CN219641977U - Optoelectronic module - Google Patents
Optoelectronic module Download PDFInfo
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- CN219641977U CN219641977U CN202320354101.3U CN202320354101U CN219641977U CN 219641977 U CN219641977 U CN 219641977U CN 202320354101 U CN202320354101 U CN 202320354101U CN 219641977 U CN219641977 U CN 219641977U
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- Prior art keywords
- cover
- elastic
- heat dissipation
- elastic heat
- copper
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- 230000005693 optoelectronics Effects 0.000 title claims description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 75
- 230000007246 mechanism Effects 0.000 claims abstract description 68
- 230000008054 signal transmission Effects 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 230000001681 protective effect Effects 0.000 claims description 15
- 239000013307 optical fiber Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 24
- 230000005540 biological transmission Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a photoelectric module. The photoelectric module comprises a shell, a cover body and a signal transmission mechanism, wherein the shell and the cover body are connected to form a containing groove, the signal transmission mechanism is arranged in the containing groove, the photoelectric module further comprises an elastic heat dissipation mechanism, the elastic heat dissipation mechanism is arranged between the signal transmission mechanism and the cover body, and the elastic heat dissipation mechanism is respectively elastically abutted to the signal transmission mechanism and the cover body. The photoelectric module has a good heat dissipation effect.
Description
Technical Field
The utility model relates to the technical field of photoelectric transmission, in particular to a photoelectric module.
Background
The traditional photoelectric module has poor heat dissipation effect. For example, chinese patent of patent publication No. CN203577453U proposes a novel heat dissipation structure photovoltaic module, which includes an upper cover, a lower cover and a button connector, wherein the upper cover and the lower cover are connected by a bolt, an upper PCB is connected in the upper cover by a bolt, a lower PCB is connected in the lower cover by a bolt, the button connector is disposed between the upper PCB and the lower PCB, and transmission units are disposed in the upper cover and the lower cover; the two groups of transmission units generate heat and are respectively diffused to the outside through the upper cover and the lower cover, the transmission units comprise FD components, driving chips and laser chips, the driving chips and the laser chips are welded in the lower cover, the FD components are arranged on the lower cover, and a protective shell is further arranged on the driving chips and connected with the lower PCB.
Although be connected with upper cover, lower cover respectively through the transmission unit who sets up, at the in-process that carries out transmission data, can give off the heat through upper cover, lower cover's surface respectively, can effectually prevent that the heat from piling up, cause transmission unit damage, but transmission unit still has following problem:
because gaps exist between the upper cover, the lower cover and the transmission unit, namely air exists between the upper cover, the lower cover and the transmission unit, the heat conductivity of the air is poor, and the heat dissipation effect of the photoelectric module with the heat dissipation structure is poor.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide a photoelectric module with a good heat dissipation effect.
The aim of the utility model is realized by the following technical scheme:
the photoelectric module comprises a shell, a cover body and a signal transmission mechanism, wherein the shell is connected with the cover body to form a containing groove, the signal transmission mechanism is arranged in the containing groove, the photoelectric module further comprises an elastic heat dissipation mechanism, the elastic heat dissipation mechanism is arranged between the signal transmission mechanism and the cover body, and the elastic heat dissipation mechanism is respectively elastically abutted to the signal transmission mechanism and the cover body.
In one embodiment, the signal transmission mechanism includes an optical fiber array assembly, a driving chip and a power chip, wherein the driving chip is respectively and electrically connected with the optical fiber array assembly and the power chip, the driving chip is used for mutually converting an electrical signal and an optical signal, and the optical fiber array assembly is used for transmitting the optical signal converted by the driving chip; the power chip is used for providing power for the driving chip.
In one embodiment, the elastic heat dissipation mechanism includes a first elastic heat dissipation component and a second elastic heat dissipation component, the first elastic heat dissipation component is disposed between the driving chip and the cover, the first elastic heat dissipation component is elastically abutted to the driving chip and the cover respectively, the second elastic heat dissipation component is disposed between the power chip and the cover, and the second elastic heat dissipation component is elastically abutted to the power chip and the cover respectively.
In one embodiment, the first elastic heat dissipation assembly includes a first elastic heat conduction buffer member and an elastic heat conduction protection cover, the elastic heat conduction protection cover is clamped on the first elastic heat conduction buffer member, and two sides of the first elastic heat conduction buffer member are respectively and elastically connected with the driving chip and the cover body.
