CN115394212B - Display panel and spliced display screen - Google Patents
Display panel and spliced display screen Download PDFInfo
- Publication number
- CN115394212B CN115394212B CN202211043398.8A CN202211043398A CN115394212B CN 115394212 B CN115394212 B CN 115394212B CN 202211043398 A CN202211043398 A CN 202211043398A CN 115394212 B CN115394212 B CN 115394212B
- Authority
- CN
- China
- Prior art keywords
- layer
- insulator
- bonding pad
- pad
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
Abstract
The embodiment of the application discloses display panel and concatenation display screen includes: the LED light-emitting device comprises an array layer, a supporting layer, a light-emitting layer, a wire and an insulator, wherein a first bonding pad is arranged on the array layer, the first bonding pad corresponds to a frame area, the supporting layer is arranged on one surface of the array layer, which is far away from the first bonding pad, the light-emitting layer is arranged on one surface of the supporting layer, which is far away from the array layer, the part of the light-emitting layer exceeds the supporting layer, the part of the light-emitting layer, which exceeds the supporting layer, is close to the supporting layer, is provided with a second bonding pad, the second bonding pad corresponds to the frame area, the wire is bent back and forth in the direction from the first bonding pad to the second bonding pad, the insulator covers the frame area, and the insulator encapsulates the wire, the first bonding pad and the second bonding pad; the wire is bent back and forth in the direction from the first bonding pad to the second bonding pad, so that the risk of wire breakage can be effectively reduced. The insulator covers the frame area, and the insulator encapsulates the wire, the first bonding pad and the second bonding pad, so that the wire can be effectively isolated from being contacted with outside air, and the wire is prevented from being oxidized.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a spliced display screen.
Background
The existence of the bending area of the flexible OLED display screen enables the lower frame of the panel to be larger, and in order to reduce the frame of the display screen, the array layer and the luminous layer can be connected and conducted through wires, and the wires are arranged on the back of the display screen. The metal bonding pad at the joint of the array layer and the luminous layer is directly or indirectly exposed through laser drilling and the like, and is conducted through gold, silver, copper wires and the like through ink-jet printing, dispensing, aerosol and the like.
In the course of research and practice of the prior art, the inventors of the present application found that the existing connection mode, where the wire directly connects two metal pads, has several problems: the adhesion force between the lead and the substrate is insufficient, and the problem of broken wire can occur; the resistance generated by the lead is high, which is easy to generate heat and affects the conductive efficiency; the wire is straight line, and the internal stress that the seal produced is big, and the material thermal expansion can make its broken string, has the risk of breaking circuit.
Disclosure of Invention
The embodiment of the application provides a display panel, from first pad to second pad orientation, the wire is the risk that the wire broken string can effectively be reduced to round trip crooked form.
The embodiment of the application provides a display panel, which comprises:
the array layer is provided with a first bonding pad, and the first bonding pad corresponds to the frame area;
the support layer is arranged on one surface of the array layer, which is far away from the first bonding pad;
the light-emitting layer is arranged on one surface of the supporting layer, which is far away from the array layer, part of the light-emitting layer exceeds the supporting layer, a second bonding pad is arranged on one surface of the light-emitting layer, which exceeds the supporting layer and is close to the supporting layer, and the second bonding pad corresponds to the frame area;
a wire connecting the first pad and the second pad; the lead at least comprises a first connecting section, a second connecting section and a first bending part, wherein the first connecting section is connected with a first bonding pad, the second connecting section is connected with a second bonding pad, and the first bending part is connected with the first connecting section and the second connecting section; the wire is bent back and forth in the direction from the first bonding pad to the second bonding pad;
and the insulator covers the frame area, and encapsulates the wire, the first bonding pad and the second bonding pad.
Optionally, in some embodiments of the present application, a first electrical conductor is further disposed at a connection portion between the first connection section and the first pad, and the first electrical conductor is connected to the first pad and the first connection section; and a second conductor is further arranged at the joint of the second connecting section and the second bonding pad, and the second conductor is connected with the second bonding pad and the second connecting section.
