JP2005175428A - Circuit board having sink hole - Google Patents

Circuit board having sink hole Download PDF

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Publication number
JP2005175428A
JP2005175428A JP2004244199A JP2004244199A JP2005175428A JP 2005175428 A JP2005175428 A JP 2005175428A JP 2004244199 A JP2004244199 A JP 2004244199A JP 2004244199 A JP2004244199 A JP 2004244199A JP 2005175428 A JP2005175428 A JP 2005175428A
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Japan
Prior art keywords
hole
circuit board
sink
sink hole
circuit
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JP2004244199A
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Japanese (ja)
Inventor
Shih-Hsiung Lien
世雄 連
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Optimum Care International Tech Inc
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Optimum Care International Tech Inc
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Publication of JP2005175428A publication Critical patent/JP2005175428A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board having sink holes which have a sufficient space for mounting an electronic element and reduce volume and thickness. <P>SOLUTION: One sink hole or one or more sink holes having a recessed or penetrated shape are provided on predetermined positions, a single layer or multilayer circuit board is selected, and a single layer or stair-like hole sink hole is provided. In this way, contact points to be connected to the electronic element are provided on the predetermined positions of the holes, and electronic element (IC transistor, connector, resistor or capacitor) is mounted on the sink holes. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、シンクホールを有する回路基板に係り、特に、各方式の回路基板（カード）に広く応用され、搭載される電子素子が充分に空間を利用することができる回路基板の改良設計に関するものである。   The present invention relates to a circuit board having a sink hole, and more particularly to an improved design of a circuit board that is widely applied to circuit boards (cards) of various systems and that allows electronic devices to be mounted to fully utilize space. It is.

例えば、PDA、携帯電話、ノート型パソコン、翻訳機、フラッシュディスク、MP３プレーヤー等、現在の電子関連製品は、軽量、小型化及び精密化の趨勢にある。このような電子関連製品の主要部分である回路基板は、プリント回路を有し、多くの機能を有する電子素子をこの回路基板に搭載し（例えば、ICトランジスタ、コネクタ、レジスタンス、コンデンサ、或いは、発光ダイオード等）、例えば、ディスプレイカード、マザーボード、インターネットカード、メモリカード、携帯電話、或いは、翻訳機等の回路基板、或いは、その他の機能の回路基板（カード）となる。   For example, current electronic products such as PDAs, mobile phones, notebook computers, translators, flash disks, MP3 players, etc. are in the trend of light weight, miniaturization and precision. The circuit board, which is the main part of such electronic products, has a printed circuit, and electronic elements having many functions are mounted on the circuit board (for example, IC transistors, connectors, resistances, capacitors, or light emitting devices). A diode, etc.), for example, a display card, a motherboard, an Internet card, a memory card, a mobile phone, a circuit board such as a translator, or a circuit board (card) of other functions.

従来の回路基板は、基板の所定面に多数の電子素子を搭載し、且つ、各種電子素子は、一定の体積と高さ有するので、回路基板の組成後の形態は、軽い、薄い、精巧である、という要求を満たすことができず、特に、電子製品に多機能が必要とされる（例えば、携帯電話にデジタル撮影及びMP３の機能を有する）状況下で、限られた空間の回路基板を、如何にして有効に利用し、多機能を達成する多種の電子素子を搭載するかが、研究の主流となっている。   A conventional circuit board has a large number of electronic elements mounted on a predetermined surface of the board, and various electronic elements have a certain volume and height, so that the form after the composition of the circuit board is light, thin, and elaborate. A circuit board with a limited space is required, especially in a situation where a multi-function is required for an electronic product (for example, a mobile phone has digital photography and MP3 functions). The mainstream of research is how to mount various electronic devices that can be used effectively and achieve multiple functions.

本発明は、これらの事情に鑑みてなされたもので、電子素子の充分な搭載空間を有して、体積と厚さを縮小させることができるシンクホール有する回路基板を提供することを目的とする。   The present invention has been made in view of these circumstances, and an object of the present invention is to provide a circuit board having a sink hole that has a sufficient mounting space for electronic elements and can be reduced in volume and thickness. .

