TWI257831B - Circuit board having countersink - Google Patents
Circuit board having countersink Download PDFInfo
- Publication number
- TWI257831B TWI257831B TW092134493A TW92134493A TWI257831B TW I257831 B TWI257831 B TW I257831B TW 092134493 A TW092134493 A TW 092134493A TW 92134493 A TW92134493 A TW 92134493A TW I257831 B TWI257831 B TW I257831B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- hole
- circuit
- countersink
- sinking
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
1257831 五、發明說明(1) 【創作之技術領域】 本創作係有關一種具有沉置孔之電路板設計,惟指一 種可廣泛應用於各式電路板(卡),使其電子元件可充分 利用空間之電路板(卡)結構改良設計。 【先前技術】 按,現今電子相關產品均以朝向輕巧化與精緻化為設 計驅勢,例如個人行動秘書(PDA)、行動電話、筆記型 電腦、語言翻譯機、隨身碟及MP3播放機等;而構成上述1257831 V. INSTRUCTIONS (1) [Technical field of creation] This creation is about a circuit board design with a sinking hole, but it can be widely used in various circuit boards (cards) to make full use of electronic components. Improved design of the circuit board (card) structure of space. [Prior Art] Press, today's electronic related products are designed to be light and refined, such as personal action secretary (PDA), mobile phone, notebook computer, language translator, flash drive and MP3 player; And constitute the above
電子產品的主要部分--電路板,其習知的構成方式係於 電路板面規劃有電子電路(印刷電路),再令許多特定功 能之電子元件排列焊接於該電路板上(諸如:I C電晶體、 電連接器、電阻、電容或發光二極體等),以達成該電路 板(卡)所設計之特定功能,例如可以作為顯示卡、主機 板、網路卡、計憶卡、行動電話或語言翻譯機等電子產品 之電路板,或其他功能之電路板(卡)等等。The main part of the electronic product, the circuit board, is conventionally constructed by electronic circuits (printed circuits) on the board surface, and then electronic components of many specific functions are arranged and soldered to the circuit board (such as: IC power). Crystals, electrical connectors, resistors, capacitors, or light-emitting diodes, etc., to achieve specific functions designed by the board (card), such as display cards, motherboards, network cards, memory cards, mobile phones Or a circuit board for electronic products such as a language translation machine, or a circuit board (card) of other functions, and the like.
惟上述習知的電子板構成技術,僅在於電路板選定面 併排多數電子元件,且習見各種電子元件均有一定體積與 高度,因此導致電路板卡組成後之型態,無法符合輕薄、 精巧需求,尤其在電子產品要求具有多功能化的設計驅勢 下(例如行動電話並具有數位攝影及MP3之功能等),如 何在體積有限的電路板面充分利用空間,進而規劃、設置 可達成多功能化之多種電子元件,即為習知技術運用上有 待於突破之瓶頸。However, the above-mentioned conventional electronic board composing technology only covers a plurality of electronic components side by side on the selected side of the circuit board, and it is known that various electronic components have a certain volume and height, so that the type of the circuit board card is formed, which cannot meet the requirements of lightness and compactness. Especially in the design of electronic products that require multi-functional design (such as mobile phones and digital photography and MP3 functions), how to make full use of space on a limited-sized circuit board surface, and then plan and set up to achieve multi-function The various electronic components of the technology are the bottlenecks that need to be broken in the application of the conventional technology.
第4頁 1257831 五、發明說明(2) 【創作内容】 本創作主要目的,即在於提供一種具有沉置孔之電路 板設計,惟指可以使各式電路板(卡)提供電子元件充分 利用空間進行組裝,藉以達成體積與厚度縮小之精巧化效 益者。Page 4 1257831 V. Description of invention (2) [Creation content] The main purpose of this creation is to provide a circuit board design with sinking holes, which means that various circuit boards (cards) can be used to provide electronic components to make full use of space. Assembled to achieve the ingenuity of volume and thickness reduction.
