CN219577358U - SMT paster mainboard - Google Patents

Abstract

The utility model discloses an SMT patch main board, which comprises a main board positioned on a mounting seat, a sealing cover positioned at the top of the main board and a heat dissipation assembly positioned between the mounting seat and the main board, wherein the heat dissipation assembly comprises a radiator and a heat conduction pad, the radiator is fixedly inlaid at the bottom of the mounting seat, the top of the radiator is fixedly connected with the heat conduction pad, and the heat conduction pad is also contacted with the main board; the two sides of the bottom of the mounting seat are fixedly connected with connecting plates, and the connecting plates are connected with small fans. According to the utility model, the small fans are arranged at two sides of the bottom of the mounting seat, and the heat dissipation effect of the radiator is enhanced by the small fans, so that the heat dissipation efficiency of the main board is improved.

Description

SMT paster mainboard

Technical Field

The utility model belongs to the technical field of SMT (surface mounted technology) paster mainboards, and particularly relates to an SMT paster mainboard.

Background

SMT patch is an abbreviation for serial process flow of processing on the basis of PCB, and SMT is currently the most popular technology and process in the electronic assembly industry.

The current patent name is "SMT paster mainboard with high dustproof construction", publication number is CN217428422U, and this patent can be sealed SMT paster mainboard through coupling assembling, sealing component, sealed cowling, mount pad and the radiating component that sets up, avoids the dust gathering at STM paster mainboard surface, has guaranteed the radiating effect of STM paster mainboard simultaneously, avoids influencing the operating condition of mainboard, and sealed pad's being provided with is favorable to connecting wire's installation and sealing simultaneously.

But above-mentioned patent just dispels the heat to STM paster mainboard through heat conduction pad cooperation radiator, can lead to the radiating effect of STM paster mainboard not good like this.

Disclosure of Invention

In order to solve the problems, the utility model provides an SMT patch main board which solves the problem of low heat dissipation efficiency of an STM patch main board.

The embodiment of the utility model is realized by the following technical scheme:

the SMT patch main board comprises a main board positioned on a mounting seat, a sealing cover positioned at the top of the main board and a heat dissipation assembly positioned between the mounting seat and the main board, wherein the heat dissipation assembly comprises a radiator and a heat conduction pad, the radiator is fixedly inlaid at the bottom of the mounting seat, the top of the radiator is fixedly connected with the heat conduction pad, and the heat conduction pad is also contacted with the main board; the two sides of the bottom of the mounting seat are fixedly connected with connecting plates, and the connecting plates are connected with small fans.

In an embodiment of the utility model, two sides of the top of the mounting seat are provided with mounting plates, the mounting plates are also positioned at two sides of the main board, and the drawing assembly is also arranged in the mounting plates.

In an embodiment of the utility model, the drawing component comprises a pull rod, a buffer spring, a clamping plate and a buffer pad, wherein one end of the buffer spring is connected to the inner side of the mounting seat, the other end of the buffer spring is connected with the clamping plate, the clamping plate is fixedly connected with the pull rod, one side of the clamping plate, close to the main plate, is connected with the buffer pad, and the pull rod is movably connected with the mounting seat.

In an embodiment of the utility model, the connection parts of the mounting seat and the sealing cover are provided with sealing components.

In an embodiment of the utility model, fixing seats are further arranged on two sides of the mounting seat, and threaded fixing holes are formed in the fixing seats.

In an embodiment of the utility model, threaded connection holes are formed on two sides of the sealing cover, and the threaded connection holes are fixedly connected with the threaded fixing holes through bolts.

In an embodiment of the utility model, two sides of the bottom end of the mounting seat are fixedly connected with an L-shaped support plate, and the L-shaped support plate is also provided with a mounting hole.

The technical scheme of the embodiment of the utility model has at least the following advantages and beneficial effects:

according to the embodiment of the utility model, the small fans are arranged on the two sides of the bottom of the mounting seat, and the heat dissipation effect of the radiator is enhanced by the small fans, so that the heat dissipation efficiency of the main board is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

fig. 3 is an enlarged schematic view of B in fig. 1.

Icon: the heat-conducting plate comprises a 1-L-shaped supporting plate, a 2-mounting seat, a 3-sealing cover, a 4-bolt, a 5-fixing seat, a 6-pull rod, a 7-mounting plate, an 8-main plate, a 9-buffer spring, a 10-buffer pad, an 11-clamping plate, a 12-heat-conducting pad, a 13-radiator, a 14-connecting plate, a 15-small fan and a 16-mounting hole.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that, if the azimuth or positional relationship indicated by the terms "inner", "outer", etc. appears to be based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that the inventive product is conventionally put in use, it is merely for convenience of describing the present utility model and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present utility model.

In the description of the present utility model, it should also be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "configured," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-3, the present embodiment provides an SMT patch main board structure, which includes a main board 8 located on a mounting base 2, a sealing cover 3 located at the top of the main board 8, and a heat dissipation assembly located between the mounting base 2 and the main board 8, wherein two sides of the bottom end of the mounting base 2 are fixedly connected with an L-shaped support board 1, the L-shaped support board 1 is provided with a mounting hole 16, and the L-shaped support board 1 can fix the mounting base 2 on a plane by penetrating the mounting hole 16 through a countersunk screw, so that the mounting of the mounting base 2 is more stable.

Further, the top both sides of this mount pad 2 are equipped with fixing base 5, have offered the screw thread fixed orifices on this fixing base 5, and this sealed cowling 3 both sides all are equipped with the threaded connection hole, when threaded connection hole and screw thread fixed orifices are in same center department, accessible bolt 4 is fixed both to make sealed cowling 3 and mount pad 2 fixed connection, and the junction of this sealed cowling 3 and mount pad 2 all is equipped with seal assembly, in this embodiment, this seal assembly is sealing rubber circle (not shown), thereby make the better mainboard 8 on the protection mount pad 2 of sealed cowling 3 not receive external environment's influence.

Further, the two sides of the top of the mounting seat 2 are also provided with mounting plate blocks 7, the mounting plate blocks 7 are also positioned at two sides of the main board 8, the mounting plate blocks 7 are internally provided with drawing components, the drawing components comprise a pull rod 6, a buffer spring 9, a clamping plate 11 and a buffer pad 10, one end of the buffer spring 9 is connected to the inner side of the mounting seat 2, the other end of the buffer spring is connected with the clamping plate 11, the clamping plate 11 is also fixedly connected with the pull rod 6, one side of the clamping plate 11 close to the main board 8 is connected with the buffer pad 10, and the pull rod 6 is movably connected with the mounting seat 2; thereby realized through outwards pulling pull rod 6, through pull rod 6 drive splint 11 remove, then put into installation plate 7 with mainboard 8 in, slowly release pull rod 6 again, because buffer spring 9's effort, this splint 11 resets to clip mainboard 8, make mainboard 8 more stable, and through installation blotter 10, appear damaging the problem of mainboard 8 when avoiding splint 11 centre gripping mainboard 8.

Further, this radiating component includes radiator 13 and heat conduction pad 12, and this radiator 13 is fixed to be inlayed in the bottom of mount pad 2, and the top and the heat conduction pad 12 fixed connection of this radiator 13, and this heat conduction pad 12 still contacts with mainboard 8 to the bottom both sides of this mount pad 2 still fixedly connected with connecting plate 14, this connecting plate 14 is connected with small-size fan 15, on the heat transfer to radiator 13 that the heat conduction pad 12 produced mainboard 8, the rethread small-size fan 15 carries out the heat dissipation with higher speed to radiator 13 to the quick heat dissipation of mainboard 8 has been realized.

The working principle of the utility model is as follows: the pull rod 6 is pulled outwards to enable the clamping plate 11 to move backwards, so that the main board 8 is placed in the installation plate 7, the pull rod 6 is slowly loosened again, after the main board 8 is stably clamped by the clamping plate 11, the sealing cover 3 is buckled again, the sealing cover 3 is fixed on the fixing seat 5 through the bolt 4, and finally the small fan 15 is started to quickly dissipate heat of the radiator 13, so that the condition that the working of the main board 8 is influenced due to the fact that the temperature of the main board 8 is too high is guaranteed.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (7)

1. The SMT patch main board comprises a main board positioned on a mounting seat, a sealing cover positioned at the top of the main board and a heat dissipation assembly positioned between the mounting seat and the main board, and is characterized in that the heat dissipation assembly comprises a radiator and a heat conduction pad, wherein the radiator is fixedly inlaid at the bottom of the mounting seat, the top of the radiator is fixedly connected with the heat conduction pad, and the heat conduction pad is also contacted with the main board; the two sides of the bottom of the mounting seat are fixedly connected with connecting plates, and the connecting plates are connected with small fans.

2. An SMT patch board as claimed in claim 1, wherein mounting blocks are provided on both sides of the top of the mounting base, the mounting blocks are also provided on both sides of the board, and a drawer assembly is also provided in the mounting blocks.

3. An SMT patch board as claimed in claim 2, wherein the pull assembly comprises a pull rod, a buffer spring, a clamping plate and a buffer pad, wherein one end of the buffer spring is connected to the inner side of the mounting seat, the other end of the buffer spring is connected to the clamping plate, the clamping plate is fixedly connected with the pull rod, one side of the clamping plate, which is close to the main board, is connected with the buffer pad, and the pull rod is movably connected with the mounting seat.

4. The SMT patch board of claim 1, wherein said mounting base and seal housing connections are each provided with a seal assembly.

5. The SMT patch board of claim 4, wherein said mounting base is further provided with a mounting base on each side, said mounting base being provided with a threaded mounting hole.

6. The SMT patch board of claim 1, wherein threaded connection holes are formed in two sides of said sealing cover, and the threaded connection holes are fixedly connected with the threaded fixing holes through bolts.

7. The SMT patch board of claim 5, wherein the two sides of the bottom end of said mounting base are fixedly connected with an L-shaped support plate, and the L-shaped support plate is further provided with a mounting hole.