In one embodiment, the first elastic heat-conducting buffer member includes two first elastic heat-conducting pads, the elastic heat-conducting protective cover is disposed between the two first elastic heat-conducting pads, one of the first elastic heat-conducting pads is connected to the elastic heat-conducting protective cover and the driving chip respectively, and the other first elastic heat-conducting pad is connected to the elastic heat-conducting protective cover and the cover body respectively.
In one embodiment, the elastic heat-conducting protective cover is an aluminum alloy elastic heat-conducting protective cover.
In one embodiment, the second elastic heat dissipation component is a second elastic heat conduction pad.
In one embodiment, the housing comprises a printed board provided with copper components connected to the signal transmission mechanism, the printed board and the cover, respectively.
In one embodiment, the copper component comprises a copper embedding block and a copper spreading piece, the copper embedding block is arranged on the printed board, the copper embedding block is respectively connected with the signal transmission mechanism, the printed board and the cover body, the copper spreading piece is arranged on the printed board, the copper spreading piece is arranged avoiding the signal transmission mechanism, and the copper spreading piece is respectively connected with the printed board and the cover body.
In one embodiment, the cover body comprises an upper cover and a lower cover, the upper cover and the lower cover are respectively arranged on two opposite sides of the shell, the upper cover is convexly provided with a heat conduction protrusion, the heat conduction protrusion is connected with the copper laying piece, and the copper embedding block is connected with the lower cover.
Compared with the prior art, the utility model has at least the following advantages:
according to the photoelectric module, the elastic heat dissipation mechanism is respectively and elastically abutted to the signal transmission mechanism and the cover body, the signal transmission mechanism and the cover body are buffered through the elastic heat dissipation mechanism, so that the signal transmission mechanism is protected, the service life of the photoelectric module is further ensured, the photoelectric module is good in structural compactness, heat generated by the signal transmission mechanism is directly transmitted to the cover body through the elastic heat dissipation mechanism, heat generated by the signal transmission mechanism is further transmitted to the outside of the photoelectric module, the problem that the heat dissipation effect is poor due to the fact that the traditional photoelectric module transmits the heat generated by the signal transmission mechanism to the cover body through air is avoided, and the heat dissipation effect of the photoelectric module is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an optoelectronic module according to an embodiment of the present utility model;
FIG. 2 is an exploded view of the photovoltaic module of FIG. 1;
FIG. 3 is a partial schematic view of the photovoltaic module of FIG. 1;
FIG. 4 is an exploded schematic view of a partial structure of the photovoltaic module shown in FIG. 1;
FIG. 5 is an enlarged view of a portion of the photovoltaic module shown in FIG. 4 at A;
FIG. 6 is a partial enlarged view of the photovoltaic module shown in FIG. 4 at B;
FIG. 7 is a cross-sectional view of the photovoltaic module shown in FIG. 1;
FIG. 8 is an enlarged view of a portion of the photovoltaic module shown in FIG. 7 at C;
FIG. 9 is a cross-sectional view of the photovoltaic module shown in FIG. 1;
fig. 10 is a partial enlarged view of the photovoltaic module shown in fig. 9 at D.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, 4, 9 and 10, the optoelectronic module 10 of an embodiment includes a housing 100, a cover 200 and a signal transmission mechanism 300, wherein the housing 100 and the cover 200 are connected to form a receiving slot 101, the signal transmission mechanism 300 is disposed in the receiving slot 101, the optoelectronic module 10 further includes an elastic heat dissipation mechanism 400, the elastic heat dissipation mechanism 400 is disposed between the signal transmission mechanism 300 and the cover 200, and the elastic heat dissipation mechanism 400 is elastically abutted to the signal transmission mechanism 300 and the cover 200, respectively.
The above-mentioned photoelectric module 10, elasticity heat dissipation mechanism 400 elasticity butt in signal transmission mechanism 300 and lid 200 respectively, buffer through elasticity heat dissipation mechanism 400 between signal transmission mechanism 300 and the lid 200, and then play the guard action to signal transmission mechanism 300, and then ensure photoelectric module 10's life, and make photoelectric module 10's compact structure better, directly transmit the lid 200 through elasticity heat dissipation mechanism 400 with the heat that signal transmission mechanism 300 produced, and then outside the heat transfer to photoelectric module 10 that signal transmission mechanism 300 produced, avoided traditional photoelectric module 10 to pass through the air transfer with the heat that signal transmission mechanism 300 produced to lid 200 and make the relatively poor problem of radiating effect, guaranteed photoelectric module 10's radiating effect.