依上述目的,本創作係於電路板依空間規劃所需位置 設有一個或一個以上呈凹陷狀或貫穿狀之沉置孔,且可選 用多層電路板而設有呈階級孔狀之沉置孔,藉此,並於該 容置孔其選定板面處設有提供電子元件組接之電路接點( 如印刷電路等),以此構成可供電子元件(例如I C電晶體 、電連接器、電阻或電容等)設置於該沉置孔中,並運用 電路接點供與各電子元件焊接或導接,俾進一步達成該電 路板(卡)體積空間及厚度尺度縮小之效果。 【實施方式】 茲依附圖實施例將本創作結構特徵及其他之作用、目 的詳細說明如下:According to the above purpose, the present invention is provided with one or more recessed holes or recessed holes in the position required for the space planning of the circuit board, and a multi-layer circuit board can be selected and a sink hole having a class hole shape is provided. Thereby, a circuit contact (such as a printed circuit or the like) for providing electronic component assembly is provided at the selected plate surface of the receiving hole, thereby forming an available electronic component (for example, an IC transistor, an electrical connector, A resistor or a capacitor is disposed in the sinking hole, and the circuit contacts are used for soldering or guiding the electronic components, thereby further achieving the effect of reducing the volume and thickness of the circuit board (card). [Embodiment] The features of the creation structure and other functions and purposes are described in detail in the following embodiments:
如附圖所示,本創作所為『具有沉置孔之電路板』結 構設計,其電路板係可為主機板、顯示卡、計憶卡、網路 卡、行動電話或語言翻譯機等之電路板,或其他各式特定 功能之電路板(卡)等,其實施狀態係包括: 如第一圖及第二圖所示,依據所構成之電子產品或電 路規劃所需,於電路板1選定位置處設有一個或一個以上 呈貫穿狀之沉置孔2 ,且該沉置孔2可為矩形、圓形或其As shown in the drawing, the author is designed as a circuit board with a sinking hole, and the circuit board can be a circuit such as a motherboard, a display card, a memory card, a network card, a mobile phone or a language translator. The implementation state of the board, or other various specific functions of the circuit board (card), etc., includes: as shown in the first figure and the second figure, selected on the circuit board 1 according to the required electronic product or circuit planning requirements One or more through-holes 2 are provided at the position, and the sinking holes 2 may be rectangular, circular or
第5頁 1257831 五、發明說明(3) 他特定或不特定之形狀,惟於該沉置孔2其任意一邊側或 多邊側孔緣之電路板1 一面或雙面處,係依該沉置孔2所 欲設之電子元件而設有複數電路接點3 ,藉此即構成本創 作所為具有沉置孔之電路板,可供於該沉置孔2中置設一 個或一個以上之電子元件4 (例如I C電晶體、電連接器、 電阻、電容或其他電路板等電氣物),並令該電子元件4 之接腳4 1與所述電路接點3焊接或以其他方式接觸。惟本 創作亦可在使用多層印刷電路板時,如第三圖及第四圖所 示,將該沉置孔2實施為階級孔狀,並選定其中一層或多 層之階級面2 1設有電路接點3 ,即形成可於沉置孔2中層 疊設置多數電子元件4之電路板。 其次,本創作所述之沉置孔2並不以實施為貫穿狀為 限,如第五圖所示,亦即可選定電路板1其一面或雙面設 有一個或一個以上凹孔狀之沉置孔2 ’,且選定於該沉置 孔2 ’孔底面或孔緣任意一邊側或多邊側表面設有所述之 電路接點3 ,藉此即構成本創作具有沉置孔之電路板,並 利用該凹孔狀之沉置孔2 ’提供組裝一個或一個以上之電 子元件4。同理,本創作該凹孔狀之沉置孔2 ’實施例, 亦可為選用多層印刷之電路板,進而選定其一面或二面處 設有一個或一個以上呈階級凹孔狀之沉置孔2 ’(如第六 圖所示),並選定於其中一層或多層之階級面2 1設有所述 電路接點3 ,亦能藉此形成可於沉置孔2中層疊設置多數 電子元件4之電路板。 另需指明者,本創作所述沉置孔2 、2 ’選定處之電Page 5 1257831 V. Description of the invention (3) His specific or unspecified shape, except for one or both sides of the circuit board 1 on either side of the sinking hole 2 or the side of the polygonal side hole The electronic component of the hole 2 is provided with a plurality of circuit contacts 3, thereby forming a circuit board having a sinking hole, and one or more electronic components are disposed in the sinking hole 2 4 (for example, an electrical circuit such as an IC transistor, an electrical connector, a resistor, a capacitor, or other circuit board), and the pin 4 1 of the electronic component 4 is soldered or otherwise contacted with the circuit contact 3. However, in the case of using a multi-layer printed circuit board, as shown in the third and fourth figures, the sinking hole 2 is implemented as a class hole