CN211959941U

CN211959941U - Heat radiation structure of PCBA shield cover and shell

Info

Publication number: CN211959941U
Application number: CN202020997430.6U
Authority: CN
Inventors: 吴迪
Original assignee: Zhejiang Xinlianyu Electronic Co ltd
Current assignee: Zhejiang Xinlianyu Electronic Co ltd
Priority date: 2020-06-03
Filing date: 2020-06-03
Publication date: 2020-11-17
Anticipated expiration: 2030-06-03

Abstract

The utility model relates to a heat radiation structure of PCBA shield cover and shell. It has solved the not good and inconvenient problem of dismouting maintenance of PCBA board heat dispersion among the prior art, it includes the PCBA board, PCBA board one side has the grafting stitch, and grafting stitch one side is equipped with a plurality of installation plugs, PCBA board one side is equipped with installation casing subassembly, the opposite side is equipped with the installation splint that are the setting that corresponds with installation casing subassembly one end, installation casing subassembly is kept away from the PCBA board and is equipped with the shield cover subassembly, and be equipped with on the shield cover subassembly and be the heat abstractor that corresponds the setting with installation casing subassembly one end, the one end that heat abstractor was kept away from to the shield cover subassembly is equipped with the audio frequency subassembly, and shield cover subassembly lower extreme is equipped with the locating hole mechanism that can supply grafting stitch. The utility model has the advantages that: the radiating effect is good, and the dismouting is convenient during the maintenance.

Description

Heat radiation structure of PCBA shield cover and shell

Technical Field

The utility model relates to an electronic component noise shielding technical field, concretely relates to heat radiation structure of PCBA shield cover and shell.

Background

In the current electronic products, because electronic components in the electronic products all have radiation, which is easy to interfere with the reception of their own radio frequency, a shield cover is generally arranged on the PCBA board, and the manufacturing and production of the electronic products generally have requirements of convenient assembly, low cost, strong reliability, etc., and the structure of the shield cover plays an important role in the manufacturing of the electronic products. The shield cover on the present PCBA board adopts the locate mode of traditional welding or clip mostly, shield cover and PCBA board are that the laminating is connected the adoption and is the welded mode, this needs the shield cover to do workmanship and requires highly, the roughness is good, can weld smoothly, another kind adopts the locate mode of clip, the accuracy that needs the shield cover size to do again, otherwise the insecure of clip clamp, the risk that drops easily has, this all makes the fixed reliability of shield cover lower, and, be connected closely between current shield cover and the PCBA board, produce the too high condition of temperature easily when the PCBA board is in operating condition for a long time, influence the performance of PCBA board, heat dispersion is not good, and simultaneously, dismantle inconveniently between shield cover and the PCBA board, when the PCBA board produces the damage, it is inconvenient to maintain.

In order to solve the defects of the prior art, people have long searched for and put forward various solutions. For example, chinese patent literature discloses a combined structure of a shield case and a PCBA board [ CN201720311787.2], which includes a main shield board and a twisted leg, wherein the twisted leg is composed of a main body portion, a connecting portion, and a locking portion, one end of the main body portion is fixedly connected to the bottom of the main shield board, and the other end of the main body portion is fixedly connected to the locking portion through the connecting portion; be provided with on the PCBA board with turn round the corresponding screens hole of foot, turn round the foot and connect in the screens hole, screens portion passes the screens hole, extends to the PCBA board on one side, is provided with on PCBA to be used for carrying out spacing groove to screens portion, turns round the foot after buckling, screens portion is located the spacing inslot.

Above-mentioned scheme has solved to a certain extent that shield cover and PCBA board among the prior art are connected unstablely, drop easily, lead to the problem of bad connection, but this scheme still has a lot of insufficiencies, for example: PCBA board heat dispersion is not good, influences performance, and simultaneously, the dismouting is inconvenient between shield cover and the PCBA board, when the PCBA board produces the damage, and the maintenance is inconvenient.