Referring to fig. 3, in one embodiment, the signal transmission mechanism 300 includes an optical fiber array assembly 310, a driving chip 320 and a power chip 330, wherein the driving chip 320 is electrically connected to the optical fiber array assembly 310 and the power chip 330, the driving chip 320 is used for mutually converting an electrical signal and an optical signal, and the optical fiber array assembly 310 is used for transmitting the optical signal converted by the driving chip 320; the power chip 330 is used to supply power to the driving chip 320. It can be understood that the power chip 330 provides power to the driving chip 320, so that the driving chip 320 converts an electrical signal into an optical signal, the optical fiber array assembly 310 transmits the converted optical signal, and the driving chip 320 converts the optical signal transmitted by the optical fiber array assembly 310 into an electrical signal, thereby ensuring the transmission effect of the optoelectronic module 10.
Referring to fig. 4 to fig. 6, in one embodiment, the elastic heat dissipation mechanism 400 includes a first elastic heat dissipation component 410 and a second elastic heat dissipation component 420, the first elastic heat dissipation component 410 is disposed between the driving chip 320 and the cover 200, the first elastic heat dissipation component 410 is elastically abutted to the driving chip 320 and the cover 200, the second elastic heat dissipation component 420 is disposed between the power chip 330 and the cover 200, and the second elastic heat dissipation component 420 is elastically abutted to the power chip 330 and the cover 200. It can be appreciated that the first elastic heat dissipation component 410 is elastically abutted to the driving chip 320 and the cover 200 respectively, and the driving chip 320 and the cover 200 are buffered by the first elastic heat dissipation component 410, so as to protect the driving chip 320, further ensure the service life of the photovoltaic module 10, and ensure the compactness of the first elastic heat dissipation component 410 and the driving chip 320 and the cover 200 respectively, so as to directly transfer the heat generated by the driving chip 320 to the cover 200 through the first elastic heat dissipation component 410, thereby avoiding the problem that the heat generated by the driving chip 320 is transferred to the cover 200 by the conventional photovoltaic module 10 to cause poor heat dissipation effect, and ensuring the heat dissipation effect of the photovoltaic module 10; likewise, the second elastic heat dissipation component 420 is elastically abutted to the power chip 330 and the cover 200 respectively, and the power chip 330 and the cover 200 are buffered by the second elastic heat dissipation component 420, so that the power chip 330 is protected, the service life of the photoelectric module 10 is further ensured, the compactness of the second elastic heat dissipation component 420 and the power chip 330 and the cover 200 is better, and the heat generated by the power chip 330 is directly transferred to the cover 200 by the second elastic heat dissipation component 420, so that the problem that the heat generated by the power chip 330 is transferred to the cover 200 by air to cause poor heat dissipation effect by the traditional photoelectric module 10 is avoided, and the heat dissipation effect of the photoelectric module 10 is ensured.
Referring to fig. 4 to 6, the driving chip 320 is provided with gold wires, which are easily damaged, so as to influence the signal transmission effect of the optoelectronic module 10. In order to ensure the signal transmission effect of the optoelectronic module 10, in one embodiment, the first elastic heat dissipation component 410 includes a first elastic heat conduction buffer member 411 and an elastic heat conduction protection cover 412, the elastic heat conduction protection cover 412 is clamped to the first elastic heat conduction buffer member 411, and two sides of the first elastic heat conduction buffer member 411 are respectively and elastically connected to the driving chip 320 and the cover 200.
Referring to fig. 4 to fig. 6 together, in one embodiment, the first elastic thermal buffer 411 includes two first elastic thermal pads 4111, the elastic thermal protection cover 412 is disposed between the two first elastic thermal pads 4111, one first elastic thermal pad 4111 is connected to the elastic thermal protection cover 412 and the driving chip 320 respectively, and the other first elastic thermal pad 4111 is connected to the elastic thermal protection cover 412 and the cover 200 respectively. It can be understood that the elastic thermal protection cover 412 is disposed between the two first elastic thermal pads 4111, that is, the two first elastic thermal pads 4111 protect the elastic thermal protection cover 412, and the two first elastic thermal pads 4111 and the elastic thermal protection cover 412 have better elasticity, so that the buffer structure formed by the two first elastic thermal pads 4111 and the elastic thermal protection cover 412 provides better protection for the driving chip 320, and the buffer structure formed by the two first elastic thermal pads 4111 and the elastic thermal protection cover 412 provides better protection for the gold wires on the driving chip 320.
