CN114690345A - Wavelength division integrated CPO device - Google Patents

Abstract

The invention provides a wavelength division integrated CPO device, which can improve the space utilization rate of products, meanwhile, the heat dissipation performance is improved, the performance of the product is not affected, the PCB is provided with a mounting base, the mounting base is provided with a light receiver mounting groove and a light emitter mounting groove which are arranged in a linear way and are arranged in an inclined way, the light receiver and the light emitter are respectively arranged in the light receiver mounting groove and the light emitter mounting groove, optical connection is realized through optic fibre and multiplexer, wave separator behind LC connector is connected respectively to photoreceptor and light emitter, and optical connection light mouth is passed through to multiplexer and wave separator, and photoreceptor and light emitter still realize the electricity through the electric chip on flexible circuit board and the PCB circuit board and are connected, and the PCB circuit board is connected with electric mouth and power supply interface, and the mounting base is connected with the radiator, and photoreceptor and light emitter can dispel the heat on conducting the casing through radiator and/or mounting base with the heat.

Description

Wavelength division integrated CPO device

Technical Field

The invention relates to the technical field of optical communication of data centers, in particular to a wavelength division integrated CPO device.

Background

Currently, major equipment manufacturers and large data center users are actively developing silicon optical engine-based CPO (Co-Packaged Optics) products in the data center market. According to the prediction of an authority, the CPO will become a leading enabling technology of a cloud provider data center in the future, and meanwhile, a huge application market can be brought.

Under the large environment that the requirements of data centers and supercomputer centers on energy consumption are more and more severe, the traditional optical modules are limited by board card panel space, the bandwidth cannot be improved by increasing the number of the optical modules, and therefore, the designed CPO product based on the silicon optical technology adopts the synergistic packaging concept that a core switching chip and an optical engine are arranged on the same high-speed mainboard, so that the distance from a photoelectric conversion function to the core switching chip is shortened, a high-speed electric channel link is shortened, redundant devices are reduced, and the system power consumption is improved.

Compared with an independently packaged optical module, the space utilization rate is improved to a certain extent, but in the prior art, the improvement of the space utilization rate is still limited because the plate is distributed in a tiled arrangement mode, the whole packaging size is still larger, and along with the improvement of the integration level, the compact layout also enables the heat dissipation pressure of the product to be larger.

Disclosure of Invention

In view of the above problems, the present invention provides a wavelength division integrated CPO device, which can improve the space utilization rate of the product, improve the heat dissipation performance, and ensure that the performance of the product is not affected.

The technical scheme is as follows: an integrated wavelength division CPO device comprising a PCB circuit board and a housing capable of accommodating said PCB circuit board, said housing comprising a base and an upper cover capable of being fitted together, said PCB circuit board being disposed on said base, characterized in that: the PCB circuit board is provided with a mounting base, the mounting base is provided with a light receiver mounting groove and a light emitter mounting groove which are linearly arranged, the optical receiver mounting groove and the optical transmitter mounting groove are obliquely arranged on the mounting base, the optical receiver and the optical transmitter are respectively arranged in the optical receiver mounting groove and the optical transmitter mounting groove, the optical receiver and the optical transmitter are respectively connected with the LC connector and then are optically connected with the wave combiner and the wave splitter through optical fibers, the wave combiner and the wave separator are connected with an optical port through optical fibers, the optical receiver and the optical transmitter are also electrically connected with an electric chip on the PCB through a flexible circuit board, the PCB circuit board is connected with an electric port and a power supply interface, the mounting base is connected with a radiator, the optical receiver and the optical transmitter can conduct heat to the housing through the heat sink and/or the mounting base for heat dissipation.

Furthermore, at least two mounting bases are arranged on the PCB in a front-to-back manner.

Furthermore, one of every two mounting bases is provided with the photoreceiver mounting groove, and the other mounting base is provided with the phototransmitter mounting groove.

Further, the optical receiver mounting groove and the optical transmitter mounting groove are arranged on the mounting base at intervals.

