CN209784599U

CN209784599U - Small-size heat dissipation optical module structure

Info

Publication number: CN209784599U
Application number: CN201920799850.0U
Authority: CN
Inventors: 伏春; 张晖; 廖强
Original assignee: Chengdu Hongxin Photoelectric Communication Co Ltd
Current assignee: Chengdu Hongxin Photoelectric Communication Co Ltd
Priority date: 2019-05-30
Filing date: 2019-05-30
Publication date: 2019-12-13
Anticipated expiration: 2029-05-30

Abstract

The utility model discloses a small-size heat dissipation optical module structure, it includes: the metal upper shell part, the heat conducting material part, the PCB, the metal lower shell part, the built-in optical fiber, the MPO connector and the locking part are fixedly connected by the locking part, the built-in MT-FA optical fiber is coupled and connected with a chip placed on the PCB through a coupling device, the built-in MT-FA optical fiber and the MPO connector are fixed through a fixed clamping groove in the metal shell, the heat conducting material is placed on a metal copper-coated surface of the PCB and is assembled and attached to the inner surface of the metal shell through the metal shell, the PCB is fixed on the metal lower shell through screws, and the metal upper shell and the metal lower shell are connected through side screws so as to be convenient to assemble; the structure has the characteristics of small volume and light weight, is simple in structure and convenient to assemble, can be butted with the server clamping plate, is stable in structure, enlarges the heat dissipation area, optimizes the heat dissipation structure, and effectively enhances the heat dissipation performance.

Description

Small-size heat dissipation optical module structure

Technical Field

the utility model belongs to the technical field of optical communication, particularly, relate to a small-size heat dissipation optical module structure.

Background

With the continuous development of the optical communication industry, the requirements of large-scale data processing centers, storage rooms and radar processing centers on the signal interconnection technology are improved, and higher requirements are provided for the high density, high data rate, anti-interference performance, high speed and the like of optical modules.

However, the current optical communication market is more and more competitive, the volume required by communication equipment is smaller and smaller, the interface density included in an interface board is higher and higher, the traditional optical module with a laser and a detector separated from each other is difficult to adapt to the requirements of modern communication equipment, and in order to adapt to the requirements of the communication equipment on optical devices, the optical module is developing to a small package with high integration.

The optical module structure in the prior art has no good heat dissipation performance and larger volume under the condition of meeting various requirements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a small-size heat dissipation optical module structure, its structure is small and exquisite, light in weight, can dock with the server cardboard, and stable in structure has enlarged heat radiating area, has optimized heat radiation structure, has effectively strengthened heat dispersion.

The embodiment of the utility model is realized like this:

A compact thermal light module structure, comprising: metal epitheca spare, heat-conducting material spare, the PCB board, metal lower casing spare, built-in optic fibre, MPO connector and retaining member, the retaining member is with metal epitheca spare, PCB board and metal lower casing spare fixed connection, metal epitheca spare and metal lower casing spare are buckled mutually and are formed the open end that one end has the installation MPO connector, MPO connector card is at the open end and is internal external connection, MPO connector is internal-connection built-in optic fibre, the top of PCB board is arranged in to built-in optic fibre, embedding annular heat-conducting material spare between metal epitheca spare and the PCB board.

In a preferred embodiment of the present invention, the built-in optical fiber is coupled to the optoelectronic chip of the PCB, and one end of the built-in optical fiber is disposed in the MPO connector.

In the preferred embodiment of the present invention, the metal bottom casing is provided with a through groove for embedding a PCB, the PCB is set to be annular and the bottom is protruded, and the metal bottom casing matches with the bottom of the PCB.

In the preferred embodiment of the present invention, the top of the metal casing member is provided with protrusions spaced from each other, and the bottom of the metal casing member is provided with a top portion matching the top portion of the heat conductive member.

the utility model discloses in the embodiment of preferred, above-mentioned heat-conducting material spare is arranged in the copper face of covering of PCB board, and small-size heat dissipation optical module structure gives off the heat outside the metal inferior valve spare through heat-conducting material spare and metal epitheca spare.