Optionally, in some embodiments of the present application, a portion of the light emitting layer beyond the support layer, a side of the support layer, and a side of the array layer define a recess; the insulator comprises a first insulator and a second insulator, and the first insulator is arranged in the concave part;
in the cross section perpendicular to the plane where the supporting layer is located, the outer side surface of the first insulator is arc-shaped, an accommodating groove is formed in the outer side surface of the first insulator, the conducting wire is arranged in the accommodating groove, and the second insulator covers the first insulator, the conducting wire, the first bonding pad and the second bonding pad.
Optionally, in some embodiments of the present application, the first insulator is provided with a stress relief hole.
Optionally, in some embodiments of the present application, a portion of the light emitting layer beyond the support layer, a side of the support layer, and a side of the array layer define a recess; the insulator comprises a first insulator and a second insulator, and the first insulator is arranged in the concave part; the second insulator covers the first insulator, the wire, the first pad and the second pad;
in a section perpendicular to a plane where the supporting layer is located, the outer side surface of the first insulator is arc-shaped; the first insulator comprises a first insulating part and a second insulating part connected with the first insulating part, the first insulating part covers the side surface of the supporting layer and the part of the light-emitting layer, and the second insulating part covers the first insulating part of the part, the side surface of the array layer and the edge angle of the array layer;
in the cross section perpendicular to the plane where the supporting layer is located, the outer side face of the first insulating part is in a first arc shape, the outer side face of the second insulating part is in a second arc shape, and the radian of the first arc shape is smaller than that of the second arc shape.
Optionally, in some embodiments of the present application, the first connection section is disposed on the second insulating portion and corresponds to an edge angle of the array layer, and the second connection section is disposed on the first insulating portion; in a cross section perpendicular to the plane of the supporting layer, the radian of the first connecting section is larger than that of the second connecting section.
Optionally, in some embodiments of the present application, the first connection section is curved back and forth in a direction from the first pad to the second pad.
Optionally, in some embodiments of the present application, a stress relief hole is provided on the second insulating portion.
Optionally, in some embodiments of the present application, the display panel further includes:
and the heat dissipation layer is arranged between the support layer and the array layer.
A polarizer disposed on the light emitting layer;
the bonding layer is arranged on the polaroid;
and the cover plate is arranged on the bonding layer.
Correspondingly, the embodiment of the application also provides a spliced display screen, which comprises at least two display panels, wherein the display panels are spliced.
The embodiment of the application adopts a display panel, and the wire is bent back and forth from the first bonding pad to the second bonding pad, so that the risk of wire breakage can be effectively reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the disclosure;
FIG. 2 is a side view of a display panel according to an embodiment of the present disclosure;
fig. 3 is a schematic cross-sectional structure of a display panel according to a second embodiment of the disclosure;
fig. 4 is a side view of a display panel according to a second embodiment of the present disclosure;
fig. 5 is a schematic cross-sectional structure of a display panel according to a second embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a tiled display screen according to a third embodiment of the present application.
Reference numerals illustrate: the display panel 100, the array layer 10, the first bonding pad 20, the frame area NA, the support layer 30, the light emitting layer 40, the second bonding pad 21, the conductive line 50, the first connection section 51, the first bent portion 52, the second connection section 53, the insulator 60, the first conductor 51a, the second conductor 53a, the recess AO, the first insulator 61, the second insulator 62, the receiving groove 61a, the stress release hole 61b, the first insulating portion 611, the second insulating portion 612, the first arc 611a, the second arc 612a, the heat dissipation layer 70, the polarizer 71, the adhesive layer 72, the cover plate 73, and the tiled display screen 200.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides a display panel, and the detailed description is given below. The following description of the embodiments is not intended to limit the preferred embodiments.
Embodiment 1,
Referring to fig. 1 and 2, a display panel 100 according to an embodiment of the present application includes: the array layer 10, the support layer 30, the light emitting layer 40, the conductive lines 50 and the insulator 60, the first bonding pads 20 are disposed on the array layer 10, and the first bonding pads 20 correspond to the frame area NA. The support layer 30 is disposed on a side of the array layer 10 remote from the first pads 20. The light emitting layer 40 is disposed on a surface of the support layer 30 away from the array layer 10, a portion of the light emitting layer 40 extends beyond the support layer 30, and a second bonding pad 21 is disposed on a surface of the light emitting layer 40, which is close to the support layer 30, of the portion of the light emitting layer 40 extending beyond the support layer 30, and the second bonding pad 21 corresponds to the frame area NA. The wire 50 connects the first pad 20 and the second pad 21. The wire 50 includes at least a first connection section 51, a second connection section 53, and a first bending portion 52, the first connection section 51 is connected to the first bonding pad 20, the second connection section 53 is connected to the second bonding pad 21, and the first bending portion 52 is connected to the first connection section 51 and the second connection section 53. The wire 50 is bent back and forth in a direction from the first pad 20 to the second pad 21. The insulator 60 covers the frame area NA, and the insulator 60 encapsulates the wire 50, the first pad 20, and the second pad 21.
It can be appreciated that, in the present embodiment, the wire 50 is bent back and forth from the first pad 20 to the second pad 21, which can effectively reduce the risk of wire breakage of the wire 50. The insulator 60 covers the frame area NA, and the insulator 60 encapsulates the wire 50, the first pad 20 and the second pad 21, so that the wire 50 can be effectively isolated from the outside air, and the wire 50 is prevented from being oxidized.
Alternatively, the insulator 60 may be formed by thermal curing or photo-curing.
Optionally, in this embodiment, a first electrical conductor 51a is further disposed at a connection portion between the first connection section 51 and the first bonding pad 20, and the first electrical conductor 51a is connected to the first bonding pad 20 and the first connection section 51; the connection between the second connection section 53 and the second bonding pad 21 is further provided with a second conductive body 53a, and the second conductive body 53a is connected to the second bonding pad 21 and the second connection section 53.
It is understood that in the present embodiment, the first electrical conductor 51a may reduce and enhance the connection between the first connection section 51 and the first pad 20, preventing a virtual connection or a poor connection. The second conductor 53a can reduce and enhance the connection between the second connection section 53 and the second pad 21, preventing a virtual connection or a poor connection. The material of the first conductor 51a and the second conductor 53a includes a metal.
Alternatively, in the present embodiment, a portion of the light emitting layer 40 beyond the support layer 30, a side surface of the support layer 30, and a side surface of the array layer 10 define a recess AO. The insulator 60 includes a first insulator 61 and a second insulator 62, the first insulator 61 being disposed in the recess AO. In a cross section perpendicular to a plane in which the support layer 30 is located, an outer side surface of the first insulator 61 is arc-shaped, a receiving groove 61a is formed in an outer side surface of the first insulator 61, the wire 50 is disposed in the receiving groove 61a, and the second insulator 62 covers the first insulator 61, the wire 50, the first pad 20, and the second pad 21.
It can be appreciated that in the present embodiment, the wires 50 are disposed in the accommodating groove 61a, and in the cross section perpendicular to the plane of the supporting layer 30, the outer side surface of the first insulator 61 is arc-shaped, so that the distance between the wires 50 and the array layer 10 can be effectively increased, and the wires 50 are prevented from being broken due to the excessive stress of the wires 50 on the outer side surface of the first insulating portion 611. Since the stress at the edge of the array layer 10 is larger, the distance between the wire 50 and the array layer 10 is increased by raising the distance between the wire 50 and the array layer 10, so that the wire 50 is prevented from being broken due to the excessive stress of the wire 50 at the edge of the array layer 10. It is understood that the second insulator 62 covers the first insulator 61, the wire 50, the first pad 20 and the second pad 21, and can insulate the wire 50, the first pad 20 and the second pad 21 from the external air and prevent oxidation. The accommodating groove 61a is formed on the outer side surface of the first insulator 61, so that the deflection phenomenon generated by the wire 50 during the wire 50 preparation can be effectively limited, and the yield of the wire 50 can be improved.
In the present embodiment, the wire 50 may be fixed to the first pad 20, the second pad 21, and the first insulator 61 by thermally curing or photo-curing the insulator 60. In some products that can withstand high temperatures, the materials of the first conductor 51a and the second conductor 53a may be selected from solder paste. The wires 50 are then filled by means of ink jet, printing, aerosol or dispensing, further securing the wires 50.
In some embodiments, the material of the conductive wire 50 may be selected from conductive silver paste materials, which not only can be conductive but also has an adhesive function, and the material can generate adhesiveness after being cured, so that no additional practical adhesive is needed. The conductive wires 50 may be formed by ink-jet, printing, aerosol or dispensing for conductive silver paste type materials.
Alternatively, in the present embodiment, the first insulator 61 is provided with the stress relief hole 61b.
It can be appreciated that, in the present embodiment, the stress release hole 61b is provided on the first insulator 61, so that the stress on the first insulator 61 can be effectively released, and the stress on the first insulator 61 is prevented from being transferred to the wire 50, thereby causing the wire 50 to break.
Embodiment II,
Referring to fig. 3 and 4, a display panel 100 according to an embodiment of the present application includes: the array layer 10, the support layer 30, the light emitting layer 40, the conductive lines 50 and the insulator 60, the first bonding pads 20 are disposed on the array layer 10, and the first bonding pads 20 correspond to the frame area NA. The support layer 30 is disposed on a side of the array layer 10 remote from the first pads 20. The light emitting layer 40 is disposed on a surface of the support layer 30 away from the array layer 10, a portion of the light emitting layer 40 extends beyond the support layer 30, and a second bonding pad 21 is disposed on a surface of the light emitting layer 40, which is close to the support layer 30, of the portion of the light emitting layer 40 extending beyond the support layer 30, and the second bonding pad 21 corresponds to the frame area NA. The wire 50 connects the first pad 20 and the second pad 21. The wire 50 includes at least a first connection section 51, a second connection section 53, and a first bending portion 52, the first connection section 51 is connected to the first bonding pad 20, the second connection section 53 is connected to the second bonding pad 21, and the first bending portion 52 is connected to the first connection section 51 and the second connection section 53. The wire 50 is bent back and forth in a direction from the first pad 20 to the second pad 21. The insulator 60 covers the frame area NA, and the insulator 60 encapsulates the wire 50, the first pad 20, and the second pad 21.
It can be appreciated that, in the present embodiment, the wire 50 is bent back and forth from the first pad 20 to the second pad 21, which can effectively reduce the risk of wire breakage of the wire 50. The insulator 60 covers the frame area NA, and the insulator 60 encapsulates the wire 50, the first pad 20 and the second pad 21, so that the wire 50 can be effectively isolated from the outside air, and the wire 50 is prevented from being oxidized.
Optionally, in this embodiment, a first electrical conductor 51a is further disposed at a connection portion between the first connection section 51 and the first bonding pad 20, and the first electrical conductor 51a is connected to the first bonding pad 20 and the first connection section 51; the connection between the second connection section 53 and the second bonding pad 21 is further provided with a second conductive body 53a, and the second conductive body 53a is connected to the second bonding pad 21 and the second connection section 53.
It is understood that in the present embodiment, the first electrical conductor 51a may reduce and enhance the connection between the first connection section 51 and the first pad 20, preventing a virtual connection or a poor connection. The second conductor 53a can reduce and enhance the connection between the second connection section 53 and the second pad 21, preventing a virtual connection or a poor connection. The material of the first conductor 51a and the second conductor 53a includes a metal.
Alternatively, in the present embodiment, a portion of the light emitting layer 40 beyond the support layer 30, a side surface of the support layer 30, and a side surface of the array layer 10 define a recess AO. The insulator 60 includes a first insulator 61 and a second insulator 62, the first insulator 61 being disposed in the recess AO. The second insulator 62 covers the first insulator 61, the wire 50, the first pad 20, and the second pad 21. In a cross section perpendicular to the plane in which the support layer 30 is located, the outer side of the first insulator 61 is arc-shaped. The first insulator 61 includes a first insulating part 611 and a second insulating part 612 connected to the first insulating part 611, the first insulating part 611 covering a side surface of the support layer 30 and a portion of the light emitting layer 40, and the second insulating part 612 covering a part of the first insulating part 611, a side surface of the array layer 10, and an edge angle of the array layer 10. In a cross section perpendicular to the plane of the supporting layer 30, the outer side surface of the first insulating portion 611 is a first arc 611a, the outer side surface of the second insulating portion 612 is a second arc 612a, and the radian of the first arc 611a is smaller than that of the second arc 612 a.
It is understood that in the present embodiment, the second insulator 62 covers the first insulator 61, the wire 50, the first pad 20, and the second pad 21, and can insulate the wire 50, the first pad 20, and the second pad 21 from the outside air, preventing the wire 50, the first pad 20, and the second pad 21 from being oxidized. It can be appreciated that, since the wire 50 is bent to a larger extent at the first insulating portion 611 and is thus subjected to a larger stress, the first arc 611a is set to have a smaller arc than the second arc 612a, so that the distance between the wire 50 and the array layer 10 can be effectively increased, and the wire 50 is prevented from being broken due to the excessive stress of the wire 50 at the outer side surface of the first insulating portion 611. Since the stress at the edge of the array layer 10 is larger, the distance between the wire 50 and the array layer 10 is increased by raising the distance between the wire 50 and the array layer 10, so that the wire 50 is prevented from being broken due to the excessive stress of the wire 50 at the edge of the array layer 10.
In the present embodiment, the wire 50 may be fixed to the first insulator 61 by thermally curing or photo-curing the wire on the first insulator 61, and the first pad 20, the second pad 21, and the first insulator 61 may be fixed. In some products that can withstand high temperatures, the materials of the first conductor 51a and the second conductor 53a may be selected from solder paste.
Alternatively, in the present embodiment, the first connection section 51 is disposed on the second insulating part 612 and corresponds to the corner angle of the array layer 10, and the second connection section 53 is disposed on the first insulating part 611. In a section perpendicular to the plane of the support layer 30, the arc of the first connecting section 51 is greater than the arc of the second connecting section 53.
It can be understood that, in the present embodiment, since the first connecting section 51 is subjected to a larger stress, the radian of the first connecting section 51 is larger than that of the second connecting section 53, so that the length of the first connecting section 51 can be effectively prolonged, and the space for releasing the stress of the first connecting section 51 can be increased.
Alternatively, in the present embodiment, the first connection section 51 is curved back and forth in a direction from the first pad 20 to the second pad 21.
It can be understood that, in the present embodiment, the first connection section 51 is bent back and forth from the first pad 20 to the second pad 21, so that the length of the first connection section 51 can be effectively lengthened, and the length of the first connection section 51 capable of releasing stress can be increased.
Alternatively, in the present embodiment, the second insulating portion 612 is provided with the stress relief hole 61b.
It can be appreciated that, in the present embodiment, the stress release hole 61b is provided on the second insulating portion 612, so as to effectively release the stress on the second insulating portion 612, and prevent the stress from being transferred to the wire 50 to cause the wire 50 to break.
Referring to fig. 5, optionally, in some embodiments, the display panel 100 further includes: a heat dissipation layer 70, a polarizer 71, an adhesive layer 72, and a cover plate 73, the heat dissipation layer 70 being disposed between the support layer 30 and the array layer 10. The polarizer 71 is disposed on the light emitting layer 40. The adhesive layer 72 is disposed on the polarizer 71. The cover plate 73 is disposed on the adhesive layer.
It can be appreciated that the heat dissipation layer 70 can increase the heat dissipation effect of the display panel 100, and ensure that the display panel 100 is in a good working environment.
Third embodiment,
Referring to fig. 6, the present embodiment provides a tiled display screen 200, which includes at least two display panels 100 as described in any of the first embodiment or the second embodiment, and the display panels 100 are tiled.
It can be appreciated that, in the present embodiment, the wire 50 is bent back and forth from the first pad 20 to the second pad 21, which can effectively reduce the risk of wire breakage of the wire 50. The insulator 60 covers the frame area NA, and the insulator 60 encapsulates the wire 50, the first pad 20 and the second pad 21, so that the wire 50 can be effectively isolated from the outside air, and the wire 50 is prevented from being oxidized. The yield of the tiled display screen 200 can be effectively ensured.
The display panel and the spliced display screen provided by the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and the implementation of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (10)
1. A display panel, comprising:
the array layer is provided with a first bonding pad, and the first bonding pad corresponds to the frame area;
the support layer is arranged on one surface of the array layer, which is far away from the first bonding pad;
the light-emitting layer is arranged on one surface of the supporting layer, which is far away from the array layer, part of the light-emitting layer exceeds the supporting layer, a second bonding pad is arranged on one surface of the light-emitting layer, which exceeds the supporting layer and is close to the supporting layer, and the second bonding pad corresponds to the frame area;
a wire connecting the first pad and the second pad; the lead at least comprises a first connecting section, a second connecting section and a first bending part, wherein the first connecting section is connected with a first bonding pad, the second connecting section is connected with a second bonding pad, and the first bending part is connected with the first connecting section and the second connecting section; the wire is bent back and forth in the direction from the first bonding pad to the second bonding pad;
and the insulator covers the frame area, and encapsulates the wire, the first bonding pad and the second bonding pad.
2. The display panel according to claim 1, wherein a first conductor is further provided at a junction of the first connection section and the first pad, the first conductor being connected to the first pad and the first connection section; and a second conductor is further arranged at the joint of the second connecting section and the second bonding pad, and the second conductor is connected with the second bonding pad and the second connecting section.
3. The display panel of claim 1, wherein the portion of the light emitting layer beyond the support layer, the side of the support layer, and the side of the array layer define a recess; the insulator comprises a first insulator and a second insulator, and the first insulator is arranged in the concave part;
in the cross section perpendicular to the plane where the supporting layer is located, the outer side surface of the first insulator is arc-shaped, an accommodating groove is formed in the outer side surface of the first insulator, the conducting wire is arranged in the accommodating groove, and the second insulator covers the first insulator, the conducting wire, the first bonding pad and the second bonding pad.
4. A display panel according to claim 3, wherein the first insulator is provided with a stress relief hole.
5. The display panel of claim 1, wherein the portion of the light emitting layer beyond the support layer, the side of the support layer, and the side of the array layer define a recess; the insulator comprises a first insulator and a second insulator, and the first insulator is arranged in the concave part; the second insulator covers the first insulator, the wire, the first pad and the second pad;
in a section perpendicular to a plane where the supporting layer is located, the outer side surface of the first insulator is arc-shaped; the first insulator comprises a first insulating part and a second insulating part connected with the first insulating part, the first insulating part covers the side surface of the supporting layer and the part of the light-emitting layer, and the second insulating part covers the first insulating part of the part, the side surface of the array layer and the edge angle of the array layer;
in the cross section perpendicular to the plane where the supporting layer is located, the outer side face of the first insulating part is in a first arc shape, the outer side face of the second insulating part is in a second arc shape, and the radian of the first arc shape is smaller than that of the second arc shape.
6. The display panel according to claim 5, wherein the first connection section is provided on the second insulating portion and corresponds to an edge angle of the array layer, and the second connection section is provided on the first insulating portion; in a cross section perpendicular to the plane of the supporting layer, the radian of the first connecting section is larger than that of the second connecting section.
7. The display panel according to claim 6, wherein the first connection section is curved back and forth in a direction from the first pad to the second pad.
8. The display panel according to claim 7, wherein the second insulating portion is provided with a stress relief hole.
9. The display panel of claim 1, wherein the display panel further comprises:
a heat dissipation layer disposed between the support layer and the array layer;
a polarizer disposed on the light emitting layer;
the bonding layer is arranged on the polaroid;
and the cover plate is arranged on the bonding layer.