Referring to fig. 4 to 6, in one embodiment, the elastic heat-conducting protection cover 412 is an aluminum alloy elastic heat-conducting protection cover. It can be understood that the aluminum alloy elastic heat conduction protective cover has higher strength, so as to ensure the strength of the buffer structure formed by the two first elastic heat conduction pads 4111 and the elastic heat conduction protective cover 412, and further protect gold wires on the driving chip 320, and the aluminum alloy elastic heat conduction protective cover has better elasticity and heat conductivity, so as to ensure the elasticity and heat conductivity of the buffer structure formed by the two first elastic heat conduction pads 4111 and the elastic heat conduction protective cover 412, and further better transfer the heat generated by the driving chip 320 to the cover 200, and further transfer the heat to the outside of the photovoltaic module 10, i.e. ensure the heat dissipation effect of the photovoltaic module 10.
Further, in one of the embodiments, the aluminum alloy elastic heat conductive protective cover is an anodized aluminum alloy elastic heat conductive protective cover. It can be appreciated that the service life of the anodized aluminum alloy elastic heat-conductive protective cover is ensured.
Referring to fig. 7 to fig. 10, in one embodiment, the second elastic heat dissipation component 420 is a second elastic heat conductive pad 421. It can be appreciated that the second elastic heat conducting pad 421 is elastically abutted to the power chip 330 and the cover 200 respectively, and the power chip 330 and the cover 200 are buffered by the second elastic heat conducting pad 421, so as to protect the power chip 330, further ensure the service life of the photovoltaic module 10, and ensure the good compactness of the photovoltaic module 10, and directly transfer the heat generated by the power chip 330 to the cover 200 through the second elastic heat conducting pad 421, so that the heat generated by the power chip 330 is transferred to the outside of the photovoltaic module 10, thereby avoiding the problem that the heat generated by the power chip 330 is transferred to the cover 200 by the traditional photovoltaic module 10 to cause poor heat dissipation effect, and ensuring the heat dissipation effect of the photovoltaic module 10.
Referring to fig. 1 and 3, in one embodiment, the housing 100 includes a printed board provided with copper components connected to the signal transmission mechanism 300, the printed board and the cover 200, respectively. It can be appreciated that the copper component has better thermal conductivity, and can transfer the heat generated by the signal transmission mechanism 300 and the heat generated by the printed board to the cover 200, so as to ensure the heat dissipation effect of the optoelectronic module 10.
Referring to fig. 1 and 3, in one embodiment, the copper assembly includes a copper-embedded block and a copper-clad member, the copper-embedded block is disposed on the printed board, the copper-embedded block is respectively connected to the signal transmission mechanism 300, the printed board and the cover 200, the copper-clad member is disposed on the printed board, the copper-clad member is disposed avoiding the signal transmission mechanism 300, and the copper-clad member is respectively connected to the printed board and the cover 200. It can be appreciated that the copper block is connected to the cover 200, so as to transfer the heat generated by the signal transmission mechanism 300 to the cover 200; similarly, the copper laying piece is also connected to the cover body 200, so that the heat generated by the signal transmission mechanism 300 is transmitted to the cover body 200 and then transmitted to the outside of the photoelectric module 10, namely, the heat dissipation effect of the photoelectric module 10 is ensured; and the copper paving piece is arranged on the printed board, so that the heat dissipation area is greatly increased, and the heat dissipation efficiency of the photoelectric module 10 is further improved.
Referring to fig. 2, in order to avoid the copper-clad member from being worn by the upper cover 210, a gap is formed between the copper-clad member and the upper cover 210, which affects the heat dissipation effect of the photovoltaic module 10. In order to transfer the heat of the copper-clad member to the upper cover 210 faster, in one embodiment, the cover body 200 includes an upper cover 210 and a lower cover 220, the upper cover 210 and the lower cover 220 are respectively disposed on two opposite sides of the housing 100, the upper cover 210 is convexly provided with a heat-conducting protrusion, the heat-conducting protrusion is connected to the copper-clad member, and the copper-embedded block is connected to the lower cover 220. It can be appreciated that the heat conductive protrusions are connected to the copper-clad member, so that the connection compactness between the upper cover 210 and the copper-clad member is ensured, and the heat dissipation effect of the photovoltaic module 10 is further ensured.
In one implementation, the first elastic thermal pad is a first thermal conductive shim, the first thermal conductive shim includes a first matrix and a plurality of first thermal conductive particles, the first matrix is formed with a plurality of first filling pores, and each first thermal conductive particle fills a corresponding first filling pore. Preferably, in one embodiment, the first thermally conductive shim has a thermal conductivity of 1W/mK to 11W/mK.
Preferably, in one of the embodiments, the first substrate is a first silicone substrate or a first non-silicone substrate.
In one implementation, the second elastic thermal pad is a second thermal conductive shim, the second thermal conductive shim includes a second matrix and a plurality of second thermal conductive particles, the second matrix is formed with a plurality of second filling voids, and each second thermal conductive particle fills a corresponding second filling void.
