CN219677277U - LED packaging structure and display screen - Google Patents

Abstract

The utility model relates to an LED packaging structure and a display screen, which have the technical scheme that the LED packaging structure comprises: a bracket; the bracket is provided with a first metal substrate, a second metal substrate, a third metal substrate and a fourth metal substrate; the bracket is provided with a containing cavity, and the containing cavity is matched with the first metal substrate, the second metal substrate, the third metal substrate and the fourth metal substrate to form a bowl cup for containing the LED chip set; a boss is arranged on the first metal substrate; an LED chip set is arranged on the boss; a black adhesive layer is arranged at the bottom of the bowl cup, and the thickness of the black adhesive layer is smaller than that of the boss; black colloid is filled in the rest parts of the bowl cup; the utility model has the effect of enabling the bottom of the bowl cup to form a black view angle without a reflection cover, so that the LED packaging structure presents an appearance close to full black when not lighted, thereby obviously improving the contrast of products and reducing the brightness loss.

Description

LED packaging structure and display screen

Technical Field

The utility model relates to the technical field of LEDs, in particular to an LED packaging structure and a display screen.

Background

In recent years, LED display screens are gradually mature in technology and are widely used. LED displays are typically soldered to a PCB and integrally encapsulated with epoxy glue.

In the prior art, as shown in fig. 1, a bracket is generally adopted for packaging an LED chip, a metal substrate is arranged on the bracket, then a containing cavity is formed on the bracket, the containing cavity is matched with the metal substrate to form a bowl cup, the LED chip is arranged on the metal substrate through die bonding glue, and the surface of the metal substrate is generally silver-plated, so that the bowl cup basically presents silvery color, when the LED chip is not lighted, the LED chip is silvery white, and cannot present obvious black on a display screen, so that the contrast ratio is poor.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model aims to provide the LED packaging structure which has the functional advantages that the bottom of the bowl cup forms a black view angle effect without a reflection cover, so that the LED packaging structure presents an appearance close to full black when not lighted, the contrast of a product is obviously improved, and the brightness loss is reduced.

The technical aim of the utility model is realized by the following technical scheme:

an LED package structure, comprising: a bracket; the bracket is provided with a first metal substrate, a second metal substrate, a third metal substrate and a fourth metal substrate; the bracket is provided with a containing cavity, and the containing cavity is matched with the first metal substrate, the second metal substrate, the third metal substrate and the fourth metal substrate to form a bowl cup for containing the LED chip set; a boss is arranged on the first metal substrate; an LED chip set is arranged on the boss; a black glue layer is arranged at the bottom of the bowl cup, and the thickness of the black glue layer is smaller than that of the boss; and black colloid is filled in the rest parts of the bowl cup.

Optionally, the LED chip set includes: the LED module comprises a red LED chip, a blue LED chip and a green LED chip, wherein the red LED chip is fixed on the boss through conductive silver colloid, and the boss and the first metal substrate are integrally formed; the blue light LED chip and the green light LED chip are fixed on the boss through die bonding glue;

the green light LED chip is electrically connected with the second metal substrate through a metal wire; the blue light LED chip is electrically connected with the third metal substrate through a metal wire; the red LED chip, the blue LED chip and the green LED chip are electrically connected with the fourth metal substrate through metal wires.

Optionally, a first groove for separating the red LED chip and the green LED chip is formed on the boss.

Optionally, a second groove for separating the green LED chip and the blue LED chip is formed on the boss.

Optionally, a black glue layer is also arranged in the first groove and the second groove.

Optionally, the bracket is a black bracket or a gray-black bracket.

Optionally, the black glue layer is a glue layer added with carbon powder or ink.

Optionally, the black colloid is a colloid added with carbon powder and diffusion powder.

The utility model also provides a display screen, which comprises at least one LED packaging structure.

In summary, the utility model has the following beneficial effects: through the setting of black glue film for bowl cup bottom forms the black visual angle effect of no reflection lid, makes this LED packaging structure when not lighting, presents near full black outward appearance, has obviously promoted the product contrast, has reduced the luminance loss, is less than the height of boss upper surface through the height of black glue film upper surface, and the black glue film of being convenient for avoids the LED chipset, thereby avoids producing great extinction phenomenon.

Drawings

FIG. 1 is a cross-sectional view of a prior art LED package structure;

FIG. 2 is a top view of the first embodiment;

FIG. 3 is a cross-sectional view of the first embodiment;

FIG. 4 is a schematic view showing the structures of a boss, a first metal substrate, a second metal substrate, a third metal substrate and a fourth metal substrate according to the first embodiment;

FIG. 5 is a top view of a second embodiment;

fig. 6 is a schematic structural diagram of a boss, a first metal substrate, a second metal substrate, a third metal substrate, and a fourth metal substrate in the second embodiment.

In the figure: 1. a bracket; 2. a first metal substrate; 3. a second metal substrate; 4. a third metal substrate; 5. a fourth metal substrate; 6. a boss; 61. a first groove; 62. a second groove; 7. a red LED chip; 8. a blue LED chip; 9. a green LED chip; 10. a bowl cup; 101. a black glue layer; 102. black gel.

Detailed Description

In order that the objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. The terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used for descriptive purposes only and are not to indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

The present utility model will be described in detail below with reference to the accompanying drawings and examples.

Example 1

The utility model provides an LED packaging structure, as shown in fig. 2-4, comprising: a bracket 1; a first metal substrate 2, a second metal substrate 3, a third metal substrate 4 and a fourth metal substrate 5 are arranged on the bracket 1; a containing cavity is formed in the bracket 1, and the containing cavity is matched with the first metal substrate 2, the second metal substrate 3, the third metal substrate 4 and the fourth metal substrate 5 to form a bowl cup 10 for containing the LED chip set; a boss 6 is arranged on the first metal substrate 2; an LED chip set is arranged on the boss 6; the LED chip set is respectively and electrically connected with the first metal substrate 2, the second metal substrate 3, the third metal substrate 4 and the fourth metal substrate 5; a black glue layer 101 is arranged at the bottom of the bowl cup 10, and the thickness of the black glue layer 101 is smaller than that of the boss 6; the rest of the bowl 10 is filled with a black gel 102.

In practical application, boss 6 adopts the metal to make, support 1 adopts the injection molding material to make, boss 6 and first metal base plate 2 are integrated into one piece, first metal base plate 2, second metal base plate 3, third metal base plate 4 and fourth metal base plate 5 can be as the pin of this LED packaging structure, through the setting of black glue film 101, make bowl cup 10 bottom form the black visual angle effect of no reflection lid, make this LED packaging structure when not lighting, present near full black outward appearance, obviously promoted the product contrast, brightness loss has been reduced, thickness through black glue film 101 is less than boss 6's thickness, be convenient for black glue film 101 avoid the LED chipset, thereby avoid producing great extinction phenomenon, through the setting of black glue film 102, also further promoted the black visual effect of the no reflection lid of this LED packaging structure, the light that the LED chipset sent still can be penetrated second glue and is penetrated, make this LED packaging structure's luminance accord with the standard.

Further, as shown in fig. 2, the LED chip set includes a red LED chip 7, a blue LED chip 8 and a green LED chip 9, the red LED chip 7 is fixed on the boss 6 by conductive silver glue, the blue LED chip 8 and the green LED chip 9 are both fixed on the boss 6 by die bond glue, and the boss 6 and the first metal substrate 2 are integrally formed;

the green LED chip 9 is electrically connected with the second metal substrate 3 through a metal wire; the blue LED chip 8 is electrically connected with the third metal substrate 4 through a metal wire; the red LED chip 7, the blue LED chip 8 and the green LED chip 9 are electrically connected with the fourth metal substrate 5 through metal wires.

In practical application, through the arrangement of the red LED chip 7, the blue LED chip 8 and the green LED chip 9, the effect of emitting light rays with different colors can be realized after the power is on; specifically, the anode/cathode of the red LED chip 7 is electrically connected with the first metal substrate 2 through conductive silver paste and the boss 6 in sequence, and the cathode/anode is connected with the fourth metal substrate 5 through a metal wire; the anode/cathode of the blue LED chip 8 is connected with the third metal substrate 4 through a metal wire, and the cathode/anode is connected with the fourth metal substrate 5 through a metal wire; the anode/cathode of the green LED chip 9 is connected with the second metal substrate 3 through a metal wire, and the cathode/anode is connected with the fourth metal substrate 5 through a metal wire; specifically, the solid brilliant portion is formed after solid brilliant glue solidification, through the thickness of black glue film 101 be less than the thickness of boss 6, can avoid black glue film 101 to influence solid brilliant glue and conductive silver nature of gluing, and the process control degree of difficulty is little, and in addition, red light LED chip 7, blue light LED chip 8 and green light LED chip 9 can arrange in proper order and set up on boss 6, also can alternate distribution.

