CN109283631B - Optical module - Google Patents
Optical module Download PDFInfo
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- CN109283631B CN109283631B CN201710590788.XA CN201710590788A CN109283631B CN 109283631 B CN109283631 B CN 109283631B CN 201710590788 A CN201710590788 A CN 201710590788A CN 109283631 B CN109283631 B CN 109283631B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 70
- 230000005693 optoelectronics Effects 0.000 claims description 127
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 20
- 238000002955 isolation Methods 0.000 description 22
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses an optical module which comprises a shell, a heat sink device and a printed circuit board, wherein the heat sink device is arranged in the shell and is in heat conduction connection with the shell, the printed circuit board is partially arranged on the heat sink device, the first photoelectric chip and the second photoelectric chip are arranged on the heat sink device and are electrically connected with the printed circuit board, the printed circuit board is provided with a first surface, a second surface opposite to the first surface and an accommodating part positioned on the first surface, the second photoelectric chip is arranged in the accommodating part, and the second photoelectric chip and the first photoelectric chip are arranged separately. The optical module has efficient heat dissipation capacity, and reduces signal crosstalk influence between the first photoelectric chip and the second photoelectric chip.
Description
Technical Field
The invention relates to the technical field of manufacturing of optical communication elements, in particular to an optical module.
Background
With the rapid development of 4G communication and the increasing exuberance of the cloud computing demand, the market demand for high-speed optical modules is increasing day by day. In response to the market demand for high bandwidth and high rate data transmission, module designs are increasingly being developed in the direction of miniaturization and high density. Although highly integrated circuits strive for miniaturization and low power consumption, with the development of high-speed and high-bandwidth module technology, high heat consumption of the module also becomes a problem to be faced, and if a good heat dissipation effect cannot be ensured, the performance of temperature-sensitive electro-optical/photoelectric conversion components and chips in the optical module can be greatly reduced, and even the whole module cannot work normally or fails. Therefore, a more efficient heat dissipation structure is required to ensure stable operation of the device.
Disclosure of Invention
The invention aims to provide an optical module which has efficient heat dissipation capacity and reduces the influence of signal crosstalk between a first photoelectric chip and a second photoelectric chip.
In order to achieve one of the above objectives, an embodiment of the present invention provides an optical module, where the optical module includes a housing, a heat sink device disposed in the housing and connected to the housing in a heat conducting manner, and a printed circuit board partially disposed on the heat sink device, where the optical module further includes a first optoelectronic chip and a second optoelectronic chip both disposed on the heat sink device, the first optoelectronic chip and the second optoelectronic chip are both electrically connected to the printed circuit board, the printed circuit board has a first surface, a second surface opposite to the first surface, and an accommodating portion located on the first surface, the second optoelectronic chip is disposed in the accommodating portion, the second optoelectronic chip and the first optoelectronic chip are separately disposed, the first optoelectronic chip, the second optoelectronic chip, and the printed circuit board are disposed on the same side of the heat sink device, and one side of the heat sink device away from the printed circuit board is connected to the housing.
As a further improvement of the embodiment of the present invention, the heat sink device includes a first heat sink and a second heat sink thermally connected to the first heat sink, the first optoelectronic chip is disposed on the first heat sink, the second heat sink is at least partially located in the accommodating portion, and the second optoelectronic chip is thermally connected to the second heat sink.
As a further improvement of the embodiment of the present invention, the first heat sink and the second heat sink are of an integrally molded structure.
As a further improvement of the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, and the first optoelectronic chip is located at an end of the printed circuit board close to the optical interface.
As a further improvement of the embodiment of the present invention, the first optoelectronic chip and the second optoelectronic chip are shifted from each other in the optical interface and electrical interface connection direction.
As a further improvement of the embodiment of the present invention, the first heat sink has a first boss on which the first optoelectronic chip is disposed, and the second heat sink has a second boss partially located in the accommodating portion.
As a further improvement of the embodiment of the present invention, the accommodating portion is an accommodating groove.
As a further improvement of the embodiment of the present invention, the first optoelectronic chip is a transmitting end chipset, and the second optoelectronic chip is a receiving end chipset.