In a preferred embodiment of the present invention, the locking member includes a first screw and a second screw, and the first screw and the second screw are connected to the metal bottom case member along different directions.

In the preferred embodiment of the present invention, the metal lower casing and the PCB board are respectively provided with at least two first through holes, the bottom of the metal upper casing is inwardly recessed to form a first connecting hole opposite to the first connecting hole, and the first screw fixedly connects the metal lower casing, the PCB board and the metal upper casing.

In a preferred embodiment of the present invention, the metal lower casing and the metal upper casing are respectively provided with a second through hole at the opening end, and the second screw is used for fixedly connecting the metal upper casing and the metal lower casing through the second through hole along the horizontal direction.

The utility model has the advantages that:

The utility model discloses a chip coupling connection on built-in MT-FA optic fibre and the PCB board, built-in MT-FA optic fibre and MPO connector pass through the groove in the metal casing and fix, have high reliability, heat conduction material spare is in PCB board metal copper-clad face, through assembling the internal surface of affixing to the metal casing spare, the heat dissipation of being convenient for, the PCB board passes through the screw fixation in metal lower casing spare, the equipment of being convenient for; the structure has the characteristics of small volume and light weight, is simple in structure and convenient to assemble, can be butted with the server clamping plate, is stable in structure, enlarges the heat dissipation area, optimizes the heat dissipation structure, and effectively enhances the heat dissipation performance.

The utility model discloses still have following advantage:

The high-speed data transmission system has the characteristics of high confidentiality, anti-interference performance, high speed, high density, high reliability and the like, and realizes high-capacity high-speed data transmission by utilizing high-speed channel multiplexing; the self-contained radiator has ultrahigh heat dissipation capacity, can be directly butted with a server board card, is convenient to install, improves the reliability of products, and reduces the difficulty of the production process.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope.

Fig. 1 is a schematic view of a small heat-dissipating optical module according to the present invention;

Icon: 1-a metal top shell; 2-a piece of thermally conductive material; 3-a PCB board; 4-a metal bottom shell member; 5-a first screw; 6-a second screw; 7-a built-in MT-FA optical fiber; 8-MPO connector.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

First embodiment

referring to fig. 1, the present embodiment provides a small heat-dissipating optical module structure, which includes: the metal upper shell part 1, the heat conducting material part 2, the PCB 3, the metal lower shell part 4, the built-in optical fiber, the MPO connector 8 and the locking part are fixedly connected by the locking part, the metal upper shell part 1, the PCB 3 and the metal lower shell part 4 form the metal shell part, the built-in optical fiber is a built-in MT-FA optical fiber 7, the locking part comprises a first screw 5 and a second screw 6, the first screw 5 is an M1.6 screw, the second screw 6 is an M2 screw, the metal upper shell part 1 and the metal lower shell part 4 are connected with each other to form a whole body, an internal space for installing other components is arranged in the metal upper shell part 1 and the metal lower shell part 4, the metal upper shell part 1 and the metal lower shell part 4 are connected in a buckling mode, the heat conducting material part 2, the PCB 3, the built-in MT-FA optical fiber 7 and the MPO connector 8 are packaged in the internal space, the heat conducting material part 2 is attached to the inner surface of the metal shell part through the, the PCB 3 is fixed on the metal upper shell part 1 and the metal lower shell part 4 through locking parts, and assembly is facilitated.