Further, as shown in fig. 3, the bracket 1 is a black bracket 1, and in other embodiments, the bracket 1 may also be a gray black bracket 1, so that the black visual effect of the LED package structure without the reflective cover is further improved, and further the contrast of the product is improved.

Further, the black glue layer 101 is a glue layer added with carbon powder or ink, and specifically, the black glue layer 101 is a glue layer formed by curing a first glue added with a black organic colorant such as carbon powder or ink.

Further, the black colloid 102 is a colloid added with carbon powder and diffusion powder, specifically, the black colloid 102 is a glue layer formed by curing a second glue added with carbon powder and diffusion powder, and the second glue can be a glue made of epoxy resin, silica gel or silicone resin.

According to the LED packaging structure, the black visual angle effect without the reflection cover is formed at the bottom of the bowl cup 10 through the arrangement of the black adhesive layer 101, so that the LED packaging structure presents a nearly full black appearance when not lighted, the contrast of a product is obviously improved, the brightness loss is reduced, the black adhesive layer 101 is convenient to avoid an LED chip set through the thickness of the black adhesive layer 101 being smaller than the thickness of the boss 6, and the phenomenon of larger light absorption is avoided.

Example two

The difference from the first embodiment is that, as shown in fig. 5 and 6, the first groove 61 for separating the red LED chip 7 and the green LED chip 9 is provided on the boss 6, the second groove 62 for separating the green LED chip 9 and the blue LED chip 8 is provided on the boss 6, the black glue layer 101 is also provided in the first groove 61 and the second groove 62, the red LED chip 7 and the green LED chip 9 are separated by the arrangement of the first groove 61, the green LED chip 9 and the blue LED chip 8 are separated by the arrangement of the second groove 62, the black glue layer 101 is also provided in the first groove 61 and the second groove 62, the area of the black glue layer 101 is enlarged, the black visual effect of the non-reflective cover of the LED package structure is further improved, and the product contrast is further improved.

The present utility model also provides a display screen, which includes at least one LED package structure as described above, and since the LED package structure has been described in detail above, the details thereof will not be described herein.

The above description is only a preferred embodiment of the present utility model, and the protection scope of the present utility model is not limited to the above examples, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. It should be noted that modifications and adaptations to the present utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be within the scope of the present utility model.

Claims (6)

1. An LED package structure, comprising: a bracket; the bracket is provided with a first metal substrate, a second metal substrate, a third metal substrate and a fourth metal substrate; the bracket is provided with a containing cavity, and the containing cavity is matched with the first metal substrate, the second metal substrate, the third metal substrate and the fourth metal substrate to form a bowl cup for containing the LED chip set; a boss is arranged on the first metal substrate; an LED chip set is arranged on the boss; a black glue layer is arranged at the bottom of the bowl cup, and the thickness of the black glue layer is smaller than that of the boss; and black colloid is filled in the rest parts of the bowl cup.

2. The LED package structure of claim 1, wherein the LED chip set comprises: the LED module comprises a red LED chip, a blue LED chip and a green LED chip, wherein the red LED chip is fixed on the boss through conductive silver colloid, and the boss and the first metal substrate are integrally formed; the blue light LED chip and the green light LED chip are fixed on the boss through die bonding glue;

the green light LED chip is electrically connected with the second metal substrate through a metal wire; the blue light LED chip is electrically connected with the third metal substrate through a metal wire; the red LED chip, the blue LED chip and the green LED chip are electrically connected with the fourth metal substrate through metal wires.

3. The LED package structure of claim 2, wherein the boss is provided with a first groove for separating the red LED chip and the green LED chip.

4. The LED package structure of claim 3, wherein the boss is provided with a second groove for separating the green LED chip and the blue LED chip.

5. The LED package structure of claim 4, wherein a black matrix layer is also disposed in the first and second grooves.

6. A display screen comprising at least one LED package structure according to any one of claims 1-5.