CN209784600U - Multi-path parallel optical module structure - Google Patents
Multi-path parallel optical module structure Download PDFInfo
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- CN209784600U CN209784600U CN201920800389.6U CN201920800389U CN209784600U CN 209784600 U CN209784600 U CN 209784600U CN 201920800389 U CN201920800389 U CN 201920800389U CN 209784600 U CN209784600 U CN 209784600U
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- spare
- lens device
- optical module
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Abstract
the utility model discloses a parallel optical module structural design of multichannel, including metal upper casing spare, metal lower casing spare, place the PCB board in the casing spare, the LENS device, MT optic fibre, miniature array connector, array connector fixed plate and heat conduction material spare, array connector fixed plate is fixed in miniature array connector in metal lower casing spare bottom, and make it meet with the PCB board, the LENS device passes through coupling device and is connected with the photoelectric chip coupling of placing on the PCB board, after the coupling is accomplished, MT optic fibre is connected with the LENS device and is fixed through curing glue, heat conduction material spare is placed between metal upper casing spare and metal lower casing spare, metal upper casing spare and metal lower casing spare pass through the screw fixation, be convenient for assemble; the structure is used for the optical module with multiple paths of parallel circuits, has the characteristics of simple structure, convenience in installation and stable performance, and can effectively transfer heat generated inside the optical module structure out.
Description
Technical Field
The utility model belongs to the technical field of optical communication, particularly, relate to a parallel optical module structure of multichannel.
Background
With the popularization of internet technology and the arrival of a big data era and the massive use of network terminal equipment, people increasingly demand high-capacity and high-speed information transmission, and the data channel of the network equipment is forced to be continuously increased by the high-capacity information transmission, so that the channel number demand of an optical module is also continuously increased, and a multipath parallel optical module is widely applied and increasingly demanded as an important device for photoelectric conversion of optical communication due to the characteristics of high capacity and low power consumption.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a parallel optical module structure of multichannel, it can be used for the parallel optical module of multichannel, has simple structure, the installation of being convenient for, stable performance's characteristics, can transmit the heat of the inside production of optical module structure effectively out.
The embodiment of the utility model is realized like this:
A multi-way parallel optical module structure, comprising: metal epitheca spare, heat-conducting material spare, the PCB board, the LENS device, optic fibre, metal inferior valve spare, miniature array connector, array connector fixed plate and retaining member, the retaining member seals metal epitheca spare top under the metal, the PCB board is fixed in metal inferior valve spare, the LENS device is fixed at PCB board top and is located metal inferior valve spare, optic fibre passes metal inferior valve spare and is connected to the LENS device, miniature array connector card is gone into array connector fixed plate and is regarded as whole and card in metal inferior valve spare, heat-conducting material spare is inlayed in the metal inferior valve spare.
In the preferred embodiment of the present invention, the metal bottom case has an installation space, and the metal top case encapsulates the heat conducting material, the PCB, the LENS device, the partial optical fiber, the micro array connector, and the array connector fixing plate in the installation space.
In a preferred embodiment of the present invention, the LENS device is coupled to the light spot chip of the PCB, and the LENS device and the optical fiber are fixed in the metal casing by the curing adhesive.
In the preferred embodiment of the present invention, the array connector fixing plate is provided with a clamping groove for clamping the micro array connector, the clamping groove connects the top and bottom sides of the array connector fixing plate, the arrangement of the clamping groove makes the array connector fixing plate be annular, and the shape and size of the clamping groove just match with the micro array connector.
In a preferred embodiment of the present invention, the shape and size of the outer side of the fixing plate of the array connector and the inner wall of the metal bottom case member are matched and clamped with each other.
In a preferred embodiment of the present invention, the two sides of the metal upper casing are respectively provided with grid grooves communicating with the top and the bottom, and the two sides of the metal lower casing are respectively provided with grid grooves opposite to the metal upper casing.
