CN219621263U - Fuse tin coating device - Google Patents
Fuse tin coating device Download PDFInfo
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- CN219621263U CN219621263U CN202320028831.4U CN202320028831U CN219621263U CN 219621263 U CN219621263 U CN 219621263U CN 202320028831 U CN202320028831 U CN 202320028831U CN 219621263 U CN219621263 U CN 219621263U
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- fuse
- solder
- tin
- substrate
- heating plate
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Abstract
The embodiment of the utility model discloses a fuse tin coating device, which comprises: a work table; the heating plate is positioned on the workbench and used for heating the fuse fusing base material arranged on the heating plate; the soldering tin placing rack is used for placing soldering tin; a solder guiding part for guiding solder from the solder placing frame to the fuse fusing substrate heated by the heating plate; the soldering tin heater is used for melting soldering tin output by the soldering tin guiding part, and the melted soldering tin is fused with the fuse fusing base material; and the controller is used for controlling the feeding speed of the fuse fusing substrate. The solder is directly melted on the fuse fusing substrate, so that the yield of the fuse is improved, and meanwhile, compared with the existing tin coating technology on the fuse, the size of a tin coating layer of the fuse is smaller.
Description
Technical Field
The utility model relates to the technical field of fuse production, in particular to a fuse tin coating device.
Background
Currently, copper and silver are used as the fuse base material of the fuse in the market. In the new energy automobile industry, high-speed rail industry, aircraft industry and other industries, the requirements on safety and precision are higher and higher, along with the gradual reduction of the size of a fuse, the market demand that the fusing precision is higher and higher is generally that the fusing area of the fuse is covered with tin (tin-covered, namely, a layer of tin belt is directly attached to the fusing substrate of the fuse, and the tin belt is attached to the surface of the fusing substrate through a welding furnace) so as to achieve the control of precise fusing current and position, however, the prior tin-covered technology enables the fuse to be unstable in production yield due to the influence of uncontrollable factors such as temperature, surface oxidation of the material, and the like, and the yield can only reach about 87%. And the tin-coating technology makes the size of the tin belt limited, and can not achieve tin coating with the width smaller than 2.5mm and the thickness smaller than 0.2mm on the fusing substrate, so that the size of the fuse can not be further reduced.
If the yield of the fuse is further improved, and the limitation of further miniaturization of the fuse size caused by the existing tin coating technology is overcome, the technical problem to be solved in the industry is urgent.
Disclosure of Invention
In order to solve at least the above technical problems, an objective of the embodiments of the present utility model is to provide a fuse tin coating device, so as to solve the technical problems of limitation on the width of the fuse substrate and the size of the tin layer disposed on the fuse substrate caused by the existing tin coating technology on the fuse substrate.
In order to achieve the above object, a tin coating device for a fuse according to an embodiment of the present utility model is used for tin coating of a fuse fusing substrate, and includes:
a work table;
the heating plate is positioned on the workbench and used for heating the fuse fusing base material arranged on the heating plate;
the soldering tin placing rack is used for placing soldering tin;
a solder guiding part for guiding solder from the solder placing frame to the fuse fusing substrate heated by the heating plate;
the soldering tin heater is used for melting soldering tin output by the soldering tin guiding part, and the melted soldering tin is fused with the fuse fusing base material;
and the controller is used for controlling the feeding speed of the fuse fusing substrate.
Further, the operating temperature of the heating plate includes: 200-280 ℃.
Further, the solder is a tin wire.
Further, the tin wire is a hollow tin wire.
Further, soldering flux is distributed in the tin wires.
Further, the flux accounts for 2.2% of the tin wire.
Further, the width of the fuse blowing substrate includes: 8mm-65mm.
According to the fuse tin coating device and the method, the feeding speed of the fuse fusing base material controlled by the controller is controlled by adjusting the temperature of the soldering tin heater and the height of the heating plate, so that the constraint of the soldering tin size is eliminated, the size of the fused fuse fusing base material is more flexibly controlled, and the fuse fusing base material with the width of 8-65 mm can be coated with a tin belt layer with the width of 0.5-4.5 mm, so that the fuse is further miniaturized in technology; the requirement on soldering tin is low, no extra customization is needed, and the raw material cost is reduced; the soldering tin is directly melted onto the fuse fusing base material, so that the yield of the fuse is improved, and the market competitiveness of a terminal product is further improved.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, reference will be made below to the accompanying drawings which are used in the description of one or more embodiments or of the prior art, it being apparent that the drawings in the description below are only some of the embodiments described in the description, from which, without inventive faculty, other drawings can also be obtained for a person skilled in the art.
FIG. 1 is a schematic diagram of a fuse tin-plating device according to an embodiment of the utility model;
fig. 2 is a flow chart of a method for tin coating a fuse according to an embodiment of the utility model.
Reference numerals:
101-heating plate; 102-a solder heater; 103-soldering tin placing rack; 104-a solder guide; 105-a controller; 106, detecting and alarming devices; 107-display means; 108-fusing the substrate with the fuse; 109-a feeder; 110-a fuse; 111-a material receiving machine.
Detailed Description
Embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While the utility model is susceptible of embodiment in the drawings, it is to be understood that the utility model may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the utility model. It should be understood that the drawings and embodiments of the utility model are for illustration purposes only and are not intended to limit the scope of the present utility model.
It should be understood that the steps recited in the method embodiments of the present utility model may be performed in a different order and/or performed in parallel. Furthermore, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the utility model is not limited in this respect.
The term "including" and variations thereof as used herein are intended to be open-ended, i.e., including, but not limited to. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments. Related definitions of other terms will be given in the description below.
It should be noted that references to "one", "a plurality" and "a plurality" in this disclosure are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that "one or more" is intended to be construed as "one or more" unless the context clearly indicates otherwise. "plurality" is understood to mean two or more.
Hereinafter, embodiments of the present utility model will be described in detail with reference to the accompanying drawings.
The embodiment of the utility model provides a fuse tin coating device, which is used for tin coating of a fuse fusing substrate and comprises the following components:
a work table;
the heating plate is positioned on the workbench and used for heating the fuse fusing base material arranged on the heating plate;
the soldering tin placing rack is used for placing soldering tin;
a solder guiding part for guiding solder from the solder placing frame to the fuse fusing substrate heated by the heating plate;
the soldering tin heater is used for melting soldering tin output by the soldering tin guiding part, and the melted soldering tin is fused with the fuse fusing base material;
and the controller is used for controlling the feeding speed of the fuse fusing substrate.
Example 1
Fig. 1 is a schematic structural diagram of a fuse tin coating device according to an embodiment of the present utility model, and the fuse tin coating device according to the embodiment of the present utility model will be described in detail with reference to fig. 1.
In an exemplary embodiment, the fuse tin coating device of the present embodiment is used for tin coating of fuse blowing substrate 108.
In an exemplary embodiment, a fuse tin-plating apparatus of an embodiment of the present utility model includes: a table, a heating plate 101, a solder placement frame 103, a solder guide 104, a solder heater 102, and a controller 105.
In an exemplary embodiment, a heating plate 101 is provided on the table.
In an exemplary embodiment, the heating plate 101 is used to heat the fuse blowing substrate 108 disposed on the heating plate 101 (i.e., when the fuse is coated with tin, the fuse blowing substrate 108 needs to be heated on the heating plate 101, and the fuse blowing substrate 108 is heated first to facilitate subsequent fusion with the melted solder).
In an exemplary embodiment, the heater plate 101 may be preheated at the start of the tin coating operation, and the fuse blowing substrate 108 is scratched against the upper surface of the heater plate 101 when the heater plate 101 reaches 200-280 ℃.
In an exemplary embodiment, the operating temperature of the heating plate 101 further includes: 220 ℃, 230 ℃, 250 ℃, 260 ℃ and 270 ℃.
In an exemplary embodiment, the specific operating temperature of the heater plate 101 may be set based on the actual fuse blowing substrate 108 size and material.
In an exemplary embodiment, the fuse blowing substrate 108 includes copper and silver tape (i.e., the fuse blowing substrate 108 is copper or silver).
In an exemplary embodiment, the width of the fuse blowing substrate 108 includes: 8mm-65mm.
In an exemplary embodiment, the solder rack 103 may be optionally disposed above the table.
In an exemplary embodiment, the solder rack 103 is used to hold solder.
In an exemplary embodiment, the solder is a tin wire.
In an exemplary embodiment, the tin wire is a hollow tin wire.
In an exemplary embodiment, the soldering flux is disposed within the tin wire.
In an exemplary embodiment, the flux comprises 2.2% tin wire.
In an exemplary embodiment, the tin wire comprises an active standard tin wire of FLUX (FLUX 2.2%).
In an exemplary embodiment, the solder guide 104 is used to guide solder from the solder rack 103 onto the fuse blowing substrate 108 heated by the heating plate 101.
In an exemplary embodiment, the solder guide 104 may be a hollow tube for solder to pass out of the solder guide 104 (i.e., solder is output from the hollow tube).
In an exemplary embodiment, the solder heater 102 is used to melt the solder controlled by the solder guide 104, and the melted solder merges with the fuse melting substrate 108.
In an exemplary embodiment, the controller 105 is configured to control the feed rate of the fuse blowing substrate 108.
In an exemplary embodiment, after the fuse blowing substrate 108 is preheated by the heating plate 101, the controller 105 is activated to control the feeding of the fuse blowing substrate 108 at a constant speed.
In an exemplary embodiment, the controller 105 controlling the feed rate of the fuse blowing substrate 108 includes: 0.3-0.7m/s.
In an exemplary embodiment, the controller 105 controlling the feed rate of the fuse blowing substrate 108 further includes: 0.5m/s.
In an exemplary embodiment, the uniform feed rate of the fuse blowing substrate 108 ensures uniformity and stability of the tin coating on the fuse 110.
In an exemplary embodiment, after the fuse cutout substrate 108 is preheated by the heating plate 101, the solder rack 103 supplies solder at a constant speed, and the solder heater 102 melts the solder above the fuse cutout substrate 108, so that the melted solder merges with the fuse cutout substrate 108.
In an exemplary embodiment, the operating temperature of the solder heater 102 includes: 300-360 deg.c.
In an exemplary embodiment, the operating temperature of the solder heater 102 further comprises: 310 ℃, 320 ℃, 330 ℃, 345 ℃ and 350 ℃.
In an exemplary embodiment, a detection alarm 106 is also included for detecting whether the solder has been used up.
In an exemplary embodiment, the detection alarm 106 includes an alarm.
In an exemplary embodiment, an alarm is given when the solder rest 103 is not soldering tin, prompting replacement/replenishment of soldering tin.
In an exemplary embodiment, the display device 107 is configured to display current technical parameters, for example: the current temperature of the heating plate 101, the current temperature of the solder heater 102, the current speed of the controller 105, etc.
In an exemplary embodiment, the display device 107 includes a display.
In an exemplary embodiment, the fuse blowing substrate 108 is disposed on the feeder 109 (i.e., the fuse blowing substrate 108 is transported by the feeder 109), passes through the surface of the heating plate 101, and is wound up by the winding up machine 111 (i.e., the winding up machine 111 winds up the fuse 110) after the speed of the drawing by the controller 105 (of course, the solder heater 102 melts the solder and is disposed on the upper surface of the fuse blowing substrate 108 in the front section of the controller 105) becomes the fuse 110.
In an exemplary embodiment, since the solder is directly melted and the melted solder is directly fused with the fuse blowing substrate 108, good control over the size (e.g., width, thickness, etc.) of the solder coating on the fuse can be achieved by the controller 105 and a reduction in the size of the solder coating to a width in the range of 0.5mm-4.5mm can be achieved.
Example 2
Fig. 2 is a flow chart of a fuse tin coating method according to an embodiment of the present utility model, and the fuse tin coating method according to an embodiment of the present utility model will be described in detail with reference to fig. 2.
The fuse tin coating method provided by the embodiment of the utility model adopts the fuse tin coating device.
First, in step 201, a heating plate is activated to heat a fuse blowing substrate.
In an exemplary embodiment, a heater plate on a fuse tinning device is first activated for a pre-heat treatment.
In an exemplary embodiment, the heater plate is pre-heated to provide a temperature to the subsequently entering fuse blowing substrate to facilitate good fusion of the fuse blowing substrate with the melted solder after subsequent melting of the solder.
In step 202, the solder placement rack is started to supply solder when the temperature of the heating plate reaches a preset heating threshold of the heating plate.
In an exemplary embodiment, the solder placement rack is activated to supply solder when the temperature of the heater plate reaches a preset heater plate heating threshold.
In an exemplary embodiment, the heating plate heating threshold includes: 200-280 ℃.
In an exemplary embodiment, the heating threshold of the heating plate further includes: 220 ℃, 230 ℃, 250 ℃, 260 ℃ and 270 ℃.
In an exemplary embodiment, the specific heating threshold of the heater plate may be set based on the actual fuse blowing substrate size and material.
In an exemplary embodiment, the fuse blowing substrate includes copper tape and silver tape (i.e., the fuse blowing substrate is copper or silver).
In an exemplary embodiment, a solder is provided on the solder placement frame, and the solder placement frame supplies solder when the temperature of the heating plate reaches a preset heating threshold of the heating plate.
In step 203, the solder heater is activated to bring the temperature to a predetermined solder heating temperature.
In an exemplary embodiment, a solder heater is activated for melting solder located on a fuse blowing substrate.
In an exemplary embodiment, the preset solder heating temperature includes: 300-360 deg.c.
In an exemplary embodiment, the preset solder heating temperature further includes: 310 ℃, 320 ℃, 330 ℃, 345 ℃ and 350 ℃.
In step 204, when the temperature of the solder heater reaches the preset solder heating temperature, the controller is started to uniformly control the feeding of the fuse fusing substrate, and the feeding speed of the fuse fusing substrate is matched with the melting speed of the solder.
In an exemplary embodiment, when the temperature of the solder heater reaches a preset solder heating temperature, the controller is started to uniformly control the feeding of the fuse melting base material, and the feeding speed of the fuse melting base material is matched with the melting speed of the solder.
In an exemplary embodiment, adjusting the control speed of the controller to adjust the size (e.g., width, thickness, etc.) of solder on the fuse is also included.
In an exemplary embodiment, since the solder is directly melted and the melted solder is directly fused with the fuse substrate, good control over the size (e.g., width, thickness, etc.) of the solder coating on the fuse can be achieved by the controller, and downsizing of the size of the solder coating to a width in the range of 0.5mm-4.5mm can be achieved.
Although the embodiments of the present utility model are described above, the present utility model is not limited to the embodiments which are used for understanding the present utility model. Any person skilled in the art can make any modification and variation in form and detail without departing from the spirit and scope of the present disclosure, but the scope of the present disclosure is to be determined by the appended claims.
Claims (7)
1. A fuse tin coating apparatus for tin coating a fuse fusing substrate, comprising:
a work table;
the heating plate is positioned on the workbench and used for heating the fuse fusing base material arranged on the heating plate;
the soldering tin placing rack is used for placing soldering tin;
a solder guiding part for guiding the solder from the solder placing frame to the fuse fusing substrate heated by the heating plate;
a solder heater for melting the solder outputted from the solder guide part, the melted solder being fused with the fuse fusing substrate;
and the controller is used for controlling the feeding speed of the fuse fusing substrate.
2. The fuse tin coating device of claim 1, wherein the operating temperature of the heating plate comprises: 200-280 ℃.
3. The fuse tin coating device of claim 2, wherein the solder is a tin wire.
4. A fuse tin coating device in accordance with claim 3, wherein the tin wire is a hollow tin wire.
5. The fuse tin coating device of claim 4, wherein a flux is disposed within the tin wire.
6. The fuse tin coating device of claim 5, wherein the flux comprises 2.2% of the tin wire.
7. The fuse tin coating device of claim 6, wherein the width of the fuse blowing substrate comprises: 8mm-65mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320028831.4U CN219621263U (en) | 2023-01-06 | 2023-01-06 | Fuse tin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320028831.4U CN219621263U (en) | 2023-01-06 | 2023-01-06 | Fuse tin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219621263U true CN219621263U (en) | 2023-09-01 |
Family
ID=87794821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320028831.4U Active CN219621263U (en) | 2023-01-06 | 2023-01-06 | Fuse tin coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219621263U (en) |
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2023
- 2023-01-06 CN CN202320028831.4U patent/CN219621263U/en active Active
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