CN115747798A - Fuse tin coating device and method - Google Patents
Fuse tin coating device and method Download PDFInfo
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- CN115747798A CN115747798A CN202310016611.4A CN202310016611A CN115747798A CN 115747798 A CN115747798 A CN 115747798A CN 202310016611 A CN202310016611 A CN 202310016611A CN 115747798 A CN115747798 A CN 115747798A
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Abstract
The embodiment of the invention discloses a fuse tin coating device and a method, wherein the fuse tin coating device comprises: a work table; the heating plate is positioned on the workbench and used for heating fuse fusing base materials distributed on the heating plate; the soldering tin placing rack is used for placing soldering tin; a solder guiding part for guiding the solder from the solder placing frame to the fuse fusing substrate heated by the heating plate; the soldering tin heater is used for melting the soldering tin output by the soldering tin guide part, and the melted soldering tin is fused with the fuse fusing base material; and the controller is used for controlling the feeding speed of the fuse fusing base material. The fuse has the advantages that the tin soldering is directly melted on the fuse fusing substrate, the yield of the fuse is improved, and meanwhile, compared with the existing tin soldering technology on the fuse, the size of a tin layer on the fuse is smaller.
Description
Technical Field
The invention relates to the technical field of fuse production, in particular to a fuse tin coating device and method.
Background
The fuses on the market currently use copper and silver as the fusing base material of the fuse. In new energy automobile trade, high-speed railway, trade such as aircraft are more and more high to the requirement of safety and precision, along with the volume of fuse dwindles gradually day by day, fusing required market demand that the precision is higher and more, generally at the regional tin (tin coating of fuse, directly attached one deck tin strip on fuse fusing substrate promptly, make tin strip attached on fusing substrate surface through welding the stove), in order to reach the control of accurate fusing current and position, current tin coating technique makes the fuse material receive uncontrollable factors such as temperature and material surface oxidation in process of production influence and leads to the production yield unstable, the yields can only reach about 87%. And the tin coating technology limits the size of the tin ribbon, and can not achieve the tin coating with the width less than 2.5mm and the thickness less than 0.2mm on the fusing base material, so that the volume of the fuse can not be further reduced.
If the yield of the fuse is further improved, and the limitation of further miniaturization of the fuse size brought by the existing tin-coating technology is overcome, the technical problem to be solved urgently in the industry is already formed.
Disclosure of Invention
In order to solve at least the above technical problems, an embodiment of the present invention provides a fuse tin coating apparatus to solve the technical problems of the limitation on the width of a fuse substrate and the size of a tin layer disposed on the fuse substrate, which are caused by the existing technology of coating tin on the fuse substrate.
In order to achieve the above object, a tin coating device for a fuse according to an embodiment of the present invention is a tin coating device for fusing a fuse on a substrate, including:
a work table;
the heating plate is positioned on the workbench and used for heating fuse fusing base materials distributed on the heating plate;
the soldering tin placing rack is used for placing soldering tin;
a solder guiding part for guiding the solder from the solder placing rack to the fuse fusing base material heated by the heating plate;
the soldering tin heater is used for melting the soldering tin output by the soldering tin guide part, and the melted soldering tin is fused with the fuse fusing base material;
and the controller is used for controlling the feeding speed of the fuse fusing base material.
Further, the operating temperature of the heating plate includes: 200 ℃ to 280 ℃.
Further, the solder is a tin wire.
Further, the tin wire is a hollow tin wire.
Furthermore, soldering flux is distributed in the tin wire.
Furthermore, the proportion of the soldering flux in the tin wire is 2.2%.
Further, the width of the fuse fusing substrate includes: 8mm-65mm.
In order to achieve the above object, a fuse tin-coating method provided by an embodiment of the present invention adopts the fuse tin-coating apparatus, including:
starting the heating plate to heat the fuse fusing base material;
when the temperature of the heating plate reaches a preset heating threshold value of the heating plate, starting the soldering tin placing frame to supply soldering tin;
starting a soldering tin heater to enable the temperature of the soldering tin heater to reach a preset soldering tin heating temperature;
when the temperature of the soldering tin heater reaches the preset soldering tin heating temperature, starting the controller to control the feeding of the fuse fusing base material at a constant speed;
the feeding speed of the fuse fusing base material is matched with the melting speed of the soldering tin.
Further, the preset heating plate heating threshold includes: 200 ℃ to 280 ℃.
Further, the preset solder heating temperature includes: 300 ℃ to-360 ℃.
According to the fuse tin coating device and method provided by the embodiment of the invention, the feeding speed of the fuse fusing base material controlled by the controller is regulated by adjusting the temperature of the soldering tin heater and the height of the heating plate, so that the constraint on the size of the soldering tin is eliminated, the size of the fused fuse fusing base material after the soldering tin is melted can be more flexibly controlled, and a tin belt layer with the width of 0.5-4.5 mm can be coated on the fuse fusing base material with the width of 8-65 mm, so that the fuse is further developed on the miniaturization technology; the requirement on soldering tin is low, additional customization is not needed, and the raw material cost is reduced; the fuse fusing base material is directly fused with the soldering tin, so that the yield of the fuse is improved, and the market competitiveness of a terminal product is further improved.
Drawings
In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, reference will now be made briefly to the attached drawings, which are needed in the description of one or more embodiments or prior art, and it should be apparent that the drawings in the description below are only some of the embodiments described in the specification, and that other drawings may be obtained by those skilled in the art without inventive exercise.
FIG. 1 is a schematic structural diagram of a fuse tin-coating device according to an embodiment of the invention;
FIG. 2 is a schematic flow chart of a method for tin-coating a fuse according to an embodiment of the present invention.
Reference numerals are as follows:
101-a heating plate; 102-a solder heater; 103-a soldering tin placing rack; 104-solder guide portion; 105-a controller; 106-detection alarm means; 107-display device; 108-fuse fusing the substrate; 109-a feeder; 110-a fuse; 111-material receiving machine.
Detailed Description
Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While certain embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided for a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are for illustration purposes only and are not intended to limit the scope of the present application.
It should be understood that the various steps described in the method embodiments of the present application may be performed in a different order and/or in parallel. Moreover, method embodiments may include additional steps and/or omit performing the illustrated steps. The scope of the present application is not limited in this respect.
The term "including" and variations thereof as used herein is intended to be open-ended, i.e., "including but not limited to". The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions for other terms will be given in the following description.
It is noted that references to "a" or "an" modification in this application are intended to be illustrative rather than limiting, and those skilled in the art will appreciate that references to "one or more" are intended to be exemplary unless the context clearly indicates otherwise. "plurality" is to be understood as two or more.
Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.
The embodiment of the invention provides a tin coating device for a fuse, which is used for tin coating of a fuse fusing base material and comprises the following components:
a work table;
the heating plate is positioned on the workbench and used for heating fuse fusing base materials distributed on the heating plate;
the soldering tin placing rack is used for placing soldering tin;
a solder guiding part for guiding the solder from the solder placing frame to the fuse fusing substrate heated by the heating plate;
the soldering tin heater is used for melting the soldering tin output by the soldering tin guide part, and the melted soldering tin is fused with the fuse fusing base material;
and the controller is used for controlling the feeding speed of the fuse fusing base material.
Example 1
Fig. 1 is a schematic structural diagram of a fuse tin-plating device according to an embodiment of the present invention, and the fuse tin-plating device according to the embodiment of the present invention will be described in detail with reference to fig. 1.
In an exemplary embodiment, the fuse tin-coating apparatus of the embodiment of the invention is used for tin coating of the fuse fusing substrate 108.
In an exemplary implementation manner, a fuse tin-coating device according to an embodiment of the present invention includes: a table, a hot plate 101, a solder placing frame 103, a solder guide 104, a solder heater 102, and a controller 105.
In an exemplary embodiment, a heating plate 101 is provided on the table.
In an exemplary embodiment, the heating plate 101 is used to heat the fuse-cutting substrate 108 disposed on the heating plate 101 (i.e., when the fuse is coated with tin, the fuse-cutting substrate 108 is heated on the heating plate 101, and the fuse-cutting substrate 108 is heated first to facilitate the fusion with the melted solder).
In an exemplary embodiment, the heating plate 101 may be preheated when the tin coating operation is started, and the fuse blow substrate 108 is scratched against the upper surface of the heating plate 101 when the heating plate 101 reaches 200 ℃ to 280 ℃.
In an exemplary embodiment, the operating temperature of the heating plate 101 further includes: 220 ℃, 230 ℃, 250 ℃, 260 ℃ and 270 ℃.
In an exemplary embodiment, the specific operating temperature of the heating plate 101 may be set according to the actual size and material of the fuse-blowing base 108.
In an exemplary embodiment, the fuse blowing substrate 108 includes copper and silver ribbons (i.e., the fuse blowing substrate 108 is copper or silver).
In an exemplary embodiment, the width of the fuse blowing substrate 108 includes: 8mm-65mm.
In an exemplary embodiment, the solder placement frame 103 is optionally disposed above the work table.
In an exemplary embodiment, the solder placement frame 103 is used for placing solder.
In an exemplary embodiment, the solder is a tin wire.
In an exemplary embodiment, the tin wire is a hollow tin wire.
In an exemplary embodiment, the solder wire is lined with a flux.
In an exemplary embodiment, the flux comprises 2.2% of the tin wire.
In an exemplary embodiment, the tin wire comprises FLUX (FLUX 2.2%) active standard tin wire.
In an exemplary embodiment, the solder guide 104 is used to guide solder from the solder mount 103 onto the fuse blowout substrate 108 heated by the heating plate 101.
In an exemplary embodiment, the solder guide 104 may be a hollow tube for the solder to pass out of the solder guide 104 (i.e., the solder is output from the hollow tube).
In an exemplary embodiment, the solder heater 102 is used to melt solder controlled by the solder guide 104, and the melted solder is fused with the fuse cutout base 108.
In an exemplary embodiment, a controller 105 is used to control the feed rate of the fuse blowing substrate 108.
In an exemplary embodiment, after the fuse substrate 108 is preheated by the heating plate 101, the controller 105 is activated to control the feeding of the fuse substrate 108 at a constant speed.
In an exemplary embodiment, the controller 105 controlling the feed rate of the fuse blowing substrate 108 includes: 0.3-0.7m/s.
In an exemplary embodiment, the controller 105 controlling the feed rate of the fuse-blown substrate 108 further comprises: 0.5m/s.
In an exemplary embodiment, the constant feeding speed of the fuse blowing substrate 108 ensures uniform and stable tin coating on the fuse 110.
In an exemplary embodiment, after the fuse-cutting substrate 108 is preheated by the heating plate 101, the solder holder 103 supplies solder at a constant speed, and the solder heater 102 melts the solder on the fuse-cutting substrate 108, so that the melted solder is fused with the fuse-cutting substrate 108.
In an exemplary embodiment, the operating temperature of the solder heater 102 includes: 300 ℃ to-360 ℃.
In an exemplary embodiment, the operating temperature of the solder heater 102 further includes: 310 ℃, 320 ℃, 330 ℃, 345 ℃ and 350 ℃.
In an exemplary embodiment, a detection alarm 106 is further included for detecting whether the solder has run out.
In an exemplary embodiment, detection alarm device 106 comprises an alarm.
In an exemplary embodiment, when the solder placement frame 103 is empty of solder, an alarm is issued to prompt replacement/replenishment of solder.
In an exemplary embodiment, the display device 107 is configured to display the current technical parameter, for example: the current temperature of the heater plate 101, the current temperature of the solder heater 102, and the current speed of the controller 105, among others.
In an exemplary embodiment, the display device 107 includes a display.
In an exemplary embodiment, the fuse-cut base material 108 is disposed on the feeding machine 109 (i.e., the fuse-cut base material 108 is transported by the feeding machine 109), passes through the surface of the heating plate 101, and is pulled by the controller 105 at a speed (of course, the front section of the controller 105 is melted by the solder heater 102 and is disposed on the upper surface of the fuse-cut base material 108), and then enters the receiving machine 111 to be received (i.e., the receiving machine 111 receives the fuse 110).
In an exemplary embodiment, since the solder is directly melted and the melted solder is directly fused with the fuse-cutting substrate 108, the controller 105 can achieve a good control of the size (e.g., width, thickness, etc.) of the tin-coated on the fuse, and can achieve a reduction of the size of the tin-coated solder to a width in the range of 0.5mm to 4.5 mm.
Example 2
Fig. 2 is a schematic flow chart of a fuse tin-plating method according to an embodiment of the present invention, and the fuse tin-plating method according to the embodiment of the present invention will be described in detail with reference to fig. 2.
The fuse tin coating method provided by the embodiment of the invention adopts the fuse tin coating device.
First, in step 201, a heating plate is activated to heat a fuse-blowing base material.
In an exemplary embodiment, a heating plate on the fuse tin coating device is started to perform a preheating treatment.
In an exemplary embodiment, the heating plate is preheated to provide a temperature for the fuse-blowing substrate that is subsequently entered, so as to facilitate good fusion of the fuse-blowing substrate with the molten solder after the molten solder has been subsequently melted.
In step 202, when the temperature of the heating plate reaches a preset heating plate heating threshold, the solder placing frame is started to supply the solder.
In an exemplary embodiment, when the temperature of the heating plate reaches a preset heating threshold value of the heating plate, the solder placing frame is started to supply the solder.
In an exemplary embodiment, the heater plate heating threshold comprises: 200 ℃ to 280 ℃.
In an exemplary embodiment, the heating threshold of the heating plate further comprises: 220 ℃, 230 ℃, 250 ℃, 260 ℃ and 270 ℃.
In an exemplary embodiment, the specific heating threshold of the heating plate may be set according to the actual fuse blowing substrate size and material.
In an exemplary embodiment, the fuse blowing substrate includes copper and silver ribbons (i.e., the fuse blowing substrate is copper or silver).
In an exemplary embodiment, the solder placing frame is provided with solder, and when the temperature of the heating plate reaches a preset heating threshold value of the heating plate, the solder placing frame supplies the solder.
In step 203, the solder heater is activated to a predetermined solder heating temperature.
In an exemplary embodiment, a solder heater is activated for melting solder on a fuse blowing substrate.
In an exemplary embodiment, the preset solder heating temperature includes: 300 ℃ to-360 ℃.
In an exemplary embodiment, the predetermined solder heating temperature further includes: 310 ℃, 320 ℃, 330 ℃, 345 ℃ and 350 ℃.
In step 204, when the temperature of the solder heater reaches the preset solder heating temperature, the controller is started to control the feeding of the fuse fusing base material at a constant speed, and the feeding speed of the fuse fusing base material is matched with the melting speed of the solder.
In an exemplary embodiment, when the temperature of the solder heater reaches a preset solder heating temperature, the controller is started to uniformly control the feeding of the fuse fusing substrate, and the feeding speed of the fuse fusing substrate is matched with the melting speed of the solder.
In an exemplary embodiment, adjusting the speed of the controller adjusts the size (e.g., width, thickness, etc.) of the solder on the fuse.
In an exemplary embodiment, since the solder is directly melted and the melted solder is directly fused with the fusing substrate, the controller can achieve good control over the size (such as width, thickness, etc.) of the tin coating on the fuse, and can achieve the reduction of the size of the tin coating to the range of 0.5mm to 4.5mm in width.
Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A fuse tin coating device for tin coating of a fuse fusing substrate, comprising:
a work table;
the heating plate is positioned on the workbench and used for heating the fuse fusing substrate distributed on the heating plate;
the soldering tin placing rack is used for placing soldering tin;
a solder guiding portion for guiding the solder from the solder placing frame to the fuse fusing base material heated by the heating plate;
the soldering tin heater is used for melting the soldering tin output by the soldering tin guide part, and the melted soldering tin is fused with the fuse fusing base material;
and the controller is used for controlling the feeding speed of the fuse fusing base material.
2. The fuse tin coating apparatus of claim 1, wherein the operating temperature of the heating plate comprises: 200 ℃ to 280 ℃.
3. The fuse tin coating apparatus of claim 2, wherein the solder is a tin wire.
4. The fuse tin coating apparatus of claim 3, wherein the tin wire is a hollow tin wire.
5. The device of claim 4, wherein a flux is disposed in the tin wire.
6. The device for tin coating fuses of claim 5, wherein the soldering flux accounts for 2.2% of the tin wires.
7. The fuse tin coating apparatus of claim 6, wherein the width of the fuse melting substrate comprises: 8mm-65mm.
8. A fuse tin coating method, which adopts the fuse tin coating device of any one of claims 1 to 7, and is characterized by comprising the following steps:
starting the heating plate to heat the fuse fusing base material;
when the temperature of the heating plate reaches a preset heating threshold value of the heating plate, starting a soldering tin placing frame to supply soldering tin;
starting a soldering tin heater to enable the temperature of the soldering tin heater to reach a preset soldering tin heating temperature;
when the temperature of the soldering tin heater reaches the preset soldering tin heating temperature, starting a controller to control the feeding of the fuse fusing base material at a constant speed;
the feeding speed of the fuse fusing substrate is matched with the melting speed of the soldering tin.
9. The method of claim 8, wherein the preset heater plate heating threshold comprises: 200 ℃ to 280 ℃.
10. The method of claim 8, wherein the predetermined solder heating temperature comprises: 300 ℃ to-360 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310016611.4A CN115747798A (en) | 2023-01-06 | 2023-01-06 | Fuse tin coating device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310016611.4A CN115747798A (en) | 2023-01-06 | 2023-01-06 | Fuse tin coating device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115747798A true CN115747798A (en) | 2023-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310016611.4A Pending CN115747798A (en) | 2023-01-06 | 2023-01-06 | Fuse tin coating device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115747798A (en) |
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2023
- 2023-01-06 CN CN202310016611.4A patent/CN115747798A/en active Pending
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