前記目的を達成するため本発明によるシンクホール有する回路基板は、
所定位置に、一つ、或いは、一つ以上の凹陥状、或いは、貫通状であるシンクホールを設け、且つ、多層回路板を選択し、階段孔状のシンクホールを設け、 この構成によって、孔の所定位置に、電子素子と接続する回路接点（プリント回路等）を設け、この構成は、電子素子（ICトランジスタ、コネクタ、レジスタンス、コンデンサ）をシンクホールに設置すると共に、回路接点を運用し、各電子素子と溶接、或いは、導接し、回路板（カード）体積空間及び厚さ、尺寸の縮小効果が得られる。 To achieve the above object, a circuit board having a sink hole according to the present invention comprises:
At one position, one or more sinkholes that are recessed or penetrating, and a multilayer circuit board is selected, and a staircase-shaped sinkhole is provided. A circuit contact (printed circuit, etc.) for connecting to an electronic element is provided at a predetermined position of this, and this configuration is such that an electronic element (IC transistor, connector, resistance, capacitor) is installed in a sink hole and a circuit contact is operated, It is possible to obtain a circuit board (card) volume space, thickness and scale reduction effect by welding or conducting contact with each electronic element.

本発明のシンクホール有する回路基板によれば、電子素子の充分な搭載空間を有して体積と厚さを縮小させることができ、電子製品の薄、軽、精巧設計を達成することができる効果を有する。   According to the circuit board having the sink hole of the present invention, it is possible to reduce the volume and thickness by having a sufficient mounting space for electronic elements, and to achieve thin, light, and elaborate design of electronic products. Have

以下、図面を参照して本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図に示されるように、本発明の実施例のシンクホール有する回路基板は、マザーボード、ディスプレイカード、メモリカード、インターネットカード、携帯電話、或いは、翻訳機等の電子機器に利用される回路基板である。   As shown in the figure, a circuit board having a sink hole according to an embodiment of the present invention is a circuit board used for an electronic device such as a mother board, a display card, a memory card, an Internet card, a mobile phone, or a translator. .

図１及び図２に示されるように、回路基板１の所定位置には、一つ、或いは一つ以上の貫通孔であるシンクホール２を設けている。これらのシンクホール２は、四角形、円形、或いは、その他の特定、或いは、不特定の任意の形状である。前記シンクホール２の任意の一辺側、或いは多辺側孔縁の回路板１の片面、或いは両面には、シンクホール２が必要とする電子素子のための複数の回路接点３が設置されている。これらの回路接点により、シンクホールを有する回路基板１は、シンクホール２中に、一つ、或いは一つ以上の電子素子４（例えば、ICトランジスタ、コネクタ、レジスタンス、コンデンサ、或いは、その他の回路板等の電子素子）を搭載できると共に、電子素子４のピン４１と回路接点３とを溶接するか、或いはその他の方式で電気的に接続させる。   As shown in FIG. 1 and FIG. 2, a sink hole 2 that is one or more through holes is provided at a predetermined position of the circuit board 1. These sink holes 2 are square, circular, or any other specific or unspecified arbitrary shape. A plurality of circuit contacts 3 for electronic elements required by the sink hole 2 are installed on one side or both sides of the circuit board 1 having an arbitrary one side of the sink hole 2 or a multi-side hole edge. . With these circuit contacts, the circuit board 1 having a sink hole is provided in the sink hole 2 with one or more electronic elements 4 (for example, IC transistors, connectors, resistances, capacitors, or other circuit boards). The pin 41 of the electronic element 4 and the circuit contact 3 are welded or electrically connected by other methods.

本実施例では、多層プリント回路を使用するときは、図３及び図４に示されるように、前記シンクホール２が階段孔状になっていると共に、一層或いは回路接点３を有する多層の階段面２１を設定し、シンクホール２中に、多数の電子素子４を搭載できる回路基板とすることができる。   In this embodiment, when a multilayer printed circuit is used, as shown in FIGS. 3 and 4, the sink hole 2 has a stepped hole shape, and one layer or a multilayer step surface having a circuit contact 3. 21 can be set to be a circuit board on which a large number of electronic elements 4 can be mounted in the sink hole 2.