In the preferred embodiment of the present invention, the heat conducting material is fastened to the metal bottom casing through the metal top casing and the metal bottom casing, so that the heat conducting material is attached to the inner wall of the metal bottom casing, and the multi-path parallel optical module structure dissipates the heat of the metal bottom casing to the air through the heat conducting material and the metal top casing.
The utility model discloses in the preferred embodiment, above-mentioned retaining member is the screw, and metal epitheca spare is provided with the through-hole that distributes in the four corners, and metal inferior valve spare is provided with the connecting hole that distributes in the four corners, and the screw is gone into the connecting hole through the through-hole card and is fixed metal epitheca spare and metal inferior valve spare connection.
The utility model has the advantages that:
The utility model discloses a metal upper casing spare and metal lower casing component form the packaging structure of optical module structure and with heat-conducting material spare, PC version board, LENS device, MT optic fibre, miniature array connector, array connector fixed plate encapsulation, through the part that forms multichannel parallel photoelectric processing signal with the coupling of LENS device to PCB plate, through heat-conducting material spare with the inside heat dissipation of optical module structure pass out; the structure can be used for a multi-path parallel optical module, has the characteristics of simple structure, convenience in installation and stable performance, and can effectively transfer heat generated in the optical module structure.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope.
Fig. 1 is an assembly diagram of the multi-path parallel optical module structure of the present invention;
Icon: 1-a metal top shell; 2-a piece of thermally conductive material; 3-a PCB board; a 4-LENS device; 5-MT optical fiber; 6-metal bottom shell member; 7-a micro array connector; 8-an array connector fixing plate; 9-screw.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
First embodiment
Referring to fig. 1, the present embodiment provides a multi-channel parallel optical module structure, which includes: the optical fiber array connector comprises a metal upper shell member 1, a heat conducting material member 2, a PCB (printed circuit board) 3, a LENS (LENS array) device 4, an optical fiber, a metal lower shell member 6, a micro array connector 7, an array connector fixing plate 8 and a locking member, wherein the optical fiber is an MT optical fiber 5, the locking member is a screw 9, the screw 9 connects the metal upper shell member 1 with the metal lower shell member 6, the metal lower shell member 6 is provided with an installation space, and the heat conducting material member 2, the PCB 3, the LENS device 4, the MT optical fiber 5, the micro array connector 7 and the array connector fixing plate 8 are installed in the installation space of the metal lower shell member 6; the packaging structure of the optical module structure is formed by the metal upper shell piece 1 and the metal lower shell piece 6, heat inside the optical module structure is radiated and transmitted out through the heat conducting material piece 2 and the metal upper shell piece 1, the inside and the outside are communicated through the MT optical fiber 5, optical signals are transmitted, and the photoelectric signals are converted through the LENS device 4 and the PCB board 3.
The locking piece seals the metal upper shell part 1 at the top of the metal lower shell part 6, the metal upper shell part 1 is in a square plate shape, grid grooves communicated with the top surface and the bottom surface are respectively arranged on two sides of the metal upper shell part 1, 7 grid grooves are parallel to each other, equal intervals are formed between every two adjacent grid grooves, grid grooves opposite to the metal upper shell part 1 are respectively arranged on the tops of two sides of the metal lower shell part 6, and heat in an installation space is convenient to transfer to the outside of the optical module structure due to the arrangement of the grid grooves; metal under casing spare 6 has installation space, this installation space includes the recess of the inner space of metal under casing spare 6 of 1 encapsulation metal under casing spare of metal and metal under casing spare 6 bottom, metal under casing spare 6 sets up to square block, the inside indent of top of metal under casing spare 6 is established and is formed the inner space, this inner space wholly is squarely, the grid trench is located the metal under the both sides of casing and with the inner space looks interval, use metal under casing spare 1 with heat-conducting material spare 2, PCB board 3, LENS device 4, partial MT optic fibre 5 encapsulates simultaneously in the inner space, miniature array connector 7 and array connector fixed plate 8 are fixed in the bottom recess of metal under casing spare 6.
The PCB 3 is fixed in a lower metal casing part 6 through curing glue, the PCB 3 is positioned at the bottom of an installation space, a LENS device 4 is fixed at the top of the PCB 3 and positioned in the lower metal casing part 6, the LENS device 4 is coupled with a light spot chip of the PCB 3, the LENS device 4 and an MT optical fiber 5 are fixed in the lower metal casing part 6 through the curing glue, an MT optical fiber 5 port for connecting the MT optical fiber 5 is arranged on the side surface of the lower metal casing part 6, one end of the MT optical fiber 5 is inserted into the lower metal casing part 6 through the MT optical fiber 5 port, the MT optical fiber 5 penetrates through the lower metal casing part 6 and is electrically connected to the LENS device 4, and the MT optical fiber 5 transmits signals to the LENS device 4 and performs photoelectric signal conversion; the micro array connector 7 is provided with a connecting hole for electrically connecting the PCB 3, the metal lower shell part 6 is provided with a through hole for connecting the micro array connector 7 and the PCB 3, the micro array connector 7 is connected with the PCB 3 inside the metal lower shell part 6 through the connecting hole for signal transmission, the micro array connector 7 is clamped into the array connector fixing plate 8 as a whole, the bottom of the metal lower shell is provided with a groove for clamping the array connector fixing plate 8, the micro array connector 7 and the array connector fixing plate 8 are clamped into the groove at the bottom of the metal lower shell part 6 as a whole, the array connector fixing plate 8 is provided with a clamping groove for clamping the micro array connector 7, the clamping groove is communicated with the two sides of the top and the bottom of the array connector fixing plate 8, the shape and the size of the outer side of the array connector fixing plate 8 are matched and clamped with the inner wall of the metal lower shell part 6, the whole clamping groove is square, a protruding structure is arranged at the edge of the clamping groove, the protruding structure is just matched and clamped with the concave part at the edge of the micro array connector 7, the array connector fixing plate 8 is annular due to the arrangement of the clamping groove, and the shape and the size of the clamping groove are just matched with the micro array connector 7; the heat conducting material piece 2 is arranged in a strip shape sheet shape, the heat conducting material piece 2 is embedded into the metal lower shell piece 6, the heat conducting material piece 2 is buckled with the metal lower shell piece 6 through the assembly of the metal upper shell piece 1 and the metal lower shell piece 6, so that the heat conducting material piece 2 is attached to the inner wall of the metal lower shell piece 6, a heat dissipation table for placing the heat conducting material piece 2 is arranged in the metal lower shell piece 6 along the edge of the inner part of the metal lower shell piece 6, the heat conducting material piece 2 is arranged on the heat dissipation table, and the heat of the metal lower shell piece 6 is dissipated into the air through the heat conducting material piece 2 and the metal upper shell piece 1 by; the retaining member is screw 9, and metal epitheca spare 1 is provided with the through-hole that distributes in the four corners, and metal inferior valve spare 6 is provided with the connecting hole that distributes in the four corners, and screw 9 is gone into the connecting hole and is connected fixedly with metal epitheca spare 1 and metal inferior valve spare 6 through the through-hole card.
the utility model discloses the equipment step of example does:
firstly, fixing the PCB 3 in the lower metal shell, and fixing the micro array connector 7 at the bottom of the lower metal shell through an array connector fixing plate 8; then the LENS device 4 is coupled and connected with the photoelectric chip on the PCB 3 through a coupling device, the MTMT optical fiber 5 is connected into the LENS device 4 after the coupling is finished, and the MTMT optical fiber and the LENS device are fixed in the shell through curing glue; finally, the heat-conducting material piece 2 is arranged on a heat dissipation platform of the metal lower shell piece 6 and is assembled and extruded to be attached to the inner surface of the metal shell piece through the metal upper shell piece 1 and the metal lower shell piece 6; the heat inside the optical module is dissipated to the air through the metal upper shell 1 and the heat conducting material 2, and the heat dissipation effect of the optical module is achieved.
To sum up, the embodiment of the present invention forms the package structure of the optical module structure by the metal upper casing and the metal lower casing and packages the heat conducting material, the PC board, the LENS device, the MT fiber, the micro array connector, and the array connector fixing board, and forms the multiple parallel parts of the photoelectric processing signal by coupling the LENS device to the PCB board, and the heat inside the optical module structure is dissipated and transmitted out by the heat conducting material; the structure can be used for a multi-path parallel optical module, has the characteristics of simple structure, convenience in installation and stable performance, and can effectively transfer heat generated in the optical module structure.
This description describes examples of embodiments of the invention, and is not intended to illustrate and describe all possible forms of the invention. It will be appreciated by those of ordinary skill in the art that the embodiments described herein are intended to assist the reader in understanding the principles of the invention, and it is to be understood that the scope of the invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the teachings of the present invention without departing from the spirit of the invention, and such modifications and combinations are still within the scope of the invention.
Claims (8)
1. A multiple parallel optical module structure, comprising: metal epitheca spare, heat-conducting material spare, PCB board, LENS device, optic fibre, metal inferior valve spare, miniature array connector, array connector fixed plate and retaining member, the retaining member seals up metal epitheca spare top under the metal, the PCB board is fixed in metal inferior valve spare, the LENS device is fixed at PCB board top and is located metal inferior valve spare in, optic fibre passes metal inferior valve spare and is connected to the LENS device, miniature array connector card goes into array connector fixed plate and blocks in metal inferior valve spare as whole, heat-conducting material spare inlays in the metal inferior valve spare.
2. The structure of claim 1, wherein the metal bottom case has a mounting space, and the heat conductive material, the PCB, the LENS device, the portion of the optical fiber, the micro array connector, and the array connector fixing plate are simultaneously encapsulated in the mounting space by using the metal top case.
3. The structure of claim 2, wherein the LENS device is coupled to the optical spot chip of the PCB, and the LENS device and the optical fiber are fixed in the metal housing by a curing adhesive.
4. The structure of claim 2, wherein the array connector fixing plate is provided with a slot for inserting the micro array connector, the slot connects the top and bottom sides of the array connector fixing plate, the slot is configured to make the array connector fixing plate have a ring shape, and the slot has a shape and size that is matched with the micro array connector.
5. The structure of claim 3, wherein the outer side of the array connector mounting plate is shaped and sized to mate with the inner wall of the metal bottom shell member.
6. The structure of claim 2, wherein the metal top case has grid grooves on both sides thereof for connecting the top and bottom surfaces, and the metal bottom case has grid grooves on both sides thereof for connecting the top and bottom surfaces.
7. The structure of claim 2, wherein the thermal conductive material is attached to the inner wall of the metal bottom case by the metal top case and the metal bottom case, and the structure of the multi-path parallel optical module dissipates the heat of the metal bottom case to the air through the thermal conductive material and the metal top case.
8. The structure of claim 1, wherein the locking member is a screw, the metal top case is provided with through holes distributed at four corners, the metal bottom case is provided with connecting holes distributed at four corners, and the screw is inserted into the connecting holes through the through holes to fix the metal top case and the metal bottom case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920800389.6U CN209784600U (en) | 2019-05-30 | 2019-05-30 | Multi-path parallel optical module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920800389.6U CN209784600U (en) | 2019-05-30 | 2019-05-30 | Multi-path parallel optical module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209784600U true CN209784600U (en) | 2019-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920800389.6U Active CN209784600U (en) | 2019-05-30 | 2019-05-30 | Multi-path parallel optical module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209784600U (en) |
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2019
- 2019-05-30 CN CN201920800389.6U patent/CN209784600U/en active Active
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