shape, and one or more of the class faces 2 1 are selected to have a circuit. The contact 3 forms a circuit board in which a plurality of electronic components 4 can be stacked in the sinking hole 2. Secondly, the sinking hole 2 described in the present application is not limited to being implemented as a penetrating shape. As shown in FIG. 5, the selected circuit board 1 may be provided with one or more recessed holes on one or both sides thereof. The hole 2' is disposed, and the circuit contact 3 is disposed on the bottom surface of the hole or the side of the hole or the side of the edge of the edge of the hole 2, thereby forming a circuit board having a sink hole. And providing one or more electronic components 4 by means of the recessed holes 2'. Similarly, the embodiment of the recessed hole 2' can be a multi-layer printed circuit board, and one or more of the one-sided or two-sided recessed ones are selected. The hole 2' (as shown in the sixth figure) and the one or more layers of the level surface 21 are provided with the circuit contacts 3, thereby forming a plurality of electronic components that can be stacked in the sinking hole 2 4 circuit board. In addition, the person specified in the creation of the sinking hole 2, 2 ’
1257831 五、發明說明(4) 路接點3固可為一般印刷電路之焊接點,是以該電路接點 3處係可實施為具有穿孔3 1 (如第七圖所示),或實施為 不具穿孔之接點(如前揭圖所示),藉此,亦能達成前述 提供電子元件4沉置組裝之效果。1257831 V. INSTRUCTIONS (4) The junction 3 can be a solder joint of a general printed circuit, and the junction 3 of the circuit can be implemented as having a perforation 3 1 (as shown in the seventh figure), or as The contact without the perforation (as shown in the previous figure) can also achieve the above-mentioned effect of providing the electronic component 4 to be assembled and assembled.
運用本創作具有沉置孔之電路板結構設計,其以沉置 孔2、2 ’提供組裝電子元件,係可將電子元件4 (如ICThe design of the circuit board structure with the sinking holes is provided, which provides the assembled electronic components with the sinking holes 2, 2', and the electronic components 4 (such as IC)
電晶體、電連接器、電阻、電容或其他電路板等電氣物 品)設於所述沉置孔2、2 ’中,使電路板1整體厚度縮 減,並可將多數電子元件4併排或呈疊層狀組裝,以於有 限的電路板空間充分的組裝所需之電子元件,即可藉此防 免運用習見電路板顯在性併排組裝電子元件之形態,使本 創作進一步達成充分利用電路板空間,縮小該電路板(卡 )體積及厚度之效果,進一步達成其電子產品獲致輕薄、 精巧設計目的。 綜上所述,本創作所為『具有沉置孔之電路板』結構 設計,已確具實用性與創作性,其手段之運用亦出於新穎 無疑,且功效與設計目的誠然符合,已稱合理進步至明。 為此,依法提出新型專利申請,惟懇請鈞局惠予詳審,Electrical components such as a transistor, an electrical connector, a resistor, a capacitor, or other circuit board are disposed in the sinking holes 2, 2' to reduce the overall thickness of the circuit board 1, and the plurality of electronic components 4 may be stacked side by side or stacked. Layered assembly, in order to fully assemble the required electronic components in a limited board space, thereby preventing the use of the apparent appearance of the circuit board to assemble the electronic components side by side, so that the creation can further make full use of the board space. The effect of reducing the volume and thickness of the circuit board (card) is further achieved, thereby achieving the goal of lightness and compact design of the electronic product. In summary, the design of the structure of the circuit board with the sinking hole has been practical and creative. The application of the method is also novel and undoubted, and the effect is in line with the design purpose. Progress is clear. To this end, a new type of patent application is filed in accordance with the law, but the bureau will be invited to give a detailed examination.