また、他の実施例としてのシンクホール２は、前記の実施例に示すような貫通孔に限定されず、図５にで示されるように、回路基板１の片面、或いは両面に、一つ、或いは一つ以上の凹孔状のシンクホール２’を設け、且つ、このシンクホール２’の底面、或いは、孔縁の任意の１辺側、或いは多辺側表面に、回路接点３を設けている。そして、前記凹孔状のシンクホール２’を利用して、一つ、或いは一つ以上の電子素子４を搭載する。   Further, the sink hole 2 as another embodiment is not limited to the through hole as shown in the above embodiment, and as shown in FIG. 5, one on one side or both sides of the circuit board 1, Alternatively, one or more recessed hole-shaped sink holes 2 ′ are provided, and circuit contacts 3 are provided on the bottom surface of the sink holes 2 ′, or on any one side or the multi-side surface of the hole edge. Yes. Then, one or more electronic elements 4 are mounted using the sink-like sink hole 2 '.

同様に、図６に示すように本発明の凹孔状のシンクホール２’の実施例は、多層プリント回路を選択し、片面、或いは両面に、一つ、或いは一つ以上の凹孔状のシンクホール２’を設け、一層、或いは多層の階段面２１に、回路接点３を設け、これにより、シンクホール２中に多数の電子素子４を搭載する回路基板とすることができる。   Similarly, as shown in FIG. 6, the embodiment of the recessed hole-like sink hole 2 'of the present invention selects a multilayer printed circuit, and has one or more recessed holes on one or both sides. The sink hole 2 ′ is provided, and the circuit contact 3 is provided on the stepped surface 21 of one layer or multiple layers, whereby a circuit board on which a large number of electronic elements 4 are mounted in the sink hole 2 can be obtained.

また、前記シンクホール２、２’の所定位置の回路接点３は、一般のプリント回路の溶接点で、回路接点３は、貫通孔３１（図７で示される）を有するか、或いは、貫通孔を有さない接点（前述で図示される）で、これにより、電子素子４を搭載する。   Further, the circuit contact 3 at a predetermined position of the sink holes 2 and 2 ′ is a welding point of a general printed circuit, and the circuit contact 3 has a through hole 31 (shown in FIG. 7) or a through hole. Thus, the electronic element 4 is mounted on the contact (not shown above).

本発明のシンクホールを有する回路基板も構造は、シンクホール２、２’により、電子素子を組み立て、電子素子４（例えば、ICトランジスタ、コネクタ、レジスタンス、コンデンサ、或いは、その他の回路板等の電子素子）を、シンクホール２、２’に中に搭載し、回路基板１全体の厚さを縮減すると共に、多数の電子素子４を、並列、或いは層状に組み立て、空間が限られた回路基板に十分な組み立て空間を与え、従来の問題を解決し、電子製品の薄、軽、精巧設計を達成することができるものである。   The circuit board having a sink hole according to the present invention also has a structure in which an electronic element is assembled by the sink holes 2 and 2 ′, and an electronic element 4 (for example, an electronic device such as an IC transistor, a connector, a resistance, a capacitor, or other circuit board) Device) in the sink holes 2 and 2 'to reduce the overall thickness of the circuit board 1 and to assemble a large number of electronic elements 4 in parallel or in layers to form a circuit board with limited space. It provides sufficient assembly space, solves conventional problems, and achieves thin, light and elaborate design of electronic products.

本発明では好ましい実施例を前述の通り開示したが、これらは決して本発明を限定するものではなく、当該技術を熟知する者なら誰でも、本発明の精神と領域を脱しない範囲内で各種の変更や付加構成を加えることができ、従って本発明の範囲は、特許請求の範囲で限定したした内容を基準とする。   Although preferred embodiments of the present invention have been disclosed in the present invention as described above, these are not intended to limit the present invention in any way, and any person who is familiar with the technology can use various methods within the scope of the spirit and scope of the present invention. Modifications and additions can be made, and therefore the scope of the present invention is based on what is defined in the claims.