Further, on the mounting base and be located the light receiver mounting groove with the rear side of light emitter mounting groove is provided with light mouthful adapter mounting groove, and light mouthful adapter is fixed in the light mouthful adapter mounting groove, the LC connector passes through the connector buckle block and is in the light mouthful adapter.

Further, the optical port adapter is fixed in the optical port adapter mounting groove in a gluing or screw fastening mode.

Furthermore, a first radiator is installed on one of the installation bases, a heat dissipation type groove matched with the optical receiver and the optical transmitter is formed in the lower end of the first radiator, the upper end face of the first radiator is close to the upper cover, and a heat conduction pad is arranged between the upper end face of the first radiator and the upper cover.

Furthermore, a second radiator is installed on one of the installation bases, a heat dissipation type groove matched with the optical receiver and the optical transmitter is formed in the lower end of the second radiator, heat dissipation fins are arranged on the upper end face of the second radiator, an avoidance notch is formed in a PCB (printed circuit board) at the lower end of the installation base where the second radiator is installed, a heat conduction pad is arranged in the avoidance notch, and the heat conduction pad is respectively contacted with the lower surface of the installation base and the base.

Further, the optical receiver mounting groove with the optical transmitter mounting groove and the heat dissipation type groove are corresponding to the optical receiver with the flange portion of the optical transmitter is provided with a flange fixing groove, and the first radiator and the second radiator are installed and limited through the flange fixing groove respectively.

Further, be equipped with electric chip on the front of PCB circuit board and the back respectively, flexible circuit board passes dodge the breach connection and set up electric chip on the PCB circuit board back, correspond on the base flexible circuit board is equipped with and dodges the groove.

Furthermore, a base mounting groove is formed in the base, the combiner and the wave splitter are arranged in the base mounting groove in an up-and-down overlapping mode, the combiner is arranged above the wave splitter, and the light port is formed in the upper end of the combiner.

Furthermore, the upper surface of the upper cover is provided with a radiating fin.

The invention provides a wavelength division integrated CPO device, which can improve the space utilization rate of products, integrate more optical and electric transmission devices under the condition of not changing the size of a distribution plate and ensure that the heat dissipation performance is not influenced; the wavelength division integrated CPO device of the invention has the advantages that by arranging a plurality of rows of mounting bases on the PCB, and the light emitter and the light receiver are arranged on the mounting base at a certain inclination angle, and the cloth plate space is expanded to a three-dimensional space from a plane, so that more light transmission devices can be integrated under the fixed cloth plate area, meanwhile, the design arranges point chips on the front and back surfaces of the PCB circuit board to match with more optical transmission devices, thereby greatly improving the space utilization rate, meanwhile, the wavelength division integrated CPO device of the invention improves the heat dissipation capability and fully utilizes the shell to dissipate heat under the condition of improving the integration level, adopts a mode of dissipating heat at two sides of the shell, the heat generated by the light emitter and the light receiver on the base of the mounting base is respectively transferred to the upper cover and the base through the heat-conducting medium to be radiated, and the heat radiation effect is good.

Drawings

Fig. 1 is a schematic view of a wavelength division integrated CPO device in an embodiment with a housing and internal parts separated;

fig. 2 is a schematic view of a first view of internal parts in a housing of a wavelength division integrated CPO device according to an embodiment;

fig. 3 is a schematic view of a second view of internal parts in a housing of a wavelength division integrated CPO device according to an embodiment;

fig. 4 is a schematic diagram of the wavelength division integrated CPO device in an embodiment after the internal components hide the heat sink;

FIG. 5 is a schematic view of a mounting base in an embodiment;

FIG. 6 is a schematic view of a first heat sink in an embodiment;

FIG. 7 is a schematic top view of the internal components of an integrated wavelength division CPO device in an example embodiment;

fig. 8 is a sectional view taken along line a-a of fig. 7.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, it should be noted that the drawings provided in this embodiment are only for schematically illustrating the basic idea of the invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component in actual implementation can be changed freely, and the component layout may be more complicated.

