CN109991703A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN109991703A CN109991703A CN201711479972.3A CN201711479972A CN109991703A CN 109991703 A CN109991703 A CN 109991703A CN 201711479972 A CN201711479972 A CN 201711479972A CN 109991703 A CN109991703 A CN 109991703A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- semiconductor cooler
- heat
- chip
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention provides a kind of optical module, is related to optical communication field.The embodiment of the present invention provides a kind of optical module, including shell；Positioned at the circuit board of enclosure interior；Semiconductor cooler in embedded circuit plate, is contacted between the radiating part and shell of semiconductor cooler by heat-conducting piece；Photoelectric chip, positioned at the heat-conducting part of semiconductor cooler；Lens subassembly, is located at circuit board surface, and cover detains photoelectric chip to change the direction of propagation of light；Microprocessor is located at circuit board surface, is electrically connected with semiconductor cooler, to control semiconductor cooler work.
Description
Technical field
The present invention relates to optical communication field more particularly to a kind of optical modules.
Background technique
Optical module is the core component that photoelectric conversion is realized in optical communication system.Fig. 1 is a kind of light that the prior art provides
Module COB package structure diagram.As shown in Figure 1, optical module is packaged laser chip using COB packaged type, specifically
Ground includes circuit board in the shell of optical module, photoelectric chip and driving chip is equipped on the surface of circuit board, in circuit board
Lens subassembly is provided with above surface, photoelectric chip and driving chip, lens subassembly seals photoelectric chip and driving chip
In circuit board surface, lens subassembly is also used to realize the light path design inside optical module.
In the prior art, heat-conducting piece is set generally between shell and chip, the both ends of heat-conducting piece contact respectively shell with
And chip surface, the heat that chip generates are conducted to heat-conducting piece by chip surface, are then conducted by heat-conducting piece to shell, thus real
Now to the heat dissipation of chip.However in the optical module of COB encapsulation, since lens subassembly clasps chip in the top of chip cover,
Lens subassembly is increased between chip surface and shell, so that heat-conducting piece can not realize thermally conductive company between chip surface and shell
It connects, affects chip cooling.
Summary of the invention
The embodiment of the present invention provides a kind of optical module, and the good heat radiating of chip is realized in the environment of using COB encapsulation
Effect.
In order to achieve the above-mentioned object of the invention, the embodiment of the present invention adopts the following technical scheme that
The embodiment of the present invention provides a kind of optical module, including shell；Positioned at the circuit board of enclosure interior；Semiconductor cooler, it is embedding
Enter in circuit board, is contacted between the radiating part and shell of semiconductor cooler by heat-conducting piece；Photoelectric chip is located at semiconductor system
The heat-conducting part of cooler；Lens subassembly, is located at circuit board surface, and cover detains photoelectric chip to change the direction of propagation of light；Microprocessor,
It positioned at circuit board surface, is electrically connected with semiconductor cooler, to control semiconductor cooler work.
Optical module provided in an embodiment of the present invention is embedded in semiconductor cooler on circuit board inside housings, by photoelectricity
Chip is placed in the heat-conducting part of semiconductor cooler, and the heat that photoelectric chip can be generated is guided by semiconductor cooler；Half
The radiating part of conductor refrigerator is contacted with shell by heat-conducting piece, can be conducted heat to shell, be radiated by shell；Positioned at electricity
The lens subassembly cover of road plate surface clasps photoelectric chip to change the direction of propagation of light；Microprocessor is located at circuit board surface, with
Semiconductor cooler is electrically connected to control its work.
Detailed description of the invention
It, below will be to attached drawing needed in embodiment description in order to illustrate more clearly of the technical solution of the application
It is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of optical module COB package structure diagram that the prior art provides；
Fig. 2 is a kind of optical module COB package structure diagram provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
COB(chip on board) encapsulation be one of mainstream packaged type of optical module.Photoelectricity core is mounted on circuit boards
Piece, cover detains lens subassembly to cooperate the optical path of photoelectric chip above photoelectric chip, this makes photoelectric chip be sealed in lens group
In the cavity that part and circuit board are formed, this is unfavorable for the heat dissipation of photoelectric chip.
Fig. 1 is a kind of optical module COB package structure diagram that the prior art provides.As shown in Figure 1, optical module uses
COB packaged type is packaged laser chip, includes circuit board 22 in the shell of optical module, in the table of circuit board specifically
Face is equipped with photoelectric chip and driving chip, is provided with lens above the surface of circuit board, photoelectric chip and driving chip
Photoelectric chip and driving chip are sealed in circuit board surface by component 23, lens subassembly, and lens subassembly is also used to realize optical module
Internal light path design.
COB encapsulation photoelectric chip is placed in the cavity that lens subassembly and circuit board surround, specifically, photoelectric chip with
Circuit board directly contacts, and there are space, circuit board and lens subassemblies not to have good heat-sinking capability between lens subassembly.
The embodiment of the present invention provides a kind of optical module, including shell；Positioned at the circuit board of enclosure interior；Semiconductor refrigerating
Device in embedded circuit plate, is contacted between the radiating part and shell of semiconductor cooler by heat-conducting piece；Photoelectric chip is located at half
The heat-conducting part of conductor refrigerator；Lens subassembly, is located at circuit board surface, and cover detains photoelectric chip to change the direction of propagation of light；It is micro-
Processor is located at circuit board surface, is electrically connected with semiconductor cooler, to control semiconductor cooler work.
Optical module provided in an embodiment of the present invention, circuit board 301 inside housings are embedded in semiconductor cooler 304, will
Photoelectric chip 305 is placed in the heat-conducting part of semiconductor cooler, the heat that photoelectric chip generates can be passed through semiconductor cooler
It guides；The radiating part of semiconductor cooler is contacted with shell by heat-conducting piece 306, shell can be conducted heat to, by shell
Heat dissipation；The cover of lens subassembly 302 positioned at circuit board surface clasps photoelectric chip to change the direction of propagation of light；Microprocessor is located at
Circuit board surface is electrically connected to control its work with semiconductor cooler.
In the embodiment of the present invention, it is embedded in semiconductor cooler TEC in the circuit board, photoelectric chip is placed in semiconductor refrigerating
The heat-conducting part of device, the heat that photoelectric chip generates can be conducted by the heat-conducting part of semiconductor cooler to semiconductor cooler,
It is shed by the radiating part of semiconductor cooler.Semiconductor cooler, can be efficient by light as a kind of active heat removal device
The heat that electrical chip generates guides.
Specifically, through-hole 303 is set on circuit boards, semiconductor cooler is placed in through-hole, realizes half by glue
Conductor refrigerator is directly fixed with circuit board, and the anode and cathode of semiconductor cooler are in such a way that gold thread is bonded and electric
The connection of road plate, is attached to TEC heat-conducting part surface for photoelectric chip, the radiating part of TEC is contacted by heat-conducting piece with shell.
In TEC embedded circuit plate, the heat-conducting part and radiating part of TEC is respectively facing upper and lower two surfaces of circuit board, TEC's
Heat-conducting part is attached on heat-conducting part towards the upper surface of circuit board, photoelectric chip, the radiating part of TEC towards the lower surface of circuit board,
Radiating part and shell, which directly pad, is connected to heat-conducting piece.The heat that photoelectric chip generates is conducted by heat-conducting part to radiating part, by dissipating
Hot portion is conducted to heat-conducting piece, is conducted by heat-conducting piece to shell, is realized and is radiated eventually by shell.
The upper surface of circuit board is arranged in lens subassembly, can cover completely and clasp semiconductor cooler.Have in lens subassembly
There is optical design, be not easy to carry out heat radiation structure design to it, it is common in the art that this use photoelectric chip can not
Surface direct contact type heat dissipation, this promotes other radiating modes of present inventor's R & D design.
Specifically, photoelectric chip can be laser chip, be also possible to light detecting chip, and photoelectric chip can also form battle array
Column.
Microprocessor is located at circuit board surface, is electrically connected with semiconductor cooler, and semiconductor cooler is opened in realization
Close control.There is temperature sensor in microprocessor, semiconductor cooler can be opened after detection temperature reaches preset value.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (1)
1. a kind of optical module, which is characterized in that including
Shell；
Positioned at the circuit board of the enclosure interior；
Semiconductor cooler is embedded in the circuit board, is passed through between the radiating part of the semiconductor cooler and the shell
Heat-conducting piece contact；
Photoelectric chip, positioned at the heat-conducting part of the semiconductor cooler；
Lens subassembly, is located at the circuit board surface, and cover detains the photoelectric chip to change the direction of propagation of light；
Microprocessor is located at the circuit board surface, is electrically connected with the semiconductor cooler, to control the semiconductor refrigerating
Device work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711479972.3A CN109991703A (en) | 2017-12-29 | 2017-12-29 | A kind of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711479972.3A CN109991703A (en) | 2017-12-29 | 2017-12-29 | A kind of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109991703A true CN109991703A (en) | 2019-07-09 |
Family
ID=67109088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711479972.3A Withdrawn CN109991703A (en) | 2017-12-29 | 2017-12-29 | A kind of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109991703A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115552800A (en) * | 2021-04-16 | 2022-12-30 | 华为技术有限公司 | Circuit board, controller assembly, controller, control method and vehicle |
| CN115826155A (en) * | 2022-10-31 | 2023-03-21 | 讯芸电子科技(中山)有限公司 | Optical communication module with heat radiation structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213806A (en) * | 2011-06-14 | 2011-10-12 | 苏州旭创科技有限公司 | Temperature control type 10G 80km SFP+ (enhanced 8.5 and 10 gigabit small form factor pluggable module) optical module with low power consumption |
| CN203084244U (en) * | 2012-12-28 | 2013-07-24 | 武汉电信器件有限公司 | Optical assembly for parallel transmission |
| US20130299683A1 (en) * | 2012-05-09 | 2013-11-14 | Sumitomo Electric Industries, Ltd. | Optical connecting member and optical module |
-
2017
- 2017-12-29 CN CN201711479972.3A patent/CN109991703A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213806A (en) * | 2011-06-14 | 2011-10-12 | 苏州旭创科技有限公司 | Temperature control type 10G 80km SFP+ (enhanced 8.5 and 10 gigabit small form factor pluggable module) optical module with low power consumption |
| US20130299683A1 (en) * | 2012-05-09 | 2013-11-14 | Sumitomo Electric Industries, Ltd. | Optical connecting member and optical module |
| CN203084244U (en) * | 2012-12-28 | 2013-07-24 | 武汉电信器件有限公司 | Optical assembly for parallel transmission |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115552800A (en) * | 2021-04-16 | 2022-12-30 | 华为技术有限公司 | Circuit board, controller assembly, controller, control method and vehicle |
| CN115826155A (en) * | 2022-10-31 | 2023-03-21 | 讯芸电子科技(中山)有限公司 | Optical communication module with heat radiation structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190709 |
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| WW01 | Invention patent application withdrawn after publication |