本発明の１実施例によるシンクホールを有する回路基板を示す説明図である。It is explanatory drawing which shows the circuit board which has a sink hole by one Example of this invention. １実施例のシンクホールを有する回路基板の応用を示す説明図である。It is explanatory drawing which shows the application of the circuit board which has a sink hole of 1 Example. 変形例の階段貫通状のシンクホールを有する回路基板を示す説明図である。It is explanatory drawing which shows the circuit board which has the sink hole of the stair-penetrating shape of a modification. 変形例による階段貫通状のシンクホールを有する回路基板の応用を示す説明図である。It is explanatory drawing which shows the application of the circuit board which has a sink hole of the stair-penetrating shape by a modification. 本発明に他の実施例による凹孔のシンクホールを有する回路基板の応用を示す説明図である。It is explanatory drawing which shows the application of the circuit board which has the sink hole of the concave hole by another Example to this invention. 変形例による凹孔のシンクホールを有する回路基板の応用を示す説明図である。It is explanatory drawing which shows the application of the circuit board which has the sink hole of the concave hole by a modification. 本発明の実施例による貫通孔を有する回路接点を示す説明図である。It is explanatory drawing which shows the circuit contact which has a through-hole by the Example of this invention. 本発明の実施例による凹孔のシンクホールを有する回路基板の応用を示す説明図である。It is explanatory drawing which shows the application of the circuit board which has the sink hole of the concave hole by the Example of this invention. 本発明の実施例による階段凹孔のシンクホールを有する回路基板の応用を示す説明図である。It is explanatory drawing which shows the application of the circuit board which has the sink hole of the staircase concave hole by the Example of this invention.

符号の説明Explanation of symbols

１…回路基板
２、２’…シンクホール
２１…階段面
３…回路接点
３１…貫通孔
４…電子素子
４１…ピン
代理人 弁理士 伊藤 進 1 ... Circuit board 2, 2 '... Sink hole
21 ... Stair surface 3 ... Circuit contact 31 ... Through hole 4 ... Electronic element 41 ... Pin
Attorney Susumu Ito

Claims (3)

所定の面に少なくとも一つの凹孔状又は貫通したシンクホールを設けると共に、前記シンクホールの少なくとも任意の一辺側孔縁に、複数の回路接点を設置し、電子素子を前記シンクホールに搭載することを特徴とするシンクホール有する回路基板。 Provide at least one recessed hole shape or through-hole sink hole on a predetermined surface, and install a plurality of circuit contacts on at least one side hole edge of the sink hole to mount an electronic element in the sink hole. A circuit board having a sink hole. 前記シンクホールは、孔壁を階段状に形成し、さらに所定階段面に前記複数の回路接点を設けていることを特徴とする請求項１に記載のシンクホール有する回路基板。 The circuit board having a sink hole according to claim 1, wherein the sink hole has a hole wall formed in a stepped shape, and further, the plurality of circuit contacts are provided on a predetermined stepped surface. 前記シンクホール側板面の回路接点は、貫通孔を有する、或いは、無貫通状で電子素子をピン溶接することを特徴とする請求項１に記載のシンクホール有する回路基板。 2. The circuit board having a sink hole according to claim 1, wherein the circuit contact on the sink hole side plate surface has a through-hole or a pin-weld electronic element without penetrating. 3.
JP2004244199A 2003-12-05 2004-08-24 Circuit board having sink hole Pending JP2005175428A (en)

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TW092134493A TWI257831B (en) 2003-12-05 2003-12-05 Circuit board having countersink

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JP2005175428A true JP2005175428A (en) 2005-06-30

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102446659A (en) * 2010-09-30 2012-05-09 松川精密股份有限公司 Relay improvement structure
JP2013021269A (en) * 2011-07-14 2013-01-31 Ngk Spark Plug Co Ltd Wiring substrate with built-in component

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114578494B (en) * 2017-07-19 2023-09-22 苏州旭创科技有限公司 Optical module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102446659A (en) * 2010-09-30 2012-05-09 松川精密股份有限公司 Relay improvement structure
JP2013021269A (en) * 2011-07-14 2013-01-31 Ngk Spark Plug Co Ltd Wiring substrate with built-in component

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Publication number Publication date
TW200520646A (en) 2005-06-16
TWI257831B (en) 2006-07-01

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