Preferably, in one embodiment, the second thermally conductive shim has a thermal conductivity of 1W/mK to 11W/mK.
Preferably, in one of the embodiments, the second substrate is a second silicone substrate or a second non-silicone substrate.
Compared with the prior art, the utility model has at least the following advantages:
according to the photoelectric module 10 disclosed by the utility model, the elastic heat dissipation mechanism 400 is respectively elastically abutted against the signal transmission mechanism 300 and the cover body 200, the signal transmission mechanism 300 and the cover body 200 are buffered through the elastic heat dissipation mechanism 400, so that the signal transmission mechanism 300 is protected, the service life of the photoelectric module 10 is further ensured, the photoelectric module 10 is better in structural compactness, the heat generated by the signal transmission mechanism 300 is directly transmitted to the cover body 200 through the elastic heat dissipation mechanism 400, the heat generated by the signal transmission mechanism 300 is further transmitted to the outside of the photoelectric module 10, the problem that the heat dissipation effect is poor due to the fact that the traditional photoelectric module 10 transmits the heat generated by the signal transmission mechanism 300 to the cover body 200 through air is avoided, and the heat dissipation effect of the photoelectric module 10 is ensured.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (9)
1. The photoelectric module comprises a shell, a cover body and a signal transmission mechanism, wherein the shell is connected with the cover body to form a containing groove, and the signal transmission mechanism is arranged in the containing groove; the signal transmission mechanism comprises an optical fiber array assembly, a driving chip and a power chip, wherein the driving chip is respectively and electrically connected with the optical fiber array assembly and the power chip, the driving chip is used for mutually converting an electric signal and an optical signal, and the optical fiber array assembly is used for transmitting the optical signal converted by the driving chip; the power chip is used for providing power for the driving chip.
2. The optoelectronic module of claim 1, wherein the elastic heat dissipation mechanism comprises a first elastic heat dissipation component and a second elastic heat dissipation component, the first elastic heat dissipation component is disposed between the driving chip and the cover, the first elastic heat dissipation component is elastically abutted to the driving chip and the cover, respectively, the second elastic heat dissipation component is disposed between the power chip and the cover, and the second elastic heat dissipation component is elastically abutted to the power chip and the cover, respectively.
3. The optoelectronic module of claim 2, wherein the first elastic heat dissipation assembly includes a first elastic heat conduction buffer member and an elastic heat conduction protection cover, the elastic heat conduction protection cover is clamped on the first elastic heat conduction buffer member, and two sides of the first elastic heat conduction buffer member are respectively and elastically connected to the driving chip and the cover body.
4. The optoelectronic module of claim 3 wherein the first elastic thermal buffer comprises two first elastic thermal pads, the elastic thermal protection cover is disposed between the two first elastic thermal pads, one first elastic thermal pad is connected to the elastic thermal protection cover and the driving chip, and the other first elastic thermal pad is connected to the elastic thermal protection cover and the cover body.
5. The optoelectronic module of claim 4 wherein the elastomeric thermally conductive protective cover is an aluminum alloy elastomeric thermally conductive protective cover.
6. The optoelectronic module of claim 2 wherein the second resilient heat sink assembly is a second resilient thermal pad.
7. The optoelectronic module of claim 1 wherein the housing comprises a printed board provided with copper components connected to the signal transmission mechanism, the printed board and the cover, respectively.
8. The optoelectronic module of claim 7, wherein the copper assembly comprises a copper block and a copper-plated piece, the copper block is disposed on the printed board, the copper block is respectively connected to the signal transmission mechanism, the printed board and the cover, the copper-plated piece is disposed on the printed board, the copper-plated piece is disposed away from the signal transmission mechanism, and the copper-plated piece is respectively connected to the printed board and the cover.
9. The optoelectronic module of claim 8 wherein the cover comprises an upper cover and a lower cover, the upper cover and the lower cover being disposed on opposite sides of the housing, respectively, the upper cover being convexly provided with a thermally conductive protrusion, the thermally conductive protrusion being connected to the copper spreader, the copper block being connected to the lower cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320354101.3U CN219641977U (en) | 2023-02-28 | 2023-02-28 | Optoelectronic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320354101.3U CN219641977U (en) | 2023-02-28 | 2023-02-28 | Optoelectronic module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219641977U true CN219641977U (en) | 2023-09-05 |
Family
ID=87820325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320354101.3U Active CN219641977U (en) | 2023-02-28 | 2023-02-28 | Optoelectronic module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219641977U (en) |
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2023
- 2023-02-28 CN CN202320354101.3U patent/CN219641977U/en active Active
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