Referring to fig. 1 to 8, the CPO device integrated with wavelength division of the present invention comprises a PCB 1 and a housing capable of accommodating the PCB 1, wherein the housing comprises a base 2 and an upper cover 3 capable of being assembled with each other in a matching manner, the PCB 1 is disposed on the base, mounting bases 4 are arranged on the PCB 1, in this embodiment, two mounting bases 4 are arranged on the PCB 1 in a front-back manner, mounting bases 4 are provided with an optical receiver mounting groove 5 and an optical transmitter mounting groove 6 which are linearly arranged, the optical receiver mounting groove 5 and the optical transmitter mounting groove 6 are arranged on the mounting bases 4 in an inclined manner at a certain angle, an optical receiver 7 and an optical transmitter 8 are respectively disposed in the optical receiver mounting groove 5 and the optical transmitter mounting groove 6, the optical receiver 7 and the optical transmitter 8 are respectively connected with an LC connector 9 and then optically connected with a multiplexer 11 and a demultiplexer 12 through an optical fiber 10, the combiner 11 and the wave splitter 12 are connected with an optical port 13 through an optical fiber 10, the optical transmitter 8 transmits a plurality of optical signals with different wavelengths to the combiner 11 through an LC connector 9 and then combines the optical signals into one optical fiber for transmission, and the wave splitter 12 separates the optical signals with different wavelengths received from one optical fiber and transmits the optical signals to the optical receiver 7; optical receiver 7 and optical transmitter 8 still realize the electricity through flexible circuit board 14 and electric chip 15 on the PCB circuit board 1 and are connected with high-speed electric mouth 16 and power supply interface 17 in the front side of electric chip 15 on the PCB circuit board 1 to can realize the photoelectric conversion transmission, mounting base 4 is connected with the radiator, and optical receiver 7 and optical transmitter 8 can be through the radiator and/or mounting base with heat conduction on the casing dispel the heat.

Because the light receiver and the light emitter are arranged on the mounting base in an inclined mode, the front end of the light transmission device in the back row can extend to the position below the light transmission device in the front row, the distance between the two rows of mounting bases is shortened, and the space utilization rate is improved.

Specifically, in one embodiment, the photoreceiver mounting slots 5 and the phototransmitter mounting slots 6 are spaced apart on each mounting base 4, and then the corresponding photoreceiver 7 and phototransmitter 8 are spaced apart on each mounting base 4.

In one embodiment, the light emitting device and the light receiving device are arranged in two rows separately on the mounting base, which is specifically represented as: one of the two mounting bases 4 is provided with only a photoreceiver mounting slot 5, corresponding only to the arrangement of a photoreceiver 7, and the other with only a phototransmitter mounting slot 6, corresponding only to the arrangement of a phototransmitter 8.

Specifically, an optical port adapter mounting groove 18 is formed in the mounting base 4 and located on the rear side of the optical receiver mounting groove 5 and the optical transmitter mounting groove 6, the optical port adapter mounting groove 18 is obliquely arranged corresponding to the optical receiver mounting groove 5 and the optical transmitter mounting groove 6, the optical port adapter 19 is fixed in the optical port adapter mounting groove 6, the LC connector 9 is clamped in the optical port adapter 19 through a connector clamp 28, and the optical port adapter 19 is used for mounting the LC connector 9. The optical port adapter 19 may be fixed in the optical port adapter mounting groove 18 by means of gluing or screw fastening.

Specifically, in an embodiment, the first heat sink 20 is mounted on the mounting base 4 disposed on the front side, the lower end of the first heat sink 20 is provided with a heat dissipation type groove 21 adapted to the optical receiver 7 and the optical transmitter 8, the upper end surface of the first heat sink 21 is disposed close to the upper cover 2, a thermal pad 22 is disposed between the upper end surface of the first heat sink 20 and the upper cover 2, and heat generated by the optical receiver 7 and the optical transmitter 8 on the mounting base 4 on the front side can be conducted to the upper cover through the thermal pad 22 and the first heat sink 20 to be dissipated.