Disclosure of Invention

The utility model aims at the above-mentioned problem, provide a reasonable in design, heat radiation structure of PCBA shield cover and shell that heat dispersion is good and the dismouting is convenient.

In order to achieve the above purpose, the utility model adopts the following technical proposal: this heat radiation structure of PCBA shield cover and shell, including the PCBA board, PCBA board one side has the grafting stitch, and grafting stitch one side is equipped with a plurality of installation plugs, PCBA board one side is equipped with installation casing subassembly, the opposite side is equipped with the installation splint that are the setting that corresponds with installation casing subassembly one end, installation casing subassembly is kept away from the PCBA board and is equipped with the shield cover subassembly, and be equipped with on the shield cover subassembly and be the heat abstractor who corresponds the setting with installation casing subassembly one end, the one end that heat abstractor was kept away from to the shield cover subassembly is equipped with the audio frequency subassembly, and shield cover subassembly lower extreme is equipped with the locating hole mechanism that can supply grafting stitch and installation plug to. Carry out removable fixed to the PCBA board through installation casing subassembly and installation splint, will install the removable setting of casing subassembly on the shield cover subassembly, utilize the locating hole mechanism on the shield cover subassembly to the audio frequency subassembly that is located the PCBA board, grafting stitch and installation plug are fixed a position, easy dismounting when not only maintaining, and stability is good moreover, through heat abstractor's setting, effectively reduced the operating temperature of PCBA board and the temperature of installation casing subassembly, avoided the high temperature to the performance production influence of PCBA board.

In the heat radiation structure of foretell PCBA shield cover and shell, installation casing subassembly includes the rectangle mounting panel, and rectangle mounting panel circumference is equipped with the installation framework that extends towards the PCBA board, and the installation framework about both ends pass through a plurality of installations and the PCBA board is removable continuous, both ends peg graft on the PCBA board through a plurality of grafting portions about the installation framework. Through the mutual cooperation of rectangle mounting panel and installation framework effectively protect PCBA board one end.

In the heat radiation structure of foretell PCBA shield cover and shell, the one side of keeping away from the PCBA board on the rectangle mounting panel is equipped with positioning groove, and transversely is equipped with a plurality of strengthening ribs that parallel arrangement each other on the rectangle mounting panel. The arrangement of the reinforcing ribs enables the bearing capacity of the rectangular mounting plate to be better.

In the heat radiation structure of foretell PCBA shield cover and shell, heat abstractor includes the heat dissipation mounting panel, and the heat dissipation mounting panel is equipped with heat dissipation conduction portion towards one side of PCBA board, and the heat dissipation mounting panel is equipped with a plurality of parallel arrangement's fin towards one side of shield cover subassembly, and heat dissipation mounting panel circumference is equipped with a plurality of fixed orificess. The working temperature of the PCBA board can be effectively reduced through the radiating fins.

In the heat radiation structure of foretell PCBA shield cover and shell, the shield cover subassembly includes the shielding panel, and shielding panel circumference is equipped with the shielding framework that extends towards installation casing subassembly one side, and is located the shielding framework at shielding panel both ends and is equipped with the constant head tank, and shielding panel one end is equipped with and supplies the exerted rectangular hole of fin, and both ends are equipped with a plurality of locating holes that set up with the fixed orifices one-to-one about the rectangular hole.

In the above-mentioned heat radiation structure of PCBA shield case and shell, the locating hole mechanism includes the stitch locating hole, and stitch locating hole one side is equipped with a plurality of plug locating holes corresponding with the installation plug, and is equipped with the spacing hole that can supply to install the pressing key on the PCBA board and expose between plug locating hole and the stitch locating hole, and spacing hole and pressing key one-to-one set up.

In the heat radiation structure of foretell PCBA shield cover and shell, the audio frequency subassembly includes the audio frequency module, the audio frequency module both sides are equipped with a plurality of plug connectors, and plug connector one end links to each other with the PCBA board, one side that the PCBA board was kept away from to the audio frequency module is equipped with the mount pad, both ends that the mount pad is relative wantonly are equipped with spacing mounting bracket device towards one side of audio frequency module, and one side that the audio frequency module was kept away from to the mount pad is equipped with annular bulge, be equipped with the annular locating hole that corresponds with annular bulge on the shield cover subassembly, and be equipped with a plurality of. The audio module not only can be fixed in the setting of mount pad, and the dismouting is convenient during the maintenance moreover.

In the heat radiation structure of foretell PCBA shield cover and shell, spacing mounting bracket device includes connecting portion, and connecting portion one end links to each other with the mount pad edge is fixed, and the other end has fixed connection portion through horizontal portion connection, and the fixed connection portion that is located mount pad one end installs on the PCBA board through a plurality of installation through-holes, and horizontal portion inner wall is equipped with spacing bellying. The limiting protruding portion is arranged to effectively prevent the audio module from shaking and falling off during working.

In the above-mentioned heat radiation structure of PCBA shield cover and shell, PCBA board one end is equipped with the fixed connection portion that can supply the mount pad other end to pass and penetrates the groove.

In the heat radiation structure of the PCBA shield cover and the shell, the shield panel is circumferentially provided with a plurality of positioning through holes.

Compared with the prior art, the utility model has the advantages of: simple structure, low cost through set up heat abstractor on the rectangle mounting panel, has effectively reduceed the operating temperature of PCBA board, has prolonged the life of PCBA board, and the installation casing subassembly is removable continuous between and the PCBA board moreover, simultaneously, carries out removable fixed, the dismouting is convenient, easy maintenance to the audio module that lies in on the PCBA board through spacing mounting bracket device and mount pad.

Drawings

FIG. 1 is an exploded view of the structure of the present invention;

fig. 2 is a side view of the present invention;

FIG. 3 is a schematic structural view of the mounting housing assembly of the present invention;

fig. 4 is a schematic diagram of a shield panel structure according to the present invention;

fig. 5 is a schematic structural view of the mounting seat and the limiting mounting frame device of the present invention when they are connected.

Fig. 6 is a schematic structural view of the heat dissipation device of the present invention.

In the figure, the PCBA board 1, the plug pins 11, the mounting plug 12, the push keys 13, the insertion grooves 14, the mounting case assembly 2, the mounting clip 21, the rectangular mounting plate 22, the mounting frame 23, the mounting portion 24, the insertion portion 25, the positioning grooves 26, the reinforcing ribs 27, the shield cover assembly 3, the shield panel 31, the shield frame 32, the positioning grooves 33, the rectangular holes 34, the positioning holes 35, the annular positioning holes 36, the positioning through holes 37, the heat dissipation device 4, the heat dissipation conduction portion 42, the heat dissipation fins 43, the fixing holes 44, the audio component 5, the audio module 51, the plug connectors 52, the mounting seats 53, the annular protrusions 54, the sound conduction holes 55, the positioning hole mechanisms 6, the pin positioning holes 61, the plug positioning holes 62, the limiting holes 63, the limiting mounting frame device 7, the connecting portions 71, the transverse portions 72, the fixing connecting portions 73, the mounting through.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1-6, this heat radiation structure of PCBA shield cover and shell, including PCBA board 1, PCBA board 1 one side has grafting stitch 11, and grafting stitch 11 one side is equipped with a plurality of installation plugs 12, PCBA board 1 one side is equipped with installation casing subassembly 2, the opposite side is equipped with the installation splint 21 that is the setting that corresponds with installation casing subassembly 2 one end, installation casing subassembly 2 keeps away from PCBA board 1 and is equipped with shield cover subassembly 3, and be equipped with on the shield cover subassembly 3 and be the heat abstractor 4 that corresponds the setting with installation casing subassembly 2 one end, the one end that shield cover subassembly 3 keeps away from heat abstractor 4 is equipped with audio frequency subassembly 5, and shield cover subassembly 3 lower extreme is equipped with the locating hole mechanism 6 that can supply grafting stitch 11 and installation plug 12 to expose. Through set up heat abstractor 4 that contacts with installation casing subassembly 2 on shield cover subassembly 3, and PCBA board 1 is installed in installation casing subassembly 2, consequently, can effectively reduce PCBA board 1's operating temperature, prolong PCBA board 1's life, simultaneously, because the removable continuous between installation casing subassembly 2 and the PCBA board 1, do not establish fixing device between installation casing subassembly 2 and the shield cover subassembly 3, when PCBA board 1 takes place to damage, the dismouting maintenance of being convenient for.

Wherein, installation casing subassembly 2 includes rectangle mounting panel 22, and rectangle mounting panel 22 circumference is equipped with the installation framework 23 towards PCBA board 1 extension, and both ends pass through a plurality of installations portion 24 and PCBA board 1 releasable connection about installation framework 23, and both ends peg graft on PCBA board 1 through a plurality of grafting portion 25 about installation framework 23. The mating part 25 and the mounting part 24 are mainly used for fixing the PCBA board 1 to the mounting frame 23, and the mating part 25 and the mounting part 24 also function as heat conduction.

As can be seen, a positioning groove 26 is formed on one side of the rectangular mounting plate 22 away from the PCBA plate 1, and a plurality of reinforcing ribs 27 arranged in parallel are transversely formed on the rectangular mounting plate 22. The ribs 27 here are different in length, and the rib 27 having one end near the positioning groove 26 is shorter in length, and the rib 27 located at the lower end of the positioning groove 26 is longer in length.

Further, the heat dissipation device 4 includes a heat dissipation mounting plate 41, a heat dissipation conducting portion 42 is disposed on one side of the heat dissipation mounting plate 41 facing the PCBA board 1, a plurality of parallel heat dissipation fins 43 are disposed on one side of the heat dissipation mounting plate 42 facing the shield case component 3, and a plurality of fixing holes 44 are circumferentially disposed on the heat dissipation mounting plate 41. The heat dissipation mounting plate 41, the heat dissipation conduction portion 42, the heat dissipation fins 43 are integrally formed, so that the heat dissipation plate is convenient to disassemble and assemble and high in heat dissipation efficiency.

Obviously, the shielding cover assembly 3 includes a shielding panel 31, the shielding panel 31 is circumferentially provided with a shielding frame 32 extending toward one side of the mounting housing assembly 2, positioning slots 33 are provided on the shielding frame 32 at two ends of the shielding panel 31, one end of the shielding panel 31 is provided with a rectangular hole 34 for exposing the heat sink 42, and the upper and lower ends of the rectangular hole 34 are provided with a plurality of positioning holes 35 disposed in one-to-one correspondence with the fixing holes 44. The rectangular hole 34 here is smaller in area than the heat radiation mounting plate 41, and the heat radiation mounting plate 41 is fixed in the shield panel 31 by the cooperation of the positioning hole 35 and the fixing hole 44.

Specifically, the positioning hole mechanism 6 includes a pin positioning hole 61, a plurality of plug positioning holes 62 corresponding to the mounting plugs 12 are disposed on one side of the pin positioning hole 61, a limiting hole 63 for exposing the pressing keys 13 mounted on the PCBA board 1 is disposed between the plug positioning hole 62 and the pin positioning hole 61, and the limiting hole 63 and the pressing keys 13 are disposed in a one-to-one correspondence.

Furthermore, the audio component 5 includes an audio module 51, a plurality of plug connectors 52 are disposed on two sides of the audio module 51, one end of each plug connector 52 is connected to the PCBA board 1, a mounting seat 53 is disposed on one side of the audio module 51, which is far away from the PCBA board 1, any opposite ends of the mounting seat 53 are provided with a limiting mounting frame device 7 towards one side of the audio module 51, an annular protruding portion 54 is disposed on one side of the mounting seat 53, which is far away from the audio module 51, an annular positioning hole 36 corresponding to the annular protruding portion 54 is disposed on the shield case component 3, and a plurality of sound guide holes 55 are disposed on the annular protruding portion 54.

Preferably, the limiting mounting frame device 7 comprises a connecting portion 71, one end of the connecting portion 71 is fixedly connected with the edge of the mounting seat 53, the other end of the connecting portion 71 is connected with a fixing connecting portion 73 through a transverse portion 72, the fixing connecting portion 73 at one end of the mounting seat 53 is mounted on the PCBA board 1 through a plurality of mounting through holes 74, and a limiting protrusion 75 is arranged on the inner wall of the transverse portion 72. The fixing connection portion 73 at the other end of the mounting seat 53 is provided corresponding to the insertion groove 14 and is externally mounted through the mounting through hole 74 to fix the PCBA board 1.

In detail, one end of the PCBA 1 is provided with a through slot 14 for the fixed connection part 73 at the other end of the mounting seat 53 to pass through.

More specifically, the shield panel 31 is circumferentially provided with a plurality of positioning through holes 37. The bottom edge of the PCBA board 1 is provided with arc-shaped notches which are in one-to-one correspondence with the positioning through holes 37.

The principle of the embodiment is as follows: by arranging the heat dissipation device 4 on the shielding panel 31, the working temperature of the PCBA board 1 arranged on the mounting shell component 2 is reduced by the mutual contact of the heat dissipation device 4 and the mounting shell component 2, and the service life of the PCBA board 1 is effectively prolonged; and because do not carry out fixed linking to each other between installation casing subassembly 2 and the shield cover subassembly 3, simultaneously, removable linking to each other between installation casing subassembly 2 and the PCBA board 1, and audio module 51 carries out removable fixing through spacing mounting bracket device 7 and mount pad 53, not only makes heat abstractor 4 and audio component 5 convenient to maintain dismantle, when PCBA board 1 produced the damage moreover, the dismouting maintenance of being convenient for equally.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the PCBA board 1, the plug pins 11, the mounting plug 12, the push keys 13, the insertion grooves 14, the mounting case assembly 2, the mounting clip 21, the rectangular mounting plate 22, the mounting frame 23, the mounting portion 24, the insertion portions 25, the positioning grooves 26, the reinforcing ribs 27, the shield cover assembly 3, the shield panel 31, the shield frame 32, the positioning grooves 33, the rectangular holes 34, the positioning holes 35, the annular positioning holes 36, the positioning through holes 37 are used more often herein, the terms of the heat sink 4, the heat-dissipating conduction portion 42, the heat sink 43, the fixing hole 44, the audio component 5, the audio module 51, the plug 52, the mounting seat 53, the annular protrusion 54, the sound-guiding hole 55, the positioning hole mechanism 6, the pin positioning hole 61, the plug positioning hole 62, the stopper hole 63, the stopper mount device 7, the connecting portion 71, the lateral portion 72, the fixing-connecting portion 73, the mounting through hole 74, the stopper protrusion 75, and the like, but do not exclude the possibility of using other terms. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims

1. A heat dissipation structure of a PCBA shield cover and a shell comprises a PCBA board (1), one side of the PCBA board (1) is provided with plug pins (11), one side of the plug pins (11) is provided with a plurality of mounting plugs (12), it is characterized in that one side of the PCBA board (1) is provided with an installation shell component (2), the other side is provided with an installation clamping plate (21) which is arranged corresponding to one end of the installation shell component (2), the mounting shell component (2) is provided with a shielding cover component (3) far away from the PCBA board (1), and the shielding cover component (3) is provided with a heat dissipation device (4) which is arranged corresponding to one end of the mounting shell component (2), an audio frequency component (5) is arranged at one end of the shielding cover component (3) far away from the heat dissipation device (4), and the lower end of the shielding cover component (3) is provided with a positioning hole mechanism (6) for exposing the plug pins (11) and the mounting plugs (12).

2. The heat dissipation structure of PCBA shield cover and shell as claimed in claim 1, wherein the installation shell assembly (2) comprises a rectangular installation plate (22), the rectangular installation plate (22) is circumferentially provided with an installation frame body (23) extending towards the PCBA board (1), the left end and the right end of the installation frame body (23) are detachably connected with the PCBA board (1) through a plurality of installation parts (24), and the upper end and the lower end of the installation frame body (23) are connected onto the PCBA board (1) through a plurality of connection parts (25) in an inserting mode.

3. The heat dissipation structure of the PCBA shield and the housing as recited in claim 2, wherein the rectangular mounting plate (22) is provided with a positioning groove (26) at a side away from the PCBA board (1), and the rectangular mounting plate (22) is provided with a plurality of reinforcing ribs (27) arranged in parallel.

4. The heat dissipating structure of the shield case and the housing of the PCBA as claimed in claim 1, wherein the heat dissipating means (4) comprises a heat dissipating mounting plate (41), a heat dissipating conductive portion (42) is disposed on a side of the heat dissipating mounting plate (41) facing the PCBA board (1), a plurality of parallel heat dissipating fins (43) are disposed on a side of the heat dissipating mounting plate (41) facing the shield case assembly (3), and a plurality of fixing holes (44) are circumferentially disposed on the heat dissipating mounting plate (41).

5. The heat dissipation structure of the PCBA shield cover and the shell as recited in claim 4, wherein the shield cover assembly (3) comprises a shield panel (31), the shield panel (31) is circumferentially provided with a shield frame (32) extending towards one side of the installation shell assembly (2), positioning grooves (33) are arranged on the shield frame (32) at two ends of the shield panel (31), one end of the shield panel (31) is provided with a rectangular hole (34) for exposing the heat dissipation fins (43), and the upper end and the lower end of the rectangular hole (34) are provided with a plurality of positioning holes (35) which are in one-to-one correspondence with the fixing holes (44).

6. The heat dissipation structure of the PCBA shield case and the shell as recited in claim 1, wherein the positioning hole mechanism (6) comprises a pin positioning hole (61), one side of the pin positioning hole (61) is provided with a plurality of plug positioning holes (62) corresponding to the mounting plugs (12), a limiting hole (63) for exposing the pressing keys (13) mounted on the PCBA board (1) is arranged between the plug positioning hole (62) and the pin positioning hole (61), and the limiting holes (63) and the pressing keys (13) are arranged in a one-to-one correspondence manner.

7. The heat dissipation structure of PCBA shield cover and shell according to claim 1, characterized in that, audio frequency subassembly (5) include audio module (51), audio module (51) both sides be equipped with a plurality of plug connectors (52), and plug connector (52) one end links to each other with PCBA board (1), audio module (51) keep away from one side of PCBA board (1) and be equipped with mount pad (53), mount pad (53) arbitrary relative both ends be equipped with spacing mounting bracket device (7) towards one side of audio module (51), and mount pad (53) keep away from one side of audio module (51) and be equipped with annular bulge (54), shield cover subassembly (3) on be equipped with annular locating hole (36) corresponding with annular bulge (54), just annular bulge (54) on be equipped with a plurality of sound guide hole (55).

8. The heat dissipation structure of the PCBA shield case and the shell as recited in claim 7, wherein the limiting mounting frame device (7) comprises a connecting part (71), one end of the connecting part (71) is fixedly connected with the edge of the mounting seat (53), the other end of the connecting part is connected with a fixed connecting part (73) through a transverse part (72), the fixed connecting part (73) at one end of the mounting seat (53) is installed on the PCBA board (1) through a plurality of installation through holes (74), and a limiting bulge part (75) is arranged on the inner wall of the transverse part (72).

9. The heat dissipation structure of the PCBA shield and the shell as recited in claim 8, wherein one end of the PCBA board (1) is provided with a through slot (14) for the fixed connection part (73) at the other end of the mounting seat (53) to pass through.

10. A heat dissipating structure for a PCBA shield and a housing as claimed in claim 5, wherein the shield panel (31) is circumferentially provided with a plurality of positioning through holes (37).