As a further improvement of the embodiment of the invention, the receiving portion has a closed or open cross-section in a direction parallel to the first surface.
As a further improvement of the embodiment of the present invention, the optical module includes an optical interface and an electrical interface, an end portion of the printed circuit board close to the optical interface is connected to a flexible circuit board, and the flexible circuit board and the end portion of the printed circuit board form a receiving portion for receiving the second optoelectronic chip.
As a further improvement of the embodiments of the present invention, the optical module includes an optical interface and an electrical interface, the end of the printed circuit board near the optical interface forms a step circuit board, and the step of the step circuit board forms a receptacle for receiving the second optoelectronic chip
As a further improvement of the embodiment of the invention, the printed circuit board is glued to the heat sink device.
As a further improvement of the embodiments of the present invention, the first optoelectronic chip and the second optoelectronic chip are located on the same side or different sides of the heat sink device.
As a further improvement of the embodiment of the present invention, a first electrical isolation pad is disposed between the first optoelectronic chip and the heat sink device, and the first electrical isolation pad is thermally conductive connected and electrically isolated from the heat sink device.
As a further improvement of the embodiment of the present invention, a second electrical isolation pad is disposed between the second optoelectronic chip and the heat sink device, and the second electrical isolation pad is thermally conductive and electrically isolated from the heat sink device.
As a further improvement of the embodiment of the present invention, a gold finger is disposed at one end of the printed circuit board away from the first optoelectronic chip.
Compared with the prior art, the invention has the beneficial effects that: according to the technical scheme provided by the invention, the accommodating part is arranged on the printed circuit board, the second photoelectric chip is arranged in the accommodating part, and the first photoelectric chip and the second photoelectric chip are both arranged on the heat sink device, so that heat generated by the first photoelectric chip and the second photoelectric chip is dissipated to the shell through the heat sink device, and the heat dissipating capacity is high-efficiency. Meanwhile, the second photoelectric chip is far away from the first photoelectric chip, so that the distance between the two photoelectric chips is increased, and the signal crosstalk influence between the first photoelectric chip and the second photoelectric chip is greatly reduced.
Drawings
FIG. 1 is a schematic perspective view of a light module according to a first embodiment of the present invention;
fig. 2 is an exploded schematic view of a light module in a first embodiment of the present invention;
FIG. 3 is a schematic perspective view of a printed circuit board of the light module of FIG. 2;
FIG. 4 is a schematic perspective view of a printed circuit board and heat sink device and an optoelectronic chip of an optical module in a first embodiment of the present invention;
FIG. 5 is a perspective view of the light module of FIG. 4 in another orientation;
FIG. 6 is a front view of the light module of FIG. 4;
FIG. 7 is a schematic perspective view of a light module according to a second embodiment of the present invention;
fig. 8 is an exploded schematic view of a light module in a second embodiment of the present invention;
FIG. 9 is a perspective view of a printed circuit board of the light module of FIG. 8;
FIG. 10 is a schematic perspective view of a printed circuit board and heat sink device and an optoelectronic chip of an optical module in a second embodiment of the present invention;
FIG. 11 is a perspective view of the light module of FIG. 10 in another orientation;
FIG. 12 is a front view of the light module of FIG. 10;
fig. 13 is an exploded schematic view of a light module in a third embodiment of the present invention;
fig. 14 is a perspective view of a printed circuit board of the light module of fig. 13.
Detailed Description
The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.
In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are merely used to illustrate the basic structure of the subject matter of the present application.
Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Moreover, it will be understood that, although the terms first, second, etc. may be used herein to describe various elements or structures, these described elements should not be limited by the above terms. The above terms are only used to distinguish these descriptive objects from each other. For example, a first surface may be referred to as a second surface, and likewise, a second surface may also be referred to as a first surface, without departing from the scope of the application.