Correspondingly, the second radiator 23 is arranged on the mounting base 5 at the rear side, a heat dissipation type groove 21 matched with the optical receiver 7 and the optical transmitter 8 is formed in the lower end of the second radiator 23, a heat dissipation fin 30 is arranged on the upper end face of the second radiator 23, an avoidance notch 24 is formed in the PCB 1 at the lower end of the mounting base provided with the second radiator 23, the avoidance notch 24 is large enough to facilitate a heat conduction pad 22, the heat conduction pad 22 is respectively contacted with the lower surface of the mounting base 5 and the base 3, heat emitted by the optical receiver 7 and the optical transmitter 8 on the mounting base 4 at the rear side can be conducted to the base 3 through the heat conduction pad 22 to be dissipated, the second radiator 20 can also dissipate heat synchronously, and the heat dissipation capacity is good.

Correspondingly, the base 2 and the upper cover 3, and the mounting base 4 and the first heat sink and the second heat sink can be made of materials with good heat dissipation capability, so as to ensure the heat dissipation capability, such as aluminum with good heat dissipation capability.

The wavelength division integrated CPO device in the embodiment improves the heat dissipation capability and fully utilizes the shell for heat dissipation under the condition of improving the integration level, adopts a mode of heat dissipation on two sides of the shell, respectively transfers heat generated by a light emitter and a light receiver on a base of an installation base to an upper cover and the base for heat dissipation through a heat-conducting medium, and has good heat dissipation effect.

In addition, flange fixing grooves 26 are formed in the flange portions 25 of the optical receiver mounting groove 5, the optical transmitter mounting groove 6 and the heat dissipation type groove 21, which correspond to the optical receiver and the optical transmitter, and the first heat sink 20 and the second heat sink 23 are installed and limited through the flange fixing grooves 26, so that the installation and the positioning of the heat sinks can be facilitated, and the heat dissipation effect is ensured.

In an embodiment, the front side and the back side of the PCB are respectively provided with the electrical chip 15, the flexible circuit board 14 passes through the avoiding notch 24 to connect the electrical chip 15 arranged on the back side of the PCB 1, the base 3 is provided with the avoiding groove 27 corresponding to the flexible circuit board, the flexible circuit board can be connected with the pad on the PCB by welding, the optical transmitter and the optical receiver are electrically connected with the PCB by the flexible circuit board, and the electrical chips 15 arranged on the front side and the back side can be correspondingly provided with more optical transmission devices, so that the integration level is further improved, the electrical chips are arranged on two sides, on one hand, the requirement of high integration level is met, and on the other hand, the heat dissipation is more facilitated. If the electric chips are arranged on the same surface, the board distribution space is not enough. If the PCB is lengthened, the overall package size will be increased, and the space utilization rate is not high.

In one embodiment, the base 3 is provided with a base mounting groove 29, the combiner 11 and the wave splitter 12 are vertically overlapped and placed in the base mounting groove 29, the combiner 11 is arranged above the wave splitter 12, the optical port 13 is arranged at the upper end of the combiner 11, and the overlapped combiner 11 and wave splitter 12 can save space and reduce the size of the product.

The wavelength division integrated CPO device provided in the above embodiments is a form of on-board optical interconnection, and is mainly applied to a data center, unlike an optical module, such as a pluggable optical-to-electrical conversion module having a fixed package structure specified by an MSA protocol, which has a higher space utilization rate compared to an independently packaged optical module, and can improve the space utilization rate of a product, and can integrate more optical and electrical transmission devices without changing the board layout size, by arranging two rows of mounting bases on a PCB, and arranging optical transmitters and optical receivers on the mounting bases at certain inclination angles, extending the board layout space from a plane to a three-dimensional space, so that under a fixed board layout area, more optical transmission devices can be integrated, and simultaneously designing point chips arranged on the front and back surfaces of the PCB to cooperate with the arranged more optical transmission devices, the space utilization rate is greatly improved.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. An integrated wavelength division CPO device comprising a PCB circuit board and a housing capable of accommodating said PCB circuit board, said housing comprising a base and an upper cover capable of being fitted together, said PCB circuit board being disposed on said base, characterized in that: the PCB circuit board is provided with a mounting base, the mounting base is provided with a light receiver mounting groove and a light emitter mounting groove which are linearly arranged, the optical receiver mounting groove and the optical transmitter mounting groove are obliquely arranged on the mounting base, the optical receiver and the optical transmitter are respectively arranged in the optical receiver mounting groove and the optical transmitter mounting groove, the optical receiver and the optical transmitter are respectively connected with the LC connector and then are optically connected with the wave combiner and the wave splitter through optical fibers, the wave combiner and the wave separator are connected with an optical port through optical fibers, the optical receiver and the optical transmitter are also electrically connected with an electric chip on the PCB through a flexible circuit board, the PCB circuit board is connected with an electric port and a power supply interface, the mounting base is connected with a radiator, the optical receiver and the optical transmitter can conduct heat to the housing through the heat sink and/or the mounting base for heat dissipation.

2. A wavelength division integrated CPO device as claimed in claim 1, wherein: at least two mounting bases are arranged on the PCB in a front-back manner.

3. A wavelength division integrated CPO device as claimed in claim 2, wherein: one of every two of the installation bases is provided with the light receiver installation groove, and the other installation base is provided with the light emitter installation groove.

4. A wavelength division integrated CPO device as in claim 2, wherein: the light receiver mounting grooves and the light emitter mounting grooves are arranged on the mounting base at intervals.

5. A wavelength division integrated CPO device as claimed in claim 3 or 4, wherein: the mounting base is provided with an optical port adapter mounting groove at the rear side of the optical receiver mounting groove and the optical transmitter mounting groove, the optical port adapter is fixed in the optical port adapter mounting groove, and the LC connector is clamped in the optical port adapter through a connector buckle.

6. A wavelength division integrated CPO device as claimed in claim 3 or 4, wherein: one of them install first radiator on the mounting base, the lower extreme of first radiator be equipped with photoreceiver with the heat dissipation type groove of light emitter adaptation, the up end of first radiator is close to the upper cover sets up, the up end of first radiator with be equipped with the heat conduction pad between the upper cover, be equipped with radiating fin on the upper surface of upper cover.

7. A wavelength division integrated CPO device as claimed in claim 6, wherein: one of the mounting bases is provided with a second radiator, the lower end of the second radiator is provided with a heat dissipation type groove matched with the optical receiver and the optical transmitter, the upper end face of the second radiator is provided with a heat dissipation fin, a PCB circuit board at the lower end of the mounting base provided with the second radiator is provided with an avoidance notch, a heat conduction pad is arranged in the avoidance notch, and the heat conduction pad is respectively contacted with the lower surface of the mounting base and the base.

8. A wavelength division integrated CPO device as claimed in claim 7, wherein: the light receiver mounting groove with the light emitter mounting groove and correspond in the heat dissipation type groove light receiver with the flange portion of light emitter is equipped with the flange fixed slot, first radiator with the second radiator passes through respectively the flange fixed slot is installed spacingly.

9. A wavelength division integrated CPO device as claimed in claim 7, wherein: be equipped with electric chip on the front of PCB circuit board and the back respectively, flexible circuit board passes dodge the breach connection and set up electric chip on the PCB circuit board back, correspond on the base flexible circuit board is equipped with and dodges the groove.

10. A wavelength division integrated CPO device as claimed in claim 1, wherein: the optical fiber combiner is characterized in that a base mounting groove is formed in the base, the combiner and the wave splitter are vertically overlapped and placed in the base mounting groove, the combiner is arranged above the wave splitter, and the optical port is formed in the upper end of the combiner.

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