並賜准專利為禱,至感德便。And granting a patent as a prayer, to the sense of virtue.
第7頁 1257831 圖式簡單說明 第一圖為本創作電路板實施沉置孔之示意圖。 第二圖為本創作貫穿狀沉置孔之應用示意圖。 第三圖為本創作階級貫穿狀沉置孔之示意圖。 第四圖為本創作階級貫穿狀沉置孔之應用示意圖。 第五圖為本創作凹孔狀沉置孔之實施應用示意圖。 第六圖為本創作階級凹孔沉置孔之實施應用示意圖。 第七圖為本創作電路接點設有穿孔之示意圖。 第八圖為為本創作凹孔狀沉置孔之實施應用示意圖。 第九圖為本創作階級凹孔沉置孔之實施應用示意圖。 【主要圖號說明】 電路板 1 ; 沉置孔 2、2 ’ ; 階級面 21; 電路接點 3 ; 穿孔 3 1; 電子元件 4 ; 接腳 4 1;Page 7 1257831 Brief description of the diagram The first figure is a schematic diagram of the implementation of the sinking hole in the creation board. The second figure is a schematic diagram of the application of the penetrating through hole. The third picture is a schematic diagram of the penetrating hole of the creative class. The fourth picture is a schematic diagram of the application of the penetrating hole of the creative class. The fifth figure is a schematic diagram of the application of the created concave hole-shaped sinking hole. The sixth figure is a schematic diagram of the application of the creative class recessed hole. The seventh figure is a schematic diagram of the perforation of the joint of the creative circuit. The eighth figure is a schematic diagram of the application of the concave hole-shaped sinking hole. The ninth figure is a schematic diagram of the application of the creative hole recessed hole. [Description of main picture number] circuit board 1; sinking hole 2, 2 '; class surface 21; circuit contact 3; perforation 3 1; electronic component 4; pin 4 1;
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092134493A TWI257831B (en) | 2003-12-05 | 2003-12-05 | Circuit board having countersink |
JP2004244199A JP2005175428A (en) | 2003-12-05 | 2004-08-24 | Circuit board having sink hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092134493A TWI257831B (en) | 2003-12-05 | 2003-12-05 | Circuit board having countersink |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200520646A TW200520646A (en) | 2005-06-16 |
TWI257831B true TWI257831B (en) | 2006-07-01 |
Family
ID=34738140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092134493A TWI257831B (en) | 2003-12-05 | 2003-12-05 | Circuit board having countersink |
Country Status (2)
Country | Link |
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JP (1) | JP2005175428A (en) |
TW (1) | TWI257831B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102446659B (en) * | 2010-09-30 | 2014-05-07 | 松川精密股份有限公司 | Relay improvement structure |
JP2013021269A (en) * | 2011-07-14 | 2013-01-31 | Ngk Spark Plug Co Ltd | Wiring substrate with built-in component |
CN114578495B (en) * | 2017-07-19 | 2024-04-02 | 苏州旭创科技有限公司 | Optical module |
-
2003
- 2003-12-05 TW TW092134493A patent/TWI257831B/en not_active IP Right Cessation
-
2004
- 2004-08-24 JP JP2004244199A patent/JP2005175428A/en active Pending
Also Published As
Publication number | Publication date |
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TW200520646A (en) | 2005-06-16 |
JP2005175428A (en) | 2005-06-30 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |