CN219534509U - Flexible chip packaging structure - Google Patents
Flexible chip packaging structure Download PDFInfo
- Publication number
- CN219534509U CN219534509U CN202320203570.5U CN202320203570U CN219534509U CN 219534509 U CN219534509 U CN 219534509U CN 202320203570 U CN202320203570 U CN 202320203570U CN 219534509 U CN219534509 U CN 219534509U
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- China
- Prior art keywords
- flexible
- packaging
- chip
- substrate
- flexible chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000000741 silica gel Substances 0.000 claims abstract description 15
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 15
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 flexible chip Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to the field of chip packaging, in particular to a flexible chip packaging structure, which comprises a packaging substrate, a flexible chip and a flexible supporting pad, wherein the flexible supporting pad is arranged at the upper end of the packaging substrate, the flexible chip is arranged at the upper end of the flexible supporting pad, the upper end of the flexible chip is provided with an upper end conducting pad, the upper end surface of the upper end conducting pad is connected with a metal bonding wire, the lower end surface of the lower end conducting pad is glued with the upper end of the packaging substrate, the upper end surface of the packaging substrate is provided with a silica gel packaging layer, the lower end conducting pad, the metal bonding wire, the flexible chip, the upper end conducting pad and the flexible supporting pad are wrapped inside the silica gel packaging layer.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a flexible chip packaging structure.
Background
The rapid development of flexible display technology and flexible circuit board technology will bring revolutionary changes to electronic terminal products, which will exhibit more and more flexible deformability, and flexible circuit boards (FlexiblePrintedCircuit, FPC) break through the traditional interconnection technology with the excellent characteristics of light weight, thin thickness, free bending and folding, etc.
In the related art, when a chip is packaged with a flexible circuit board, due to the soft and bendable characteristic of the flexible circuit board, the chip is not provided with a stable substrate for packaging, and a plurality of air gaps are often reserved between the chip and the flexible circuit board after packaging, so that the chip is not packaged firmly, and the problem that the chip is easy to fall off is caused, and the whole packaging structure is invalid.
The above information disclosed in this background section is only for the understanding of the background of the inventive concept and, therefore, it may contain information that does not form the prior art.
Disclosure of Invention
The utility model aims to provide a flexible chip packaging structure, which solves the problems that when a chip and a flexible circuit board are packaged in the prior art, the flexible circuit board has soft and bendable characteristics, so that the chip does not have a stable substrate for packaging, and a plurality of air gaps are left between the chip and the flexible circuit board after packaging, so that the chip packaging is unstable, and the chip is easy to fall off, and the like, thereby the whole packaging structure is invalid.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a flexible chip packaging structure, includes package substrate, flexible chip, silica gel packaging layer and flexible supporting pad, package substrate's upper end veneer is provided with flexible supporting pad, flexible supporting pad's upper end installation is provided with flexible chip, flexible chip's upper end left and right sides symmetry is fixed and is provided with upper end conductive pad, the up end fixedly connected with metal bonding line of upper end conductive pad, the crooked setting of metal bonding line slope, the lower extreme of metal bonding line and the up end fixed connection of lower extreme conductive pad, the lower terminal surface of lower extreme conductive pad and package substrate's upper end veneer setting, package substrate's up end veneer is provided with the silica gel packaging layer, inside parcel lower extreme conductive pad, metal bonding line, flexible chip, upper end conductive pad and the flexible supporting pad of silica gel packaging layer.
In some embodiments, the lower end glue of the packaging substrate is provided with an inner filling sheet, the lower end glue of the inner filling sheet is provided with the packaging substrate, the thickness of the packaging substrate is 1-2mm, and the thickness of the inner filling sheet is 1-1.5mm.
In some embodiments, the inner part of the inner filling sheet is fixedly provided with an inner heat absorbing filling layer, and the thickness of the inner heat absorbing filling layer is consistent with that of the inner filling sheet.
In some embodiments, the side edge of the package substrate is fixedly provided with side edge circuit connection boards, the side edge circuit connection boards are symmetrically arranged, and the thickness of the side edge circuit connection boards is consistent with that of the package substrate.
In some embodiments, the flexible support pad is internally provided with a micro-via structure disposed on a side of the flexible support pad adjacent to the package substrate.
In some embodiments, the metal bonding wire is one of a gold wire, a silver wire or a copper wire, and a gap of 2-3mm is arranged between the top of the silica gel packaging layer and the metal bonding wire inside.
The beneficial effects of the utility model are as follows:
according to the utility model, the flexible support pad is arranged between the packaging substrate and the flexible chip, so that the space for releasing stress and deforming when the packaging structure is bent is provided, the possibility of transmitting the stress to the flexible chip is reduced, the flexibility of the chip packaging structure is realized, the bending deformation capacity of the chip packaging structure is enhanced, the inner side of the packaging substrate is provided with the inner filling sheet, the arranged inner filling sheet not only provides good supporting strength and a flat surface for the combination of the flexible chip and the packaging substrate, but also improves the combination capacity of the flexible chip and the packaging substrate, and meanwhile, the inner heat absorption filling layer arranged inside the packaging substrate also improves the heat dissipation capacity of the chip.
Drawings
Fig. 1 is a schematic main body diagram of a flexible chip package structure according to the present utility model;
fig. 2 is a side view of a flexible chip package structure according to the present utility model.
In the figure: the flexible support pad 1 is a flexible support pad 2 is a micro through hole structure, 3 is an internal filling sheet, 4 is a packaging substrate, 5 is a side circuit connecting plate, 6 is a silica gel packaging layer, 7 is an upper end conductive pad, 8 is a flexible chip, 9 is a metal bonding wire, 10 is a lower end conductive pad, and 11 is an internal heat absorption filling layer.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
It should be noted that, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like refer to an azimuth or a positional relationship based on that shown in the drawings, or that the inventive product is commonly put in place when used, merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 and 2, a flexible chip packaging structure comprises a packaging substrate 4, a flexible chip 8, a silica gel packaging layer 6 and a flexible supporting pad 1, wherein the flexible supporting pad 1 is arranged at the upper end of the packaging substrate 4 in a gluing way, the flexible chip 8 is arranged at the upper end of the flexible supporting pad 1, upper end conductive pads 7 are symmetrically and fixedly arranged at the left side and the right side of the upper end of the flexible chip 8, a metal bonding wire 9 is fixedly connected to the upper end surface of the upper end conductive pad 7, the metal bonding wire 9 is obliquely bent, the lower end of the metal bonding wire 9 is fixedly connected with the upper end surface of a lower end conductive pad 10, the lower end surface of the lower end conductive pad 10 is in a gluing way with the upper end of the packaging substrate 4, the silica gel packaging layer 6 is internally wrapped by the lower end conductive pad 10, the metal bonding wire 9, the flexible chip 8, the upper end conductive pad 7 and the flexible supporting pad 1, and the silica gel packaging layer 6 is used for sealing the inner flexible chip 8, and the inner flexible chip 8 is effectively protected.
When the embodiment of the utility model is implemented, as shown in fig. 1, the lower end of the packaging substrate 4 is glued and provided with the inner filling sheet 3, the lower end of the inner filling sheet 3 is glued and provided with the packaging substrate 4, the thickness of the packaging substrate 4 is 1-2mm, the thickness of the inner filling sheet 3 is 1-1.5mm, and the inner filling sheet 3 and the packaging substrate 4 are connected and fixed through specific hot-press bonding.
In the embodiment of the utility model, as shown in fig. 1 and 2, an inner heat absorbing filling layer 11 is fixedly arranged in the inner filling sheet 3, the thickness of the inner heat absorbing filling layer 11 is consistent with that of the inner filling sheet 3, side circuit connection plates 5 are fixedly arranged on the sides of the packaging substrate 4, the side circuit connection plates 5 are symmetrically arranged, the thickness of the side circuit connection plates 5 is consistent with that of the packaging substrate 4, and the arranged side circuit connection plates 5 can facilitate the electrical connection between the flexible chip 8 and an external device.
In the embodiment of the utility model, as shown in fig. 1, a micro through hole structure 2 is arranged in the flexible supporting pad 1, the micro through hole structure 2 is arranged on one side of the flexible supporting pad 1 close to the packaging substrate 4, one of gold wires, silver wires or copper wires is selected as the metal bonding wire 9, a gap of 2-3mm is arranged between the top of the silica gel packaging layer 6 and the metal bonding wire 9 in the interior, and the arranged micro through hole structure 2 provides a space for releasing stress and deforming during bending.
In this embodiment, the flexible supporting pad 1 is provided, by arranging the flexible supporting pad 1 with the micro through hole structure 2 between the package substrate 4 and the flexible chip 8, a space for releasing stress and deforming when the package structure is bent is provided, so that the possibility of conducting stress to the flexible chip 8 is reduced, the flexibility of the chip package structure is realized, the bending deformation capacity of the chip package structure is enhanced, the inner side of the package substrate 4 is provided with the inner filling sheet 3, the arranged inner filling sheet 3 not only provides good supporting strength and flat surface for the combination of the flexible chip 8 and the package substrate 4, the combination capacity of the flexible chip 8 and the package substrate 4 is improved, and meanwhile, the heat dissipation capacity of the chip is also improved by the inner heat absorption filling layer 11 arranged inside the package substrate 4.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a flexible chip packaging structure, includes package substrate (4), flexible chip (8), silica gel encapsulation layer (6) and flexible supporting pad (1), its characterized in that: the packaging substrate is characterized in that a flexible supporting pad (1) is arranged at the upper end of the packaging substrate (4) in a gluing mode, a flexible chip (8) is arranged at the upper end of the flexible supporting pad (1), upper end conducting pads (7) are symmetrically and fixedly arranged on the left side and the right side of the upper end of the flexible chip (8), a metal bonding wire (9) is fixedly connected to the upper end face of each upper end conducting pad (7), the metal bonding wire (9) is obliquely and flexibly arranged, the lower end of each metal bonding wire (9) is fixedly connected with the upper end face of each lower end conducting pad (10), the lower end face of each lower end conducting pad (10) is arranged with the upper end of the packaging substrate (4) in a gluing mode, a silica gel packaging layer (6) is arranged on the upper end face of the packaging substrate (4), and the lower end conducting pads (10), the metal bonding wire (9), the flexible chip (8), the upper end conducting pads (7) and the flexible supporting pad (1) are wrapped inside the silica gel packaging layer (6).
2. A flexible chip package structure according to claim 1, wherein the lower end of the package substrate (4) is provided with an inner filling sheet (3) by gluing, the lower end of the inner filling sheet (3) is provided with the package substrate (4) by gluing, the thickness of the package substrate (4) is 1-2mm, and the thickness of the inner filling sheet (3) is 1-1.5mm.
3. A flexible chip package structure according to claim 2, wherein an inner heat absorbing filling layer (11) is fixedly provided inside the inner filling sheet (3), and the thickness of the inner heat absorbing filling layer (11) is consistent with the thickness of the inner filling sheet (3).
4. The flexible chip packaging structure according to claim 1, wherein a side circuit connection board (5) is fixedly arranged on a side of the packaging substrate (4), the side circuit connection board (5) is symmetrically arranged, and the thickness of the side circuit connection board (5) is consistent with the thickness of the packaging substrate (4).
5. The flexible chip packaging structure according to claim 1, wherein the flexible supporting pad (1) is internally provided with a micro through hole structure (2), and the micro through hole structure (2) is arranged at one side of the flexible supporting pad (1) close to the packaging substrate (4).
6. The flexible chip packaging structure according to claim 1, wherein the metal bonding wire (9) is one of a gold wire, a silver wire or a copper wire, and a gap of 2-3mm is arranged between the top of the silica gel packaging layer (6) and the metal bonding wire (9) inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320203570.5U CN219534509U (en) | 2023-02-14 | 2023-02-14 | Flexible chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320203570.5U CN219534509U (en) | 2023-02-14 | 2023-02-14 | Flexible chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219534509U true CN219534509U (en) | 2023-08-15 |
Family
ID=87630822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320203570.5U Active CN219534509U (en) | 2023-02-14 | 2023-02-14 | Flexible chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219534509U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116782506A (en) * | 2023-08-24 | 2023-09-19 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
-
2023
- 2023-02-14 CN CN202320203570.5U patent/CN219534509U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116782506A (en) * | 2023-08-24 | 2023-09-19 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
| CN116782506B (en) * | 2023-08-24 | 2023-11-24 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangsu Yunchuang Intelligent Technology Co.,Ltd. Assignor: Jiangsu Zhuobao Zhizao Technology Co.,Ltd. Contract record no.: X2024980017709 Denomination of utility model: A flexible chip packaging structure Granted publication date: 20230815 License type: Common License Record date: 20241010 |