113109610B (en) | 2021-04-06 | 2021-04-06 | RF bare chip flat probe test tool |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114675162B (en) * | 2022-03-24 | 2022-11-15 | 北京涵鑫盛科技有限公司 | PCB for testing and packaging SSD main control chip |
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- 2021-04-06 CN CN202110365272.1A patent/CN113109610B/en active Active
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| CN113109610A (en) | 2021-07-13 |
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