The metal upper shell part 1 and the metal lower shell part 4 are arranged in a shell shape, one end of each of the metal upper shell part 1 and the metal lower shell part 4 is respectively provided with a groove which communicates the inside and the outside, the two grooves are opposite in position and form an internal and external communicated structure, the metal upper shell part 1 and the metal lower shell part 4 are buckled with each other to form an open end, one end of each of the metal upper shell part 1 and the metal lower shell part 4 is provided with an MPO connector 8, the open end is an internal and external communicated structure formed by the two grooves, the MPO connector 8 is clamped at the open end and is connected internally and externally, the open end just clamps the outer side of the MPO connector 8 for one circle, the MPO connector 8 is internally connected with the built-in MT-FA optical fiber 7, one end of the inner side of the MPO connector 8 is provided with a socket for inserting the optical fiber, one end of the built-, the built-in MT-FA optical fiber 7 is positioned on the top of the PCB 3, the joint of the built-in MT-FA optical fiber 7 and the MPO connector 8 is bonded on the top of the PCB 3 through curing glue, the MPO connector 8, the built-in MT-FA optical fiber 7 and the PCB 3 are connected to form an integral structure, and the MPO connector 8 is in butt joint with the server card.

The metal lower shell piece 4 is provided with a through groove embedded into the PCB 3, the PCB 3 is annular, the bottom of the PCB 3 is provided with a convex shape, the bottom of the PCB 3 is clamped into the through groove of the metal lower shell piece 4 and is mutually clamped and matched, the top of the metal lower shell piece 4 is provided with a clamping groove clamped into the joint of the built-in MT-FA optical fiber 7 and the MPO connector 8, the MPO connector 8 is just embedded into the groove at one end of the metal lower shell piece 4 and is mutually matched with the groove at one end of the metal upper shell piece 1, the top of the metal upper shell piece 1 is provided with convex-concave protrusions which are arranged alternately, the protrusions are provided with 4 multiplied by 6 arrays, and the arrangement of the protrusions is favorable for the metal upper shell piece 1 to radiate heat inside the optical module structure to the outside; imbed annular heat-conducting material spare 2 between metal epitheca spare 1 and the PCB board 3, the shape of this heat-conducting material spare 2 is the same with the marginal shape of PCB board 3, heat-conducting material spare 2 is the annular, and the position at the both ends of heat-conducting material spare 2 and 3 both ends of PCB board is relative, the bottom setting of metal epitheca spare 1 matches with the top of heat-conducting material spare 2, when metal epitheca spare 1 and metal inferior valve spare 4 are buckled mutually, the bottom at metal epitheca spare 1 is laminated to heat-conducting material spare 2, the copper facing of PCB board 3 is arranged in to heat-conducting material spare 2 simultaneously, it does benefit to heat-conducting material spare 2 and passes through heat-conducting material spare 2 and metal superior valve spare 1 and spreads the heat outside the metal epitheca spare.

The locking piece comprises a first screw 5 and a second screw 6, the first screw 5 is an M1.6 screw, the second screw 6 is an M2 screw, the first screw 5 and the second screw 6 are respectively connected to the metal lower shell piece 4 along the vertical direction and the horizontal direction, the metal lower shell piece 4 and the PCB 3 are respectively provided with three first through holes, one of the first through holes is respectively positioned at one end of the metal lower shell piece 4 and one end of the PCB 3, the other two first through holes are positioned at the other end of the PCB 3 and the middle part of the metal lower shell piece 4, the bottom of the metal upper shell piece 1 is inwards concavely provided with three first connecting holes opposite to the first connecting holes, and the first screw 5 fixedly connects the metal lower shell piece 4, the PCB 3 and the metal upper shell piece 1 from the bottom of the metal lower shell piece 4; the metal lower shell part 4 and the metal upper shell part 1 are respectively provided with a second through hole located at the opening end, the second through holes are arranged one by one, the side face of the metal upper shell part 1 is provided with a second through hole located at the position of the opening end, the side face of the metal lower shell part 4 is provided with a second through hole located at the bottom position of the opening end of the metal lower shell part 4, and a second screw 6 is used for fixedly connecting the metal upper shell part 1 and the metal lower shell part 4 through the second through holes along the horizontal direction.

the utility model discloses the equipment step of example does:

Firstly, the built-in MT-FA optical fiber 7 is coupled and connected with the photoelectric chip on the PCB 3 through a coupling device, so that the optical power coupling efficiency of the optical module is maximized, and the performance of the optical module is ensured to reach the optimal state; then the coupled built-in MT-FA optical fiber 7 is arranged in an MPO connector 8, and the built-in MT-FA optical fiber 7 and the MPO connector 8 are fixed on the top of the PCB 3 through curing glue; finally, the PCB 3, the built-in MT-FA optical fiber 7 and the MPO connector 8 are arranged in the metal lower shell, the heat conducting material piece 2 is arranged on the copper-coated surface of the PCB 3, the metal upper shell 1 is assembled with the metal lower shell 4, so that the heat conducting material piece 2 is attached to the inner surface of the metal shell, and the heat inside the optical module structure is dissipated to the air through the heat conducting material piece 2 and the metal upper shell 1 radiator.

To sum up, the embodiment of the present invention couples the built-in MT-FA fiber to the chip on the PCB, the built-in MT-FA fiber and the MPO connector are fixed by the groove in the metal shell, so that the present invention has high reliability, the heat conducting material is attached to the copper-clad surface of the metal of the PCB, and is convenient for heat dissipation by being assembled and attached to the inner surface of the metal shell, and the PCB is fixed to the metal lower shell and the metal lower shell by screws, so that the assembly is convenient; the structure has the characteristics of small volume and light weight, is simple in structure and convenient to assemble, can be butted with the server clamping plate, is stable in structure, enlarges the heat dissipation area, optimizes the heat dissipation structure, and effectively enhances the heat dissipation performance.

This description describes examples of embodiments of the invention, and is not intended to illustrate and describe all possible forms of the invention. It will be appreciated by those of ordinary skill in the art that the embodiments described herein are intended to assist the reader in understanding the principles of the invention, and it is to be understood that the scope of the invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the teachings of the present invention without departing from the spirit of the invention, and such modifications and combinations are still within the scope of the invention.

Claims

1. A compact thermal module structure, comprising: the metal upper shell part, the PCB and the metal lower shell part are fixedly connected by the locking part, one end of the metal upper shell part and one end of the metal lower shell part are buckled to form an open end, the open end is used for installing the MPO connector, the MPO connector is clamped at the open end and is connected internally and externally, the MPO connector is internally connected with the built-in optical fibers, the built-in optical fibers are arranged at the top of the PCB, and the annular heat conducting material part is embedded between the metal upper shell part and the PCB.

2. The structure of claim 1, wherein the built-in optical fiber is coupled to the optoelectronic chip of the PCB, and one end of the built-in optical fiber is disposed in the MPO connector.

3. The structure of claim 2, wherein the metal bottom case member has a through groove for inserting into the PCB, the PCB is disposed in a ring shape and has a bottom with a protrusion, and the metal bottom case member matches with the bottom protrusion of the PCB.

4. The structure of claim 2, wherein the top of the metal top case is provided with protrusions and protrusions, and the bottom of the metal top case is matched with the top of the heat conducting material.

5. The small form factor thermal module structure of claim 2, wherein the thermal conductive material is disposed on the copper-clad surface of the PCB, and the small form factor thermal module structure dissipates heat to the outside of the metal bottom case through the thermal conductive material and the metal top case.

6. The structure of claim 1, wherein the locking member comprises a first screw and a second screw, and the first screw and the second screw are connected to the metal bottom case in different directions.

7. The structure of claim 6, wherein the metal bottom case and the PCB are respectively provided with at least two first through holes, the bottom of the metal top case is recessed with a first connecting hole opposite to the first connecting hole, and the first screw fixedly connects the metal bottom case, the PCB and the metal top case.

8. The small heat dissipating optical module structure of claim 6, wherein the metal bottom case member and the metal top case member are respectively provided with a second through hole at the opening end, and the second screw is used to fixedly connect the metal top case member and the metal bottom case member through the second through hole along the horizontal direction.