As shown in fig. 1 to 6, a first embodiment of the present invention discloses an optical module. Referring to fig. 1 and 2, the optical module includes a housing 20, an optical interface system 36 disposed in the housing 20, a connector 38 fixed on the housing 20, and a pull ring 40 disposed on the housing 20 for unlocking the optical module, wherein a spring 42 is disposed between the connector 38 and the optical interface system 36. The light module further comprises a heat sink device 22 and a printed circuit board 24. Wherein the heat sink device 22 is disposed within the housing 20 and thermally coupled to the housing 20, and the printed circuit board 24 is partially disposed on the heat sink device 22. In this embodiment, the printed circuit board 24 is fixed to the housing 20 by snap-fitting, and the heat sink device 22 is fixed to the housing 20 by gluing. Of course, the printed circuit board 24 may be disposed in the housing 20 using other connection methods, and likewise, the heat sink device 22 may be disposed in the housing 20 using other connection methods.
Specifically, the optical module further includes a first optoelectronic chip 26 and a second optoelectronic chip 28, both disposed on the heat sink device 22. The first optoelectronic chip 26 and the second optoelectronic chip 28 may be both optoelectronic chip arrays, or may be a single chip or a plurality of single chips arranged together. Here, the first photo-chip 26 is a laser array and the second photo-chip 28 is a photo-detector array. The first optoelectronic chip 26 and the second optoelectronic chip 28 are electrically connected to the printed circuit board 24 by a gold wire or other high-speed signal electrical connection.
Referring to fig. 3, the printed circuit board 24 has a first surface 30, a second surface 32 opposite to the first surface 30, and an opening 34 penetrating from the first surface 30 to the second surface 32. Wherein the second optoelectronic chip 28 is disposed in the opening 34, and the second optoelectronic chip 28 is disposed apart from the first optoelectronic chip 26.
In this embodiment, since the printed circuit board 24 is provided with the opening portion 34, the second optoelectronic chip 28 is disposed in the opening portion 34, and the first optoelectronic chip 26 and the second optoelectronic chip 28 are both disposed on the heat sink device 22. Therefore, the heat generated by the first and second optoelectronic chips 26 and 28 is dissipated to the housing 20 through the heat sink device 22, and the heat dissipation capability is high. Meanwhile, the second photoelectric chip 28 and the first photoelectric chip 26 are separately arranged, so that the distance between the two photoelectric chips is increased, the signal crosstalk influence between the first photoelectric chip 26 and the second photoelectric chip 28 is greatly reduced, and the heat dissipation effect is better.
Referring to fig. 4 and 5, the heat sink apparatus 22 includes a first heat sink 44 and a second heat sink 46 in thermally conductive connection with the first heat sink 44. The first photovoltaic chip 26 is disposed on the first heat sink 44, heat generated by the first photovoltaic chip 26 is dissipated to the housing 20 through the first heat sink 44, the second heat sink 46 is partially disposed in the opening 34, and the second photovoltaic chip 28 is disposed on the second heat sink 46. The first heat sink 44 and the second heat sink 46 are each in thermally conductive connection with the housing 20. In this way, the heat generated by the first and second photoelectric chips 26 and 28 is dissipated to the housing 20 through the first and second heat sinks 44 and 46, respectively, and the first and second photoelectric chips 26 and 28 are separately disposed, so that the optical module has a high-efficiency heat dissipation capability, and the signal crosstalk effect between the first and second photoelectric chips 26 and 28 is further reduced.
Referring to fig. 2, the housing 20 includes a first housing 48 and a second housing 50 connected to the first housing 48, and the first housing 48 and the second housing 50 may be fixed together by screws. The heat sink device 22 is disposed adjacent to the second housing 50 such that heat generated by the first and second optoelectronic chips 26, 28 is primarily transferred to the second housing 50, the second housing 50 being the primary heat dissipation surface. In addition, only a part of the heat is transferred to the first case 48, and the first case 48 is a sub heat radiation surface. The second housing 50 has a special heat dissipation design to better dissipate heat out of the housing 20.
In order to further improve the heat dissipation capability of the optical module, a heat dissipation pad or paste is disposed between the heat sink device 22 and the housing 20, so as to better conduct the heat on the heat sink device 22 to the housing 20. In this embodiment, a thermal pad or paste is disposed between the heat sink device 22 and the second housing 50. Specifically, a first heat sink 44 is disposed between the first housing 50 and the first heat sink 44, and a second heat sink 46 is disposed between the second housing 50 and the second heat sink 54. The first heat dissipation pad 52 and the first optoelectronic chip 26 are disposed on opposite sides of the first heat sink 44, and are disposed at corresponding positions, that is, a projection of the first heat dissipation pad 52 on the first surface 30 at least partially overlaps a projection of the first optoelectronic chip 26 on the first surface 30; the second thermal pad 54 and the second optoelectronic chip 28 are disposed on opposite sides of the second heat sink 46, and the positions of the second thermal pad 54 and the second optoelectronic chip 28 are also disposed correspondingly, that is, a projection of the second thermal pad 54 on the first surface 30 at least partially coincides with a projection of the second optoelectronic chip 28 on the first surface 30.
In this embodiment, the first and second heat sinks 44, 46 are of unitary construction. Of course, the first heat sink 44 and the second heat sink 46 may be separate heat sinks, and they are thermally connected to each other or to the housing 20. The heat sink device 22 formed by the first heat sink 44 and the second heat sink 46 is L-shaped, and this structure can make the first optoelectronic chip 26 and the second optoelectronic chip 28 staggered from each other in the optical path transmission direction, so as to facilitate the isolation of the optoelectronic signals. The L-shaped heat sink device 22 can also save heat sink usage while ensuring heat dissipation, and the printed circuit board 24 can obtain more board distribution space, which facilitates the layout of components.
The first heat sink 44 has a base 56 and a first boss 58, the first optoelectronic chip 26 is disposed on the first boss 58, the first optoelectronic chip 26 is disposed adjacent to one end of the printed circuit board 24, and the first optoelectronic chip 26 is electrically connected to the printed circuit board 24. The second heat sink 46 has a second boss 60, the second boss 60 being at least partially located in the opening portion 34. The second optoelectronic chip 28 is disposed on the second bump 60, and the second optoelectronic chip 28 is electrically connected to the printed circuit board 24. In addition, an end of the printed circuit board 24 away from the first optoelectronic chip 26 is provided with a peripheral electrical interface, here a gold finger, for electrically connecting with the outside.
In addition, the optical module includes an optical interface and an electrical interface, and the first optoelectronic chip 26 is located at an end of the printed circuit board 24 near the optical interface. Specifically, the first optoelectronic chip 26 and the second optoelectronic chip 28 are staggered in position in the optical interface and electrical interface connection direction.
Specifically, in this embodiment, the first photo-chip 26 is a laser, and the second photo-chip 28 is a photo-detector. Of course, the first photo-chip 26 may also be configured as a photo-detector and the second photo-chip 28 as a laser. Or both the first photo chip 26 and the second photo chip 28 are configured as a photo detector, and certainly, when the first photo chip 26 and the second photo chip 28 are lasers or photo detectors, the laser or the photo detectors may also have elements such as drivers or photo signal detectors. Here, the first photo-chip 26 is a laser and the second photo-chip 28 is a photodetector. Thus, the laser is arranged close to the middle part of the heat sink device 22 as a high heat generation element, and the heat dissipation effect is better. In addition, the laser is positioned at one side of the printed circuit board 24 instead of the middle part of the printed circuit board 24, so that the optical path design is convenient, and the assembly is more convenient.
The opening 34 is closed in cross section in a direction parallel to the first surface 30. That is, the opening 34 is a through hole having a closed outer periphery. Preferably, the opening 34 has a square cross-section in a direction parallel to the first surface 30. Of course, the cross section of the opening portion 34 in the direction parallel to the first surface 30 may be provided in other shapes.
In addition, the cross section of the opening 34 in the direction parallel to the first surface 30 may be open. For example, the cross section of the opening 34 in the direction parallel to the first surface 30 may be formed in a U-shape or an L-shape. Of course, other open shapes may be provided.
The printed circuit board 24 is bonded to the heat sink device 22. Of course, other attachment means may be used to secure the printed circuit board 24 to the heat sink device 22. The printed circuit board 24 may be directly bonded to the heat sink device 22 or indirectly bonded to the heat sink device 22, and a heat conducting medium or an electrically conducting medium may be disposed between the printed circuit board 24 and the heat sink device 22. In this embodiment, the first optoelectronic chip 26 and the second optoelectronic chip 28 are located on the same side of the heat sink device 22. That is, the first optoelectronic chip 26 and the second optoelectronic chip 28 are disposed on the same surface of the heat sink device, and the first optoelectronic chip 26 and the second optoelectronic chip 28 are electrically connected to the same surface of the printed circuit board 24. Of course, the first and second optoelectronic chips 26, 28 may also be disposed on different sides of the heat sink device 22, such as on opposite sides of the heat sink device 22. When the first optoelectronic chip 26 and the second optoelectronic chip 28 are disposed on different sides of the heat sink device 22, one side of the printed circuit board 24 is electrically connected to the first optoelectronic chip 26, and the other side of the printed circuit board 24 is electrically connected to the second optoelectronic chip 28. Thus, the signal transmission crosstalk is smaller, and the signal transmission quality is higher. Specifically, when the first optoelectronic chip 26 and the second optoelectronic chip 28 are located on different sides of the heat sink device, the first heat sink 44 is provided with a hole or a groove for light to pass through, but the connection of the optical path and the like may also be implemented by using an optical fiber.
In addition, a first electrical isolation pad 62 is arranged between the first optoelectronic chip 26 and the heat sink device 22, and the first electrical isolation pad 62 is in heat conduction connection with the heat sink device 22 and has an electrical isolation effect, so that heat generated by the first optoelectronic chip 26 can be transferred to the housing 20 through the heat sink device 22 to dissipate heat, and electrical isolation among the housing 20, the heat sink device 22 and the first optoelectronic chip 26 is realized. The optical module has stable performance and is safe to use. The upper surface of the first electrical isolation pad 62 is made of a low conductivity material and is electrically connected to the printed circuit board 24, and the base material and the lower surface of the first electrical isolation pad 62 are made of an insulating material and are electrically isolated from the heat sink device 22.
A second electrical isolation pad 64 is disposed between the second optoelectronic chip 28 and the heat sink device 22, and the second electrical isolation pad 64 is thermally connected to and electrically isolated from the heat sink device 22. Likewise, heat generated by the second optoelectronic chip 28 can be transferred to the housing 20 through the heat sink device 22 to dissipate heat, while electrical isolation between the housing 20, the heat sink device 22, and the second optoelectronic chip 28 is achieved. The performance of the optical module is more stable, and the optical module is safer to use.
Of course, in other embodiments, the heat sink device 22 itself may also be made of a material having electrical isolation and good thermal conductivity, thereby eliminating the use of an electrical isolation pad.
Referring to fig. 7 to 12, a second embodiment of the present invention discloses an optical module.
Referring to fig. 7 and 8, the optical module includes a housing 68, an optical interface system 88 disposed in the housing 68, a connector 90 inserted into the optical interface system 88, and a pull ring 92 disposed in the housing 68 for unlocking the optical module. In addition, the light module further comprises a heat sink device 70 and a printed circuit board 72. Wherein a heat sink device 70 is disposed within the housing 68 and is in thermally conductive communication with the housing 68, and a printed circuit board 72 is also disposed within the housing 68. Similar to the first embodiment, in this embodiment, the printed circuit board 72 is snap-fit secured to the housing 68 and the heat sink device 70 is adhesively secured to the housing 68. Of course, the printed circuit board 72 may be disposed within the housing 68 using other connection methods, and likewise, the heat sink device 70 may be disposed within the housing 68 using other connection methods.
Referring to fig. 9 and 10, the printed circuit board 72 has a first surface 74, a second surface 76, and a receiving portion 82 located on the first surface 74, wherein the first surface 74 is opposite to the second surface 76, and specifically, the printed circuit board 72 further includes a third surface 78 and a side surface 80 connecting the first surface 74 and the third surface 78, the third surface 78 is located between the first surface 74 and the second surface 76 and has a height difference with the first surface 74, the third surface 78 and the side surface 80 form the receiving portion 82, and the heat sink device 70 is partially located in the receiving portion 82. Specifically, the accommodating portion 82 is an accommodating groove. The optical module further includes a first optoelectronic chip 84 and a second optoelectronic chip 86 both disposed on the heat sink device 70, and the first optoelectronic chip 84 and the second optoelectronic chip 86 are both electrically connected to the printed circuit board 72, and in addition, the second optoelectronic chip 86 is at least partially disposed in the accommodating portion 82, and the second optoelectronic chip 86 and the first optoelectronic chip 84 are disposed separately from each other.
In this embodiment, since the printed circuit board 72 has the accommodating portion 82 formed by the third surface 78 and the side surface 80, the heat sink device 70 is partially located in the accommodating portion 82, the second optoelectronic chip 86 is at least partially located in the accommodating portion 82, and the heat sink device 70 is located between the second optoelectronic chip 86 and the printed circuit board 72, so that the heat generated by the first optoelectronic chip 84 and the second optoelectronic chip 86 is dissipated to the housing 68 through the heat sink device 70, and the heat dissipation capability is highly efficient. Meanwhile, the second photoelectric chip 86 is far away from the first photoelectric chip 84, so that the distance between the two photoelectric chips is increased, the signal crosstalk influence between the first photoelectric chip 84 and the second photoelectric chip 86 is greatly reduced, and the heat dissipation effect is better.
The heat sink arrangement 70 includes a first heat sink 94 and a second heat sink 96 thermally coupled to the first heat sink 94, the first optoelectronic chip 84 is disposed on the first heat sink 94, the second heat sink 96 is at least partially disposed in the receptacle 82, and the second optoelectronic chip 86 is thermally coupled to the second heat sink 96. In this way, the heat generated by the first and second optoelectronic chips 84 and 86 is dissipated to the housing 68 through the first and second heat sinks 94 and 96, respectively, and the first optoelectronic chip 84 is far away from the second optoelectronic chip 86, thereby ensuring a more efficient heat dissipation capability and further reducing the signal crosstalk effect between the first and second optoelectronic chips 84 and 86.
In this embodiment, the first heat sink 94 and the second heat sink 96 are separately disposed, and the second heat sink 96 is adhesively fixed to the first heat sink 94 and thermally conductively connected thereto. Of course, the first and second heat sinks 94, 96 may also be formed as a single piece.
The housing 68 includes a first housing 98 and a second housing 99 coupled to the first housing 98, and the heat sink device 70 is disposed adjacent to the second housing 99 such that heat generated by the first and second optoelectronic chips 84 and 86 is primarily transferred to the second housing 99, the second housing 99 being the primary heat sink. In addition, since only a part of the heat is transferred to the first casing 98, the first casing 98 is a sub heat radiation surface.
To further improve the heat dissipation capability of the optical module, a heat dissipation pad (not shown) or paste may be disposed between the heat sink device 70 and the housing 68, so as to better conduct the heat on the heat sink device 70 to the housing 68.
In the present embodiment, the receiving portion 82 has a closed cross section in a direction parallel to the first surface 74. That is, the accommodating portion 82 is an impermeable groove provided on the printed circuit board 72 and closed at the periphery. Preferably, the receiving portion 82 has a square cross-section in a direction parallel to the first surface 74. Of course, the cross-section of the receiving portion 82 in a direction parallel to the first surface 74 may be provided in other shapes.
In addition, the cross section of the accommodating portion 82 in the direction parallel to the first surface 74 may be provided to be open. Such as receiving portion 82, may be U-shaped or L-shaped in cross-section in a direction parallel to first surface 74. Accordingly, there are three or two sides 80. Of course, other open shapes may be provided.
In this embodiment, the first optoelectronic chip 84 is a transmitting end chipset, and the second optoelectronic chip 86 is a receiving end chipset. Of course, the first optoelectronic chip 84 may be configured as a receiving end chip set, and the second optoelectronic chip 86 may be configured as a transmitting end chip set. Or the first photoelectric chip 84 and the second photoelectric chip 86 are both set as a transmitting end chip set, or the first photoelectric chip 84 and the second photoelectric chip 86 are both set as a receiving end chip set.
The printed circuit board 72 is bonded to the heat sink device 70. Of course, other attachment means may be used to attach the printed circuit board 72 to the heat sink device 70. In this embodiment, the first and second optoelectronic chips 84, 86 are located on different sides of the heat sink device 70. Specifically, the first optoelectronic chip 84 and the second optoelectronic chip 86 are disposed on opposite sides of the heat sink device 70. Of course, the first and second optoelectronic chips 84, 86 may also be disposed on the same side of the heat sink device 70. Specifically, when the first optoelectronic chip 84 and the second optoelectronic chip 86 are located on different sides of the heat sink device 70, a hole or a slot is formed on the first heat sink 94 for light to pass through, although the connection of the optical path and the like may also be implemented by using an optical fiber.
In addition, a first electrical isolation pad 100 is disposed between the first optoelectronic chip 84 and the heat sink device 70, and the first electrical isolation pad 100 is thermally connected to and electrically isolated from the heat sink device 70, so that heat generated by the first optoelectronic chip 84 can be transferred to the housing 68 through the heat sink device 70 to dissipate heat, and at the same time, the housing 68, the heat sink device 70 and the first optoelectronic chip 84 are electrically isolated from each other. The optical module has stable performance and is safe to use.
A second electrical isolation pad (not shown) is disposed between the second optoelectronic chip 86 and the heat sink device 70, and is thermally conductively connected to and electrically isolated from the heat sink device 70. Likewise, heat generated by the second optoelectronic chip 86 may be transferred to the housing 68 through the heat sink device 70 to dissipate heat while achieving electrical isolation between the housing 68, the heat sink device 70, and the second optoelectronic chip 86. The performance of the optical module is more stable and the optical module is safer to use.
Specifically, a first electrical isolation pad 100 is disposed between the first optoelectronic chip 84 and the first heat sink 94, and a second electrical isolation pad is disposed between the second optoelectronic chip 86 and the second heat sink 96.
Referring to fig. 13 to 14, a third embodiment of the present invention is provided, in which the configurations of the pcb 103 and the accommodating portion 104 are different from the second embodiment, and the other components are the same as the second embodiment, and the detailed description of the different components will be omitted.
In this embodiment, the cross-section of the receiving portion 104 in a direction parallel to the first surface 106 is open. In particular, the receiving portion 104 is arranged in a straight line in a cross-section in a direction parallel to the first surface 106. Correspondingly, the side is one. That is, the printed circuit board 103 has a step to constitute the accommodating portion 104.
The optical module includes an optical interface and an electrical interface, an end of the printed circuit board 103 near the optical interface forms a step circuit board 110, and a step of the step circuit board 110 forms a receiving portion 104 for receiving the second optoelectronic chip 114. The step circuit board 110 may be a hard circuit board or a flexible circuit board. That is, a flexible circuit board may be connected to an end of the printed circuit board 103 near the optical interface, and the flexible circuit board and the end of the printed circuit board 103 form an accommodating portion 104 for accommodating the second optoelectronic chip 114.
In this embodiment, the first photoelectric chip 112 is close to the printed circuit board 103 and electrically connected to the printed circuit board 103, and the second photoelectric chip 114 is close to the step circuit board 110 and electrically connected to the step circuit board 110. Of course, the first optoelectronic chip 112 can be disposed close to the step circuit board 110 and electrically connected to the step circuit board 110, and correspondingly, the second optoelectronic chip 114 is close to the printed circuit board 103 and electrically connected to the printed circuit board 103.
Similarly, the first optoelectronic chip 112 is a transmitting end chip set, and the second optoelectronic chip 114 is a receiving end chip set. Of course, the first optoelectronic chip 112 may also be configured as a receiving end chip set, and the second optoelectronic chip 114 may be configured as a transmitting end chip set. Or the first photoelectric chip 112 and the second photoelectric chip 114 are both set as a transmitting terminal chip set, or the first photoelectric chip 112 and the second photoelectric chip 114 are both set as a receiving terminal chip set.
It should be understood that although the specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it will be appreciated by those skilled in the art that the specification as a whole may be appropriately combined to form other embodiments as will be apparent to those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (8)
1. An optical module, which comprises a shell, a heat sink device arranged in the shell and connected with the shell in a heat conduction way, and a printed circuit board partially arranged on the heat sink device,
the optical module further comprises a first photoelectric chip and a second photoelectric chip which are arranged on the heat sink device, the first photoelectric chip and the second photoelectric chip are electrically connected with the printed circuit board, the printed circuit board is provided with a first surface, a second surface opposite to the first surface and an accommodating part located on the first surface, the second photoelectric chip is arranged in the accommodating part, the second photoelectric chip and the first photoelectric chip are arranged separately, one end of the printed circuit board is a peripheral electrical interface electrically connected with the outside, the printed circuit board is bonded with one end, opposite to the peripheral electrical interface, of the printed circuit board on the heat sink device, and the first photoelectric chip is located on the outer side of one end, away from the peripheral electrical interface, of the printed circuit board.
2. The optical module of claim 1, wherein the heat sink device comprises a first heat sink and a second heat sink thermally connected to the first heat sink, the first optoelectronic chip is disposed on the first heat sink, the second heat sink is at least partially disposed in the receiving portion, and the second optoelectronic chip is thermally connected to the second heat sink.
3. The optical module of claim 2, wherein the first and second heat sinks are of unitary construction.
4. The optical module of claim 2, wherein the optical module includes an optical interface and a peripheral electrical interface, the first optoelectronic chip being located between the printed circuit board and the optical interface.
5. The optical module of claim 4, wherein the first optoelectronic chip and the second optoelectronic chip are staggered with respect to each other in a direction of a connection line between the optical interface and the peripheral electrical interface.
6. The optical module of claim 4, wherein the first heat sink has a first boss on which the first optoelectronic chip is disposed, and the second heat sink has a second boss partially located in the receptacle.
7. The optical module of claim 1, wherein the receiving portion is a receiving groove.
8. The optical module according to claim 7, wherein a cross section of the receiving groove in a direction parallel to the first surface is closed or open.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590788.XA CN109283631B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202310732876.4A CN116699772A (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202211188138.XA CN115508957B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210130237.6A CN114578495B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202211195392.2A CN115524806A (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210129329.2A CN114578494B (en) | 2017-07-19 | 2017-07-19 | Optical module |
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| CN201710590788.XA CN109283631B (en) | 2017-07-19 | 2017-07-19 | Optical module |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211195392.2A Division CN115524806A (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210129329.2A Division CN114578494B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210130237.6A Division CN114578495B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202211188138.XA Division CN115508957B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202310732876.4A Division CN116699772A (en) | 2017-07-19 | 2017-07-19 | Optical module |
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| CN109283631A CN109283631A (en) | 2019-01-29 |
| CN109283631B true CN109283631B (en) | 2022-10-21 |
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| CN202211195392.2A Pending CN115524806A (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210130237.6A Active CN114578495B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202310732876.4A Pending CN116699772A (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN201710590788.XA Active CN109283631B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202211188138.XA Active CN115508957B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210129329.2A Active CN114578494B (en) | 2017-07-19 | 2017-07-19 | Optical module |
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| CN202211195392.2A Pending CN115524806A (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202210130237.6A Active CN114578495B (en) | 2017-07-19 | 2017-07-19 | Optical module |
| CN202310732876.4A Pending CN116699772A (en) | 2017-07-19 | 2017-07-19 | Optical module |
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| CN116577885A (en) * | 2020-10-23 | 2023-08-11 | 苏州旭创科技有限公司 | Optical module packaging structure |
| CN113391412A (en) * | 2021-07-16 | 2021-09-14 | 亨通洛克利科技有限公司 | High-efficient radiating 800G optical module |
| CN216772046U (en) * | 2021-11-19 | 2022-06-17 | 东莞立讯技术有限公司 | Photoelectric connector |
| CN217879743U (en) * | 2022-08-23 | 2022-11-22 | 苏州旭创科技有限公司 | Heat radiation structure of optical module |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN114578494A (en) | 2022-06-03 |
| CN115508957A (en) | 2022-12-23 |
| CN114578494B (en) | 2023-09-22 |
| CN115508957B (en) | 2024-02-23 |
| CN114578495A (en) | 2022-06-03 |
| CN115524806A (en) | 2022-12-27 |
| CN114578495B (en) | 2024-04-02 |
| CN116699772A (en) | 2023-09-05 |
| CN109283631A (en) | 2019-01-29 |
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