10. A tiled display screen comprising at least two display panels according to any of claims 1-9, said display panels being tiled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211043398.8A CN115394212B (en) | 2022-08-29 | 2022-08-29 | Display panel and spliced display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211043398.8A CN115394212B (en) | 2022-08-29 | 2022-08-29 | Display panel and spliced display screen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115394212A CN115394212A (en) | 2022-11-25 |
| CN115394212B true CN115394212B (en) | 2023-07-25 |
Family
ID=84123608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211043398.8A Active CN115394212B (en) | 2022-08-29 | 2022-08-29 | Display panel and spliced display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115394212B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570515A (en) * | 2015-01-26 | 2015-04-29 | 京东方科技集团股份有限公司 | Array substrate and manufacture method thereof, display panel and display device |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100859464B1 (en) * | 2000-12-29 | 2008-09-23 | 엘지디스플레이 주식회사 | Thin film transistor array panel of digital X-ray defector device and manufacturing method of the same |
| JP2004312008A (en) * | 2003-04-08 | 2004-11-04 | Samsung Electronics Co Ltd | Semiconductor multi-chip package and manufacturing method therefor |
| KR101756656B1 (en) * | 2010-06-25 | 2017-07-11 | 엘지디스플레이 주식회사 | Organic light emitting diode display device including touch panel |
| US9349758B2 (en) * | 2014-09-30 | 2016-05-24 | Lg Display Co., Ltd. | Flexible display device with divided power lines and manufacturing method for the same |
| US9627463B2 (en) * | 2014-11-28 | 2017-04-18 | Lg Display Co., Ltd. | Flexible display device with space reducing wire configuration |
| CN109755256B (en) * | 2017-11-01 | 2022-01-11 | 京东方科技集团股份有限公司 | Flexible display panel, preparation method and flexible display device |
| CN110277015B (en) * | 2018-03-15 | 2021-10-26 | 群创光电股份有限公司 | Display panel and assembling method of display device using same |
| CN108766245B (en) * | 2018-07-18 | 2023-10-20 | 昆山国显光电有限公司 | Flexible display screen and display device |
| TWI687144B (en) * | 2018-11-13 | 2020-03-01 | 友達光電股份有限公司 | Flexible array substrate and manufacturing method thereof |
| CN110289289B (en) * | 2019-06-24 | 2021-04-20 | 昆山国显光电有限公司 | Display panel and display device |
| KR20210108526A (en) * | 2020-02-25 | 2021-09-03 | 삼성디스플레이 주식회사 | Display device |
| CN111725287A (en) * | 2020-06-30 | 2020-09-29 | 武汉天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN215731722U (en) * | 2021-05-31 | 2022-02-01 | 成都辰显光电有限公司 | Display panel, display assembly and splicing display device |
| CN114743959A (en) * | 2022-05-06 | 2022-07-12 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
-
2022
- 2022-08-29 CN CN202211043398.8A patent/CN115394212B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570515A (en) * | 2015-01-26 | 2015-04-29 | 京东方科技集团股份有限公司 | Array substrate and manufacture method thereof, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115394212A (en) | 2022-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5038623B2 (en) | Optical semiconductor device and manufacturing method thereof | |
| US10103304B2 (en) | LED module | |
| JP4122784B2 (en) | Light emitting device | |
| JP5290101B2 (en) | Light emitting diode mounting structure having a plurality of spare solder pads to increase wire bonding yield and manufacturing method thereof | |
| JP4910220B1 (en) | LED module device and manufacturing method thereof | |
| JP4904604B1 (en) | LED module device and manufacturing method thereof | |
| WO2012053550A1 (en) | Led module device, method for manufacturing same, led package used for led module device, and method for manufacturing same | |
| TW200406071A (en) | Surface-mountable semiconductor component and its production method | |
| US7816690B2 (en) | Light-emitting device | |
| CN115394212B (en) | Display panel and spliced display screen | |
| JP2012044102A (en) | Light-emitting device and method of manufacturing the same and wiring board | |
| JP4913099B2 (en) | Light emitting device | |
| JP2011187586A (en) | Light emitting device and method of manufacturing the same | |
| JP4250171B2 (en) | Ceramic package for light emitting device | |
| JP4948777B2 (en) | Optical communication module | |
| JP2011077164A (en) | Semiconductor light-emitting device | |
| JP2015038902A (en) | Led module device and manufacturing method of the same | |
| CN210443581U (en) | Semiconductor light emitting device | |
| JP2013161841A (en) | Led package and led packaging frame | |
| JP5063445B2 (en) | Light emitting diode lamp with low thermal resistance | |
| JP2009021303A (en) | Light-emitting device | |
| US6404059B1 (en) | Semiconductor device having a mounting structure and fabrication method thereof | |
| JP6679799B2 (en) | Light emitting device | |
| CN114335309A (en) | LED device | |
| JP2008091446A (en) | Semiconductor device, and manufacturing method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |